CN103779346A - Near ultraviolet or ultraviolet excited LED light-emitting device - Google Patents
Near ultraviolet or ultraviolet excited LED light-emitting device Download PDFInfo
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- CN103779346A CN103779346A CN201410022228.0A CN201410022228A CN103779346A CN 103779346 A CN103779346 A CN 103779346A CN 201410022228 A CN201410022228 A CN 201410022228A CN 103779346 A CN103779346 A CN 103779346A
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Abstract
The invention relates to a near ultraviolet or ultraviolet excited LED light-emitting device which is composed of a packaging substrate, a near ultraviolet or ultraviolet LED chip and mixed fluorescent powder glue which can be used to effectively absorb light emitted by the LED chip and emit red, green and blue light. The light-emitting peak wavelength of the LED chip is in the range from 380nm to 420nm. The red fluorescent powder is the CaAlSi(ON)3: Eu system. The green fluorescent powder is the SiAlON: Eu system. The blue fluorescent powder is the (Sr, Ba)10(PO4)6Cl2: Eu system. Most of the light generated by the near ultraviolet or ultraviolet LED chip is used for exciting the fluorescent powder, so the color purity of the light only depends on the color purity of the fluorescent powder, and a high color rendering index CRI which is greater than 95 can be obtained, wherein color rendering indexes from R1 to R15 are all greater than 90. According to the invention, the made white LED device has advantages of good spectrum continuity, natural light proximity, that is the solar spectrum, good color temperature uniformity and no light spot.
Description
Technical field
The present invention relates to LED technical field, particularly relate to a kind of near ultraviolet or purple light excited LED light-emitting device.
Background technology
In the today of being becoming tight energy day, with respect to traditional fluorescent lamp and incandescent lamp, white light LEDs as a kind of novel lighting source there are energy-saving and environmental protection, the significant advantage such as the response time is short, the life-span is long.Current LED industry develops rapidly, and luminous efficiency rises year by year, and price declines year by year, and white light LEDs replaces fluorescent lamp and incandescent lamp just gradually, enters the market of domestic lighting.The method of making white light LEDs mainly contains following five kinds.
1, adopt red, green, blue color chip or the luminous colour mixture of multiple device to become white light, or pass through complementary color principle colour mixture generation white light with indigo plant+yellow dual chip.
2, white chip deposits successively the multi-layer quantum well structure of the light that can send different colours in same epitaxial wafer.
3, adopt blue chip to coordinate yellow fluorescent powder as yttrium-aluminium-garnet (YAG), the gold-tinted that the blue light sending by chip and fluorescent material send is mixed and is produced white light by complementary color principle.
4, adopt blue chip to coordinate red, green fluorescence powder, ruddiness, green glow that the blue light sending by chip and fluorescent material send mix acquisition white light.
5, adopt near ultraviolet or purple light chip to coordinate RGB fluorescent material, the ultraviolet light sending by chip or purple light excited fluorescent material send ruddiness, green glow, blue light acquisition white light.
Above-mentioned first two mode is directly to adopt chip light emitting to obtain white light, but the decay of the chip of different-waveband or quantum well there are differences, and therefore in use has wild effect, very easily causes the skew of colourity, and these two kinds of modes are eliminated gradually.
The third above-mentioned method is that the method that adopts chip to add fluorescent material obtains white light, is also current the most frequently used white light LEDs manufacture method, and yellow fluorescent powder+blue chip scheme is made white light LEDs, also referred to as binary white light LEDs.As shown in Figure 1, its spectrum is discontinuous spectrum to its typical light spectrogram of white light LEDs that this method is manufactured, and after 700nm, intensity is almost 0.Near blue green light region ruddiness region and the 490nm at 630nm-700nm place also relatively a little less than, therefore its color rendering index is lower.
What the 4th kind of above-mentioned method adopted is that blue chip excites green and red fluorescence powder acquisition white light, also be the method for current most widely used making white-light LED with high color rendering index, but equally also there is the problem of the above band spectrum of 470-520nm and 650nm disappearance, cause the R9 in the color rendering index of LED product to be difficult to raising with R12.
