CN203149522U - Touch panel - Google Patents
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- CN203149522U CN203149522U CN 201320107050 CN201320107050U CN203149522U CN 203149522 U CN203149522 U CN 203149522U CN 201320107050 CN201320107050 CN 201320107050 CN 201320107050 U CN201320107050 U CN 201320107050U CN 203149522 U CN203149522 U CN 203149522U
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- grid
- contact panel
- conducting channel
- grid conducting
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Abstract
The utility model discloses a touch panel, comprising a rigid transparent insulating substrate, an inductive electrode layer, a transparent insulating layer and a driving electrode layer, wherein the inductive electrode layer is formed on one surface of the rigid transparent insulating substrate and comprises a plurality of inductive electrodes which are independently arranged; the transparent insulating layer is formed on the inductive electrode layer; the driving electrode layer is formed on the transparent insulating layer and comprises a plurality of driving electrodes which are independently arranged; each driving electrode of the driving electrode layer comprises a grid conductive circuit; and the grid conductive circuits are embedded into the transparent insulating layer. The touch panel is relatively low in cost and higher in sensitivity.
Description
Technical field
The utility model relates to the touch technology field, particularly relates to a kind of contact panel.
Background technology
Contact panel is widely used in the various electronic installations that have a display screen, as smart mobile phone, TV, PDA, panel computer, notebook computer, comprise industry and show computing machines such as touching machining tool, integrated computing machine and super or electronic equipment etc.Contact panel can be divided into condenser type, resistance-type and surperficial optical waves type etc. according to principle of work.
Capacitance type touch-control panel is to utilize the electric current induction of human body to carry out work.When finger touch was on metal level, because people's bulk electric field, user and contact panel surface formed with a coupling capacitance, and for high-frequency current, electric capacity is direct conductor, so finger siphons away a very little electric current from contact point.This electric current flows out the electrode from four jiaos of contact panel respectively, and the electric current of these four electrodes of flowing through is directly proportional with the distance of finger to four jiaos, and controller draws touch point position by the accurate Calculation to these four current ratios.
Capacitance type touch-control panel all adopts glass ITO or film ITO(also namely to form at glass or film at present) formation drive electrode and induction electrode pattern.But above-mentioned glass ITO or film ITO form drive electrode and there is following shortcoming in the induction electrode pattern: ITO drive electrode or induction electrode projection are scratched easily on glass surface or transparent membrane surface or drop on the one hand, cause producing yield and reduce; On the other hand, glass ITO or film ITO main material mainly are the rare metal indiums, phosphide material rare, therefore cost is relatively more expensive, and ITO is bigger at the resistance of doing large touch panel or side's resistance, influence signaling rate, cause touch sensitivity poor, thereby it is not good enough to influence whole electronic product user experience sense.
The thickness of existing contact panel is thicker, thereby influences the integral thickness of mobile phone.
The utility model content
Based on this, be necessary to provide the contact panel that a kind of cost is lower, sensitivity is higher.
A kind of contact panel comprises: rigidity transparent insulation substrate; The induction electrode layer is formed at a surface of described rigidity transparent insulation substrate, comprises some independent induction electrodes that arrange; Transparent insulating layer is formed on the described induction electrode layer; Drive electrode layer is formed on the described transparent insulating layer, comprises some independent drive electrodes that arrange; Each drive electrode of described drive electrode layer comprises the grid conducting channel; Described grid conducting channel embeds or imbeds and is arranged in the transparent insulating layer.
Above-mentioned contact panel and manufacture method thereof, because the drive electrode of contact panel is made as the conductive grid that the grid conducting channel forms, therefore contact panel do not exist exist when adopting film ITO such as the surface scratch easily or drop, problem such as cost is higher, the resistance of large scale time side is bigger, so the cost of contact panel is lower, sensitivity is higher.In addition, compare existing contact panel, contact panel described in the utility model has reduced by second transparent substrates, has reduced the thickness of contact panel.
