CN101681858B - 电子部件的连接方法及接合体 - Google Patents
电子部件的连接方法及接合体 Download PDFInfo
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- CN101681858B CN101681858B CN2008800190225A CN200880019022A CN101681858B CN 101681858 B CN101681858 B CN 101681858B CN 2008800190225 A CN2008800190225 A CN 2008800190225A CN 200880019022 A CN200880019022 A CN 200880019022A CN 101681858 B CN101681858 B CN 101681858B
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Abstract
本发明的目的在于提供一种能够正确计测导电性粒子的捕捉数,并且连接后的导通可靠性高的电子部件的连接方法及接合体。本发明的电子部件的连接方法,包括:混合工序,将分散溶剂、溶解于所述分散溶剂的粘结剂树脂、导电性粒子和粒径比所述导电性粒子小的绝缘性粒子进行混合,从而制作各向异导电性粘结剂;热挤压工序,隔着所述各向异导电性粘结剂,使基板的基板侧端子和电子部件的部件侧端子对置,在所述基板和所述电子部件上施加热及挤压力,用所述基板侧端子及所述部件侧端子夹持所述导电性粒子,进而使所述导电性粒子变形,并且,所述热挤压工序中的挤压力,比破坏所述导电性粒子的破坏挤压力及使所述导电性粒子的粒径变得与所述绝缘性粒子的粒径相同的变形挤压力均小。
Description
技术领域
本发明涉及一种电子部件的连接方法,尤其涉及一种使用各向异导电性粘结剂连接电子部件的连接方法及接合体。
背景技术
以往,在电子部件的连接中,使用将导电性粒子分散在粘结剂中的各向异导电性粘结剂。
但是,近年来,随着电子产品端子的窄节距化,在连接电子部件时,导电性粒子在相邻的端子之间凝聚,从而导致端子之间发生短路(short)。
尤其,将载带上连接有半导体芯片的设备(TAB:Tape AutomatedBonding)或膜形载体上连接有半导体芯片的设备(COF:Chip OnFilm)连接到LCD面板(液晶面板)边缘部分的端子上时,压接工具发生偏离而压接LCD面板的角部分(边缘部),则导电性粒子在边缘部上受到拦截而发生粒子的凝聚,从而存在相邻端子之间发生短路的问题。
作为降低由这种导电性粒子的凝聚引起的短路的技术,提出的方案有,使用在导电性粒子的表面实施绝缘性覆膜的粒子、缩小导电性粒子的粒子直径、减小导电性粒子的密度等。
实施绝缘性覆膜的粒子存在如下问题:发生凝聚时只施加破坏其绝缘覆膜的外部应力,则会引起短路。
并且,仅仅依靠单纯地缩小导电性粒子的粒子直径,不仅不能完全解决粒子凝聚所引起的短路,而且还会降低导电性粒子自身的特性(恢复力等),因此并不优选。
另外,通过降低粒子密度来抑制粒子凝聚的方法则存在端子之间的粒子捕捉不充分而导致导通不良等问题。
并且,为了完全防止由粒子的凝聚引起的短路而与导电性粒子一起添加绝缘性粒子的各向异导电性粘结剂属于公知技术(参照专利文献1~5)。
但是,当绝缘性粒子的粒径较大时,在导电性粒子被电子部件的端子之间夹持之前,绝缘性粒子会先被夹持。在这里,当绝缘性粒子先被夹持时,导电性粒子不能与端子接触,或就算有接触也会因施加到导电性粒子上的挤压力变小而变形量变小,进而引起端子之间的导通不良的问题。
并且,在完成电子部件的连接后,为了确认连接的可靠性,进行导电性粒子的捕捉数检查。当端子之间夹持有导电性粒子时,由于导电性粒子变形时产生的回弹力,端子的背面上会产生微小的凸起。因此,从LCD面板的玻璃基板背面侧,利用微分显微镜(微分干涉仪)观察该玻璃基板表面上的端子的背面,对微小凸起进行计数,则能够得到端子之间夹持的导电性粒子个数。