Above-mentioned Lung biopsy once had patent and literature research in LED industry, but all do not relate to encapsulation finished product color rendering index or color rendering index generally not high.For example document " white light LEDs that near ultraviolet chip excites three primary colors to make ", because of its fluorescent material system difference used, emission spectrum half-wave is wide narrow, causes its encapsulation finished product color rendering index generally not high, can only reach 82.For example CN1434521 again, its color rendering index can only reach 82-87, again because of its use be the fluorescent material of sulfide, and sulfide easily decomposes in the time being heated, and will inevitably cause light decay.
Summary of the invention
The object of this invention is to provide a kind of high color rendering index (CRI) (CRI>95, from R1 to R15, be all greater than 90) the manufacture method of White LED light-emitting device, utilize black light or purple light excited fluorescent material to produce three primary colors light, colour mixture forms white light.
Near ultraviolet or a purple light excited LED light-emitting device, by base plate for packaging, black light or purple LED chip and the mixed fluorescent powder glue that can effectively absorb the luminous of LED chip and discharge red, green, blue form;
Wherein LED chip peak luminous wavelength is: 380nm-420nm,
Wherein consisting of of red, green, blue three primary colors fluorescent powder:
Red fluorescence powder: CaAlSi (ON)
3: Eu system,
Green emitting phosphor: SiAlON:Eu system,
Blue colour fluorescent powder: (Sr, Ba)
10(PO
4)
6cl
2: Eu system.
Described red fluorescence powder compound general formula is: Ca
xal
ysi
vo
wn
e: Eu
z0.8<x<1,0.8<y<1,0<z<0.1,0.8<v<1.1,0<w<0.2,2.2<e<3.3, green emitting phosphor compound general formula is: Si
6-mal
mo
mn
8-m: Eu
z, 0<m≤4.2,0<z<0.1, blue colour fluorescent powder compound general formula is: (Sr
n, Ba
1-n)
10(PO
4)
6cl
2: Eu
z, 0<n<1,0<z<0.1.
Because the ratio of fluorescent material composition has very close relationship with the particle size of fluorescent material itself, even the fluorescent material of composition of the same race, the difference that also can distribute because of particle diameter causes proportional difference very large, so in LED Packaging Industry, the proportioning of fluorescent material is not fixed, need to adjust according to target colour temperature, preferably join powder ratio and be:
Rouge and powder: green powder: blue powder=(0.5-5): (0.1-0.7): 1.
Described LED chip installs the filter that filters purple light outward additional.
Wherein base plate for packaging can be metallic support, printed circuit board (PCB), ceramic substrate or silicon substrate.
Described base plate for packaging is square, and two electrodes that are connected with LED chip are respectively at two diagonal angles of base plate for packaging or relative two ends.
Described LED chip has several, is cascaded structure each other, and is fixed on the central authorities of base plate for packaging.
Described LED chip is InGaN or GaN series semiconductor chip.
Wherein mixed fluorescent powder glue glue used is that light transmittance is greater than 90% glue.
Described glue is silica gel.
LED chip is fixed on base plate for packaging, be communicated with electrode and will there is the wide range fluorescent powder colloid of red, green, blue three primary colors mixing, to apply or the mode of some glue is direct or indirect is coated in LED chip surface, utilize black light or purple light excited fluorescent material to produce three primary colors light, colour mixture forms white light.
The invention has the advantages that:
1, the present invention is a kind of production method of white-light LED with high color rendering index light source, because chip used peak wavelength is at 380nm-420nm, the wide part that this LED chip produces is for excitated fluorescent powder, therefore, the colorimetric purity of light only depends on the colorimetric purity of fluorescent material, can also obtain very high color rendering index (CRI>95, from R1 to R15, be all greater than 90), far exceed the color rendering index 85 that other blue chips coordinate fluorescent material to produce, this also at present other any illumination modes all cannot realize.
2, the white light that the present invention produces, because be by black light or purple light excited and obtain, therefore energy conversion efficiency is high.
3, the white light LEDs device of made of the present invention, its spectrum belongs to continuous spectrum, approaches natural daylight, i.e. solar spectrum.
4, the white light LEDs device of made of the present invention, can increase filter the excitation spectrum of purple light is filtered out, and does not affect the luminous of fluorescent material, makes white light LEDs spectrum more approach solar spectrum.
