CN101794186A - Processing method for induction layers of capacitive touch panel - Google Patents

Processing method for induction layers of capacitive touch panel Download PDF

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Publication number
CN101794186A
CN101794186A CN201010128911A CN201010128911A CN101794186A CN 101794186 A CN101794186 A CN 101794186A CN 201010128911 A CN201010128911 A CN 201010128911A CN 201010128911 A CN201010128911 A CN 201010128911A CN 101794186 A CN101794186 A CN 101794186A
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China
Prior art keywords
layer
capacitive touch
touch panel
microns
induction layers
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Pending
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CN201010128911A
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Chinese (zh)
Inventor
陈栋南
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MUTTO OPTRONICS Corp
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MUTTO OPTRONICS Corp
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Priority to CN201010128911A priority Critical patent/CN101794186A/en
Publication of CN101794186A publication Critical patent/CN101794186A/en
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Abstract

The invention relates to a processing method for induction layers of a capacitive touch panel, which belongs to the technical field of processing induction layers of capacitive touch panels. In the method, a laser radiation means is adopted in the process of processing the induction layer of the capacitive touch panel so that surfaces of the processed products have no etch marks, lines are optimized, the production cost and the pollution exhaust are reduced, the production efficiency is improved, the touch control accuracy is high and the stability is good.

