CN101770264A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN101770264A CN101770264A CN200810189132A CN200810189132A CN101770264A CN 101770264 A CN101770264 A CN 101770264A CN 200810189132 A CN200810189132 A CN 200810189132A CN 200810189132 A CN200810189132 A CN 200810189132A CN 101770264 A CN101770264 A CN 101770264A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- housing
- nonmetal
- electronic installation
- conductie buffer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention relates to an electronic device which comprises a casing, a circuit board, a first nonmetal conductive buffer piece and a fastener. The circuit board is arranged in the casing, and the first nonmetal conductive buffer piece is arranged between the circuit board and the casing, wherein the first nonmetal conductive buffer piece and the casing have the same potential. The fastener enables the circuit board and the first nonmetal conductive buffer piece to be fixed in the casing.
Description
Technical field
The invention relates to a kind of device, and particularly relevant for a kind of electronic installation.
Background technology
The difference of portable computer and traditional desktop PC maximum is that portable computer is stressed compact, the user can be easy to carry about with one, and provide the user to carry out the convenience of computer operation under various environment.Yet portable electronic devices can more or less be vibrated along with moving of individual, these vibratory impulses then may for internal circuit board indirect cause damage.
Fig. 1 is the schematic perspective view of known portable electronic devices.Fig. 2 is the diagrammatic cross-section of known portable electronic devices.Please also refer to Fig. 1 and Fig. 2, portable electronic devices 10 (for example being mobile computer) comprises a display 20, a main frame 30 and a pin-jointed structure 40, and wherein display 20 interconnects through pin-jointed structure 40 with main frame 30.Main frame 30 is combined with circuit board 36 by loam cake group 32, lower cover group 34, and circuit board 36 is mounted between loam cake group 32 and the lower cover group 34, wherein has a plurality of joint pin 34a on the plane of lower cover group 34, and the inner ring of joint pin 34a has screw thread.There is an assembly hole 36a position of circuit board 36 corresponding joint pin 34a.When circuit board 36 is assembled in lower cover group 34, pass the assembly hole 36a of circuit board 36 with a screw 50, lock the joint pin 34a of lower cover group 34 again.So, circuit board 36 can firmly fit together with lower cover group 34.
Above-mentioned circuit board 36 assembling modes, but though fixing circuit board 36, but because screw 50, circuit board 36 and lower cover group 34 are hard material, so portable electronic devices 10 vibrates or bears when clashing into, circuit board 36 bears bigger stress in the position that screw 50 is locked, therefore be easy to generate fracture even cracked, might cause circuit board 36 distortion in addition, and then influence the transmission of the electric signal of circuit board 36.
Summary of the invention
The object of the present invention is to provide a kind of electronic installation, the surge capability in the time of can promoting circuit board chance external impacts.
The present invention proposes a kind of electronic installation, and it comprises a casing, a circuit board, one first nonmetal conductie buffer spare and a locking part.Circuit board arrangement is in casing, and the first nonmetal conductie buffer spare is disposed between circuit board and the casing, and wherein the first nonmetal conductie buffer spare is identical with the casing current potential.Locking part is fixed in casing with the circuit board and the first nonmetal conductie buffer spare.
In an embodiment of electronic installation of the present invention, the first nonmetal conductie buffer spare is a packing ring.
In an embodiment of electronic installation of the present invention, the first nonmetal conductie buffer spare has a vertical in fact sleeved part and one first support portion that links to each other, and circuit board has an assembly hole, wherein sleeved part is positioned at the assembly hole of circuit board, and support zone is between a first surface and casing of circuit board.In addition, the first nonmetal conductie buffer spare more comprises one second support portion, and second support portion in fact vertically is connected in sleeved part, and between a second surface relative with first surface and casing of circuit board.
In an embodiment of electronic installation of the present invention, more comprise one second nonmetal conductie buffer spare, wherein the second nonmetal conductie buffer spare and the first nonmetal conductie buffer spare lay respectively at the both sides of circuit board.