Description of drawings
Fig. 1 is the electronic equipment synoptic diagram of using the utility model contact panel;
Fig. 2 is the cross sectional representation of the contact panel of the utility model first embodiment;
Fig. 3 is the cross sectional representation of an embodiment shown in Figure 2;
Fig. 4 is that drive electrode layer shown in Figure 3 is formed at the floor map on the transparent insulating layer;
Fig. 5 is that Fig. 4 is along the schematic cross-section of aa ' profile line;
Fig. 6 is that Fig. 4 is along the schematic cross-section of bb ' profile line;
Fig. 7 is the floor map that induction electrode layer shown in Figure 3 is formed at rigidity transparent insulation substrate one surface;
Fig. 8 is that Fig. 7 is along the schematic cross-section of AA ' profile line;
Fig. 9 is that Fig. 7 is along the schematic cross-section of BB ' profile line;
Figure 10 a and Figure 10 b are induction electrode and drive electrode arrangement and shape synoptic diagram;
Figure 11 a, 11b, 11c and 11d are respectively the A part that corresponds respectively among the embodiment among Figure 10 a or the partial enlarged drawing of the part of the B among Figure 10 b;
Figure 12 is the manufacture method process flow diagram of the contact panel of an embodiment;
Figure 13 is the particular flow sheet of the step S104 in the flow process shown in Figure 12;
The drive electrode stratiform structural drawing of Figure 14 for obtaining according to the step S104 in the flow process shown in Figure 13.
Embodiment
For the ease of understanding the utility model, with reference to relevant drawings the utility model is described more fully below.Provided first-selected embodiment of the present utility model in the accompanying drawing.But the utility model can be realized with many different forms, be not limited to embodiment described herein.On the contrary, providing the purpose of these embodiment is to make to disclosure of the present utility model more thoroughly comprehensively.
Unless otherwise defined, the employed all technology of this paper are identical with the implication that belongs to those skilled in the art's common sense of the present utility model with scientific terminology.Employed term is not intended to be restriction the utility model just in order to describe the purpose of specific embodiment in instructions of the present utility model herein.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
" transparent " in the transparent insulation substrate described in the utility model can be regarded as " transparent " and " substantially transparent "; " insulation " in the transparent insulation substrate can be regarded as " insulation " and " dielectric medium (dielectric) " in the utility model.Therefore " the transparent insulation substrate " described in the utility model should be explained and include but not limited to transparent insulation substrate, substantially transparent dielectric substrate, transparent dielectric medium substrate and substantially transparent dielectric medium substrate.
See also Fig. 1, be one of them embodiment of the electronic equipment of using the utility model contact panel, wherein said electronic equipment is smart mobile phone or flat computer.In above-mentioned electronic equipment 10, described contact panel 100 fits in the upper surface of LCD display, is used for one of them I/O equipment of electronic equipment man-machine interaction.Can understand easily, also can be applicable to mobile phone, mobile communication phone, TV, panel computer, notebook computer, the industrial lathe that comprises touch display screen, aviation at described contact panel 100 of the present utility model and touch computer equipments such as display electronics assemblies, GPS electronic installation, integrated computing machine and super.
As shown in Figure 2, be the cross sectional representation of first embodiment of the utility model contact panel.This contact panel 100 comprises drive electrode layer 110, transparent insulating layer 120, induction electrode layer 130 and rigidity transparent insulation substrate 150.Induction electrode layer 130 is formed at a surface of described rigidity transparent insulation substrate 150.Drive electrode layer 110 is formed on the described transparent insulating layer 120, and each drive electrode of drive electrode layer 110 comprises the grid conducting channel, and described grid conducting channel embeds or imbeds and is arranged in the transparent insulating layer 120.
Described contact panel 100 also comprises at least one adhesion promoting layer 140, for increasing the bounding force between described induction electrode layer 130 and the described transparent insulation substrate 150.Described adhesion promoting layer generally adopts the optically transparent OCA(Optical Clear of optical cement Adhesive) glue or LOCA glue.
The material of described transparent insulating layer 120 is OCA glue, UV glue, hot-setting adhesive or dried glue etc. certainly, and described OCA glue and described UV glue are the optical lens gelatin, to guarantee the light transmission of described contact panel 100.Certainly transparent insulating layer 120 in the industry cycle is referred to as to impress glue etc.
