CN108145962A - A kind of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment and manufacturing method - Google Patents
A kind of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment and manufacturing method Download PDFInfo
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- CN108145962A CN108145962A CN201711401162.6A CN201711401162A CN108145962A CN 108145962 A CN108145962 A CN 108145962A CN 201711401162 A CN201711401162 A CN 201711401162A CN 108145962 A CN108145962 A CN 108145962A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
Abstract
The present invention relates to a kind of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment and manufacturing methods, dielectric layer is shaped by way of ultraviolet light solidified forming photosensitive resin, and print caulking groove, then conductive foil is moved in caulking groove by mechanical arm, or nanometer silver paste is printed in caulking groove, and cure by write-through extruder head；Optical soliton interaction is accumulated, and is recycled above procedure, is finally completed multilayer mode of resonance Meta Materials wave-absorber.The present invention can one-pass molding wave-absorber product, flexible design, conformability is good, the stealthy field of weapon have important use.
Description
Technical field
The present invention relates to a kind of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment and manufacturing methods, belong to a variety of materials
Material mixing increases material manufacturing technology field.
Background technology
Meta Materials wave-absorber is being electromagnetically shielded, and equipping stealthy aspect has major application, with weaponry moulding increasingly
How complexity improves stealth capabilities as important research content, when Meta Materials wave-absorber passes through electromagnetic wave by resonance effect
Concussion loss is generated, so as to play the shielding action of certain wave band, this functionality has important application in terms of weapon radar invisible
Value.The integration of weapon surface and conformalization are important solutions.Therefore, integration system is solving force for Meta Materials wave-absorber
Research significance is great in terms of device radar invisible.
Mode of resonance Meta Materials wave-absorber is made of conductive layer and dielectric layer, traditional handicraft frequently with photoetching method, equal
Air layer is carved on one medium, is then bonded layer by layer, prepares multilayer absorber.Wave-absorber is prepared with such method, first only
The mode that air layer can be carved in same material realizes the variation of dielectric constant, lacks and designs flexibility, second, by gluing layer by layer
The mode connect prepares multilayer absorber structure, easily occur bonding gap, and there are lithographic cell centering error it is larger the problem of.And
Wave-absorber is prepared by the way of increasing material manufacturing, wave-absorber can be prepared in a manner that multiple material is successively accumulated, is designed
It is flexible big, and disposal molding precision is high.
But a few class processing technologys of current increases material manufacturing technology, such as fdm techniques, forming accuracy is inadequate, sla and sls techniques,
It can only prepare simultaneously, for more Material cladding products as mode of resonance wave-absorber class, preparative capacibility is limited.
Invention content
The technical problems to be solved by the invention are to provide a kind of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment,
Can one-pass molding wave-absorber product, flexible design, conformability is good, the stealthy field of weapon have important use.
In order to solve the above-mentioned technical problem the present invention uses following technical scheme：The present invention devises a kind of multilayer mode of resonance
Meta Materials wave-absorber increasing material manufacturing equipment, including dielectric layer forming unit, conductive layer forming unit, defective material clearing cell and control
Unit (16), wherein, dielectric layer forming unit includes liquid bath (1), print platform (3), upright guide rail (4), ultraviolet generater
(5)；Open ports at the top of liquid bath (1), upright guide rail (4) are fixedly installed on the outside of liquid bath (1) vertically, and electric driving device is movably arranged at
On upright guide rail (4), print platform (3) is positioned horizontally in liquid bath (1), and print platform (3) passes through connecting rod and electric driving device
It is connected, print platform (3) moving up and down on upright guide rail (4) with electric driving device, and moved up and down in liquid bath (1),
Ultraviolet generater (5) is positioned at the surface of liquid bath (1), and the irradiation end on ultraviolet generater (5) is directed toward beats straight down
Print platform (3)；Conductive layer forming unit includes the gas corresponding to write-through nozzle (7), air compressor machine (8) and write-through nozzle
Manage (10), electric-controlled mechanical arm (15)；Wherein one end of the corresponding tracheae of injection end (10) of write-through nozzle (7) is connected,
The outlet side of the other end connection air compressor machine (8) of tracheae (10), wherein the one of electric-controlled mechanical arm (15) corresponding to write-through nozzle
End position is fixed, and the electric-controlled mechanical arm (15) is rotated by fulcrum of its fixing end, the other end of the electric-controlled mechanical arm (15)
It is connected with the side of write-through nozzle (7), write-through nozzle (7) is corresponded under electric-controlled mechanical arm (15) motion control at it and moved
It is dynamic；Defective material clearing cell includes resin defective material sucker (12), defective material separation pump (13), defective material pond (14) and resin defective material and inhales
Tracheae (10), electric-controlled mechanical arm (15) corresponding to disk (12), wherein one end of defective material separation pump (13) overdraught channel and sky
The inlet end of press (8) is connected, and the other end of defective material separation pump (13) overdraught channel is through its corresponding tracheae (10) and tree
It is connected at the top of fat defective material sucker (12), the separating end of defective material separation pump (13) docks defective material pond (14) through conduit, resin defective material
A wherein end position for electric-controlled mechanical arm (15) corresponding to sucker (12) is fixed, and the electric-controlled mechanical arm (15) is with its fixing end
It is rotated for fulcrum, the other end of the electric-controlled mechanical arm (15) is connected with the side of resin defective material sucker (12), and resin defective material is inhaled
Disk (12) is corresponded under electric-controlled mechanical arm (15) motion control at it and is moved；On ultraviolet generater (5), upright guide rail (4)
Electric driving device, air compressor machine (8), the electric-controlled mechanical arm (15) corresponding to write-through nozzle, corresponding to resin defective material sucker (12)
Electric-controlled mechanical arm (15), defective material separation pump (13) are connected respectively with control unit (16).
