CN101846471B - 一种均热板 - Google Patents
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
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- 239000000843 powder Substances 0.000 claims abstract description 7
- 238000010276 construction Methods 0.000 claims description 23
- 238000005476 soldering Methods 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 5
- 239000012224 working solution Substances 0.000 claims description 4
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
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- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
一种均热板,其包括圆管压扁成形的扁状金属管、设置于金属管内壁上的粉末烧结部、位于金属管内、并被金属管包覆住的支撑结构、填充于金属管内的工作液,其中所述金属管的上、下面均为平面状,且连接上、下平面的两个相对侧边呈圆弧状;另外两个相对边,为金属管两端开口经压合后封焊而成的密封口;本发明的均热板,可以顺利解决目前的使用CPU,Graphic processor,或者LED,Solar cell等等高发热性的电子产品的散热问题。
Description
技术领域
本发明涉及一种均热板,尤其是一种均热板及其支撑结构。
背景技术
现在市面上越来越多的精密电子产品性能都非常强大,在高速的工作运转下,相应产生的热流密度也会很高,而传统的散热装置,多为铝挤压散热片和风扇式的,在针对这些精密电子产品的散热上,会略显吃力。因此目前行业内许多厂家不断开发出新型的热管以及均热板类散热元件,这类散热元件具有较大的导热性,能够结合散热片有效解决电子产品的散热问题。其中,有一类具有液-气两相变化功能的均热板,因为在均热板上具有一个较宽广的部位,可直接接触产生热量的电子元件,让热量呈平面辐射状的方式散发,因此,这类均热板相比一般的呈线形散热的热管,具有更好的散热效果。
如图1所示,此类传统的均热板结构,主要是由上外壳01、下外壳02及设于上、下外壳内的支撑物03等元件组成,在制造过程中需要将各元件设置于外壳内,再对外壳进行压合,而该工艺过程往往工艺难度较大:倘若外壳的壁太薄,则高温操作时,容易连同支撑结构同步塌陷;而若是外壳的壁太厚,又容易使得总重量的设计超过设计标准;此外,均热板面积较大,使得四边的边长较长,因此压合及焊接时稍有不均匀,容易成为高温操作时的爆开点。可见,传统的均热板在制造成型时工艺较复杂、难度较高,容易出现不良品,导致生产成本增高。
发明内容
本发明的目的在于提供一种结构更为合理、高功效并且能够节省生产成本的均热板结构。
本发明为解决其技术问题所采用的技术方案是:
一种均热板,其特征在于包括:
一经圆管压扁成形的扁状金属管,金属管内壁上设有粉末烧结部;
一位于金属管内、并被金属管包覆住的支撑结构;
填充于金属管内的工作液;
其中所述金属管的上、下面均为平面状,且连接上、下面的两个相对侧边呈圆弧状;另外两个相对边,为金属管两端开口经压合后封焊而成的密封口,如此所形成的总封焊长度最短,同时密封可靠度高。
所述支撑物结构由金属射出成形(Metal Injection Molding,MIM)所构成的。
作为上述方案的进一步改进,所述支撑结构为带有凸起的板状。
作为上述方案的进一步改进,所述支撑结构上的凸起呈现波峰波谷交替分布。
本发明的有益效果是:本发明所提供的一压扁的金属管状,内部设有金属粉末烧结结构,该金属管内部呈现中空状,在填入耐高温的支撑结构,如金属射出成型,耐高温能力更强,且质量轻,同时坚硬程度超过大部份金属结构,可以说是最佳的支撑结构的材料选择;此外,支撑结构上凸起的优选呈现梯形波峰波谷交替的形状,可以均分施加在均热板表面上的外力,使得受力均匀,以避免均热板坍塌或变形;本发明的均热板,可以顺利解决目前的使用CPU,Graphic processor,或者LED,Solarcell等等高发热性的电子产品的散热问题。
附图说明
下面结合附图和具体实施方式作进一步说明:
图1为传统均热板的拆分结构示意图;
图2为本发明的金属管的结构示意图;
图3为本发明的结构示意图;
图4为图4中A-A截面的结构示意图;
图5为图4中B-B截面的结构示意图;
图6为本发明第一种实施例中支撑结构的示意图;
图7为本发明第二种实施例中支撑结构的示意图;
具体实施方式
参照图2~图5,本发明所提供的一种均热板,包括经圆管压扁成形的扁状金属管1、设置于金属管1内壁上的粉末烧结部2、位于金属管1内、并被金属管1包覆住的支撑结构3以及填充于金属管1内的工作液;金属圆管两端部为开口,因此在压扁后的金属管1两端,为扁平状的开口,并经过压合之后进行封焊,形成狭长的密封口14,其结构如图3及图5所示;而且,经压扁后,所述金属管1的上面11及下面12成为较宽的平面状,同时,连接上面11及下面12的两个相对侧边13呈圆弧状,其结构如图2、图3所示。该结构的优点是:均热板外壳的原材料可直接采用圆形金属管来制造,而不需要通过两块分离的金属板组合,在压合时更为容易,可以简化原材料成本及降低制造难度;而且,通过圆形金属管压制的外壳,只具有首、尾两端开口,两个相对侧边13是一体相连密封的,因此一方面在密封均热板时,只需要对首、尾两端的开口进行密封操作,通过压合之后再进行封焊,形成密封口14,如图3所示,金属管1每一端的密封的长度为L,等于原圆管内径圆周长的一半,则金属管1两端密封的总焊接长度为2L,等于金属管1内壁的一圆周长,如此可形成最短焊接长度的设计,保证密封可靠度,并可以极大简化均热板封口的工艺难度,提高成品率,降低生产成本;另一方面,最终的均热板成品,也因而具有更好的密封性,不容易出现工作液泄露等问题。