Description

The job operation of induction layers of capacitive touch panel
Technical field
The present invention relates to a kind of job operation of induction layers of capacitive touch panel, belong to the processing technique field of induction layers of capacitive touch panel.
Background technology
Modern laser is applied at numerous areas more and more, and the present invention utilizes accurately machining characteristics of laser just, adapts to the more and more higher requirement of processing technology of contact panel.Laser processing is meant according to digital information, with the laser beam rapidoprint, makes the material gasification at place that laser shines to replace the traditional employing chemical corrosion or the method for machining.Adopt laser to be processed with following advantage:
1, dirigibility: Any shape, do not need molding jig, as long as input needs the figure shelves of processing, laser beam just can process the pattern that needs by the figure shelves, need not any mould, so shortened production cycle of product.
2, accuracy is good: tolerance is little can also make automatic Compensation Regulation, and in traditional cross cutting, is difficult to change after mould is fixing.
3, production efficiency height: because do not need molding jig, only need input to need the pattern of processing, task saves time with connecing with doing, saving trouble.Last minute can also be regulated if any changing before beginning to process, and unlikelyly influences production.No matter simple or complicated machining shape, its processing cost is identical, and institute takes time also identical basically.Its process velocity basically can with the speeds match of digital printing, can the machine production of the company of formation.
4, economic benefit: operation is simple, such as complex procedures in traditional etch process: need silk-screen anti-etching printing ink → curing → harsh → cleaning/oven dry, and because traditional etched complex procedures can cause bad increase.
5, environmental protection:, therefore adopt Laser Processing can not produce any influence to environment because Laser Processing without any need for chemicals, does not produce any poisonous fume waste material etc. simultaneously yet.
Summary of the invention
Technical matters: the present invention is directed to the more and more higher requirement of contact panel processing technology, proposed a kind of job operation of induction layers of capacitive touch panel.The present invention uses the laser means in the inductive layer technology of processing capacitance touching control panel, make the product surface after the processing not have etching mark, and the line lines are optimized more, reduce production costs and disposal of pollutants, enhance productivity; Make touch-control degree of accuracy height, the effect of good stability.
Technical scheme: the invention discloses a kind of job operation of induction layers of capacitive touch panel, carry out under dustless condition, this method comprises the steps:
Step 1: four angles of conducting surface at the rectangle transparent conductive substrate are provided with a target respectively;
Step 2: utilize that four targets are provided with rectangular-shaped separation layer at the conducting surface of transparent conductive substrate in the step 1;
Step 3: along separation layer edge plating conductive layer in the step 2;
Step 4: if separation layer is a printing-ink, can utilize deinking agent such as palm oil methyl esters, soybean oil methyl esters, separation layer exposes rectangular-shaped conducting surface in the removal step 2;
Step 5: form patterned layer with rectangular-shaped conducting surface in the laser cutting step four;
Step 6: with metal conducting layer in the laser cutting step three, form electrode in patterned layer and metal conducting layer junction, electrode is that output terminal and lead-in wire are connected on the patterned layer edge as a whole together.
In the job operation of above-mentioned induction layers of capacitive touch panel, transparent conductive substrate is a conductive film in the step 1; Perhaps transparent conductive substrate is an electro-conductive glass, and conductive material is ITO (Indium Tin Oxide tin indium oxide) or indium-zinc oxide, and ITO material Direct Electroplating is on the surface of transparency carrier.Transparency carrier is film substrate, acrylic plate, glass substrate, and film substrate is that (Polythylene terephthalate, PET), glass substrate is meant wherein a kind of of soda-lime glass, pyrex, tempered glass to polyester.The step 3 metal conducting layer is conductive materials such as copper, silver, gold; The thickness range of metal conducting layer is between 0.1 micron to 5 microns; The width range of metal conducting layer is between 10 microns to 300 microns.Equidistant in the step 6 between the edge adjacent electrode is 10 microns to 300 microns.In the step 5 patterned layer with diamond-shaped element matrix or circular cell matrix form as sensing patterns cabling form.Because the laser cutting is little to the conductive material loss, so susceptibility height at the bottom of the conducting surface resistance is suitable for the widescreen contact panel.The laser output wavelength is 355 nanometer Ultra-Violet Lasers in step 5 and the step 6.