As a preferred technical solution of the present invention：The conductive layer forming unit further includes paillon sucker (9), air pump
(11) tracheae (10), electric-controlled mechanical arm (15) and corresponding to paillon sucker (9)；The air compressor machine (8) through air pump (11) with
Wherein one end of tracheae (10) is connected corresponding to paillon sucker (9), the other end and paillon sucker (9) top of the tracheae (10)
Be connected, a wherein end position for electric-controlled mechanical arm (15) corresponding to paillon sucker (9) is fixed, and the electric-controlled mechanical arm (15) with
Its fixing end is rotated for fulcrum, and the other end of the electric-controlled mechanical arm (15) is connected with the side of paillon sucker (9), and paillon is inhaled
Disk (9) is corresponded under electric-controlled mechanical arm (15) motion control at it and is moved；Electric-controlled mechanical arm corresponding to paillon sucker (9)
(15), air pump (11) is connected respectively with described control unit (16).
With above-mentioned corresponding, the present invention also technical problems to be solved are to provide a kind of multilayer mode of resonance Meta Materials wave-absorber
The manufacturing method of increasing material manufacturing equipment, can one-pass molding wave-absorber product, flexible design, conformability is good, in the stealthy neck of weapon
Domain has important use.
In order to solve the above-mentioned technical problem the present invention uses following technical scheme：The present invention devises a kind of multilayer mode of resonance
The manufacturing method of Meta Materials wave-absorber increasing material manufacturing equipment, is used to implement the manufacture of multilayer mode of resonance Meta Materials wave-absorber, including
Following steps：
Filling photosensitive resin in step A. liquid baths (1), the electric driving device of control unit (16) control are moved in upright guide rail (4)
It is dynamic, print platform (3) is driven successively to be moved down in liquid bath (1), meanwhile, control unit (16) control ultraviolet generater (5) works,
Irradiation is allowed to the solidified forming on print platform (3), i.e., is put down with printing positioned at the photosensitive resin of print platform (3) upper surface
Platform (3) is successively moved down in liquid bath (1), and the photosensitive resin on print platform (3) successively accumulates solidified forming, in this way, control
Unit (16) cooperates according to wave-absorber basic structure, control ultraviolet generater (5) with electric driving device so that photosensitive resin
Caulking groove is formed, subsequently into step B；
Electric-controlled mechanical arm (15) work corresponding to step B. control units (16) control resin defective material sucker (12) so that
Resin defective material sucker (12) is moved to above caulking groove, then control unit (16) control defective material separation pump (13) work, by defective material
Uncured photosensitive resin siphons away, and be transported in defective material pond (14) and store in separation pump (13) caulking groove, subsequently into step C；
Step C. completes the preparation of conductive layer for caulking groove by control unit (16) control conductive layer forming unit work；
Step D. cycle above-mentioned steps A to step C operations, are finally completed multilayer mode of resonance Meta Materials wave-absorber.
As a preferred technical solution of the present invention, the step C is as follows：
Electric-controlled mechanical arm (15) work corresponding to control unit (16) control write-through nozzle (7) so that write-through sprays
Head (7) is moved to above caulking groove, and then control unit (16) control air compressor machine (8) works, and pressure is generated by air compressor machine (8), will
The nanometer silver paste being built in write-through nozzle (7) squeezes out, and be injected into caulking groove, completes the preparation of conductive layer.