In an embodiment of electronic installation of the present invention, casing has one first housing and one second housing, and circuit board arrangement is between first housing and second housing, and locking part pass circuit board and the first nonmetal conductie buffer spare with lock first housing and second housing at least one of them.First housing has one first assembled portion, and second housing has one second assembled portion.
In an embodiment of electronic installation of the present invention, first assembled portion is the projection of a hollow, and second assembled portion comprises a perforate, and locking part passes first assembled portion and second assembled portion so that first housing and second housing fit together.
In an embodiment of electronic installation of the present invention, first housing has more a body and a lug boss, and lug boss protrudes from the surface of body towards circuit board, and lug boss is connected between the body and first assembled portion.
In an embodiment of electronic installation of the present invention, first assembled portion or second assembled portion have an internal thread, and locking part is a screw.
In an embodiment of electronic installation of the present invention, locking part comprises a screw and a nut, and nut is equipped in second assembled portion of second housing, and screw passes first assembled portion to lock in the nut.
In an embodiment of electronic installation of the present invention, the first nonmetal conductie buffer spare has more a plurality of salient points, and salient point contact casing and circuit board at least one of them.
In an embodiment of electronic installation of the present invention, the material of the first nonmetal conductie buffer spare is a conductive rubber.
In electronic installation of the present invention, the external force collision and the vibration that can the buffer circuit plate be subjected to by nonmetal conductie buffer spare are with the holding circuit plate.In addition, circuit board can see through nonmetal conductie buffer spare and the mutual conducting of casing with ground connection.So being provided with of nonmetal conductie buffer spare can reach the function that cushions external force and ground connection simultaneously, electronic installation does not need to be provided with in addition grounding circuit or Buffer Unit, and then saves cost.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 is the schematic perspective view of known portable electronic devices.
Fig. 2 is the diagrammatic cross-section of known portable electronic devices.
Fig. 3 illustrates the diagrammatic cross-section of the electronic installation of first embodiment of the invention.
Fig. 4 is another diagrammatic cross-section of the electronic installation of Fig. 3.
Fig. 5 is the diagrammatic cross-section of the electronic installation of second embodiment of the invention.
Fig. 6 is the diagrammatic cross-section that illustrates the electronic installation of third embodiment of the invention.
Fig. 7 only has the synoptic diagram of the example of a support portion for nonmetal conductie buffer spare.
Fig. 8 seizes the synoptic diagram of the example of a circuit board on both sides by the arms jointly for using a plurality of nonmetal conductie buffer spares.
Fig. 9 is the diagrammatic cross-section of the electronic installation of fourth embodiment of the invention.
[primary clustering symbol description]
10: portable electronic devices
20: display
30: main frame
32: the loam cake group
34: the lower cover group
34a: joint pin
36: circuit board
36a: assembly hole
40: pin-jointed structure
50: screw
100,200,300: electronic installation
110,210: the first housings
110a: surface
112,212: the first assembled portion
122a: internal thread
114: body
116: lug boss
120: the second housings
122: the second assembled portion
130,220: circuit board
130a: first surface
130b: second surface
132,222: assembly hole
140,140 ', 230,230 ', 340: nonmetal conductie buffer spare
142,232: sleeved part
144,145,234: the support portion
146,236: salient point
150,240: locking part
152,242: screw
154,244: nut
Embodiment
[first embodiment]
