CN101787273A - Light-emitting diode (LED) fluorescent glue - Google Patents
Light-emitting diode (LED) fluorescent glue Download PDFInfo
- Publication number
- CN101787273A CN101787273A CN200910251589A CN200910251589A CN101787273A CN 101787273 A CN101787273 A CN 101787273A CN 200910251589 A CN200910251589 A CN 200910251589A CN 200910251589 A CN200910251589 A CN 200910251589A CN 101787273 A CN101787273 A CN 101787273A
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- glue
- silica gel
- led
- powder
- light
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Abstract
The invention discloses an LED fluorescent glue prepared from the following components (by the total weight of 100%): 3.10%-3.40% of OE-6450A (silica gel main agent), 2.60%-2.90% of OE-6450B (silica gel curing agents), 72.80%-75.54% of TO powder (dispersing agents), 6.3%-7.0% of silicon dioxide powder (SiO2), 10.6%-11.8% of aluminum oxide powder (Al2O3), 1.4%-1.7% of ST-11001 (silica gel), 0.28%-0.32% of JZ-520A (glue main agent) and 0.18%-0.22% of JZ-520B (glue curing agents). The invention can effectively excite the light spots of finished products and improve the confidence degree of finished products, has the advantages of low cost and convenient use, and can be used for preparing fluorescent powder for white-light LED elements.
Description
Technical field
The present invention relates to the matrix material of a kind of LED, especially relate to a kind of LED fluorescent glue, can be used for the preparation fluorescent material of direct insertion LED (LAMP) white light LEDs element.
Background technology
In recent years, be the rise of semiconductor lighting in the most noticeable incident of lighting field.The mid-90 in 20th century, the people such as Nakamura of Japanese Ri Ya chemical company have broken through the gordian technique of manufacturing blue light-emitting diode (LED) through unremitting effort, and develop thus with fluorescent material and cover the technology that blue-ray LED produces white light source.Semiconductor lighting have environmental protection, overlong service life, energy-efficient, anti-adverse environment, simple in structure, volume is little, in light weight, response is fast, operating voltage is low and the good characteristics of security, therefore be described as after incandescent light, fluorescent lamp and electricity-saving lamp the 4th generation lighting electric light source, or be called the 21 century green light source.A large amount of manpower and financial resources are all injected in the U.S., Japan and Europe, set up the development of special mechanism urges semiconductor lighting technology.
LED realizes that white light has multiple mode, and exploitation has realized that early, the mode of industrialization is a coating fluorescent powder and realize white light emission on led chip.
LED adopts fluorescent material to realize that white light mainly contains three kinds of methods, but they do not have fully matured, seriously influence the application of white light LEDs at lighting field thus.Specifically, first method is that coating can be by blue-light excited yellow fluorescent powder on the blue led chip, the complementary white light that forms of the gold-tinted that blue light that chip sends and fluorescent material send.This technology is by Japanese Nichia company monopolizing, and the shortcoming of a principle of this scheme is exactly Ce in this fluor
3+The ionic emmission spectrum is not had a continuous spectrum characteristic, and color developing is relatively poor, is difficult to satisfy the requirement of low colour temperature illumination, and luminous efficiency is high not enough simultaneously, need improve by the high-efficiency fluorescence powder of development of new.
Second kind of implementation method is to apply green and red fluorescence powder on the blue led chip, green glow and the compound white light that obtains of ruddiness that blue light that sends by chip and fluorescent material send, and color developing is better.But the effective efficiency of conversion of the used fluorescent material of this method is lower, and especially the efficient of red fluorescence powder needs raising by a relatively large margin.
The third implementation method is the fluorescent material that applies three primary colours or multiple color on purple light or ultraviolet leds chip, utilize the long wave ultraviolet light (370nm-380nm) or the purple light (380nm-410nm) of this chip emission to come excitated fluorescent powder and realize white light emission, this method color developing is better, but the same existence problem similar with second method, and higher redness and the green emitting phosphor of efficiency of conversion mostly is the sulfide system at present, this class light-emitting phosphor poor stability, light decay is bigger, and therefore exploitation efficiently, the phosphor for white light LED of low light decay has become an extremely urgent job.