As a preferred technical solution of the present invention, the step C is as follows：
Control unit (16) control air pump (11) works, and negative pressure, absorption one are generated by air pump (11) driving paillon sucker (9)
Piece conductive foil, then electric-controlled mechanical arm (15) work corresponding to control unit (16) control paillon sucker (9) so that paillon
Sucker (9) is moved to above caulking groove, and the conductive foil adsorbed is embedded into caulking groove, completes the preparation of conductive layer.
A kind of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment and manufacturing method of the present invention, using more than skill
Art scheme compared with prior art, has following technique effect：Multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment meets
The preparation demand of various multi-layer metamaterial wave-absorbers by wave-absorber structure design, meets the absorption requirement of the hot ejected wave of multiband.
In addition, the present invention can meet the preparation demand of other more material mixed products, the preparative capacibility of increases material manufacturing technology is expanded.
Description of the drawings
Fig. 1 is the overall schematic of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment of the present invention；
Fig. 2 is the side view of present invention application production multilayer mode of resonance Meta Materials wave-absorber structure；
Fig. 3 is the vertical view of present invention application production multilayer mode of resonance Meta Materials wave-absorber structure.
Wherein, 1. liquid bath, 2. photosensitive resins, 3. print platforms, 4. upright guide rails, 5. ultraviolet generaters, 6. ultraviolet lights,
7. write-through nozzle, 8. air compressor machines, 9. paillon suckers, 10. tracheaes, 11. air pumps, 12. resin defective material suckers, the separation of 13. defective materials
Pump, 14. defective material ponds, 15. mechanical arms, 16. control units, 17. conductive layers, 18. dielectric layers.
Specific embodiment
The specific embodiment of the present invention is described in further detail with reference to the accompanying drawings of the specification.
As shown in Figure 1, the present invention devises a kind of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment, practical application
In the middle, including dielectric layer forming unit, conductive layer forming unit, defective material clearing cell and control unit (16), wherein, dielectric layer
Forming unit includes liquid bath (1), print platform (3), upright guide rail (4), ultraviolet generater (5)；It is opened wide at the top of liquid bath (1)
Mouthful, upright guide rail (4) is fixedly installed on the outside of liquid bath (1) vertically, and electric driving device is movably arranged on upright guide rail (4), printing
Platform (3) is positioned horizontally in liquid bath (1), and print platform (3) is connected by connecting rod with electric driving device, print platform (3)
It with electric driving device moving up and down on upright guide rail (4), and is moved up and down in liquid bath (1), ultraviolet generater (5) is located at
The surface of liquid bath (1), and print platform (3) is directed toward at the irradiation end on ultraviolet generater (5) straight down；In institute of the present invention
In the multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment of design, for conductive layer forming unit, while design and include containing
Two nested structures, first set include tracheae (10), the electricity corresponding to write-through nozzle (7), air compressor machine (8) and write-through nozzle
Control mechanical arm (15)；Wherein one end of the corresponding tracheae of injection end (10) of write-through nozzle (7) is connected, tracheae (10)
The outlet side of other end connection air compressor machine (8), a wherein end position for electric-controlled mechanical arm (15) corresponding to write-through nozzle are fixed,
And the electric-controlled mechanical arm (15) is rotated by fulcrum of its fixing end, the other end and the write-through nozzle of the electric-controlled mechanical arm (15)
(7) side is connected, and write-through nozzle (7) is corresponded under electric-controlled mechanical arm (15) motion control at it and moved；Second set of packet
Include tracheae (10), the electric-controlled mechanical arm (15) corresponding to paillon sucker (9), air pump (11) and paillon sucker (9)；The sky
Press (8) is connected through air pump (11) with wherein one end of tracheae (10) corresponding to paillon sucker (9), the tracheae (10) it is another
It is connected at the top of end and paillon sucker (9), a wherein end position for electric-controlled mechanical arm (15) corresponding to paillon sucker (9) is fixed,
And the electric-controlled mechanical arm (15) is rotated by fulcrum of its fixing end, the other end and the paillon sucker of the electric-controlled mechanical arm (15)
(9) side is connected, and paillon sucker (9) is corresponded under electric-controlled mechanical arm (15) motion control at it and moved；Paillon sucker (9)
Corresponding electric-controlled mechanical arm (15), air pump (11) are connected respectively with described control unit (16)；Defective material clearing cell includes
Resin defective material sucker (12), defective material separation pump (13), defective material pond (14) and the tracheae corresponding to resin defective material sucker (12)
(10), electric-controlled mechanical arm (15), wherein one end of defective material separation pump (13) overdraught channel are connected with the inlet end of air compressor machine (8)
It connects, the other end of defective material separation pump (13) overdraught channel is through its corresponding tracheae (10) and phase at the top of resin defective material sucker (12)
Connection, the separating end of defective material separation pump (13) dock defective material pond (14) through conduit, automatically controlled machine corresponding to resin defective material sucker (12)
A wherein end position for tool arm (15) is fixed, and the electric-controlled mechanical arm (15) is rotated by fulcrum of its fixing end, the automatically controlled machine
The other end of tool arm (15) is connected with the side of resin defective material sucker (12), and resin defective material sucker (12) corresponds to automatically controlled machine at it
It is moved under tool arm (15) motion control；It is ultraviolet generater (5), the electric driving device on upright guide rail (4), air compressor machine (8), straight
Write the electric-controlled mechanical arm (15) corresponding to formula nozzle, the electric-controlled mechanical arm (15) corresponding to resin defective material sucker (12), defective material point
It is connected respectively with control unit (16) from pump (13).