Fig. 3 illustrates the diagrammatic cross-section of the electronic installation of first embodiment of the invention.Please refer to Fig. 3, the electronic installation 100 of present embodiment comprises a casing, a circuit board 130, one nonmetal conductie buffer spare 140 and a locking part 150.Casing comprises first housing 110 and one second housing 120.First housing 110 has one first assembled portion 112, and wherein first assembled portion 112 of present embodiment is the projection of a hollow.Second housing 120 has one second assembled portion 122, and second assembled portion 122 for example is a perforate.In the present embodiment, the material of first housing 110 and second housing 120 can be metal or other conductive material.Circuit board 130 has an assembly hole 132, and circuit board 130 is mounted between first housing 110 and second housing 120.Nonmetal conductie buffer spare 140 is set in the assembly hole 132, and nonmetal conductie buffer spare 140 optional usefulness have the material making of conductive characteristic, for example conductive rubber.The nonmetal conductie buffer spare 140 of present embodiment has a sleeved part 142 and two support portions 144,145.Sleeved part 142 is positioned at the assembly hole 132 of circuit board 130, and support portion 144,145 all is connected with sleeved part 142 is vertical in fact, wherein support portion 144 is between the second surface 130b of second housing 120 and circuit board 130, and support portion 145 is between the first surface 130a of first housing 110 and circuit board 130.Support portion 144,145 is held under the arm jointly and is put support circuit plate 130, and because the conductive characteristic of nonmetal conductie buffer spare 140 makes it identical with the casing current potential, can there be the effect that is equal to ground connection support portion 144,145 with first housing 110 and second housing 120 respectively.In other embodiments, also can have only one of them and first housing 110 of support portion 144,145 or second housing 120 that the effect that is equal to ground connection is arranged, determine according to design requirement.The current potential that the present invention carried is identical/equipotential and ground connection/be equal to ground connection can use alternately, and the meaning and effect that it is expressed are the same.Locking part 150 passes the sleeved part 142 of first assembled portion 112 and nonmetal conductie buffer spare 140, locks second assembled portion 122, so that circuit board 130 and first housing 110 and second housing 120 are fixed together.The locking part 150 of present embodiment can comprise a screw 152 and a nut 154, and wherein nut 154 is equipped in second assembled portion 122 of second housing 120, and screw 152 passes first assembled portion 112 to lock in the nut 154.
Hold above-mentioned, when assembling the electronic installation 100 of present embodiment, the assembly hole 132 that earlier nonmetal conductie buffer spare 140 is sheathed on circuit board 130 is interior to hold circuits plate 130 under the arm, and nut 154 is arranged in second assembled portion 122, again screw 152 is passed the sleeved part 142 of first assembled portion 112 and nonmetal conductie buffer spare 140 afterwards and lock on nut 154.So, circuit board 130 can be seen through locking part 150 is fixed between first housing 110 and second housing 120.Specifically, nonmetal conductie buffer spare 140 has conductive characteristic, and the nonmetal conductie buffer spare 140 of present embodiment can contact with first housing 110, second housing 120 and circuit board 130 simultaneously, so can allow circuit board 130 via nonmetal conductie buffer spare 140 and first housing 110 and second housing 120 one of them ground connection at least.In addition; nonmetal conductie buffer spare 140 also has surge capability with holding circuit plate 130; avoid electronic installation 100 to make the circuit board 130 and first housing 110 or 120 collisions of second housing because being subjected to external impacts, and can make the circuit board 130 and first housing 110 or second housing 120 keep firm fixed relationship.In the present embodiment, circuit board 130 is fixed together with first housing 110 and second housing 120 simultaneously.But in other embodiments, circuit board 130 also can only be fixed with first housing 110 or only fix with second housing 120 and get final product, and this knows usually that for present technique field tool the knowledgeable just can well imagine after considering this instructions in light of actual conditions, therefore draw no longer in addition and show explanation.
Fig. 4 is the diagrammatic cross-section of another example of casing of the electronic installation of Fig. 3.Please refer to Fig. 4, in another example, second assembled portion 122 for example can have an internal thread 122a, and locking part 150 for example is a screw.So, can directly locking part 150 be passed first assembled portion 112 and lock among the internal thread 122a of second assembled portion 122, so that the circuit board 130 and first housing 110 and second housing 120 are fixed together.In the embodiment that other does not illustrate, also can be to make first assembled portion 112 have internal thread 122a, determine according to demand.
