CN101853846A - 半导体模块及搭载有该模块的照相机模块 - Google Patents
半导体模块及搭载有该模块的照相机模块 Download PDFInfo
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Abstract
本发明提供一种半导体模块以及搭载有该模块的照相机模块。该半导体模块在半导体元件的周围通过多个焊球电连接具备半导体元件的下侧的布线基板以及在对应此半导体元件的位置具有开口部且在此开口部的周边具有可搭载安装部件的区域的上侧的布线基板,该焊球被遮光性的底层填料覆盖。
Description
技术领域
本发明涉及一种半导体模块及搭载了该模块的照相机模块。
背景技术
便携电话、PDA、DVC、DSC等便携式电子设备在加速附加能够拍摄人物和风景的照相机功能等的高功能化中,为了使这样的产品被市场接受,就必须为小型且轻型的产品,为了使其实现,就需要高集成的***LSI。
另一方面,对于这些电子设备要求使用更加便利,对于在设备中使用的LSI要求高功能化、高性能化。为此,一方面随着LSI芯片的高集成化增加其I/O数,另一方面,也强烈要求封装本身的小型化、薄型化,为了兼顾这些方方面面,就强烈要求研发一种适合高密度地安装半导体部件的基板的半导体封装。为了满足这样的要求,就要求使搭载半导体部件的半导体模块进一步薄型化。
下面,说明作为现有便携式电子设备的一个实例的照相机模块。
图8是表示现有的照相机模块的结构的剖面图。
如图8所示,现有的照相机模块1000具有结合了印刷基板10、镜筒46及圆筒形本体45的结构。在印刷基板10上通过接合引线14安装CCD、CMOS图像传感器11,配置有塑料材质的框体40以便将它们覆盖。
另外,照相机模块1000通过设置在镜筒46的内周表面的螺钉部的螺纹接合将圆筒形本体45和镜筒46(框体40)结合在一起。
并且,在印刷基板10的上方即安装在圆筒形本体45上的透镜41和安装在印刷基板10的上表面的半导体元件即图像传感器11之间结合有IR截止滤镜22,遮断向图像传感器11流入的过度的长波长的红外线。
但是,为了使搭载在便携电话等便携式电子设备中的照相机模块本身小型化,在现有的半导体模块中,如图8所示,在由框体40、镜筒46、圆筒形本体45及印刷基板10包围的空间内,安装了作为用于驱动透镜或半导体元件(CMOS传感器)而安装的安装部件的一个实例的芯片部件(电阻、电容等无源部件或驱动用IC芯片)。具体地,仅在半导体元件的周边的印刷基板10上有搭载芯片部件的区域。
为此,由于必须在照相机模块本体中在此空间较高地层叠这些芯片部件或者平面上确保面积进行配置,所以不能解决小型化的课题。
发明内容
本发明的一实施方式提供一种半导体模块,其特征在于,包括:具有半导体元件的第一布线基板和在对应所述半导体元件的位置具有开口部的第二布线基板;其中,在所述半导体元件的周围通过多个导电构件电连接所述第一布线基板和所述第二布线基板。
附图说明
图1是表示第一实施方式的半导体模块的结构的平面图;
图2(A)、(B)分别是表示第一实施方式的半导体模块的上侧布线基板和下侧布线基板的结构的平面图;
图3是沿图1的A-A′线的第一实施方式的半导体模块的剖面图;
图4是表示第一实施方式的半导体模块的变化例的剖面图;
图5是表示第一实施方式的半导体模块的变化例的剖面图;
图6是表示第一实施方式的半导体模块的变化例的剖面图;
图7是表示具备第二实施方式的半导体模块的照相机模块的结构的剖面图;
图8是表示具备现有的半导体模块的照相机模块的结构的剖面图。
具体实施方式
现在,将参照优选实施方式来说明本发明。优选实施方式不是要限制本发明的范围,而仅仅是示例本发明。
下面,将参照附图说明本发明的实施方式。
第一实施方式
图1是表示第一实施方式的半导体模块的结构的平面图。
半导体模块1包括下侧布线基板10和上侧布线基板20,这些布线基板10,20通过作为连接导电构件的一个实例的焊球30进行电连接。此外,在上侧的布线基板20的上表面搭载有无源元件、驱动IC等芯片部件23。半导体模块1的尺寸为约10mm×约10mm。
在此,分别在图2(A)及(B)中示出图1所示的半导体模块的上侧布线基板20和下侧布线基板10的平面图。