5, the white light LEDs device of made of the present invention, color temperature uniformity is good, without hot spot.
Accompanying drawing explanation
The mixed white light spectrum of Fig. 1 for adopting blue chip to coordinate yellow fluorescent powder to be produced as yttrium-aluminium-garnet (YAG),
Fig. 2 is for adopting blue chip to coordinate red, the mixed white light spectrum that green fluorescence powder produces, black light of the present invention or purple light chip to coordinate mixed white light spectrum that red-green-blue fluorescent material produces and the comparison diagram of solar spectrum,
Fig. 3 coordinates mixed white light spectrum that red-green-blue fluorescent material produces and the comparison diagram of solar spectrum for black light of the present invention or purple light chip,
Fig. 4 coordinates the comparison diagram of mixed white light spectrum (adding after filter) that red-green-blue fluorescent material produces and solar spectrum for black light of the present invention or purple light chip,
Fig. 5 is the encapsulating structure schematic diagram of the embodiment of the present invention 1,
Fig. 6 is the encapsulating structure schematic diagram of the embodiment of the present invention 2,
Fig. 7 is the emission spectrum of the embodiment of the present invention 1 red-green-blue wide range used fluorescent material.
Embodiment
By reference to the accompanying drawings the present invention is described in further details below by embodiment.
Fluorescent material used is sold on market, for example CaAlSi (ON)
3: Eu system is the 1113 system fluorescent material that Mitsubishi Chemical sells, and SiAlON:Eu system is the SiAlON system fluorescent material that electrochemical (DENKA) is sold, (Sr, Ba)
10(PO
4)
6cl
2: Eu system is the blue colour fluorescent powder that Mitsubishi Chemical sells.
Wherein LED chip peak luminous wavelength is: 380nm-420nm, the one in InGaN or GaN series semiconductor chip.
Red fluorescence powder composition formula is: CaAlSi (ON)
3: Eu, Emission Spectrum Peals wavelength is at 620-650nm, and half-peak breadth is at 105-135nm;
Green emitting phosphor composition formula is: SiAlON:Eu, and Emission Spectrum Peals wavelength is at 530-560nnm, and half-peak breadth is at 40-70nm;
Blue colour fluorescent powder composition formula is: (Sr, Ba)
10(PO
4)
6cl
2: Eu, Emission Spectrum Peals wavelength is at 455-485nnm, and half-peak breadth is at 60-90nm.
Its emission spectrum is shown in Fig. 7.
As shown in Figure 5, the white light emitting device of present embodiment belongs to paster encapsulation, comprises that base plate for packaging 3, LED chip 1 and 2, two electrodes of two electrodes are respectively at the two ends of base plate for packaging 3, for drawing the both positive and negative polarity of LED chip 1.
First, chip 1 is fixed on base plate for packaging 3, thereby chip two ends are connected and two electrode 2 conductings with two pole pieces of base plate bottom by gold thread respectively.
Then, allot by a certain percentage (in the time that the particle diameter of fluorescent material changes, proportioning need adjust, in fact the particle diameter of the fluorescent material of each batch is not identical, therefore in the time making LED, the fluorescent material that every buying is one batch all needs to adjust proportioning one time.Further, when the white light LED color temperature of encapsulation is different, the ratio of fluorescent material also needs to adjust) colloid mixture that contains red-green-blue fluorescent material, stir, vacuum defoamation.
Further, colloid mixture is evenly coated in to LED chip top, its coating thickness is rationally set, guarantee good photochromic uniformity, make LED keep higher light extraction efficiency, strengthen LED brightness.
Table 1 is that the embodiment of the present invention 1 contrasts list with every color rendering index of common high colour developing product
As seen from Table 1, color rendering index (CRI>95 is all greater than 90 from R1 to R15).
Its mixed white light spectrum as shown in Figure 1.
The present embodiment 1, comparative example and solar spectrum contrast as shown in Figure 2,3.