Based on above-mentioned designed multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment, the present invention further devises system
Method is made, is used to implement the manufacture of multilayer mode of resonance Meta Materials wave-absorber, in practical application, is specifically comprised the following steps：
Filling photosensitive resin in step A. liquid baths (1), dielectric constant should be between 3-4, and can be by adding aluminium oxide
The mode of ceramic powder adjusts dielectric constant；The electric driving device of control unit (16) control is mobile in upright guide rail (4), drives printing flat
Platform (3) is successively moved down in liquid bath (1), meanwhile, control unit (16) control ultraviolet generater (5) works, and irradiation is located at printing
The photosensitive resin of platform (3) upper surface, is allowed to the solidified forming on print platform (3), i.e., with print platform (3) in liquid bath
(1) it successively moves down, the photosensitive resin on print platform (3) successively accumulates solidified forming, in this way, control unit (16) foundation
Wave-absorber basic structure, control ultraviolet generater (5) cooperate with electric driving device, as shown in Figures 2 and 3 so that photosensitive
Resin forms caulking groove, and after photosensitive resin is cured to certain thickness, ultraviolet generater can suspend, convenient for the insertion of conductive layer,
Subsequently into step B.
Electric-controlled mechanical arm (15) work corresponding to step B. control units (16) control resin defective material sucker (12) so that
Resin defective material sucker (12) is moved to above caulking groove, then control unit (16) control defective material separation pump (13) work, by defective material
Uncured photosensitive resin siphons away, and be transported in defective material pond (14) and store in separation pump (13) caulking groove, subsequently into step C.
Step C. completes the preparation of conductive layer for caulking groove by control unit (16) control conductive layer forming unit work.
Here based on for conductive layer forming unit, containing two Analysis of Nested Design structures, different designs structure is respectively adopted can be real
The operation of existing step C, wherein, according to first set design structure, then it is embodied as follows：
Electric-controlled mechanical arm (15) work corresponding to control unit (16) control write-through nozzle (7) so that write-through sprays
Head (7) is moved to above caulking groove, and then control unit (16) control air compressor machine (8) works, and pressure is generated by air compressor machine (8), will
The nanometer silver paste being built in write-through nozzle (7) squeezes out, and be injected into caulking groove, completes the preparation of conductive layer.
According to the second Analysis of Nested Design structure, then it is embodied as follows：
Control unit (16) control air pump (11) works, and negative pressure, absorption one are generated by air pump (11) driving paillon sucker (9)
Piece conductive foil, then electric-controlled mechanical arm (15) work corresponding to control unit (16) control paillon sucker (9) so that paillon
Sucker (9) is moved to above caulking groove, and the conductive foil adsorbed is embedded into caulking groove, completes the preparation of conductive layer.Here, it leads
Electric paillon includes metal foils and the conductive plastics paillons such as copper foil, aluminium foil, according to the different electricity of the design alternative of Meta Materials wave-absorber
The paillon of conductance is transmitted by paillon sucker.
Step D. cycle above-mentioned steps A to step C operations, are finally completed multilayer mode of resonance Meta Materials wave-absorber.
Multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment and manufacturing method designed by this patent, using absolute coordinate
System, the kinematic accuracy of each execution unit should ensure that 0.1mm, meet the preparation accuracy requirement of wave-absorber.Its model format can be used
Stl forms are assembled, and grid division according to bi-material layers pattern.And three-dimensional data is converted into uv equipment movement number
According to the exercise data with mechanical arm.Associated execution unit is moved according to movement code.
Embodiments of the present invention are explained in detail above in conjunction with attached drawing, but the present invention is not limited to above-mentioned implementations
Mode, within the knowledge of a person skilled in the art, can also be under the premise of present inventive concept not be departed from
Make various variations.
Claims (5)
1. a kind of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment, it is characterised in that：Including dielectric layer forming unit, lead
Electric layer forming unit, defective material clearing cell and control unit (16), wherein, dielectric layer forming unit includes liquid bath (1), printing is put down
Platform (3), upright guide rail (4), ultraviolet generater (5)；Open ports at the top of liquid bath (1), upright guide rail (4) are fixedly installed on vertically
The outside of liquid bath (1), electric driving device are movably arranged on upright guide rail (4), and print platform (3) is positioned horizontally in liquid bath (1), and is beaten
Print platform (3) is connected by connecting rod with electric driving device, and print platform (3) is upper on upright guide rail (4) with electric driving device
Lower movement, and moved up and down in liquid bath (1), ultraviolet generater (5) is positioned at the surface of liquid bath (1), and ultraviolet light occurs
It is directed toward print platform (3) straight down in irradiation end on device (5)；Conductive layer forming unit includes write-through nozzle (7), air compressor machine
(8) tracheae (10), electric-controlled mechanical arm (15) and corresponding to write-through nozzle；The injection end of write-through nozzle (7) is right with it
Wherein one end of tracheae (10) is answered to be connected, the outlet side of the other end connection air compressor machine (8) of tracheae (10), write-through nozzle institute
A wherein end position for corresponding electric-controlled mechanical arm (15) is fixed, and the electric-controlled mechanical arm (15) turns by fulcrum of its fixing end
Dynamic, the other end of the electric-controlled mechanical arm (15) is connected with the side of write-through nozzle (7), and write-through nozzle (7) is corresponded at it
It is moved under electric-controlled mechanical arm (15) motion control；Defective material clearing cell includes resin defective material sucker (12), defective material separation pump
(13), defective material pond (14) and tracheae (10), electric-controlled mechanical arm (15) corresponding to resin defective material sucker (12), defective material separation
Wherein one end of pump (13) overdraught channel is connected with the inlet end of air compressor machine (8), defective material separation pump (13) overdraught channel
The other end through being connected at the top of its corresponding tracheae (10) and resin defective material sucker (12), the separating end of defective material separation pump (13)
Defective material pond (14) are docked through conduit, a wherein end position for electric-controlled mechanical arm (15) corresponding to resin defective material sucker (12) is fixed,
And the electric-controlled mechanical arm (15) is rotated by fulcrum of its fixing end, the other end and the resin defective material of the electric-controlled mechanical arm (15) are inhaled
The side of disk (12) is connected, and resin defective material sucker (12) is corresponded under electric-controlled mechanical arm (15) motion control at it and moved；It is purple
Outside line generator (5), the electric driving device on upright guide rail (4), air compressor machine (8), the electric-controlled mechanical arm corresponding to write-through nozzle
(15), the electric-controlled mechanical arm (15) corresponding to resin defective material sucker (12), defective material separation pump (13) respectively with control unit (16)
It is connected.
2. multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment according to claim 1, it is characterised in that：It is described to lead
Electric layer forming unit further includes tracheae (10), the automatically controlled machine corresponding to paillon sucker (9), air pump (11) and paillon sucker (9)
Tool arm (15)；The air compressor machine (8) is connected through air pump (11) with wherein one end of tracheae (10) corresponding to paillon sucker (9),
Be connected at the top of the other end of the tracheae (10) and paillon sucker (9), electric-controlled mechanical arm (15) corresponding to paillon sucker (9) its
In an end position fix, and the electric-controlled mechanical arm (15) using its fixing end as fulcrum rotate, the electric-controlled mechanical arm (15) it is another
One end is connected with the side of paillon sucker (9), and paillon sucker (9) is corresponded under electric-controlled mechanical arm (15) motion control at it and moved
It is dynamic；Electric-controlled mechanical arm (15), air pump (11) corresponding to paillon sucker (9) are connected respectively with described control unit (16).