Beneficial effect: the job operation that the invention discloses a kind of induction layers of capacitive touch panel, the present invention is in the inductive layer technology of processing capacitance touching control panel, used the laser processing mode, thereby realized that successfully the product surface after the processing does not have etching mark, its outward appearance is more neat and artistic, the line lines are optimized smoothly more, can not produce the phenomenon that electrode departs from the conductive region end.By reducing production costs, enhance productivity with method processing capacitive sensing layer of the present invention; Make the touch-control degree of accuracy height of product, the effect of good stability.
Description of drawings:
Fig. 1 is the job operation process flow diagram of induction layers of capacitive touch panel of the present invention.
Fig. 2 is an embodiments of the invention processing capacitance touching control panel process concrete steps flowage structure synoptic diagram.Wherein have: transparent conductive substrate 1, target 2, separation layer 3, metal conducting layer 4, electrode 5, patterned layer 6.
Embodiment
Be that specific embodiments of the invention further describe below:
The job operation of induction layers of capacitive touch panel of the present invention is carried out following steps under dustless condition as shown in Figure 2;
Step 1: four angles of conducting surface at rectangle transparent conductive substrate 1 are provided with a target 2 respectively;
Step 2: utilize that four targets are provided with rectangular-shaped separation layer 3 at the conducting surface of transparent conductive substrate 1 in the step 1;
Step 3: along the 3 edge plating conductive layers 4 of separation layer in the step 2;
Step 4: separation layer 3 exposes rectangular-shaped conducting surface in the removal step 2;
Step 5: form patterned layer 6 with rectangular-shaped conducting surface in the laser cutting step four;
Step 6:, form electrode 5 in patterned layer 6 and metal conducting layer 4 junctions with metal conducting layer 4 in the laser cutting step three.
Transparent conductive substrate 1 is conductive film or electro-conductive glass in the above-mentioned steps one.Step 3 metal conducting layer 4 is wherein a kind of of copper, silver, gold; The thickness range of metal conducting layer 4 is between 0.1 micron to 5 microns; The width range of metal conducting layer 4 is between 10 microns to 300 microns.Separation layer 3 is a printing-ink in the step 2.Equidistant in the step 6 between the edge adjacent electrode is 10 microns to 300 microns.Patterned layer 6 is diamond-shaped element matrix or circular cell matrix in the step 5.The laser output wavelength is 355 nanometer Ultra-Violet Lasers in step 5 and the step 6.
Embodiment 1:
Among Fig. 2, under dustless condition;
Step 1: four angles of conducting surface at the rectangular conductive film are provided with a target respectively.
Step 2: utilize that four targets form rectangular-shaped separation layer at the conducting surface printing-ink of conductive film in the step 1.
Step 3: along electro-coppering conductive layer in separation layer edge in the step 2; The thickness of copper conductive layer is 5 microns, and the width of copper conductive layer is 55 microns.
Step 4: separation layer exposes rectangular-shaped conducting surface in the removal step 2.
Step 5: form the diamond-shaped element matrix with rectangular-shaped conducting surface in the laser cutting step four.
Step 6: with copper conductive layer in the laser cutting step three, at diamond-shaped element matrix and copper conductive layer junction formation electrode, equidistant between the edge adjacent electrode is 300 microns.
Embodiment 2:
Under dustless condition;
Step 1: four angles of conducting surface at the rectangular conductive film are provided with a target respectively.
Step 2: utilize that four targets form rectangular-shaped separation layer at the conducting surface printing-ink of conductive film in the step 1.
Step 3: along the silver-plated conductive layer in separation layer edge in the step 2; The thickness of silver conductive layer is 2 microns, and the width of silver conductive layer is 50 microns.
Step 4: separation layer exposes rectangular-shaped conducting surface in the removal step 2.
Step 5: form the diamond-shaped element matrix with rectangular-shaped conducting surface in the laser cutting step four.
Step 6: with silver conductive layer in the laser cutting step three, at diamond-shaped element matrix and silver conductive layer junction formation electrode, equidistant between the edge adjacent electrode is 200 microns.
Embodiment 3:
Under dustless condition;
Step 1: four angles of conducting surface at rectangular conductive glass are provided with a target respectively.
Step 2: utilize that four targets form rectangular-shaped separation layer at the conducting surface printing-ink of electro-conductive glass in the step 1.
Step 3: along the gold-plated conductive layer in separation layer edge in the step 2; The thickness of gold conductive layer is 0.1 micron, and the width of golden conductive layer is 10 microns.
Step 4: separation layer exposes rectangular-shaped conducting surface in the removal step 2.
Step 5: form the diamond-shaped element matrix with rectangular-shaped conducting surface in the laser cutting step four.
Step 6: with golden conductive layer in the laser cutting step three, at diamond-shaped element matrix and golden conductive layer junction formation electrode, equidistant between the edge adjacent electrode is 10 microns.