首先,图2(A)所示的上侧布线基板20是具有由多个布线层及绝缘层构成的所谓多层布线层的布线基板,在与搭载于下侧的布线基板10上的半导体元件11对应的位置具有开口部21。从上侧布线基板20的上侧看时,此开口部21成为大致“口”字形状。其形状不一定是“口”字形状,例如可以是圆形状、椭圆形状或矩形形状。在搭载于下侧布线基板10上的半导体元件11内设置有发光或受光的功能部的情况下,当从上侧布线基板20侧观察开口部21时,能够目视此发光或受光功能部的形状即可。半导体元件11的厚度为约100μm~150μm的程度。
例如,在照相机模块中采用半导体模块1的情况下,在此开口部21的周边(上侧布线基板20的上表面)配置有用于驱动此透镜的芯片部件(例如驱动IC、电源IC、电阻、电容等无源部件等芯片部件)。
此外,在光学滤镜的一个实例中,设置截断红外线的IR截止滤镜22以覆盖开口部21。作为光学滤镜,除此之外可列举紫外线截止滤镜、偏振片等。这些光学滤镜根据需要设置即可。
接着,说明图2(B)所示的下侧布线基板10。
下侧布线基板10是具有由多个布线层及绝缘层构成的所谓多层布线层的布线基板,是比上述的上侧布线基板20的外周端部更大的布线基板。作为一个实例,为比上侧布线基板20的纵长度及横长度分别大2mm左右的纵约10mm、横约10mm左右的尺寸。即,是上侧布线基板20的外周端部比下侧布线基板10的外周端部处于更内侧的结构。通过采用这样的结构,当在后述的照相机模块(参照后述的图7)中采用半导体模块1时,可作为支持框体40的区域(遮蔽部(庇部))使用。此外,下侧布线基板在层内具备成为基体材料的铜板,由此,能够维持布线基板的刚性。在下侧布线基板10的表面,在与开口部21对应的下侧布线基板10的大致中央部搭载有半导体元件11。此半导体元件11通过粘合树脂粘合在下侧布线基板10的表面上。再有,作为半导体元件11的具体实例,可列举作为受光元件的CMOS传感器、作为发光元件的LED、其它还有集成电路(IC)、大规模集成电路(LSI)等半导体芯片。如果是CMOS传感器或LED,则将CMOS传感器或LED配置为使其受光面成为开口部21的位置。
此外,在半导体元件11的上表面上形成有元件电极12,通过用接合引线14连接此元件电极12和设置在下侧布线基板10的表面上的电极端子13,来电连接下侧布线基板10和半导体元件11。
再有,半导体元件11也可以是在半导体元件11的下表面侧设置了此元件电极12的结构,此情况下不使用接合引线,通过所谓的倒装芯片安装与下侧布线基板10电连接即可。
此外,在后面详述利用焊球连接此下侧布线基板10和上侧布线基板20的连接部的详细结构。
通过焊球30电连接如上所述的上侧布线基板20和下侧布线基板10。
在此,图3表示沿图1的A-A′线的剖面图。
如图3所示,通过作为连接导电构件的焊球30电连接下侧布线基板10和上侧布线基板20。此焊球30配置在上侧布线基板20及下侧布线基板10的周围附近。
在布线基板10及布线基板20连接的周边的区域,形成有连接焊球30的第一电极160及第三电极161。此第一电极160及第三电极161构成为从形成在其上层的光阻焊剂18的开口部露出的结构。
在此,如前述的图1及图2所示,焊球30沿两布线基板10,20的各边以“彼此交错状”排列。即,当着眼于沿下侧布线基板10的某一边的焊球30时,则焊球30两列并排,并且在一列中的邻接的两个焊球之间重叠排列着另一列的焊球30。
通过这种排列,在上侧布线基板20及下侧布线基板10中能够有效地确保更多的连接区域,并且与排列成一列的情形相比,能够防止来自外部的不需要的光进入或光向外部泄漏。
并且,利用在环氧树脂等粘合树脂中混合了遮光材料的底层填料31覆盖此焊球30的周围并填充在邻接的焊球30间,由此能够使下侧布线基板10和上侧布线基板20之间的粘合力变得牢固,而且能够防止从半导体模块1泄漏光或外部光入射进来。
如上所述,在本申请中,通过将以“彼此交错状”进行配置以及覆盖焊球30的底层填料具有遮光性加以组合,能够防止焊球引起的从连接部向外部放出所需的光,相反,防止不需要的光从此处进入。
如在图1及图2(B)中用斜线(从左上向右下的斜线)所示,此底层填料31被设置在两布线基板10,20的周围。其内侧的端部设置在不覆盖半导体元件11的位置。下侧基板10具有比上侧布线基板20更突出的遮蔽部,在此部分设置照相机模块的框体的情况下,底层填料31不设置在遮蔽部,仅设置到上侧布线基板20的端部。
