CN101801668A - 丝网印刷机及方法 - Google Patents
丝网印刷机及方法 Download PDFInfo
- Publication number
- CN101801668A CN101801668A CN200880012124A CN200880012124A CN101801668A CN 101801668 A CN101801668 A CN 101801668A CN 200880012124 A CN200880012124 A CN 200880012124A CN 200880012124 A CN200880012124 A CN 200880012124A CN 101801668 A CN101801668 A CN 101801668A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- operated
- end effector
- process press
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 132
- 230000008569 process Effects 0.000 title claims abstract description 105
- 239000000463 material Substances 0.000 claims abstract description 103
- 239000012636 effector Substances 0.000 claims abstract description 87
- 238000007639 printing Methods 0.000 claims abstract description 84
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 238000012797 qualification Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 5
- 238000011017 operating method Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims 8
- 238000009434 installation Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/12—Machines with auxiliary equipment, e.g. for drying printed articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
- B41M1/125—Stencil printing; Silk-screen printing using a field of force, e.g. an electrostatic field, or an electric current
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (39)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89067507P | 2007-02-20 | 2007-02-20 | |
US60/890,675 | 2007-02-20 | ||
PCT/EP2008/001275 WO2008101663A1 (en) | 2007-02-20 | 2008-02-19 | Screen printing machine and method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101801668A true CN101801668A (zh) | 2010-08-11 |
CN101801668B CN101801668B (zh) | 2015-09-30 |
Family
ID=38050428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880012124.4A Active CN101801668B (zh) | 2007-02-20 | 2008-02-19 | 丝网印刷机及方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9327490B2 (zh) |
EP (1) | EP2117845B1 (zh) |
CN (1) | CN101801668B (zh) |
AT (1) | ATE482084T1 (zh) |
DE (1) | DE602008002714D1 (zh) |
GB (1) | GB2446884B (zh) |
HK (1) | HK1138542A1 (zh) |
WO (1) | WO2008101663A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102092178A (zh) * | 2010-12-22 | 2011-06-15 | 常州聚诚科技有限公司 | 电视机面板丝网印刷装置 |
CN102501615A (zh) * | 2011-10-12 | 2012-06-20 | 江苏锐毕利实业有限公司 | 刚性印制电路板喷印定位方法 |
CN104551291A (zh) * | 2013-10-21 | 2015-04-29 | 泰科电子(上海)有限公司 | 自动焊接*** |
CN105015151A (zh) * | 2015-07-31 | 2015-11-04 | 苏州宏展信息科技有限公司 | 一种小型焊膏丝印台 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007019073A1 (de) * | 2007-04-23 | 2008-11-06 | Ekra Automatisierungssysteme Gmbh Asys Group | Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate |
US8739699B2 (en) * | 2010-12-08 | 2014-06-03 | Illinois Tool Works Inc. | Combination stencil printer and dispenser and related methods |
US8746139B2 (en) * | 2010-12-08 | 2014-06-10 | Illinois Tool Works Inc. | Combination stencil printer and dispenser and related methods |
US8733244B2 (en) * | 2010-12-08 | 2014-05-27 | Illinois Tool Works, Inc. | Methods for depositing viscous material on a substrate with a combination stencil printer and dispenser |
US8474377B2 (en) * | 2010-12-08 | 2013-07-02 | Illinois Tool Works Inc. | Combination stencil printer and dispenser and related methods |
US11176635B2 (en) * | 2013-01-25 | 2021-11-16 | Cyberoptics Corporation | Automatic programming of solder paste inspection system |
US10137528B2 (en) * | 2014-12-15 | 2018-11-27 | Autodie Llc | Blank etching fixture |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5792268A (en) * | 1993-07-02 | 1998-08-11 | Sci Systems, Inc. | Printered circuit board screen printer vacuum holding apparatus |
GB2362132A (en) * | 2000-05-09 | 2001-11-14 | Matsushita Electric Ind Co Ltd | Screen printing apparatus for a printed circuit board having defect measuring and inspection means |
GB2377908A (en) * | 2001-05-31 | 2003-01-29 | Blakell Europlacer Ltd | Screen printer for PCB with alignment apparatus |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5110615A (en) * | 1990-01-31 | 1992-05-05 | Asymptotic Technologies, Inc. | Method for dispensing viscous materials a constant height above a workpiece surface |
JPH05160549A (ja) * | 1991-12-11 | 1993-06-25 | Hitachi Ltd | 印刷配線板の回路パタ−ン切除方法および装置 |
JPH07185999A (ja) * | 1993-12-28 | 1995-07-25 | Seikosha Co Ltd | プリント基板の穴明け装置 |
US5794329A (en) * | 1995-02-27 | 1998-08-18 | Mpm Corporation | Support apparatus for circuit board |
SG71804A1 (en) * | 1995-08-30 | 2000-04-18 | Matsushita Electric Ind Co Ltd | Screen printing method and screen printing apparatus |