作为本发明的优选实施方式,所述支撑物结构3由金属射出成形所构成的,由于支撑物结构3的形状特性,采用金属射出成形,不但能降低支撑物结构3的生产时间及成本,而且所制造出来的成品,能够具有高耐温行,而且质量轻,硬度也超过了大部分金属结构,可以说是最佳的支撑结构的材料选择。
为了增加其支撑可靠性,优选所述支撑结构3为带有凸起31的板状。其中,凸起31一般通过是在支撑结构3经冲压或其他工艺一体成形的,可以保证支撑结构3的强度与支撑能力,如图6所示的第一种实施例中,凸起31呈现梯形波峰波谷交替,平均分布于支撑结构3上,可以使得每个波峰支撑住其同一侧金属管1内壁的相应部位,因此在均热板受力时,每个受支撑结构3支撑的部位将均分所受到的压力,使得均热板上面11和下面12的受力都基本相同,较为平均,其支撑能力优秀,避免均热板坍塌或变形;如图7所示,本发明的另一种实施例中,所述的凸起31呈梯形凸起,并波浪状平均分布于支撑结构3上,其优点是梯形的上端面可正好对应于金属管1的内壁平面上,可以得到面接触,并且如同第一种实施例中,可以均分均热板所受到的压力,达到较好的使用效果。
另外,作为优选的方案,所述密封口14外设有锡焊层,作为补强焊接,以增强产品的可靠度。
下面列举了本发明中各结构的优选规格,同时也是最长用到的规格:所述金属管1的管壁厚度为1.0-5mm;所述粉末烧结部2厚度为0.3-1.0mm;此外,同时整个均热板外表厚度为3-12mm;该规格的均热板适合于大部分电子元件结构,且强度也满足了日常工作的需要,同时结构轻薄短小,成本也能够控制在较低的范围内。
本发明的主旨在于可应用于CPU,Graphic processor,或者LED,Solar cell等等高发热性的电子产品上,以解决这些电子产品的散热问题,同时其兼顾了产品的结构强度,以及通过采用圆形金属管的原料对生产工艺作出了简化,并通过更为合理的结构达,在合适尺寸下最优的使用效果,因此可以说,本发明是一种性能极为优越的均热板结构,
当然,上述只是阐述了本发明较优的实施方式,因此并不视为本发明唯一的保护范围,惟应了解的是在不脱离本发明的保护范围内,对于本发明所属技术领域中具有通常知识者而言,仍得有许多变化及修改。因此,本发明并不限制于所揭露的实施例,而是以后附申请专利范围之文字记载为准,即不偏离本发明申请专利范围所为之均等变化与修饰,应仍属本发明之涵盖范围。
Claims (7)
1.一种均热板,其特征在于:包括:
一经圆管压扁成形的扁状金属管(1),金属管(1)内壁上设有粉末烧结部(2);
一位于金属管(1)内、并被金属管(1)包覆住的耐高温支撑结构(3),所述支撑结构(3)由金属射出成形所构成的;
填充于金属管(1)内的工作液;
其中所述金属管(1)的上、下面(11、12)均为平面状,且连接上、下面(11、12)的两个相对侧边(13)呈圆弧状;另外两个相对边,为金属管(1)两端开口经压合后封焊而成的密封口(14),所述密封口(14)外设有锡焊层;密封口(14)的总封焊长度为金属管(1)内壁的一圆周周长。
2.根据权利要求1所述的一种均热板,其特征在于:所述支撑结构(3)为带有凸起(31)的板状。
3.根据权利要求2所述的一种均热板,其特征在于:所述支撑结构(3)上的凸起(31)呈现梯形波峰波谷交替分布。
4.根据权利要求2所述的一种均热板,其特征在于:所述支撑结构(3)上的凸起(31)呈梯形波浪状分布。
5.根据权利要求1所述的一种均热板,其特征在于:所述金属管(1)的管壁厚度为1.0-5mm。
6.根据权利要求1所述的一种均热板,其特征在于:所述粉末烧结部(2)厚度为0.3-1.0mm。
7.根据权利要求1所述的一种均热板,其特征在于:整个均热板外表厚度为3-12mm。
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CN201010180396.4A CN101846471B (zh) | 2010-05-15 | 2010-05-15 | 一种均热板 |
US13/090,715 US20110277955A1 (en) | 2010-05-15 | 2011-04-20 | Vapor chamber |
US13/090,712 US8590154B2 (en) | 2010-05-15 | 2011-04-20 | Vapor chamber manufacturing method |
JP2011109488A JP2011243987A (ja) | 2010-05-15 | 2011-05-16 | ベーパーチェンバーの製造方法及びベーパーチェンバー |
JP2011109475A JP2011242125A (ja) | 2010-05-15 | 2011-05-16 | ベーパーチェンバーの製造方法及びベーパーチェンバー |
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-
2010
- 2010-05-15 CN CN201010180396.4A patent/CN101846471B/zh active Active
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2011
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- 2011-05-16 JP JP2011109488A patent/JP2011243987A/ja active Pending
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US20110277955A1 (en) | 2011-11-17 |
CN101846471A (zh) | 2010-09-29 |
JP2011243987A (ja) | 2011-12-01 |
JP2011242125A (ja) | 2011-12-01 |
US8590154B2 (en) | 2013-11-26 |
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