Please refer to Fig. 3, is the utility model contact panel one embodiment cross sectional representation.Described induction electrode layer 130 comprises some independent induction electrode 130a that arrange.Please in the lump with reference to figure 4, described drive electrode layer 110 comprises some independent drive electrode 110a that arrange, and described each drive electrode 110a comprises grid conducting channel 110b." the independent setting " described in the utility model can be understood as and include but not limited to " the independent setting ", " isolate and arrange " or several explanations such as " insulation arrange ".
In capacitance type touch-control panel, induction electrode and drive electrode are requisite two parts of touch-control sensing assembly.The general touch face near contact panel of induction electrode, drive electrode is then relatively away from touch face.Drive electrode connects the sweep signal generating means, provides sweep signal by the sweep signal generating means, and induction electrode then produces electrical quantity when being touched by energized conductor changes, with touch sensitive zone or position of touch.
Wherein, each induction electrode that described induction electrode layer 130 comprises is electrically connected with the sensing of described contact panel peripheral hardware detecting processing module, each drive electrode of described drive electrode layer 110 is electrically connected with the pumping signal module of described contact panel peripheral hardware, forms mutual capacitance between described induction electrode and the described drive electrode.When touch action takes place in described contact panel surface, the mutual capacitance value of touching central area can change, described touch action is converted to electric signal, through just can obtain the coordinate data of touch action center to the processing of capacitance domain transformation data, the electronic installation that can handle related data just can be judged the touch action correspondence according to the coordinate data of touch action center and fit in accurate position on the display screen at contact panel, thereby finishes corresponding corresponding function or input operation.
The layer of induction electrode described in the utility model 130 and drive electrode layer 110 in different ways, different materials and different process make.
Specifically, please in the lump with reference to figure 5 and Fig. 6, be respectively that Fig. 4 is along the schematic cross-section of aa ' profile line and bb ' profile line.Described drive electrode layer 110 comprises some separate grid conducting channel 110b.Described grid conducting channel 110b embeds or is embedded in the transparent insulating layer 120.The material of described grid conducting channel 110b is selected from gold, silver, copper, aluminium, zinc, vermeil or the alloy of the two at least.Above-mentioned material obtains easily, and cost is lower, and particularly the silver slurry makes above-mentioned grid conducting channel 110b, conducts electricity very well, and cost is low.
Can easily understand, it is in the majority that grid conducting channel 110b embeds or be embedded in the transparent insulating layer 120 mode, wherein a kind of optimal way is to form some staggered grid grooves at described transparent insulating layer 120, described grid conducting channel 110b is arranged at described groove, thereby makes grid conducting channel 110b to embed or to imbed transparent insulating layer 120 surfaces.Depend on the rigidity transparent insulation substrate 150 of described drive electrode 110a in mobile or handling process, described drive electrode 110a can firmly depend on rigidity transparent insulation substrate 150, is not easy to be damaged or to come off.
More particularly, the mesh spacing of described grid conducting channel 110b is d
1, and 100 μ m≤d
1＜600 μ m; The square resistance of grid conducting channel is R and 0.1 Ω/sq≤R＜200 Ω/sq.
The square resistance of described grid conducting channel 110b is that R affects the current signal transmission speed, thereby affects the contact panel reaction sensitivity.So described grid conducting channel 110b square resistance is R and is preferably 1 Ω/sq≤R≤60 Ω/sq.Square resistance R in this scope, can significantly improve the electric conductivity of conducting film, significantly improve the transmission speed of electric signal, and low than 0.1 Ω/sq≤R＜200 Ω/sq to the requirement of precision, namely under the prerequisite that guarantees electric conductivity, reduce technological requirement, reduced cost.Certainly in manufacture process, the square resistance of grid conducting channel 110b is that R and mesh spacing, material, line footpath a plurality of factors such as (live widths) determine jointly.