In addition, nonmetal conductie buffer spare 140 can have a plurality of salient points 146, and these salient points 146 be positioned at two support portions 144,145 with contact first housing 110, second housing 120 and circuit board 130 at least one of them, seize the steadiness of circuit board 130 on both sides by the arms and make the effect of circuit board 130 to increase nonmetal conductie buffer spare 140 via chassics earth.144,145 contacts, first housing 110, second housing 120 and circuit board 130 places all are provided with salient point 146 to the nonmetal conductie buffer spare 140 of Fig. 3 in the support portion.When locking part 150 fitted together circuit board 130, first housing 110 and second housing 120, first housing 110, second housing 120 and circuit board 130 can be earlier to salient point 146 precompressed, to reach fixed effect more closely.In addition, by the precompressed of salient point 146, what more can increase the circuit board 130 and first housing 110 and second housing 120 is equal to the ground connection effect.
[second embodiment]
Fig. 5 is the diagrammatic cross-section of the electronic installation of second embodiment of the invention.The present embodiment and first embodiment are roughly the same, and same or analogous assembly label is represented same or analogous assembly.Please refer to Fig. 5, first housing 110 of present embodiment has more a body 114 and a lug boss 116, lug boss 116 protrudes from the surperficial 110a of body 114 towards circuit board 130, and lug boss 116 is connected between the body 114 and first assembled portion 112, and wherein first assembled portion 112 is the projection of a hollow.Compared to first embodiment, the body 114 of first housing 110 of present embodiment and the distance between the circuit board 130 are greater than first housing 110 of first embodiment and the distance between the circuit board 130.Because the height of lug boss 116 can cooperate the height of assembly on the circuit board 130 to adjust, thus increase distance between body 114 and the circuit board 130 by lug boss 116, can make the assembly on the circuit board 130 selection and dispose more elasticity.
[the 3rd embodiment]
Fig. 6 is the diagrammatic cross-section that illustrates the electronic installation of third embodiment of the invention.Please refer to Fig. 6, the electronic installation 200 of the 3rd embodiment and the part member of first embodiment are roughly the same, thus do not add to give unnecessary details, only at more important and difference explanation.First housing 210 of second embodiment has one first assembled portion 212, and first assembled portion 212 is a groove.In the present embodiment, the material of first housing 210 is metal or other conductive material.Wherein, for illustrative simplicity in order to explanation, among Fig. 6 and unshowned second housing, but be not that the electronic installation 200 of present embodiment does not comprise second housing.
Show that as Fig. 6 the sleeved part 232 of nonmetal conductie buffer spare 230 is sheathed in the assembly hole 222 of circuit board 220, and two support portions 234 are positioned at the both sides of sleeved part 232 and hold under the arm and put support circuit plate 220, and one of them support portion 234 and first housing, 210 ground connection.The nut 244 of locking part 240 is equipped in first assembled portion 212, and the screw 242 of locking part 240 passes nonmetal conductie buffer spare 230 and locks in the nut 244, circuit board 220 is fixed in first housing 210.The nut 244 that is equipped on first assembled portion 212 also can substitute by an internal thread, locks for screw 242.
In addition, nonmetal conductie buffer spare 230 can have a plurality of salient points 236, and the salient point 236 of present embodiment is positioned at two support portions, 234 contact circuit plates 220, locking part 240 and first housing 210 one of them place at least.When locking part 240 was fixed together circuit board 220 and first housing 210, first housing 210, locking part 240 and circuit board 220 can be to these salient point 236 precompressed, to reach fixed effect more closely.In addition, circuit board 220 can be by the salient point 236 and first housing, 210 ground connection of nonmetal conductie buffer spare 230.
Though above three embodiment are that to have two support portions with nonmetal conductie buffer spare be the example explanation, but present technique field tool knows that usually the knowledgeable is after considering this instructions in light of actual conditions, also can make nonmetal conductie buffer spare only have a support portion with well imagining, and make this support portion and frame ground because of nonmetal conductie buffer spare and casing equipotential.Fig. 7 only has the synoptic diagram of the example of a support portion for nonmetal conductie buffer spare.Show as Fig. 7, as long as just make nonmetal conductie buffer spare 230 ' have a support portion 234 can with first housing, 210 ground connection, and provide circuit board 220 buffering effects.Perhaps, also can be that two nonmetal conductie buffer spares 140,140 ' with a support portion are fitted together, use a plurality of nonmetal conductie buffer spares 140,140 ' to seize the also effect of holding circuit plate 130 jointly on both sides by the arms to reach, show as Fig. 8.