再有,例如通过利用切割机、钻孔机或激光器从上侧布线基板20切下与半导体元件11对应的位置形成开口部21。但是,在形成开口部21时,在其内表面(开口部内的相对的面)会产生凹凸24(参照图3)。于是,在使用半导体模块1中,从此凹凸24在半导体元件11上落下作为上侧布线基板20的切屑的绝缘树脂片,会整面地或部分地覆盖例如形成在半导体元件11的发光面或受光面,导致使发光或受光功能显著下降。因此,在凹凸24的表面上通过化学镀法(無電気めっき)例如在上侧布线基板20的表面形成电极的同时,用Ni层和层叠在此Ni层上的Au层(以下称为“Ni-Au层”。)25覆盖开口部21的内表面。由此,能够防止切屑从上侧布线基板20的开口部21内表面的凹凸24落在半导体元件上。同时,由于能够用此金属面反射来自发光面的光或到达受光面的光,所以能够更有效地利用这些光。
第一变化例
接着,在图4中示出了本申请的半导体模块的变化例。
图4所示的半导体模块与上述图3所示的半导体模块的不同点是上侧布线基板20和下侧布线基板10的形状。
在图3中的上侧布线基板20上朝向同图的上方向设置有对应半导体元件11的形状的凹部17,与此相比,图4所示的半导体模块的结构为上侧布线基板20不具有凹部而具有开口部21。这样,由于没有凹部,布线基板20本身无需被挖除,所以能够增大上侧布线基板20的强度。
另一方面,下侧布线基板10具有凹部17,在此凹部17内容纳有半导体元件11。另外,上侧布线基板20和下侧布线基板10在其周边通过焊球30电连接。如此,在下侧布线基板10中,由于在凹部17内配置有半导体元件11,所以当此半导体元件11为受光传感器或发光元件时,能够可靠地防止来自外部的不需要的光的入射或光的泄漏。
第二变化例
在图5中示出了本申请的半导体模块的另一变化例。
图5所示的半导体模块与上述图3所示的半导体模块的不同点是上侧布线基板20的形状和大小。
在图3中的上侧布线基板20上朝向同图的上方向设置有对应半导体元件11的形状的凹部,与此相比,图5所示的半导体模块的结构为上侧布线基板20不具有凹部而具有开口部21。这样,由于没有凹部,布线基板20本身无需被挖除,所以能够增大上侧布线基板20的强度。此外,在图3中虽然设置了遮蔽部,但在图5中上侧布线基板和下侧布线基板的大小相等。
第三变化例
在图6中示出了本申请的半导体模块的又一个变化例。
图6所示的半导体模块与上述图3所示的半导体模块的不同点是在设置于下侧布线基板10的凹部内设置有搭载在下侧布线基板10上的半导体元件11。再有,不具有光学滤镜。
这样,通过在设置于下侧布线基板10的凹部17中配置半导体元件11,能够可靠地防止焊球30引起的从连接部入射外部光而导致的向半导体元件输入而引起的误工作。此外,由于配置了半导体元件11的凹部的底部周围向上侧布线基板20方向突出,所以连接部中的下侧布线基板10和上侧布线基板20之间的距离变短,因此能够减小焊球30的高度及宽度。此外,由于能够减小焊球30的宽度,所以能够减小下侧布线基板10的凹部17以外周边区域的宽度。
第二实施方式
接着,参照图7说明在照相机模块中采用本申请的半导体模块的情形。
图7表示在照相机模块中采用本申请的半导体模块的剖面图。
如前所述,在以铜板15为基体材料的下侧布线基板10的上表面,通过粘合材料固定CMOS传感器11以便能够接收来自开口部21的光。CMOS传感器11的电极12和下侧布线基板10的电极13通过接合引线14电连接。
上侧布线基板20通过其周边的焊球30与下侧布线基板10连接。此外,在开口部21的周边区域,配置有驱动后述的透镜41的驱动IC、无源元件(电阻、电容等)。不仅能够配置透镜,还能够配置驱动CMOS传感器的芯片等。
为了遮断向图像传感器11流入的过度长波长的红外线,在透镜41和CMOS传感器11之间配置有覆盖开口部21的IR截止滤镜22。
由于用混入了遮光材料的底层填料剂31覆盖了设置在连接部的焊球30,所以能够防止外部光从连接部进入。此时,虽然底层填料剂在图7中不覆盖CMOS传感器11的端部,但也可以包括接合引线14及电极12,连传感器部的附近都覆盖,由此,能够进一步防止来自连接部的外部光的进入。
在由上侧布线基板10和下侧布线基板20构成的半导体模块1的上侧,结合有支持照相机透镜的框体40。框体40包括聚集外部光(风景、人物等影像)的透镜41、用于调整此透镜41的焦点的可上下移动的可动部42和取入外部光的开口部43。