The grid live width of described grid conducting channel 110b is d
2, and 1 μ m≤d
2≤ 10 μ m.The live width of grid influences the light transmission of conducting film, and the grid live width is more little, and light transmission is more good.Needing the mesh lines spacing d of conductive grid
1Be 100 μ m≤d
1When＜600 μ m, the square resistance R of grid conducting channel 110b are 0.1 Ω/sq≤R＜200 Ω/sq, grid live width d
2Be 1 μ m≤d
2≤ 10 μ m can meet the demands, and can improve the light transmission of whole contact panel simultaneously.The grid live width d of grid conducting channel 110b particularly
2Be 2 μ m≤d
2During＜5 μ m, the contact panel glazed area is more big, and light transmission is more good, and accuracy requirement is relatively low.
In embodiment preferably, grid conducting channel 110b selects ag material for use, and adopts regular figure, mesh lines spacing 200 μ m～500 μ m; Grid conducting channel surface resistance is 4 Ω/sq≤R＜50 Ω/sq, and the coating weight of silver is 0.7g/m
2～1.1g/m
2
In embodiment one, get d
1=200 μ m, R=4～5 Ω/sq, argentiferous is measured 1.1g/m
2, grid live width d
2Get 500nm～5 μ m.Certainly, what of the value of square resistance R, silver content all can be subjected to grid live width d
2With the influence of the depth of groove of filling, grid live width d
2Depth of groove more big, that fill is more big, and square resistance can increase thereupon to some extent, silver content also increases thereupon.
In embodiment two, get d
1=300 μ m, R=10 Ω/sq, argentiferous is measured 0.9～1.0g/m
2, grid live width d
2Get 500nm～5 μ m.Certainly, what of the value of square resistance R, silver content all can be subjected to grid live width d
2With the influence of the depth of groove of filling, grid live width d
2Depth of groove more big, that fill is more big, and square resistance can increase thereupon to some extent, silver content also increases thereupon.
In embodiment three, get d
1=500 μ m, R=30～40 Ω/sq, argentiferous is measured 0.7g/m
2, grid live width d
2Get 500nm～5 μ m.Certainly, what of the value of square resistance R, silver content all can be subjected to grid live width d
2With the influence of the depth of groove of filling, grid live width d
2Depth of groove more big, that fill is more big, and square resistance can increase thereupon to some extent, silver content also increases thereupon.
Certainly, make the above-mentioned grid conducting channel 110b except selecting the metallic conduction material for use, can also select a kind of the making in electrically conducting transparent macromolecular material, Graphene or the carbon nano-tube for use.
Please in the lump with reference to figure 7, Fig. 8 and Fig. 9, the induction electrode of described induction electrode layer 130 adopts tin indium oxide (Indium Tin Oxide, ITO), tin-antiomony oxide (Antimony Doped Tin Oxide, ATO), indium zinc oxide (Indium Zinc Oxide, IZO), zinc oxide aluminum (Aluminum Zinc Oxide, AZO), any one material in poly-enedioxy thiophene (PEDOT), electrically conducting transparent macromolecular material, Graphene or the carbon nano-tube makes.By the induction electrode of processes such as the etching on the engineering, printing, coating, photoetching or gold-tinted processing procedure formation patterning, the i.e. transparent induction electrodes of some independent settings.
In this class embodiment, described induction electrode layer 130 directly is formed at the surface of rigidity transparent insulation substrate 110, and described rigidity transparent insulation substrate is rigid substrate.More particularly, glass or clear plastic plate that the process intensive treatment that described rigid substrate adopts is crossed are called for short tempered glass or reinforced plastic plate.Wherein said tempered glass comprise have anti-dazzle, sclerosis, the functional layer of anti-reflection or atomizing functions.Wherein, have the functional layer of anti-dazzle or atomizing functions, formed by the applying coating with anti-dazzle or atomizing functions, coating comprises metal oxide particle; Functional layer with sclerosis function forms or directly passes through the sclerosis of chemistry or physical method by the high-molecular coating coating with sclerosis function; Functional layer with anti-reflection function is titania coating, magnesium fluoride coating or calcium fluoride coating.Be appreciated that adopting the good plastic plate of transmittance also can handle as above-mentioned tempered glass mode makes rigidity transparent insulation substrate described in the utility model.