[the 4th embodiment]
Present embodiment and above-mentioned first, second and third embodiment are roughly the same, and same or analogous assembly label represents same or analogous assembly, just no longer add to give unnecessary details.
Fig. 9 is the diagrammatic cross-section of the electronic installation of fourth embodiment of the invention.Please refer to Fig. 9, present embodiment and aforesaid embodiment difference are: in the electronic installation 300 of present embodiment, nonmetal conductie buffer spare 340 is a packing ring, and locking part 150 can pass packing ring.In Fig. 9, packing ring has two, be configured in respectively between the circuit board 130 and first housing 110 and second housing 120, with effect that circuit board 130 buffering is provided and with first housing 110 and second housing 120 one of them ground connection at least.In addition, packing ring the position is set and quantity also can determine according to actual demand.
What deserves to be mentioned is, though the above embodiments are to be the example explanation with ground connection with nonmetal conductie buffer spare contact casing, this technical field tool knows that usually the knowledgeable also can also make nonmetal conductie buffer spare see through other conductive component with or ground connection identical with the casing current potential.In other words, nonmetal conductie buffer spare does not directly contact casing.
In addition, present technique field tool is known the knowledgeable usually, also can not violate under the spirit of the present invention, and the change of the above embodiments flexibly being made up, replace or make other is with realistic demand.
In sum, in electronic installation of the present invention, nonmetal conductie buffer spare has resiliency to absorb because of vibration effectively or to collide the impulsive force holding circuit plate that is produced.Therefore, circuit board is difficult for deforming or being shifted when meeting vibration or bearing bump, and circuit board is still firmly fitted together with housing.In addition, nonmetal conductie buffer spare has the characteristic of conduction, can make the circuit board and first housing or second housing see through nonmetal conductie buffer spare ground connection.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (13)
1. an electronic installation is characterized in that, comprising:
One casing;
One circuit board is disposed in this casing;
One first nonmetal conductie buffer spare is disposed between this circuit board and this casing, and wherein this first nonmetal conductie buffer spare is identical with this casing current potential; And
One locking part is fixed in this casing with this circuit board and this first nonmetal conductie buffer spare.
2. electronic installation as claimed in claim 1 is characterized in that: this first nonmetal conductie buffer spare is a packing ring.
3. electronic installation as claimed in claim 1, it is characterized in that: this first nonmetal conductie buffer spare has a vertical sleeved part and one first support portion that links to each other, and this circuit board has an assembly hole, wherein this sleeved part is positioned at this assembly hole of this circuit board, and this support zone is between a first surface and this casing of this circuit board.
4. electronic installation as claimed in claim 3, it is characterized in that: this first nonmetal conductie buffer spare more comprises one second support portion, and this second support portion vertically is connected in this sleeved part, and between a second surface relative with this first surface and this casing of this circuit board.
5. electronic installation as claimed in claim 1 is characterized in that: more comprise one second nonmetal conductie buffer spare, wherein this second nonmetal conductie buffer spare and this first nonmetal conductie buffer spare lay respectively at the both sides of this circuit board.
6. electronic installation as claimed in claim 1, it is characterized in that: this casing has one first housing and one second housing, and this circuit board arrangement is between this first housing and this second housing, and this locking part pass this circuit board and this first nonmetal conductie buffer spare with lock this first housing and this second housing at least one of them.
7. electronic installation as claimed in claim 6 is characterized in that: this first housing has one first assembled portion, and this second housing has one second assembled portion.
8. electronic installation as claimed in claim 7, it is characterized in that: this first assembled portion is the projection of a hollow, and this second assembled portion comprises a perforate, and this locking part passes this first assembled portion and this second assembled portion so that this first housing and this second housing fit together.
