CN101707230A - Method for manufacturing high-power white light LED - Google Patents
Method for manufacturing high-power white light LED Download PDFInfo
- Publication number
- CN101707230A CN101707230A CN200910145176A CN200910145176A CN101707230A CN 101707230 A CN101707230 A CN 101707230A CN 200910145176 A CN200910145176 A CN 200910145176A CN 200910145176 A CN200910145176 A CN 200910145176A CN 101707230 A CN101707230 A CN 101707230A
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- China
- Prior art keywords
- silica gel
- ceramic substrate
- white light
- light led
- power white
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000741 silica gel Substances 0.000 claims abstract description 35
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 35
- 239000000919 ceramic Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 6
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000013078 crystal Substances 0.000 claims abstract description 4
- 229960001866 silicon dioxide Drugs 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 19
- 235000012431 wafers Nutrition 0.000 claims description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 241000218202 Coptis Species 0.000 claims description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 4
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 239000008187 granular material Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000011148 porous material Substances 0.000 abstract 2
- 238000005520 cutting process Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101451765A CN101707230B (en) | 2009-10-13 | 2009-10-13 | Method for manufacturing high-power white light LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101451765A CN101707230B (en) | 2009-10-13 | 2009-10-13 | Method for manufacturing high-power white light LED |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101707230A true CN101707230A (en) | 2010-05-12 |
CN101707230B CN101707230B (en) | 2011-03-16 |
Family
ID=42377438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101451765A Active CN101707230B (en) | 2009-10-13 | 2009-10-13 | Method for manufacturing high-power white light LED |
Country Status (1)
Country | Link |
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CN (1) | CN101707230B (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102157665A (en) * | 2011-03-22 | 2011-08-17 | 湘能华磊光电股份有限公司 | Light-emitting diode (LED) chip packaging structure and packaging method thereof |
CN102185050A (en) * | 2011-04-22 | 2011-09-14 | 江苏苏能光电科技有限责任公司 | Ceramic substrate module packaging method applicable to alternating-current direct-drive LED (light-emitting diode) light source |
CN102214777A (en) * | 2011-05-09 | 2011-10-12 | 厦门市英诺尔电子科技有限公司 | High-power LED (light-emitting diode) packaging substrate and manufacturing method thereof |
CN102222739A (en) * | 2011-06-27 | 2011-10-19 | 中外合资江苏稳润光电有限公司 | Method for encapsulating white light LED (Light Emitting Diode) display module |
CN102738317A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | Packaging method for light source used in LED fluorescent lamp and light source |
CN102809137A (en) * | 2011-06-01 | 2012-12-05 | 弘凯光电股份有限公司 | Lamp heat radiation structure manufacturing method and lamp component manufacturing method |
CN103022326A (en) * | 2012-12-26 | 2013-04-03 | 常州银河世纪微电子有限公司 | Intensive packaging method of LEDs |
CN103090227A (en) * | 2012-12-29 | 2013-05-08 | 瑞安市亿星新能源有限公司 | Light emitting diode (LED) lighting board and manufacturing method thereof |
WO2013177796A1 (en) * | 2012-06-01 | 2013-12-05 | 东莞华明灯具有限公司 | Method of changing light emitting angle of led light strip by glue injection |
CN106784261A (en) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | A kind of preparation method of laminated devices quantum dot LED backlight |
CN106848038A (en) * | 2017-01-18 | 2017-06-13 | 东洋工业照明(广东)有限公司 | A kind of painting method of LED fluorescent powder |
CN109256448A (en) * | 2018-08-07 | 2019-01-22 | 广州市巨宏光电有限公司 | A kind of LED light moulding process |
-
2009
- 2009-10-13 CN CN2009101451765A patent/CN101707230B/en active Active
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102157665A (en) * | 2011-03-22 | 2011-08-17 | 湘能华磊光电股份有限公司 | Light-emitting diode (LED) chip packaging structure and packaging method thereof |
CN102738317A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | Packaging method for light source used in LED fluorescent lamp and light source |
CN102185050A (en) * | 2011-04-22 | 2011-09-14 | 江苏苏能光电科技有限责任公司 | Ceramic substrate module packaging method applicable to alternating-current direct-drive LED (light-emitting diode) light source |
CN102214777A (en) * | 2011-05-09 | 2011-10-12 | 厦门市英诺尔电子科技有限公司 | High-power LED (light-emitting diode) packaging substrate and manufacturing method thereof |
CN102809137A (en) * | 2011-06-01 | 2012-12-05 | 弘凯光电股份有限公司 | Lamp heat radiation structure manufacturing method and lamp component manufacturing method |
CN102222739A (en) * | 2011-06-27 | 2011-10-19 | 中外合资江苏稳润光电有限公司 | Method for encapsulating white light LED (Light Emitting Diode) display module |
CN102222739B (en) * | 2011-06-27 | 2012-12-19 | 中外合资江苏稳润光电有限公司 | Method for encapsulating white light LED (Light Emitting Diode) display module |
CN103857956B (en) * | 2012-06-01 | 2016-03-30 | 东莞华明灯具有限公司 | LED changes the method for rising angle by encapsulating |
WO2013177796A1 (en) * | 2012-06-01 | 2013-12-05 | 东莞华明灯具有限公司 | Method of changing light emitting angle of led light strip by glue injection |
CN103857956A (en) * | 2012-06-01 | 2014-06-11 | 东莞华明灯具有限公司 | Method of changing light emitting angle of LED light strip by glue injection |
CN103022326B (en) * | 2012-12-26 | 2015-05-13 | 常州银河世纪微电子有限公司 | Intensive packaging method of LEDs |
CN103022326A (en) * | 2012-12-26 | 2013-04-03 | 常州银河世纪微电子有限公司 | Intensive packaging method of LEDs |
CN103090227A (en) * | 2012-12-29 | 2013-05-08 | 瑞安市亿星新能源有限公司 | Light emitting diode (LED) lighting board and manufacturing method thereof |
CN103090227B (en) * | 2012-12-29 | 2017-07-11 | 瑞安市亿星新能源有限公司 | LED luminescent screens and its manufacture method |
CN106784261A (en) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | A kind of preparation method of laminated devices quantum dot LED backlight |
CN106848038A (en) * | 2017-01-18 | 2017-06-13 | 东洋工业照明(广东)有限公司 | A kind of painting method of LED fluorescent powder |
CN109256448A (en) * | 2018-08-07 | 2019-01-22 | 广州市巨宏光电有限公司 | A kind of LED light moulding process |
Also Published As
Publication number | Publication date |
---|---|
CN101707230B (en) | 2011-03-16 |
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Owner name: WENRUI PHOTOELECTRIC CO., LTD., JIANGSU Free format text: FORMER OWNER: JOINT VENTURE JIANGSU WENRUN OPTOELECTRONICS CO., LTD. Effective date: 20120605 |
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Denomination of invention: Method for manufacturing high-power white light LED Effective date of registration: 20130205 Granted publication date: 20110316 Pledgee: The Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch of science and technology Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: 2013990000090 |
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Denomination of invention: Method for manufacturing high-power white light LED Effective date of registration: 20150318 Granted publication date: 20110316 Pledgee: The Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch of science and technology Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: 2015990000202 |
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Denomination of invention: A manufacturing method of high power white LED Effective date of registration: 20210706 Granted publication date: 20110316 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: Y2021320000116 |
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Denomination of invention: A Manufacturing Method for High Power White LED Effective date of registration: 20230807 Granted publication date: 20110316 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: Y2023980051059 |