IT1283534B1 (it) * | 1996-07-26 | 1998-04-21 | Aisa Spa | Macchina per la stampa serigrafica di lastre dotata di apparecchiatura di registrazione della posizione relativa tra la lastra e il retino |
US5709905A (en) * | 1997-01-28 | 1998-01-20 | Motorola, Inc. | Apparatus and method for automatic monitoring and control of stencil printing |
JPH10217427A (ja) * | 1997-02-12 | 1998-08-18 | Matsushita Electric Ind Co Ltd | クリーム半田印刷方法及び印刷機 |
JP4014270B2 (ja) * | 1998-01-06 | 2007-11-28 | 富士機械製造株式会社 | 基板支持ピン配置方法,配置検査方法および装置 |
JP2000168040A (ja) * | 1998-12-04 | 2000-06-20 | Minami Kk | スクリーン印刷機 |
US6541063B1 (en) * | 1999-11-04 | 2003-04-01 | Speedline Technologies, Inc. | Calibration of a dispensing system |
KR200236121Y1 (ko) | 2000-03-10 | 2001-10-06 | (주)에이알아이 | 인쇄회로기판의 솔더 페이스트 검사 및 도포장치 |
US6510356B2 (en) * | 2001-04-02 | 2003-01-21 | Hewlett-Packard Company | Method and apparatus for programming a paste dispensing machine |
US6890050B2 (en) * | 2002-08-20 | 2005-05-10 | Palo Alto Research Center Incorporated | Method for the printing of homogeneous electronic material with a multi-ejector print head |
KR100540633B1 (ko) * | 2003-06-20 | 2006-01-11 | 주식회사 탑 엔지니어링 | 페이스트 도포기 및 그 제어 방법 |
US20050268799A1 (en) * | 2004-06-02 | 2005-12-08 | Speedline Technologies, Inc. | Solder paste lateral flow and redistribution system and methods of same |
JP2006167991A (ja) | 2004-12-13 | 2006-06-29 | Denso Corp | スクリーン印刷装置及びその印刷方法 |
US20070102477A1 (en) * | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Imaging system and method for a stencil printer |
DE102007019073A1 (de) | 2007-04-23 | 2008-11-06 | Ekra Automatisierungssysteme Gmbh Asys Group | Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate |
-
2007
- 2007-03-29 GB GB0706091.6A patent/GB2446884B/en not_active Withdrawn - After Issue
-
2008
- 2008-02-19 DE DE602008002714T patent/DE602008002714D1/de active Active
- 2008-02-19 CN CN200880012124.4A patent/CN101801668B/zh active Active
- 2008-02-19 AT AT08734584T patent/ATE482084T1/de not_active IP Right Cessation
- 2008-02-19 US US12/527,954 patent/US9327490B2/en active Active
- 2008-02-19 EP EP08734584A patent/EP2117845B1/en active Active
- 2008-02-19 WO PCT/EP2008/001275 patent/WO2008101663A1/en active Application Filing
-
2010
- 2010-04-15 HK HK10103713.8A patent/HK1138542A1/xx unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5792268A (en) * | 1993-07-02 | 1998-08-11 | Sci Systems, Inc. | Printered circuit board screen printer vacuum holding apparatus |
GB2362132A (en) * | 2000-05-09 | 2001-11-14 | Matsushita Electric Ind Co Ltd | Screen printing apparatus for a printed circuit board having defect measuring and inspection means |
GB2377908A (en) * | 2001-05-31 | 2003-01-29 | Blakell Europlacer Ltd | Screen printer for PCB with alignment apparatus |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102092178A (zh) * | 2010-12-22 | 2011-06-15 | 常州聚诚科技有限公司 | 电视机面板丝网印刷装置 |
CN102092178B (zh) * | 2010-12-22 | 2012-05-30 | 常州聚诚科技有限公司 | 电视机面板丝网印刷装置 |
CN102501615A (zh) * | 2011-10-12 | 2012-06-20 | 江苏锐毕利实业有限公司 | 刚性印制电路板喷印定位方法 |
CN104551291A (zh) * | 2013-10-21 | 2015-04-29 | 泰科电子(上海)有限公司 | 自动焊接*** |
CN105015151A (zh) * | 2015-07-31 | 2015-11-04 | 苏州宏展信息科技有限公司 | 一种小型焊膏丝印台 |
Also Published As
Publication number | Publication date |
---|---|
CN101801668B (zh) | 2015-09-30 |
US20100206189A1 (en) | 2010-08-19 |
EP2117845A1 (en) | 2009-11-18 |
GB2446884B (en) | 2012-02-01 |
DE602008002714D1 (de) | 2010-11-04 |
WO2008101663A1 (en) | 2008-08-28 |
US9327490B2 (en) | 2016-05-03 |
GB2446884A (en) | 2008-08-27 |
GB0706091D0 (en) | 2007-05-09 |
EP2117845B1 (en) | 2010-09-22 |
HK1138542A1 (en) | 2010-08-27 |
ATE482084T1 (de) | 2010-10-15 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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Address after: Zurich Applicant after: DTG INTERNATIONAL GmbH Address before: Zurich Applicant before: DEK INTERNATIONAL GmbH |
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Free format text: CORRECT: APPLICANT; FROM: DEK INTERNAT GMBH TO: DEK INT GMBH |
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CP01 | Change in the name or title of a patent holder | ||
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Address after: Zurich Patentee after: DTG INTERNATIONAL GmbH Address before: Zurich Patentee before: DTG INTERNATIONAL GmbH |
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TR01 | Transfer of patent right |
Effective date of registration: 20170904 Address after: Singapore Singapore Patentee after: ASM ASSEMBLY SYSTEMS SINGAPORE Pte. Ltd. Address before: Zurich Patentee before: DTG INTERNATIONAL GmbH |
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