9. electronic installation as claimed in claim 7 is characterized in that: this first housing has more a body and a lug boss, and this lug boss protrudes from the surface of this body towards this circuit board, and this lug boss is connected between this body and this first assembled portion.
10. electronic installation as claimed in claim 7 is characterized in that: this first assembled portion or this second assembled portion have an internal thread, and this locking part is a screw.
11. electronic installation as claimed in claim 7 is characterized in that: this locking part comprises a screw and a nut, and this nut is equipped in this second assembled portion of this second housing, and this screw passes this first assembled portion to lock in this nut.
12. electronic installation as claimed in claim 1 is characterized in that: this first nonmetal conductie buffer spare has more a plurality of salient points, and those salient points contact this casing and this circuit board at least one of them.
13. electronic installation as claimed in claim 1 is characterized in that: the material of this first nonmetal conductie buffer spare is a conductive rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810189132A CN101770264A (en) | 2008-12-29 | 2008-12-29 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810189132A CN101770264A (en) | 2008-12-29 | 2008-12-29 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101770264A true CN101770264A (en) | 2010-07-07 |
Family
ID=42503168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810189132A Pending CN101770264A (en) | 2008-12-29 | 2008-12-29 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101770264A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529303A (en) * | 2016-06-20 | 2017-12-29 | 台达电子工业股份有限公司 | Electronic installation |
| CN110475441A (en) * | 2019-09-05 | 2019-11-19 | 王舒正 | A kind of electronic information communication equipment |
| CN114845491A (en) * | 2021-02-02 | 2022-08-02 | 台达电子工业股份有限公司 | Electronic device and grounding module thereof |
-
2008
- 2008-12-29 CN CN200810189132A patent/CN101770264A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529303A (en) * | 2016-06-20 | 2017-12-29 | 台达电子工业股份有限公司 | Electronic installation |
| CN110475441A (en) * | 2019-09-05 | 2019-11-19 | 王舒正 | A kind of electronic information communication equipment |
| CN114845491A (en) * | 2021-02-02 | 2022-08-02 | 台达电子工业股份有限公司 | Electronic device and grounding module thereof |
| CN114845491B (en) * | 2021-02-02 | 2024-04-02 | 台达电子工业股份有限公司 | Electronic device and grounding module thereof |
| US11956888B2 (en) | 2021-02-02 | 2024-04-09 | Delta Electronics, Inc. | Electronic device and grounding assembly thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI360038B (en) | Electronic device | |
| US7204723B2 (en) | Universal serial bus connector | |
| US20120171883A1 (en) | Securing apparatus for connector | |
| US8472198B2 (en) | Data center with cable management structure | |
| JP7206374B2 (en) | Electronic board mounting system | |
| US6654232B1 (en) | Portable computer which uses spring to buffer shock force of a monitor | |
| CN108258875A (en) | Moving-coil type linear vibration electric motor | |
| CN101770264A (en) | Electronic device | |
| CN101686595A (en) | Electronic device and conducting strip thereof | |
| JP4884334B2 (en) | Image display device | |
| JP5922486B2 (en) | Slide type electronic equipment | |
| CN208240908U (en) | Connector and electronic equipment | |
| JP2002299859A (en) | Structure for mounting printed board | |
| US8625285B2 (en) | Data center with cable management structure | |
| JP6624263B1 (en) | Electronics | |
| CN107623198B (en) | Connecting assembly and mobile terminal | |
| CN107275835B (en) | Connector assembly and terminal device | |
| US10008813B2 (en) | Electronic device | |
| KR100624876B1 (en) | Socket connector having structure for improving impedance-characteristics | |
| JP2003098510A (en) | Attaching structure for liquid crystal display panel | |
| CN107989833B (en) | Fan fixing assembly | |
| US9256091B2 (en) | Display device with stand | |
| US8446714B2 (en) | Electronic device having connecting mechanism | |
| KR19990017510A (en) | Detachable Laptop Computer | |
| US9244489B2 (en) | Display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100707 |