在此,上侧布线基板20比下侧布线基板10面积更小,上侧布线基板20的外周端部的整个周围位于比下侧布线基板10的外周端部更靠内侧。即,由于下侧布线基板10比上侧布线基板20更向外方向突出,所以在下侧布线基板10存在支持框体40的支持区域(遮蔽部)44。在此支持区域44中,通过粘合剂或者在上侧布线基板20或在框体40的内周表面设置的螺钉部的螺纹结合来固定框体40和半导体模块1。
如上所述,在照相机模块中能够采用本申请的半导体模块。
相对于此,在现有的结构中,由于在由布线基板10和框体40形成的空间内需要平面地并列配置用于驱动透镜的驱动IC、无源元件,所以面积变大。
但是,如上所述,通过在照相机模块中采用本申请的半导体模块,能够得到小型化的照相机模块。即,由于能够在上侧布线基板20的开口部21周边配置用于驱动透镜的驱动IC、无源元件,所以小型化成为可能。
再有,在上述的图3至图7中,虽然示出了用密封树脂280覆盖上侧布线基板10的结构,但也可以根据需要设置此密封树脂280。如果设置密封树脂,则能够保护芯片部件23,但在不设置的情况下能够谋求减轻相当于此密封树脂的重量。
此外,在本申请的半导体模块中,也可以使上侧布线基板10的外周端部比下侧布线基板20的外周端部更处于内侧,或者上侧布线基板及下侧布线基板的外周端部面为同一平面。
本申请基于并要求2009年3月31日申请的首次日本专利申请No.2009-086620的优先权;在此引用其全部内容作为参考。
Claims (13)
1.一种半导体模块,其特征在于,包括:
搭载有半导体元件的第一布线基板;以及
在对应所述半导体元件的位置具有开口部且在此开口部的周边具有可搭载安装部件的区域的第二布线基板;
在所述半导体元件的周围通过多个导电构件电连接所述第一布线基板和所述第二布线基板;
所述多个导电构件被遮光性材料覆盖。
2.根据权利要求1所述的半导体模块,其特征在于,
在所述多个连接导电构件间填充有所述遮光性材料。
3.根据权利要求1所述的半导体模块,其特征在于,
从所述第一布线基板侧或第二布线基板侧俯视时,所述多个连接导电构件以彼此交错状配置在所述半导体元件的周围。
4.根据权利要求2所述的半导体模块,其特征在于,
从所述第一布线基板侧或第二布线基板侧俯视时,所述多个连接导电构件以彼此交错状配置在所述半导体元件的周围。
5.根据权利要求1所述的半导体模块,其特征在于,
所述第二布线基板的外周端部与所述第一布线基板的外周端部一致或者位于所述第一布线基板的外周端部的内侧。
6.根据权利要求2所述的半导体模块,其特征在于,
所述第二布线基板的外周端部与所述第一布线基板的外周端部一致或者位于所述第一布线基板的外周端部的内侧。
7.根据权利要求3所述的半导体模块,其特征在于,
所述第二布线基板的外周端部与所述第一布线基板的外周端部一致或者位于所述第一布线基板的外周端部的内侧。
8.根据权利要求1所述的半导体模块,其特征在于,
所述第一布线基板具有凹部,在该凹部内具有所述半导体元件。
9.一种照相机模块,其特征在于,
包括权利要求1所述的半导体模块。
10.一种照相机模块,其特征在于,
包括权利要求2所述的半导体模块。
11.一种照相机模块,其特征在于,
包括权利要求3所述的半导体模块。
12.一种照相机模块,其特征在于,
包括权利要求5所述的半导体模块。
13.一种照相机模块,其特征在于,
包括权利要求8所述的半导体模块。
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2010
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- 2010-03-31 CN CN201010155272A patent/CN101853846A/zh active Pending
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JP2010238995A (ja) | 2010-10-21 |
US20100244171A1 (en) | 2010-09-30 |
US8269298B2 (en) | 2012-09-18 |
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