CN101817969A - 节能灯用电容器浸渍料 - Google Patents

节能灯用电容器浸渍料 Download PDF

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Publication number
CN101817969A
CN101817969A CN201010145747A CN201010145747A CN101817969A CN 101817969 A CN101817969 A CN 101817969A CN 201010145747 A CN201010145747 A CN 201010145747A CN 201010145747 A CN201010145747 A CN 201010145747A CN 101817969 A CN101817969 A CN 101817969A
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percent
capacitor
product
energy
dipping material
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李梅
倪保林
郑美
许月飞
李超超
柯云
汪鲁旭
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Changxing Huaqiang Electronics Co Ltd
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Changxing Huaqiang Electronics Co Ltd
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Priority to CN201010145747A priority Critical patent/CN101817969A/zh
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Abstract

本发明公开了节能灯用电容器浸渍料,包括环氧树脂,以环氧树脂为质量百分比的基数,其余成分如下:5300消泡剂0.1~0.15%,6500消泡剂0.1~0.15%,351铬璃粉4~6%,硅微粉60~70%,二氧化硅2~3%,固化剂20~25%,苯乙烯20~30%。本发明大大提高了产品可靠性和使用寿命,产品表面光亮、平整,基本消除了表面气泡,产品外观包封严密性好,彻底避免露白现象,引线上不易产生残留物,在高温下绝缘电阻大幅度提高,提高了电容器的质量。

Description

节能灯用电容器浸渍料
技术领域
本发明涉及电容器浸渍工艺中使用的浸渍料。
背景技术
电容器生产过程中,对电容器进行严格真空下的浸渍处理,用于提高电容器的外观质量和电容器的可靠性及使用寿命。目前在浸渍处理中使用的浸渍料,包括环氧树脂,以环氧树脂为质量百分比的基数,其余成分为:351铬璃粉8~10%,硅微粉25~35%,二氧化硅5~7%,固化剂30~35%,苯乙烯30~35%。采用上述浸渍料,电容器表面容易产生气泡,平整度较差,导致在外观包封时严密性差,出现露白现象,影响电容器的可靠性和使用寿命。
发明内容
本发明的目的在于提供节能灯用电容器浸渍料,可以有效解决现有浸渍料导致电容器表面容易产生气泡,平整度较差,在外观包封时严密性差,出现露白现象,影响电容器的可靠性和使用寿命的问题。
为了解决上述技术问题,本发明采用如下技术方案:节能灯用电容器浸渍料,其特征在于:包括环氧树脂,以环氧树脂为质量百分比的基数,其余成分如下:
5300消泡剂0.1~0.15%,
6500消泡剂0.1~0.15%,
351铬璃粉4~6%,
硅微粉60~70%,
二氧化硅2~3%,
固化剂20~25%,
苯乙烯20~30%。
优选的,固化剂为脂肪多元胺、多乙烯多胺或者三甲基己二胺。
本发明由于采用了上述技术方案,大大提高了产品可靠性和使用寿命,产品表面光亮、平整,基本消除了表面气泡,产品外观包封严密性好,彻底避免露白现象,引线上不易产生残留物,在高温下绝缘电阻大幅度提高,提高了电容器的质量。
具体实施方式
节能灯用电容器浸渍料,包括环氧树脂,以环氧树脂为质量百分比的基数,其余成分如下:
5300消泡剂0.1~0.15%,
6500消泡剂0.1~0.15%,
351铬璃粉4~6%,
硅微粉60~70%,
二氧化硅2~3%,
固化剂20~25%,固化剂为脂肪多元胺、多乙烯多胺或者三甲基己二胺;
苯乙烯20~30%。
采用上述浸渍料进行浸渍处理,产品外观改善效果明显(以下百分比为每一定数量的批次产生缺陷的概率,以10000只/批次为例):
Figure GSA00000063435100021

Claims (2)

1.节能灯用电容器浸渍料,其特征在于:包括环氧树脂,以环氧树脂为质量百分比的基数,其余成分如下:
5300消泡剂  0.1~0.15%,
6500消泡剂  0.1~0.15%,
351铬璃粉   4~6%,
硅微粉      60~70%,
二氧化硅    2~3%,
固化剂      20~25%,
苯乙烯      20~30%。
2.根据权利要求1所述的节能灯用电容器浸渍料,其特征在于:所述固化剂为脂肪多元胺、多乙烯多胺或者三甲基己二胺。
CN201010145747A 2010-04-08 2010-04-08 节能灯用电容器浸渍料 Pending CN101817969A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010145747A CN101817969A (zh) 2010-04-08 2010-04-08 节能灯用电容器浸渍料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010145747A CN101817969A (zh) 2010-04-08 2010-04-08 节能灯用电容器浸渍料

Publications (1)

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CN101817969A true CN101817969A (zh) 2010-09-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103881310A (zh) * 2014-04-11 2014-06-25 上海神沃电子有限公司 一种无卤环保热敏电阻用环氧树脂包封材料及应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4173593A (en) * 1977-04-05 1979-11-06 Westinghouse Electric Corp. Metal acetylacetonate latent accelerators for an epoxy-styrene resin system
JPS6234920A (ja) * 1985-08-07 1987-02-14 Toshiba Corp エポキシ樹脂組成物およびそれを用いた樹脂封止型半導体装置
CN1185467A (zh) * 1996-12-18 1998-06-24 闳邦实业股份有限公司 用于绝缘涂装电容器的单液型环氧树脂浸剂
US20020132094A1 (en) * 2000-12-27 2002-09-19 Ngk Spark Plug Co., Ltd. Wiring board and method for fabricating the same
TW200922961A (en) * 2007-09-27 2009-06-01 Mitsubishi Gas Chemical Co Epoxy resin composition, hardened product thereof and light-emitting diode

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4173593A (en) * 1977-04-05 1979-11-06 Westinghouse Electric Corp. Metal acetylacetonate latent accelerators for an epoxy-styrene resin system
JPS6234920A (ja) * 1985-08-07 1987-02-14 Toshiba Corp エポキシ樹脂組成物およびそれを用いた樹脂封止型半導体装置
CN1185467A (zh) * 1996-12-18 1998-06-24 闳邦实业股份有限公司 用于绝缘涂装电容器的单液型环氧树脂浸剂
US20020132094A1 (en) * 2000-12-27 2002-09-19 Ngk Spark Plug Co., Ltd. Wiring board and method for fabricating the same
TW200922961A (en) * 2007-09-27 2009-06-01 Mitsubishi Gas Chemical Co Epoxy resin composition, hardened product thereof and light-emitting diode
CN101809056A (zh) * 2007-09-27 2010-08-18 三菱瓦斯化学株式会社 环氧树脂组合物和环氧树脂固化物以及发光二极管

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103881310A (zh) * 2014-04-11 2014-06-25 上海神沃电子有限公司 一种无卤环保热敏电阻用环氧树脂包封材料及应用

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Application publication date: 20100901