Along with the development of LED, the hot spot consistence that encapsulates direct insertion white light LEDs receives much attention, and for satisfying the demand in market, improves the whole consistence of packaged LED, and it is very necessary to develop good and easy to use, the cheap LED fluorescent glue of reliability.
Summary of the invention
Purpose of the present invention is exactly the deficiency that exists at prior art, and a kind of high purity, high fast light, weathering resistance are provided, and can excite the hot spot of finished product effectively, improves its reliability and LED fluorescent glue cheap, easy to use.
For realizing the present invention's purpose, LED fluorescent glue of the present invention is realized by following technical scheme.
LED fluorescent glue of the present invention is formulated by following component, and each component concentration (gross weight is by 100%) is:
OE-6450A (silica gel host) 3.10%-3.40%
OE-6450B (silica gel solidifying agent) 2.60%-2.90%
TO powder (diffusant) 72.80%-75.54%
Silicon-dioxide pulvis (SiO
2): 6.3%-7.0%
Aluminium sesquioxide pulvis (Al
2O
3) 10.6%-11.8%
ST-11001 (silica gel) 1.4%-1.7%
JZ-520A (glue host) 0.28%-0.32%
JZ-520B (glue curing agent) 0.18%-0.22%
Each component optimum content (gross weight is by 100%) is:
OE-6450A (silica gel host) 3.24%
OE-6450B (silica gel solidifying agent) 2.76%
TO powder (diffusant) 74.1%
Silicon-dioxide pulvis (SiO
2): 6.7%
Aluminium sesquioxide pulvis (Al
2O
3) 11.2%
ST-11001 (silica gel) 1.5%
JZ-520A (glue host) 0.3%
JZ-520B (glue curing agent) 0.2%
Above-mentioned all components all can be bought acquisition from the market, and the code name of all components is all the common name of industry field, and those skilled in the art are known by industry.
LED fluorescent glue of the present invention adopts the principle of above technical scheme to be:
(1) suitability: the improvement hot spot promotes brightness.With internal diameter less than 5 microns meltable TO powder thorough mixing in silicon series glue material (Silicone) but to promote its diffustivity, reach the hot spot diffusion, promote its consistence. rhombohedron SiO
2With AL
2O
3Be whitening powder.Can in mixture, form the solid barrier of one side after both combinations, so that the refraction of light body.It is bright with an amount of just adjustable glossing up of fluorescent material to be equipped with brightener ST-11001 again, high-brightness LED.
(2) reliability: select the host of silicon series glue material (Silicone) as the LED fluorescent glue for use, to have a high temperature resistant height hot because of silicon series glue material (Silicone), and the xanthochromia coefficient is lower down hot and humid, the good purpose of final product reliability to reach.
After LED fluorescent glue of the present invention adopts above technical scheme, have following positively effect:
(1) high Pure degree characteristic: sodium, potassium, chlorion do not absorb the short wavelength all less than below the 1ppm.
(2) photostabilization: high transparent, transmittance is nearly 100%, with respect to methyl resinoid specific refractory power height.
(3) weathering resistance: silica gel cracking temperature is not less than 350 ℃, nondiscoloration in 280 ℃ of Reflow Soldering (IR Reflow) temperature ,-150 ℃ of its glass transition temperatures (Tg point).
(4) high bonding characteristic:, wait LED base material associativity preferable with direct insertion LED (LAMP) support.
Embodiment
For further describing the present invention, LED fluorescent glue of the present invention is further described below in conjunction with embodiment.
According to component and the content (weight %) that table 1 lists, preparation LED fluorescent glue.All components all can be bought acquisition from the market.
Table 1 LED fluorescent glue component and content (weight 100%)
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | |
| OE-6450A (silica gel host) | ??3.10 | ??3.40 | ??3.24 | ??3.1 | ??3.20 |
| OE-6450B (silica gel solidifying agent) | ??2.90 | ??2.80 | ??2.76 | ??2.6 | ??2.75 |
| TO powder (diffusant) | ??73.81 | ??72.8 | ??74.1 | ??75.54 | ??74.2 |
| Silicon-dioxide pulvis (SiO 2) | ??6.4 | ??7.0 | ??6.7 | ??6.3 | ??6.75 |
| Aluminium sesquioxide pulvis (Al 2O 3) | ??11.8 | ??11.76 | ??11.2 | ??10.6 | ??11.0 |
| ST-11001 (silica gel) | ??1.5 | ??1.7 | ??1.5 | ??1.4 | ??1.6 |
| JZ-520A (glue host) | ??0.3 | ??0.32 | ??0.3 | ??0.28 | ??0.3 |
| JZ-520B (glue curing agent) | ??0.19 | ??0.22 | ??0.2 | ??0.18 | ??0.2 |
Wherein the LED fluorescent glue performance of embodiment 3 is as shown in table 2.