Claims (7)

1. the job operation of an induction layers of capacitive touch panel comprises the steps, it is characterized in that: described step is carried out under dustless condition;
Step 1: four angles of conducting surface at rectangle transparent conductive substrate (1) are provided with a target (2) respectively;
Step 2: utilize that four targets are provided with rectangular-shaped separation layer (3) at the conducting surface of transparent conductive substrate (1) in the step 1;
Step 3: along separation layer in the step 2 (3) edge plating conductive layer (4);
Step 4: separation layer (3) exposes rectangular-shaped conducting surface in the removal step 2;
Step 5: form patterned layer (6) with rectangular-shaped conducting surface in the laser cutting step four;
Step 6:, form electrode (5) in patterned layer (6) and metal conducting layer (4) junction with metal conducting layer (4) in the laser cutting step three.
2. the job operation of induction layers of capacitive touch panel according to claim 1, it is characterized in that: transparent conductive substrate in the described step 1 (1) is a conductive film; Perhaps transparent conductive substrate (1) is an electro-conductive glass.
3. the job operation of induction layers of capacitive touch panel according to claim 1 is characterized in that: described step 3 metal conducting layer (4) is wherein a kind of of copper, silver, gold; The thickness range of metal conducting layer (4) is between 0.1 micron to 5 microns; The width range of metal conducting layer (4) is between 10 microns to 300 microns.
4. the job operation of induction layers of capacitive touch panel according to claim 1, it is characterized in that: separation layer in the described step 2 (3) is a printing-ink.
5. the job operation of induction layers of capacitive touch panel according to claim 1 is characterized in that: equidistant in the described step 6 between the edge adjacent electrode is 10 microns to 300 microns.
6. the job operation of induction layers of capacitive touch panel according to claim 1, it is characterized in that: patterned layer in the described step 5 (6) is diamond-shaped element matrix or circular cell matrix.
7. the job operation of induction layers of capacitive touch panel according to claim 1, it is characterized in that: the laser output wavelength is 355 nanometer Ultra-Violet Lasers in the described step 5; The laser output wavelength is 355 nanometer Ultra-Violet Lasers in the step 6.
CN201010128911A 2010-03-22 2010-03-22 Processing method for induction layers of capacitive touch panel Pending CN101794186A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102750054A (en) * 2011-04-22 2012-10-24 上海晨兴希姆通电子科技有限公司 Capacitive touch screen and processing method thereof
CN102929471A (en) * 2012-11-21 2013-02-13 深圳爱商精密电子有限公司 Manufacturing method for capacitive touch screen
CN103309528A (en) * 2012-03-16 2013-09-18 瀚宇彩晶股份有限公司 Touch panel and manufacturing method thereof
CN103713764A (en) * 2013-08-28 2014-04-09 福建宝发光电科技有限公司 3D silkscreened OGS touchscreen and production method thereof
CN104793786A (en) * 2015-03-26 2015-07-22 无锡格菲电子薄膜科技有限公司 Manufacturing method for graphene touch screen sensor
WO2017156878A1 (en) * 2016-03-16 2017-09-21 意力(广州)电子科技有限公司 Capacitor, capacitive touch screen, and manufacturing method thereof
CN109592892A (en) * 2018-11-26 2019-04-09 武汉华工激光工程有限责任公司 A kind of laser processing of glass
CN114449774A (en) * 2022-02-28 2022-05-06 厦门市匠研新材料技术有限公司 Manufacturing process of conducting circuit

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CN1881536A (en) * 2005-06-16 2006-12-20 阿苏拉布股份有限公司 Fabrication method for a transparent device having transparent electrodes
CN101576790A (en) * 2008-05-09 2009-11-11 群康科技(深圳)有限公司 Manufacturing process for touch-control panel
CN101587413A (en) * 2008-05-19 2009-11-25 富士通电子零件有限公司 Method for manufacturing coordinate detector

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CN1881536A (en) * 2005-06-16 2006-12-20 阿苏拉布股份有限公司 Fabrication method for a transparent device having transparent electrodes
CN101576790A (en) * 2008-05-09 2009-11-11 群康科技(深圳)有限公司 Manufacturing process for touch-control panel
CN101587413A (en) * 2008-05-19 2009-11-25 富士通电子零件有限公司 Method for manufacturing coordinate detector

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102750054A (en) * 2011-04-22 2012-10-24 上海晨兴希姆通电子科技有限公司 Capacitive touch screen and processing method thereof
CN103309528A (en) * 2012-03-16 2013-09-18 瀚宇彩晶股份有限公司 Touch panel and manufacturing method thereof
CN102929471A (en) * 2012-11-21 2013-02-13 深圳爱商精密电子有限公司 Manufacturing method for capacitive touch screen
CN102929471B (en) * 2012-11-21 2015-08-12 深圳爱商精密电子有限公司 The method for making of capacitive touch screen
CN103713764A (en) * 2013-08-28 2014-04-09 福建宝发光电科技有限公司 3D silkscreened OGS touchscreen and production method thereof
CN104793786A (en) * 2015-03-26 2015-07-22 无锡格菲电子薄膜科技有限公司 Manufacturing method for graphene touch screen sensor
WO2017156878A1 (en) * 2016-03-16 2017-09-21 意力(广州)电子科技有限公司 Capacitor, capacitive touch screen, and manufacturing method thereof
CN109592892A (en) * 2018-11-26 2019-04-09 武汉华工激光工程有限责任公司 A kind of laser processing of glass
CN114449774A (en) * 2022-02-28 2022-05-06 厦门市匠研新材料技术有限公司 Manufacturing process of conducting circuit

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Application publication date: 20100804