CN101873767B - Sodium-sprayed circuit board - Google Patents
Sodium-sprayed circuit board Download PDFInfo
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- CN101873767B CN101873767B CN200910173108XA CN200910173108A CN101873767B CN 101873767 B CN101873767 B CN 101873767B CN 200910173108X A CN200910173108X A CN 200910173108XA CN 200910173108 A CN200910173108 A CN 200910173108A CN 101873767 B CN101873767 B CN 101873767B
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- circuit board
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- conductive
- substrate
- sodium
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Abstract
The invention provides a sodium-sprayed circuit board. A circuit board is a basic component for a conductive circuit between electronic product components. The invention discloses the sodium-sprayed circuit board. The sodium-sprayed circuit board is formed by directly spraying UV nano-conductive paste onto an insulated substrate through a nozzle according to a designed path by using a computer-controlled circuit board plate marking machine and a fluid controller, wherein the UV nano-conductive paste is paste prepared from micro-nano metal powder, a two-component high molecular binder and a cationic photo-initiator; the surface of the substrate is roughened; a binder film is coated under the protection of a release film; and the UV nano-conductive paste and the binder film are instantaneously cured through ultraviolet light so as to form the conductive circuit. Copper wire coating is replaced by lead spraying. The circuit board does not need to be coated with a copper plate and chemical corrosion is not needed. Both hard plates and soft plates can be produced, electricity, water and place are saved and production and trial-manufacture periods are shortened. The sodium-sprayed circuit board is a zero-pollution, zero-emission and zero-loss truly environmental-friendly circuit board. Since China is one of the largest manufacturers of circuit board, the sodium-sprayed circuit board has promising prospect.
Description
The present invention relates to a kind of nano spraying circuit board of electron trade.
Wiring board is the basic device of turning circuit between the electronic product components and parts, and full name conducting wire plate is called for short wiring board, circuit board, and this paper is referred to as wiring board.Wiring board is widely used in departments such as electronics industry, household electrical appliances industry, assembly industry, national defense industry.We can say that any electrical equipment all can't do without wiring board.China makes wiring board big country, stands above global front three, and a few years from now on will increase progressively with double figures.The wiring board industry is eternal rising industry, and prospect is considerable.
Etched circuit board is first folding printing or sensitization circuit in the copper-clad plate that the book Copper Foil is arranged, again through chemolysis, and the wiring board of formation.Etched circuit board waste copper material, contaminated environment.
The engraving wiring board is an application circuit plate engraving machine, and the copper-clad plate beyond the circuit diagram is weeded out, and has save corrosion.Engraving method can only be processed hardboard, still unresolved soft board and multiple-plate processing problems at present.
The silk screen printing wiring board.Circuit is produced on the web plate, and the electrically conductive ink substrate of biting solidifies the wiring board that the back forms.
The inkjet printing wiring board.With ink-jet printer metal nano printing ink is directly printed on the substrate, form through the sintering furnace sintering again, be mainly used in the vlsi circuitry plate.
The developed industrial country man very payes attention to the research and development to wiring board, and they concentrate on emphasis in the extension of vlsi circuitry plate and wiring board function.
The technical problem that the present invention will solve just provides a kind of suitable China's national situation, environmental protection, loss-free wiring board.
Copper material is the strategic resource of country, and the protection environment is one of fundamental state policy of our country.Contaminated environment, waste resource perplex the development of wiring board industry always, on existing production facility, improve and follow traditional mode of thinking to solve this two hang-up.Have only and break through and innovation; Current advanced digital technology, micro-electromechanical technology, nanometer technology, fine chemical technology, macromolecule bonding technology, fluid control technology and machine are calculated machine science and technology; For providing, we distribute rationally; Integrate innovations new approaches, new method, new way are for the generation of nano spraying circuit board provides theoretical foundation and technical support.
The used material of nano spraying circuit board mainly contains: UV conductive nano cream and insulated substrate.
UV conductive nano cream is by the paste of micro-nano metal-powder with two component high polymer binders and cation light initiator configuration, metal-powder particle diameter≤0.05um, resistivity≤5 * 10 in the time of 25 ℃
-4Ω cm
-1, content is not less than 78%, and adhesive force>=6Mpa adds stream agent 0.5%, thickness 18～68um.UV conductive nano cream has three functions: the one, and conduction makes by the coupling part and forms conductive path, replaces copper-clad plate.The 2nd, cohere, UV conductive nano cream and substrate bonding agent film are binded.The 3rd, the UV instantaneous solidification is indeformable, and adhesive force >=6Mpa is solidified into one.