Table 2 LED fluorescent glue product performance
Through detecting, LED fluorescent glue performance and table 2 that embodiment 1,2,4,5 obtains are basic identical.
Claims (2)
1. a LED fluorescent glue is characterized in that it being formulated by following component, and each component concentration (gross weight is by 100%) is:
OE-6450A (silica gel host) 3.10%-3.40%
OE-6450B (silica gel solidifying agent) 2.60%-2.90%
TO powder (diffusant) 72.80%-75.54%
Silicon-dioxide pulvis (SiO
2): 6.3%-7.0%
Aluminium sesquioxide pulvis (Al
2O
3) 10.6%-11.8%
ST-11001 (silica gel) 1.4%-1.7%
JZ-520A (glue host) 0.28%-0.32%
JZ-520B (glue curing agent) 0.18%-0.22%
2. LED fluorescent glue as claimed in claim 1 is characterized in that each component concentration (gross weight is by 100%) is:
OE-6450A (silica gel host) 3.24%
OE-6450B (silica gel solidifying agent) 2.76%
TO powder (diffusant) 74.1%
Silicon-dioxide pulvis (SiO
2): 6.7%
Aluminium sesquioxide pulvis (Al
2O
3) 11.2%
ST-11001 (silica gel) 1.5%
JZ-520A (glue host) 0.3%
JZ-520B (glue curing agent) 0.2%
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910251589A CN101787273A (en) | 2009-12-24 | 2009-12-24 | Light-emitting diode (LED) fluorescent glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910251589A CN101787273A (en) | 2009-12-24 | 2009-12-24 | Light-emitting diode (LED) fluorescent glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101787273A true CN101787273A (en) | 2010-07-28 |
Family
ID=42530655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910251589A Pending CN101787273A (en) | 2009-12-24 | 2009-12-24 | Light-emitting diode (LED) fluorescent glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101787273A (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544327A (en) * | 2012-01-13 | 2012-07-04 | 深圳市兆驰节能照明有限公司 | White light LED (light emitting diode) and packaging process thereof |
| CN102766462A (en) * | 2012-07-26 | 2012-11-07 | 常州金凯照明电器有限公司 | Color temperature-tunable, universal and high performance fluorescent powder |
| CN104576897A (en) * | 2014-12-16 | 2015-04-29 | 江门市赛宁灯饰有限公司 | Fluorescent adhesive for COB encapsulation of LED |
| CN104576895A (en) * | 2014-12-16 | 2015-04-29 | 江门市赛宁灯饰有限公司 | Fluorescent glue capable of packaging white light LEDs |
| CN106622469A (en) * | 2016-12-01 | 2017-05-10 | 鸿利智汇集团股份有限公司 | Preparation method of LED (light emitting diode) anti-precipitation glue |
| CN106704860A (en) * | 2014-09-28 | 2017-05-24 | 嘉兴山蒲照明电器有限公司 | LED fluorescent lamp |
| CN107452858A (en) * | 2017-08-15 | 2017-12-08 | 苏州轻光材料科技有限公司 | A kind of burst of ultraviolel white light LEDs containing three-color phosphor and preparation method thereof |
| CN107546314A (en) * | 2017-08-14 | 2018-01-05 | 广东聚科照明股份有限公司 | A kind of packaging technology of LED fluorescent powder sedimentation |
| US10352540B2 (en) | 2014-12-05 | 2019-07-16 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10408441B1 (en) | 2016-03-17 | 2019-09-10 | Zhejiang Super Lighting Electric | Curved LED tubular lamp |
| US10436394B2 (en) | 2015-09-02 | 2019-10-08 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp |
| US10487991B2 (en) | 2015-03-10 | 2019-11-26 | Jiaxing Super Lighting Electronic Appliance Co., Ltd. | LED tube lamp |
| US10514134B2 (en) | 2014-12-05 | 2019-12-24 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10560989B2 (en) | 2014-09-28 | 2020-02-11 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10624160B2 (en) | 2014-09-28 | 2020-04-14 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10634337B2 (en) | 2014-12-05 | 2020-04-28 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp with heat dissipation of power supply in end cap |
| US10670197B2 (en) | 2014-09-28 | 2020-06-02 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US11131431B2 (en) | 2014-09-28 | 2021-09-28 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