3. a kind of manufacturing method of the multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment based on described in claim 2 is used
In the manufacture for realizing multilayer mode of resonance Meta Materials wave-absorber, which is characterized in that include the following steps：
Filling photosensitive resin in step A. liquid baths (1), the electric driving device of control unit (16) control is mobile in upright guide rail (4), band
Dynamic print platform (3) is successively moved down in liquid bath (1), meanwhile, control unit (16) control ultraviolet generater (5) works, irradiation
Photosensitive resin positioned at print platform (3) upper surface is allowed to the solidified forming on print platform (3), i.e., with print platform (3)
It is successively moved down in liquid bath (1), the photosensitive resin on print platform (3) successively accumulates solidified forming, in this way, control unit
(16) according to wave-absorber basic structure, control ultraviolet generater (5) cooperates with electric driving device so that photosensitive resin is formed
Caulking groove, subsequently into step B；
Electric-controlled mechanical arm (15) work corresponding to step B. control units (16) control resin defective material sucker (12) so that resin
Defective material sucker (12) is moved to above caulking groove, and then control unit (16) control defective material separation pump (13) work, is detached by defective material
Uncured photosensitive resin siphons away in pump (13) caulking groove, and is transported in defective material pond (14) and stores, subsequently into step C；
Step C. completes the preparation of conductive layer for caulking groove by control unit (16) control conductive layer forming unit work；
Step D. cycle above-mentioned steps A to step C operations, are finally completed multilayer mode of resonance Meta Materials wave-absorber.
4. the manufacturing method of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment according to claim 3, feature
It is, the step C is as follows：
Electric-controlled mechanical arm (15) work corresponding to control unit (16) control write-through nozzle (7) so that write-through nozzle (7)
It is moved to above caulking groove, then control unit (16) control air compressor machine (8) works, and generates pressure by air compressor machine (8), will be built in
Nanometer silver paste in write-through nozzle (7) squeezes out, and be injected into caulking groove, completes the preparation of conductive layer.
5. the manufacturing method of multilayer mode of resonance Meta Materials wave-absorber increasing material manufacturing equipment according to claim 3, feature
It is, the step C is as follows：
Control unit (16) control air pump (11) works, and generates negative pressure by air pump (11) driving paillon sucker (9), absorption is a piece of to be led
Electric paillon, then electric-controlled mechanical arm (15) work corresponding to control unit (16) control paillon sucker (9) so that paillon sucker
(9) it is moved to above caulking groove, the conductive foil adsorbed is embedded into caulking groove, completes the preparation of conductive layer.
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| CN113795133A (en) * | 2021-09-13 | 2021-12-14 | 合肥工业大学 | Preparation method of layered magnetic orientation photosensitive resin-based electromagnetic wave absorber |
| CN114243284A (en) * | 2021-12-24 | 2022-03-25 | 航天恒星科技有限公司 | Preparation method of frequency selection antenna housing and frequency selection antenna |
| CN116571767A (en) * | 2023-07-14 | 2023-08-11 | 华南理工大学 | Powder bed laser melting equipment and method |
| CN116571768A (en) * | 2023-07-14 | 2023-08-11 | 华南理工大学 | Device and method for manufacturing in-situ embedded electronic components through powder bed additive |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110768019A (en) * | 2018-07-26 | 2020-02-07 | 苏州维业达触控科技有限公司 | Frequency selective surface structure |
| CN113795133A (en) * | 2021-09-13 | 2021-12-14 | 合肥工业大学 | Preparation method of layered magnetic orientation photosensitive resin-based electromagnetic wave absorber |
| CN113795133B (en) * | 2021-09-13 | 2024-01-26 | 合肥工业大学 | Preparation method of layered magnetically oriented photosensitive resin-based electromagnetic wave absorber |
| CN114243284A (en) * | 2021-12-24 | 2022-03-25 | 航天恒星科技有限公司 | Preparation method of frequency selection antenna housing and frequency selection antenna |
| CN116571767A (en) * | 2023-07-14 | 2023-08-11 | 华南理工大学 | Powder bed laser melting equipment and method |
| CN116571768A (en) * | 2023-07-14 | 2023-08-11 | 华南理工大学 | Device and method for manufacturing in-situ embedded electronic components through powder bed additive |
| CN116571767B (en) * | 2023-07-14 | 2023-10-10 | 华南理工大学 | Powder bed laser melting equipment and method |
| CN116571768B (en) * | 2023-07-14 | 2023-12-05 | 华南理工大学 | Device and method for manufacturing in-situ embedded electronic components through powder bed additive |
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