See also Figure 10 a and Figure 10 b, comprise induction electrode and drive electrode arrangement and the shape floor map of a few class embodiments for the utility model.The induction electrode of described separate setting is in the parallel and equally spaced setting of first axial (X-axis); The drive electrode of described separate setting is in the parallel and equally spaced setting of second axial (Y-axis).Wherein Figure 10 a induction electrode and drive electrode be square shape structure (bar) and mutually vertical interlaced arrange; Figure 10 b induction electrode and drive electrode are that diamond shaped structure and mutual vertical interlaced are arranged.
Figure 11 a, 11b, 11c and 11d are respectively the A part that corresponds respectively among the embodiment among Figure 10 a or the partial enlarged drawing of the part of the B among Figure 10 b.
The grid conducting channel adopts non-regular grid shown in Figure 11 a and the 11b, and the manufacture difficulty of this non-regular grid conducting channel is lower, saves concerned process steps etc.
Grid conducting channel shown in 11c and the 11d, described grid conducting channel 110b is the regular figure of evenly arranging.Conductive grid is arranged evenly rule, mesh lines spacing d
1All equate, can make the contact panel printing opacity even on the one hand; On the other hand, the square resistance of grid conducting channel (resistance of abbreviation side) is evenly distributed, and resistance deviation is little, need not the setting for the revisal resistance deviation, makes imaging even.Can be the straight line grid pattern of nearly orthogonal form, crooked wave grid pattern etc.The unit grid of grid conducting channel can be regular figure, and for example triangle, rhombus or regular polygon etc. also can be irregular geometric figures.
As shown in figure 12, be the manufacture method flow process of the contact panel of an embodiment.Please in the lump with reference to figure 3, this method comprises the steps.
S101: rigidity transparent insulation substrate is provided.Described rigidity transparent insulation substrate 150 adopts rigidity transparent insulation substrate, and wherein rigidity transparent insulation substrate can adopt tempered glass and pliability transparent panel.Wherein the pliability transparent panel can select for use in flexible polyethylene terephthalate (PET), polycarbonate (PC), tygon (PE), Polyvinylchloride (PVC), polypropylene (PP), polystyrene (PS) or the polymethylmethacrylate (PMMA) any one to make.
S102: the surface at described rigidity transparent insulation substrate forms the induction electrode layer.
S103: form transparent insulating layer at described induction electrode layer.Transparent insulating layer 120 is exemplified as UV glue.Wherein, in the present embodiment, in order to increase the adhesion of transparent insulating layer 120 and rigidity transparent insulation substrate 150, can between rigidity transparent insulation substrate 150 and transparent insulating layer 120, add adhesion promoting layer 140.
S104: form drive electrode layer at described transparent insulating layer.The drive electrode of described drive electrode layer 110 is to comprise that the grid conducting channel 110b(of a large amount of unit grids is with reference to figure 4).
Specifically comprise with reference to Figure 13～14 above-mentioned steps S104:
S141: described transparent insulating layer impression forms the grid groove.With reference to Figure 14, after the process mould was pressed on the transparent insulating layer 120, form a plurality of grid grooves 170 identical with the drive electrode shape, drive electrode layer 110 is formed in this grid groove 170.
S142: in described grid groove, add metal paste and carry out blade coating and sintering curing to form the grid conducting channel.Metal paste is added in the grid groove 170, and through blade coating, make in the grid groove and fill metal paste, carry out sintering curing then and can obtain conductive grid.This metal paste is preferably nanometer silver paste.Among other embodiment, the metal that forms the grid conducting channel can also adopt the alloy of the two at least of gold, silver, copper, aluminium, zinc, vermeil or above metal.
In other embodiment, the grid conducting channel can also adopt other technologies to realize that for example photoetching process is made grid conducting channel described in the utility model.
Said method is made as the conductive grid that the grid conducting channel forms with the drive electrode of contact panel, therefore contact panel do not exist exist when adopting film ITO such as the surface scratch easily or drop, problem such as cost is higher, the resistance of large scale time side is bigger, so the cost of contact panel is lower, sensitivity is higher.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (13)
1. contact panel comprises:
Rigidity transparent insulation substrate;
The induction electrode layer is formed at a surface of described rigidity transparent insulation substrate, comprises some independent induction electrodes that arrange;
Transparent insulating layer is formed on the described induction electrode layer;
Drive electrode layer is formed on the described transparent insulating layer, comprises some independent drive electrodes that arrange; Each drive electrode of described drive electrode layer comprises the grid conducting channel; Described grid conducting channel embeds or imbeds and is arranged in the transparent insulating layer.