Substrate is the carrier of UV conductive nano cream, and substrate is the premium insulation material.Substrate surface covers one deck adhesive film through alligatoring under the mould release membrance protection.Tear mould release membrance during use, solidify back UV conductive nano cream and substrate and firmly cohere, form needed wiring board.Substrate thickness is selected for use as required, can use hardboard, also can use flexible board.
Processing nano spraying circuit board used equipment mainly contains: the wiring board contouring system of being made up of computer and wiring board spray printing machine; By the fluid intelligent controller, annotate control cream and cure system that cream tube, pulsometer, uviol lamp are formed.
Wiring board spray printing machine is one of capital equipment of nano spraying circuit board production.It is cooperated by intelligent three-dimensional manipulator and fluid control two large divisions and forms.Wiring board spray printing machine can be by path, an amount of conductive nano cream of thickness ejection of computer design.Wiring board spray printing machine can read AUTO CAD figure and circuit diagram, can import and export editor, revise, and the figure of being convenient to import changes, corrects, confirms in machine maintenance.Can the translation twiddle operation, region duplication and mirror are beneficial to and expand production capacity, and increase the benefit.Configuration CCD auxiliary routine editor has automatic target positioning identification of vision imaging and self-checking function, can the motion track position display follow the trail of.Repeatable accuracy 0.025mm; Spray cream line footpath 0.1mm; Velocity of displacement: 0～300mm/s is adjustable.
Accurately control UV conductive paste flow is fluid control, configuration 5kg/cm
2Air voltage source.Built-in fine adjustment valve and pressure sensitive transducer are guaranteed stability and accuracy that UV conductive nano cream spues, guarantee not leak cream, do not drip cream.Flow size, line footpath thickness, between the stream stopping time, number of times etc. can built-inly set.When exhausting, conductive paste points out automatically, and record processing number of times and consumption cream amount.And whole process all can be interactive with computerized control system.
High strength, stable uviol lamp are the preconditions that guarantees curing.Ultraviolet source wavelength 390n, lamp intensity is 1060mw/cm
2, light energy is at 0.1～0.3j/cm
2, the photo-thermal acting in conjunction is fully solidified down, and cream and substrate bonding jail are indeformable.
The practical implementation step of processing nano spraying circuit board method is: in computer, draw the line map that will process earlier; The incoming line plate sprays the machine of receiving; Speed of advancing according to three-dimensional mechanical hand and nozzle conduct track set spray cream flow, duration, arrhea technical parameter such as number of times; These technical parameters both can directly be set in the SMART FLUID controller; Also can in computer, set, can change mutually after the affirmation; According to the thickness apolegamy shower nozzle of graph line in the line map, by dress cream tube; The fixed-site substrate of setting; Air compressor machine provides source of the gas for the cream pump, start air compressor machine earlier.Can start wiring board after all preparations are ready and spray the machine of receiving, manipulator carries nozzle and on substrate, sprays UV conductive nano cream, on substrate, goes out line map with the cream air brushing; Spray is sticked the line map that UV conductive nano cream is arranged place uviol lamp irradiation of following moment, under photothermy, UV conductive nano cream and adhesive film solidify rapidly, and nano spraying circuit board completes.
Subsequent treatment such as punching, light processing, multi-layer sheet compacting are the routine works of wiring board processing industry.
Prove absolutely that from above method of operation and step the disclosed nano spraying circuit board of this patent belongs to the component invention that is combined into by multiple high and new technology, main points are combination itself.Wiring board spray printing machine by the computer control three-dimensional mechanical hand is formed can be guaranteed the circuit precision; The contained metallic conduction thing of micro-nano conductive paste content is high, and electric conductivity is stable; Line weight is through nozzle and fluid control regulation and control; The stable power that flows out of conductive paste is provided by mini air compressor; Fluid control can guarantee that cream stream and lines are synchronous, and does not drip cream, do not leak cream; UV solidifies the specific (special) requirements that can not only satisfy wiring board self, also is beneficial to continuous productive process; Dual-component binder makes UV conductive nano cream and substrate bond strength reach instructions for use; Supervising device can in time feed back machining information, guarantees quality, and it is practical that the whole proposal of road plate is received in spray.Accomplish with ' spray ' circuit through Applied Digital technology, fluid control technology and micro-nano technology; Replace ' covering ' circuit, without copper-clad plate, without chemical corrosion; Water-saving, power saving, province place, investment-saving; Real realize individual layer and multilayer circuit board production, environmental protection and loss-free technical goal also shorten dramatically the production and the trial-produce period of wiring board.