Solar spectrum shown in figure is the solar spectrum of 3200K, is also the spectral shape that the most frequently used incandescent lamp sends.The common high-color development LED of CRI90 is the high-color development LED product of selling in the market, to adopt the white light that blue chip is excitated red and green emitting phosphor obtains, this spectrum has approached solar spectrum, but because the crest of blue chip is narrower, lack supplementing of blue colour fluorescent powder spectrum simultaneously, and the region of the red fluorescence powder using after 700nm is luminous hardly, therefore can locate to occur spectrum disappearance at blue green light (480nm～520nm) and saturated ruddiness (>660nm), cause color rendering index to be difficult to further lifting.The spectrum of embodiment 1 has supplemented the blue green light of 480nm～520nm and saturated ruddiness more than 660nm just, makes its spectrum more approach solar spectrum.
As shown in Figure 6, the white light emitting device of present embodiment belongs to integration packaging, comprises that base plate for packaging 1, LED chip 2 and 3, two electrodes of two electrodes are respectively at two diagonal angles of base plate for packaging 1, for drawing the both positive and negative polarity of LED chip 2.
First, some chips 2 are fixed on base plate for packaging 1, by series-parallel system, thereby chip two ends are connected and two electrode 3 conductings with two pole pieces of base plate bottom by gold thread respectively.
Then, after box dam baking, allot by a certain percentage the colloid mixture that contains red-green-blue fluorescent material, stir, vacuum defoamation.
Further, colloid mixture is evenly coated in to LED chip top, its coating thickness is rationally set, guarantee good photochromic uniformity, make LED keep higher light extraction efficiency, without hot spot.
The advantage of integration packaging is, at the less substrate surface multiple chips of can arranging, to have dwindled the volume of LED light source.
On the chip of embodiment 1, load filter.
Its mixed spectra as shown in Figure 4.
Increase after filter, eliminated the injury of the ultraviolet light that may leak to human body, the crest of the purple light that the purple light chip of eliminating on the other hand sends, is that the spectral shape of whole white light LEDs device more approaches solar spectrum.
Above content is in conjunction with embodiment further description made for the present invention; can not assert that specific embodiment of the invention is confined to these explanations; any deduction or replace that design has been done according to the present invention, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. near ultraviolet or a purple light excited LED light-emitting device, by base plate for packaging, black light or purple LED chip and the mixed fluorescent powder glue that can effectively absorb the luminous of LED chip and discharge red, green, blue form;
Wherein LED chip peak luminous wavelength is: 380nm-420nm,
Wherein consisting of of red-green-blue fluorescent material:
Red fluorescence powder: CaAlSi (ON)
3: Eu system,
Green emitting phosphor: SiAlON:Eu system,
Blue colour fluorescent powder: (Sr, Ba)
10(PO
4)
6cl
2: Eu system.
2. LED light-emitting device according to claim 1, described red fluorescence powder compound general formula is: Sr
xca
yal
wsi
vn
e: Eu
z0.3<x<1,0.08<y<1,0<z<0.1,0.8<w<1,0.8<v<1.1,2.2<e<3.3, green emitting phosphor compound general formula is: Si
6-mal
mo
mn
8-m: Eu
z, 0<m≤4.2,0<z<0.1, blue colour fluorescent powder compound general formula is: (Sr
n, Ba
1-n)
10(PO
4)
6cl
2: Eu
z, 0<n<1,0<z<0.1.
3. LED light-emitting device according to claim 2, red fluorescence powder: green emitting phosphor: blue colour fluorescent powder=(0.5-5): (0.1-0.7): 1.
4. LED light-emitting device according to claim 1, described LED chip installs the filter that filters purple light outward additional.
5. LED light-emitting device according to claim 1, wherein base plate for packaging is metallic support, printed circuit board (PCB), ceramic substrate or silicon substrate.
6. LED light-emitting device according to claim 5, described base plate for packaging is square, two electrodes that are connected with LED chip are respectively at two diagonal angles of base plate for packaging or relative two ends.
7. LED light-emitting device according to claim 6, described LED chip has several, is cascaded structure each other, and is fixed on the central authorities of base plate for packaging.
8. LED light-emitting device according to claim 1, described LED chip is InGaN or GaN series semiconductor chip.
9. LED light-emitting device according to claim 1, wherein mixed fluorescent powder glue glue used is that light transmittance is greater than 90% glue.