2. contact panel according to claim 1 is characterized in that, the mesh spacing of described grid conducting channel is d
1, and 100 μ m≤d
1＜600 μ m; The square resistance of grid conducting channel is R and 0.1 Ω/sq≤R＜200 Ω/sq.
3. contact panel according to claim 1 is characterized in that, described transparent insulating layer forms some staggered grid grooves, and described grid conducting channel is arranged at described grid groove.
4. contact panel according to claim 1 is characterized in that, described rigidity transparent insulation substrate is tempered glass.
5. contact panel according to claim 1 is characterized in that, described induction electrode adopts a kind of the making in transparent tin indium oxide, tin-antiomony oxide, indium zinc oxide, zinc oxide aluminum or the poly-enedioxy thiophene.
6. according to any described contact panel of claim 1 to 5, it is characterized in that the grid of described grid conducting channel adopts the regular geometric patterned grid.
7. according to any described contact panel of claim 1 to 5, it is characterized in that the grid of described grid conducting channel adopts the irregular geometric figures grid.
8. contact panel according to claim 6 is characterized in that, the unit grid of described grid is shaped as single triangle, rhombus or regular polygon.
9. contact panel according to claim 3 is characterized in that, also comprises adhesion promoting layer, is formed between described induction electrode layer and the rigidity transparent insulation substrate.
10. contact panel according to claim 9 is characterized in that, described adhesion promoting layer is optically transparent OCA glue or LOCA glue.
11. contact panel according to claim 1 is characterized in that, described grid conducting channel is selected ag material for use, the mesh lines spacing 200 μ m～500 μ m of grid conducting channel; Side's resistance of grid conducting channel is 4 Ω/sq≤R＜50 Ω/sq, and the coating weight of silver is 0.7g/m
2～1.1g/m
2
12. contact panel according to claim 1 is characterized in that, described grid conducting channel selects for use in the two the alloy material at least of gold, silver, copper, aluminium, zinc, vermeil or above metal any one to make.
13. contact panel according to claim 1, described transparent insulating layer can be light binding, hot-setting adhesive or do adhesive curing formation certainly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320107050 CN203149522U (en) | 2013-03-08 | 2013-03-08 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320107050 CN203149522U (en) | 2013-03-08 | 2013-03-08 | Touch panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203149522U true CN203149522U (en) | 2013-08-21 |
Family
ID=48977034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320107050 Expired - Fee Related CN203149522U (en) | 2013-03-08 | 2013-03-08 | Touch panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203149522U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103176681A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch panel and manufacturing method of touch panel |
| CN103778410A (en) * | 2014-01-10 | 2014-05-07 | 南昌欧菲光科技有限公司 | Capacitive biometric feature recognition sensor |
| TWI628563B (en) * | 2013-08-30 | 2018-07-01 | 東友精細化工有限公司 | Touch-sensing electrode and touch screen panel including the same |
| CN111863314A (en) * | 2019-04-30 | 2020-10-30 | 昇印光电（昆山）股份有限公司 | Conducting film |
-
2013
- 2013-03-08 CN CN 201320107050 patent/CN203149522U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103176681A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch panel and manufacturing method of touch panel |
| TWI628563B (en) * | 2013-08-30 | 2018-07-01 | 東友精細化工有限公司 | Touch-sensing electrode and touch screen panel including the same |
| CN103778410A (en) * | 2014-01-10 | 2014-05-07 | 南昌欧菲光科技有限公司 | Capacitive biometric feature recognition sensor |
| CN103778410B (en) * | 2014-01-10 | 2017-09-22 | 南昌欧菲光科技有限公司 | Condenser type biometric sensor |
| CN111863314A (en) * | 2019-04-30 | 2020-10-30 | 昇印光电（昆山）股份有限公司 | Conducting film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130821 Termination date: 20200308 |