CN104576895A - Fluorescent glue capable of packaging white light LEDs - Google Patents
Fluorescent glue capable of packaging white light LEDs Download PDFInfo
- Publication number
- CN104576895A CN104576895A CN201410772586.3A CN201410772586A CN104576895A CN 104576895 A CN104576895 A CN 104576895A CN 201410772586 A CN201410772586 A CN 201410772586A CN 104576895 A CN104576895 A CN 104576895A
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- CN
- China
- Prior art keywords
- parts
- powder
- powders
- fluorescent
- white light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000843 powder Substances 0.000 claims abstract description 55
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000741 silica gel Substances 0.000 claims abstract description 13
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000004927 clay Substances 0.000 claims abstract description 3
- 150000001450 anions Chemical class 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000000499 gel Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229960001866 silicon dioxide Drugs 0.000 abstract 2
- 108010043121 Green Fluorescent Proteins Proteins 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000002270 dispersing agent Substances 0.000 abstract 1
- 238000004062 sedimentation Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses fluorescent glue capable of packaging white light LEDs. The fluorescent glue is prepared by mixing the following components in parts by weight: 50-60 parts of allochroic silicagel, 45-50 parts of water-proof silica gel, 30-40 parts of super light clay, 20-25 parts of epoxy resin glue, 5-10 parts of colorful flashlight powder, 10-12 parts of blue fluorescent powder, 10-12 parts of red fluorescent powder, 10-12 parts of green fluorescent powder, 3-5 parts of diffusion powder, 5-8 parts of light dispersing agent, 5-8 parts of electron powder and 5-10 parts of nanometer negative ion powder. The fluorescent glue capable of packaging the white light LEDs can improve the yield of the white light LEDs; compared with traditional fluorescent glue, the sedimentation rate of the fluorescent glue can be effectively controlled, the brightness of the LEDs is improved, and thus the product quality is improved.
Description
Technical field
The present invention relates to a kind of fluorescent glue encapsulating white light LEDs, particularly relate to a kind of fluorescent glue improving the encapsulation white light LEDs of LED white light output.
Background technology
LED is a kind of solid-state semiconductor device, can be directly luminous energy electric energy conversion, has that luminous efficiency is high, power consumption is low, reaction speed is fast, volume is little, the life-span is long, the advantage such as vibration resistance and applicable volume production.Along with the development and progress of science and technology, LED technology is applied in daily life more and more widely, such as various LED lamp and LED display etc.
The technique of packaged LED generally all needs through die bond, bonding wire, step such as some glue, baking etc., the fluorescent glue used in the technique of existing encapsulation white light LEDs adds fluorescent glue in silica gel, such packaging technology due to fluorescent material precipitation too fast, thus affect the white light product of LED, affect the brightness of LED.
Summary of the invention
The present invention is the defect in order to overcome prior art, object is to provide a kind of fluorescent glue encapsulating white light LEDs, the fluorescent glue of this encapsulation white light LEDs can improve the output of white light LEDs, compare traditional fluorescent glue, effectively can control the settling velocity of fluorescent glue, improve the brightness of LED, thus improve the quality of products.
The technical solution adopted for the present invention to solve the technical problems is: a kind of fluorescent glue encapsulating white light LEDs, is mixed and forms: 50-60 part discolour silica gel, 45-50 part is water-fast silica gel by the component of following number, the ultralight clay of 30-40 part, 20-25 part epoxide-resin glue, 5-10 part seven colour flashing powder, 10-12 part blue colour fluorescent powder, 10-12 part red fluorescence powder, 10-12 part green emitting phosphor, 3-5 part spread powder, 5-8 part light diffusing agent, 5-8 part electronic powder, 5-10 part nanometer anion powder.
Further, be made up of the component of following number: 50 parts of discolour silica gels, 45 parts of water-fast silica gel, 30 parts of ultralight clays, 20 parts of epoxide-resin glues, 5 part of seven colour flashing powder, 10 parts of blue colour fluorescent powders, 10 parts of red fluorescence powders, 10 parts of green emitting phosphors, 3 parts of spread powders, 5 parts of light diffusing agents, 5 parts of electronic powders, 5 parts of nanometer anion powders.
Or, be made up of the component of following number: 60 parts of discolour silica gels, 50 parts of water-fast silica gel, 40 parts of ultralight clays, 25 parts of epoxide-resin glues, 10 part of seven colour flashing powder, 12 parts of blue colour fluorescent powders, 12 parts of red fluorescence powders, 12 parts of green emitting phosphors, 5 parts of spread powders, 8 parts of light diffusing agents, 8 parts of electronic powders, 10 parts of nanometer anion powders.
In sum, the fluorescent glue of encapsulation white light LEDs of the present invention can improve the output of white light LEDs, compares traditional fluorescent glue, effectively can control the settling velocity of fluorescent glue, improves the brightness of LED, thus improves the quality of products.
Embodiment
Embodiment 1
A kind of fluorescent glue encapsulating white light LEDs described by the embodiment of the present invention 1, is mixed by the component of following number and forms: 50 parts of discolour silica gels, 45 parts of water-fast silica gel, 30 parts of ultralight clays, 20 parts of epoxide-resin glues, 5 part of seven colour flashing powder, 10 parts of blue colour fluorescent powders, 10 parts of red fluorescence powders, 10 parts of green emitting phosphors, 3 parts of spread powders, 5 parts of light diffusing agents, 5 parts of electronic powders, 5 parts of nanometer anion powders.