10. LED light-emitting device according to claim 9, described glue is silica gel.
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| CN201410022228.0A CN103779346B (en) | 2014-01-17 | 2014-01-17 | Near ultraviolet or ultraviolet excited LED light-emitting device |
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| CN104993035A (en) * | 2015-07-30 | 2015-10-21 | 厦门大学 | Warm white light LED luminescent apparatus |
| CN105609494A (en) * | 2014-10-27 | 2016-05-25 | 光宝光电(常州)有限公司 | White light emitting device |
| CN105702837A (en) * | 2015-12-10 | 2016-06-22 | 广东新光源电子科技有限公司 | LED light source imitating spectrum of sunlight |
| CN107384383A (en) * | 2017-08-18 | 2017-11-24 | 苏州轻光材料科技有限公司 | A kind of compound fluorescent material of UV excited white lights LED |
| JP2018093161A (en) * | 2016-12-02 | 2018-06-14 | 豊田合成株式会社 | Light-emitting device |
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| CN110635013A (en) * | 2019-09-20 | 2019-12-31 | 深圳市长方集团股份有限公司 | Full-spectrum cold-white LED light source excited by purple light |
| CN110959201A (en) * | 2017-06-28 | 2020-04-03 | 京瓷株式会社 | Light emitting device and lighting device |
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| CN105609494B (en) * | 2014-10-27 | 2019-03-01 | 光宝光电(常州)有限公司 | White light emitting device |
| CN105609494A (en) * | 2014-10-27 | 2016-05-25 | 光宝光电(常州)有限公司 | White light emitting device |
| CN104993035A (en) * | 2015-07-30 | 2015-10-21 | 厦门大学 | Warm white light LED luminescent apparatus |
| CN104993035B (en) * | 2015-07-30 | 2018-08-17 | 厦门大学 | A kind of warm white LED light-emitting device |
| CN105702837A (en) * | 2015-12-10 | 2016-06-22 | 广东新光源电子科技有限公司 | LED light source imitating spectrum of sunlight |
| CN105702837B (en) * | 2015-12-10 | 2019-03-01 | 广东新光源电子科技有限公司 | A kind of imitative sunlight spectrum LED light source |
| JP2018093161A (en) * | 2016-12-02 | 2018-06-14 | 豊田合成株式会社 | Light-emitting device |
| JP2018182028A (en) * | 2017-04-11 | 2018-11-15 | 日亜化学工業株式会社 | Light emitting device |
| JP7004892B2 (en) | 2017-04-11 | 2022-01-21 | 日亜化学工業株式会社 | Luminescent device |
| CN110959201A (en) * | 2017-06-28 | 2020-04-03 | 京瓷株式会社 | Light emitting device and lighting device |
| CN110959201B (en) * | 2017-06-28 | 2023-05-09 | 京瓷株式会社 | Light emitting device and lighting device |
| CN107384383A (en) * | 2017-08-18 | 2017-11-24 | 苏州轻光材料科技有限公司 | A kind of compound fluorescent material of UV excited white lights LED |
| CN109301055A (en) * | 2018-08-31 | 2019-02-01 | 广东希姆乐斯健康照明科技有限公司 | A kind of Healthy Lighting LED light |
| CN109869687A (en) * | 2019-03-15 | 2019-06-11 | 索罗紫光(上海)科技有限公司 | A kind of LED light source and car light |
| CN110098304A (en) * | 2019-04-29 | 2019-08-06 | 佛山市国星光电股份有限公司 | A kind of novel light-emitting lamp bead and lamps and lanterns |
| CN112310263A (en) * | 2019-08-02 | 2021-02-02 | 江苏博睿光电有限公司 | Full-spectrum LED light source |
| CN112310263B (en) * | 2019-08-02 | 2022-04-05 | 江苏博睿光电有限公司 | Full-spectrum LED light source |
| CN110452699A (en) * | 2019-08-08 | 2019-11-15 | 苏州山人纳米科技有限公司 | Nitrifier green phosphor fast preparation method |
| CN110635013A (en) * | 2019-09-20 | 2019-12-31 | 深圳市长方集团股份有限公司 | Full-spectrum cold-white LED light source excited by purple light |
| CN111963911A (en) * | 2020-08-14 | 2020-11-20 | 贵州西能电光科技发展有限公司 | LED white light source and LED white light source device |
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