-
2009
- 2009-12-24 CN CN200910251589A patent/CN101787273A/en active Pending
Cited By (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544327A (en) * | 2012-01-13 | 2012-07-04 | 深圳市兆驰节能照明有限公司 | White light LED (light emitting diode) and packaging process thereof |
| CN102766462A (en) * | 2012-07-26 | 2012-11-07 | 常州金凯照明电器有限公司 | Color temperature-tunable, universal and high performance fluorescent powder |
| CN102766462B (en) * | 2012-07-26 | 2015-03-25 | 常州金凯照明电器有限公司 | Color temperature-tunable, universal and high performance fluorescent powder |
| US10897801B2 (en) | 2014-09-28 | 2021-01-19 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US11112068B2 (en) | 2014-09-28 | 2021-09-07 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10670197B2 (en) | 2014-09-28 | 2020-06-02 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| CN106704860A (en) * | 2014-09-28 | 2017-05-24 | 嘉兴山蒲照明电器有限公司 | LED fluorescent lamp |
| US11686457B2 (en) | 2014-09-28 | 2023-06-27 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US11649934B2 (en) | 2014-09-28 | 2023-05-16 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10624160B2 (en) | 2014-09-28 | 2020-04-14 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US11519567B2 (en) | 2014-09-28 | 2022-12-06 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US11131431B2 (en) | 2014-09-28 | 2021-09-28 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10560989B2 (en) | 2014-09-28 | 2020-02-11 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10514134B2 (en) | 2014-12-05 | 2019-12-24 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10352540B2 (en) | 2014-12-05 | 2019-07-16 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10634337B2 (en) | 2014-12-05 | 2020-04-28 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp with heat dissipation of power supply in end cap |
| US11906115B2 (en) | 2014-12-05 | 2024-02-20 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| US10830397B2 (en) | 2014-12-05 | 2020-11-10 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| CN104576895A (en) * | 2014-12-16 | 2015-04-29 | 江门市赛宁灯饰有限公司 | Fluorescent glue capable of packaging white light LEDs |
| CN104576897A (en) * | 2014-12-16 | 2015-04-29 | 江门市赛宁灯饰有限公司 | Fluorescent adhesive for COB encapsulation of LED |
| US10890300B2 (en) | 2015-03-10 | 2021-01-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp |
| US10487991B2 (en) | 2015-03-10 | 2019-11-26 | Jiaxing Super Lighting Electronic Appliance Co., Ltd. | LED tube lamp |
| US11226073B2 (en) | 2015-03-10 | 2022-01-18 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | Led tube lamp |
| US11698170B2 (en) | 2015-03-10 | 2023-07-11 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp |
| US10876690B2 (en) | 2015-09-02 | 2020-12-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp |
| US10436394B2 (en) | 2015-09-02 | 2019-10-08 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp |
| US10619833B2 (en) | 2016-03-17 | 2020-04-14 | Zhejiang Super Lighting Electric Appliance Co., Ltd | Curved LED tubular lamp |
| US10408441B1 (en) | 2016-03-17 | 2019-09-10 | Zhejiang Super Lighting Electric | Curved LED tubular lamp |
| CN106622469A (en) * | 2016-12-01 | 2017-05-10 | 鸿利智汇集团股份有限公司 | Preparation method of LED (light emitting diode) anti-precipitation glue |
| CN107546314A (en) * | 2017-08-14 | 2018-01-05 | 广东聚科照明股份有限公司 | A kind of packaging technology of LED fluorescent powder sedimentation |
| CN107452858A (en) * | 2017-08-15 | 2017-12-08 | 苏州轻光材料科技有限公司 | A kind of burst of ultraviolel white light LEDs containing three-color phosphor and preparation method thereof |
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Application publication date: 20100728 |