Embodiment 2
A kind of fluorescent glue encapsulating white light LEDs described by the embodiment of the present invention 2, is mixed by the component of following number and forms: 60 parts of discolour silica gels, 50 parts of water-fast silica gel, 40 parts of ultralight clays, 25 parts of epoxide-resin glues, 10 part of seven colour flashing powder, 12 parts of blue colour fluorescent powders, 12 parts of red fluorescence powders, 12 parts of green emitting phosphors, 5 parts of spread powders, 8 parts of light diffusing agents, 8 parts of electronic powders, 10 parts of nanometer anion powders.
Above-described embodiment is only some preferred embodiments of the present invention, not limits the scope of the invention according to this, therefore: all various equivalence changes done according to principle of the present invention etc., all should be encompassed within protection scope of the present invention.
Claims (3)
1. encapsulate a fluorescent glue for white light LEDs, it is characterized in that, mixed by the component of following number and form: 50-60 part discolour silica gel, 45-50 part is water-fast silica gel, the ultralight clay of 30-40 part, 20-25 part epoxide-resin glue, 5-10 part seven colour flashing powder, 10-12 part blue colour fluorescent powder, 10-12 part red fluorescence powder, 10-12 part green emitting phosphor, 3-5 part spread powder, 5-8 part light diffusing agent, 5-8 part electronic powder, 5-10 part nanometer anion powder.
2. a kind of fluorescent glue encapsulating white light LEDs according to claim 1, is characterized in that, be made up of the component of following number: 50 parts of discolour silica gels, 45 parts of water-fast silica gel, 30 parts of ultralight clays, 20 parts of epoxide-resin glues, 5 part of seven colour flashing powder, 10 parts of blue colour fluorescent powders, 10 parts of red fluorescence powders, 10 parts of green emitting phosphors, 3 parts of spread powders, 5 parts of light diffusing agents, 5 parts of electronic powders, 5 parts of nanometer anion powders.
3. a kind of fluorescent glue encapsulating white light LEDs according to claim 1, is characterized in that, be made up of the component of following number: 60 parts of discolour silica gels, 50 parts of water-fast silica gel, 40 parts of ultralight clays, 25 parts of epoxide-resin glues, 10 part of seven colour flashing powder, 12 parts of blue colour fluorescent powders, 12 parts of red fluorescence powders, 12 parts of green emitting phosphors, 5 parts of spread powders, 8 parts of light diffusing agents, 8 parts of electronic powders, 10 parts of nanometer anion powders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410772586.3A CN104576895A (en) | 2014-12-16 | 2014-12-16 | Fluorescent glue capable of packaging white light LEDs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410772586.3A CN104576895A (en) | 2014-12-16 | 2014-12-16 | Fluorescent glue capable of packaging white light LEDs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104576895A true CN104576895A (en) | 2015-04-29 |
Family
ID=53092505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410772586.3A Pending CN104576895A (en) | 2014-12-16 | 2014-12-16 | Fluorescent glue capable of packaging white light LEDs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104576895A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106622469A (en) * | 2016-12-01 | 2017-05-10 | 鸿利智汇集团股份有限公司 | Preparation method of LED (light emitting diode) anti-precipitation glue |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1275814A (en) * | 2000-06-27 | 2000-12-06 | 复旦大学 | Packaging method for organic electroluminescence device |
| CN101787273A (en) * | 2009-12-24 | 2010-07-28 | 安徽泽润光电有限公司 | Light-emitting diode (LED) fluorescent glue |
| CN103682053A (en) * | 2013-12-04 | 2014-03-26 | 广西玖典电子新材料有限公司 | Blue fluorescent adhesive for LED |
| CN103746061A (en) * | 2013-12-18 | 2014-04-23 | 奇瑞汽车股份有限公司 | Fluorescent glue for COB-packaged LEDs |
| CN103811638A (en) * | 2012-11-06 | 2014-05-21 | 江苏稳润光电有限公司 | White light led |
| CN103985807A (en) * | 2013-02-07 | 2014-08-13 | 罗容 | Inorganic substrate and manufacturing method thereof |
-
2014
- 2014-12-16 CN CN201410772586.3A patent/CN104576895A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1275814A (en) * | 2000-06-27 | 2000-12-06 | 复旦大学 | Packaging method for organic electroluminescence device |
| CN101787273A (en) * | 2009-12-24 | 2010-07-28 | 安徽泽润光电有限公司 | Light-emitting diode (LED) fluorescent glue |
| CN103811638A (en) * | 2012-11-06 | 2014-05-21 | 江苏稳润光电有限公司 | White light led |
| CN103985807A (en) * | 2013-02-07 | 2014-08-13 | 罗容 | Inorganic substrate and manufacturing method thereof |
| CN103682053A (en) * | 2013-12-04 | 2014-03-26 | 广西玖典电子新材料有限公司 | Blue fluorescent adhesive for LED |
| CN103746061A (en) * | 2013-12-18 | 2014-04-23 | 奇瑞汽车股份有限公司 | Fluorescent glue for COB-packaged LEDs |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106622469A (en) * | 2016-12-01 | 2017-05-10 | 鸿利智汇集团股份有限公司 | Preparation method of LED (light emitting diode) anti-precipitation glue |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150429 |