CN101877323A - 设置模片粘贴膜的切割带和生产半导体器件的方法 - Google Patents

设置模片粘贴膜的切割带和生产半导体器件的方法 Download PDF

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Publication number
CN101877323A
CN101877323A CN2010101608745A CN201010160874A CN101877323A CN 101877323 A CN101877323 A CN 101877323A CN 2010101608745 A CN2010101608745 A CN 2010101608745A CN 201010160874 A CN201010160874 A CN 201010160874A CN 101877323 A CN101877323 A CN 101877323A
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China
Prior art keywords
die attach
attach film
cutting belt
supporting strap
film
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CN2010101608745A
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English (en)
Chinese (zh)
Inventor
木内一之
西尾昭德
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Nitto Denko Corp
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Nitto Denko Corp
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Publication of CN101877323A publication Critical patent/CN101877323A/zh
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
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