CN101747842B - 一种化学机械抛光液 - Google Patents
一种化学机械抛光液 Download PDFInfo
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- CN101747842B CN101747842B CN200810207470.XA CN200810207470A CN101747842B CN 101747842 B CN101747842 B CN 101747842B CN 200810207470 A CN200810207470 A CN 200810207470A CN 101747842 B CN101747842 B CN 101747842B
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CN200810207470.XA CN101747842B (zh) | 2008-12-19 | 2008-12-19 | 一种化学机械抛光液 |
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CN200810207470.XA CN101747842B (zh) | 2008-12-19 | 2008-12-19 | 一种化学机械抛光液 |
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CN101747842A CN101747842A (zh) | 2010-06-23 |
CN101747842B true CN101747842B (zh) | 2014-12-31 |
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Families Citing this family (1)
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WO2013042596A1 (ja) * | 2011-09-20 | 2013-03-28 | 堺化学工業株式会社 | ガラス研磨用複合粒子 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1106663A1 (en) * | 1999-12-08 | 2001-06-13 | Eastman Kodak Company | Slurry for chemical mechanical polishing silicon dioxide |
CN1644640A (zh) * | 2003-12-19 | 2005-07-27 | Cmp罗姆和哈斯电子材料控股公司 | 用于铜的受控抛光的组合物和方法 |
CN1699444A (zh) * | 2004-02-23 | 2005-11-23 | Cmp罗姆和哈斯电子材料控股公司 | 用于控制半导体晶片中金属互连去除速率的抛光组合物 |
CN1900146A (zh) * | 2005-07-21 | 2007-01-24 | 安集微电子(上海)有限公司 | 化学机械抛光液 |
CN101143996A (zh) * | 2006-09-15 | 2008-03-19 | 安集微电子(上海)有限公司 | 用于抛光多晶硅的化学机械抛光液 |
CN101153206A (zh) * | 2006-09-29 | 2008-04-02 | 安集微电子(上海)有限公司 | 用于抛光多晶硅的化学机械抛光液 |
CN101168647A (zh) * | 2006-10-27 | 2008-04-30 | 安集微电子(上海)有限公司 | 一种用于抛光多晶硅的化学机械抛光液 |
CN101195729A (zh) * | 2006-12-08 | 2008-06-11 | 安集微电子(上海)有限公司 | 非离子型聚合物在自停止多晶硅抛光液制备及使用中的应用 |
CN101280158A (zh) * | 2007-04-06 | 2008-10-08 | 安集微电子(上海)有限公司 | 多晶硅化学机械抛光液 |
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2008
- 2008-12-19 CN CN200810207470.XA patent/CN101747842B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1106663A1 (en) * | 1999-12-08 | 2001-06-13 | Eastman Kodak Company | Slurry for chemical mechanical polishing silicon dioxide |
TW526251B (en) * | 1999-12-08 | 2003-04-01 | Eastman Kodak Co | Aqueous slurry and method for removing silicon dioxide in preference to silicon nitride, and slurry for polishing silica and silicon nitride |
CN1644640A (zh) * | 2003-12-19 | 2005-07-27 | Cmp罗姆和哈斯电子材料控股公司 | 用于铜的受控抛光的组合物和方法 |
CN1699444A (zh) * | 2004-02-23 | 2005-11-23 | Cmp罗姆和哈斯电子材料控股公司 | 用于控制半导体晶片中金属互连去除速率的抛光组合物 |
CN1900146A (zh) * | 2005-07-21 | 2007-01-24 | 安集微电子(上海)有限公司 | 化学机械抛光液 |
CN101143996A (zh) * | 2006-09-15 | 2008-03-19 | 安集微电子(上海)有限公司 | 用于抛光多晶硅的化学机械抛光液 |
CN101153206A (zh) * | 2006-09-29 | 2008-04-02 | 安集微电子(上海)有限公司 | 用于抛光多晶硅的化学机械抛光液 |
CN101168647A (zh) * | 2006-10-27 | 2008-04-30 | 安集微电子(上海)有限公司 | 一种用于抛光多晶硅的化学机械抛光液 |
CN101195729A (zh) * | 2006-12-08 | 2008-06-11 | 安集微电子(上海)有限公司 | 非离子型聚合物在自停止多晶硅抛光液制备及使用中的应用 |
CN101280158A (zh) * | 2007-04-06 | 2008-10-08 | 安集微电子(上海)有限公司 | 多晶硅化学机械抛光液 |
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CN101747842A (zh) | 2010-06-23 |
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Effective date of registration: 20160928 Address after: 201201 Pudong New Area East Road, No. 5001 Jinqiao Export Processing Zone (South) T6-9 floor, the bottom of the Patentee after: Anji Microelectronics (Shanghai) Co., Ltd. Address before: 201203, room 5, building 3000, 613-618 East Avenue, Zhangjiang hi tech park, Shanghai, Pudong New Area Patentee before: Anji Microelectronics (Shanghai) Co., Ltd. |
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Address after: 201201 Pudong New Area East Road, No. 5001 Jinqiao Export Processing Zone (South) T6-9 floor, the bottom of the Patentee after: Anji microelectronic technology (Shanghai) Limited by Share Ltd Address before: 201201 Pudong New Area East Road, No. 5001 Jinqiao Export Processing Zone (South) T6-9 floor, the bottom of the Patentee before: Anji Microelectronics (Shanghai) Co., Ltd. |