This patent indication wiring board is a broad sense, and the wiring board of broad sense not only comprises circuit board, comprises that also light path plate, magnetic circuit plate and all can form soft board, hardboard and other object of concavo-convex circuit through other material of nozzle ejection.
Claims (3)
1. a nano spraying circuit board is characterized in that: by wiring board spray printing machine UV conductive nano cream is pressed the direct spray printing of designed path on insulated substrate, become integrally formed wiring board through photo-thermal curing;
Wherein said nano spraying circuit board material therefor is; UV conductive nano cream, it is by the paste of micro-nano metal-powder with two component high polymer binders, cation light initiator configuration, and UV conductive nano cream has conducting function; Make by the coupling part and form conductive path, replace copper-clad plate; Be to cohere function again, UV conductive nano cream and substrate bonding agent film bind, and through photo-thermal curing, are solidified into one with substrate;
The used substrate of wherein said nano spraying circuit board is the carrier of conductive paste, is insulating material, and substrate surface has one deck adhesive film through alligatoring under the mould release membrance protection, and substrate thickness is selected for use as required.
2. nano spraying circuit board according to claim 1 is characterized in that: said nano spraying circuit board comprises circuit board, also comprises light path plate, magnetic circuit plate.
3. nano spraying circuit board according to claim 1 is characterized in that: said nano spraying circuit board is all soft board, the hardboards that can form concavo-convex circuit through the material of ejection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910173108XA CN101873767B (en) | 2006-06-02 | 2006-06-02 | Sodium-sprayed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910173108XA CN101873767B (en) | 2006-06-02 | 2006-06-02 | Sodium-sprayed circuit board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100608582A Division CN100531523C (en) | 2006-06-02 | 2006-06-02 | Nano spraying circuit board producing method and equipment and material configuration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101873767A CN101873767A (en) | 2010-10-27 |
| CN101873767B true CN101873767B (en) | 2012-06-20 |
Family
ID=42998355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910173108XA Expired - Fee Related CN101873767B (en) | 2006-06-02 | 2006-06-02 | Sodium-sprayed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101873767B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102303841A (en) * | 2011-07-11 | 2012-01-04 | 西安交通大学 | Method for forming micro-nano composite structure by micro-spraying-printing and dielectrophoretic force |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1419715A (en) * | 2001-01-24 | 2003-05-21 | 皇家菲利浦电子有限公司 | Method of producing printed circuit on a substrate |
| CN1498519A (en) * | 2001-03-22 | 2004-05-19 | 西门子公司 | Circuit support element for electronic devices, in particular for communication terminals |
-
2006
- 2006-06-02 CN CN200910173108XA patent/CN101873767B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1419715A (en) * | 2001-01-24 | 2003-05-21 | 皇家菲利浦电子有限公司 | Method of producing printed circuit on a substrate |
| CN1498519A (en) * | 2001-03-22 | 2004-05-19 | 西门子公司 | Circuit support element for electronic devices, in particular for communication terminals |
Non-Patent Citations (3)
| Title |
|---|
| 李江.纳米油墨及其应用技术(一).《丝网印刷》.2005, * |
| 李江.纳米油墨及其应用技术(二).《丝网印刷》.2005, * |
| 杜延平.UV光固化喷墨打印技术的研究与发展.《印刷杂志》.2004,(第217期), * |
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| Publication number | Publication date |
|---|---|
| CN101873767A (en) | 2010-10-27 |
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| C14 | Grant of patent or utility model | ||
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| C41 | Transfer of patent application or patent right or utility model | ||
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Inventor after: Zhong Honghui Inventor before: Liu Yangming |
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| TR01 | Transfer of patent right |
Effective date of registration: 20170216 Address after: 518100 Guangdong city of Shenzhen province Nanshan District overseas Chinese town No. 9 West World Habitat garden Haihua fourth 20A Patentee after: Zhong Honghui Address before: 518048 Guangdong city of Shenzhen province Futian District mintian Road 1 development of Xing Yuan Ge 15C Grevillea robusta Patentee before: Liu Yangming |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120620 Termination date: 20170602 |