但是,当绝缘性粒子夹持在端子之间时,也发生与导电性粒子夹持在端子之间时相同的微小凸起。在这里,由于无法区分端子之间所夹持的绝缘性粒子而引起的微小凸起和端子之间所夹持的导电性粒子而引起的微小凸起,因此不能正确测定导电性粒子的捕捉数。
并且,为了增大导电性粒子与端子之间的接触面积,通过挤压来使导电性粒子发生变形的情况下,绝缘性粒子夹持在端子之间的概率变高,因此这种问题特别深刻。
并且,绝缘性粒子一般由树脂粒子构成,因此在制造各向异导电性粘结剂时,或在制造之后,容易吸收各向异导电性粘结剂中的溶剂。当绝缘性粒子吸收溶剂时,发生膨胀而粒径变大,因此端子之间的导通不良、捕捉数计测问题更为严重。
另外,若绝缘性粒子吸收溶剂,则在加热各向异导电性粘结剂时,会从绝缘性粒子释放溶剂,该溶剂发生蒸发,从而在各向异导电性粘结剂中产生气泡(空洞)。
当发生空洞时,电子部件的连接强度变低,长时间放置时,电子部件从各向异导电性粘结剂浮起(脱离),从而发生导通不良。
专利文献1:日本特开2001-85083号公报
专利文献2:日本特开2005-347273号公报
专利文献3:日本特开2002-75488号公报
专利文献4:日本特开2003-165825号公报
专利文献5:日本特开平8-113654号公报
发明内容
本发明的课题为,解决上述诸多问题,实现以下目的:
即,本发明的目的在于提供能够正确计测导电性粒子的捕捉数,并且提供连接后的导通可靠性高的电子部件的连接方法及接合体。
(1)一种电子部件的连接方法,其特征在于,包括:混合工序,将分散溶剂、溶解于所述分散溶剂的粘结剂树脂、导电性粒子和粒径比所述导电性粒子小的绝缘性粒子进行混合,从而制作各向异导电性粘结剂;热挤压工序,隔着所述各向异导电性粘结剂,使基板的基板侧端子和电子部件的部件侧端子对置,在所述基板和所述电子部件上施加热及挤压力,用所述基板侧端子及所述部件侧端子夹持所述导电性粒子,进而使所述导电性粒子变形,并且,所述热挤压工序中的挤压力,比破坏所述导电性粒子的破坏挤压力及使所述导电性粒子的粒径变得与所述绝缘性粒子的粒径相同的变形挤压力均小。
(2)如(1)所述的电子部件的连接方法,其中,绝缘性粒子的总体积为,导电性粒子总体积的0.2倍以上、2倍以下。
(3)如(1)至(2)中任一项所述的电子部件的连接方法,其中,绝缘性粒子为,不会因与分散溶剂的接触而发生膨胀的绝缘性粒子。
(4)如(1)至(3)中任一项所述的电子部件的连接方法,其中,绝缘性粒子为在无机粒子的表面上结合官能单体的有机无机混合粒子,粘结剂树脂包含能够与所述有机无机混合粒子中的所述官能单体聚合的聚合树脂。
(5)如(1)至(3)中任一项所述的电子部件的连接方法,其中,绝缘性粒子为在有机粒子的表面上结合无机材料的有机无机混合粒子。
(6)如(1)至(3)中任一项所述的电子部件的连接方法,其中,绝缘性粒子为,在有机聚合物骨架中至少与一个无机材料骨架化学结合的无机含有树脂。
(7)一种各向异性导电接合体,其特征在于,使用如(1)至(6)中任一项所述的电子部件的连接方法。
按照本发明,能够解决现存问题,实现上述目的。即,按照本发明,能够提供可正确计测导电性粒子的捕捉数,并且提供连接后的导通可靠性高的电子部件的连接方法及接合体。
本发明按照如上所述构成,在基板上连接电子部件之前,通过预试验预先求解导电性粒子被破坏时的导电性粒子的破坏粒径、与导电性粒子的粒径及挤压力的关系。
另外,导电性粒子被破坏的状态是指,即使解除挤压力导电性粒子的粒径也不能复原的失去恢复特性的状态,例如,导电性粒子为在树脂粒子表面上形成有金属覆膜的金属覆膜树脂粒子的情况下,表示树脂粒子本身被破坏了的状态。
事先知道在基板和电子部件的连接上所使用的各向异导电性粘结剂的组成、配合比例、膜厚、平面形状的面积及向该各向异导电性粘结剂中所添加的导电性粒子的粒径(变形前)。
在预试验中,首先将由与基板和电子部件的连接上所使用的各向异导电性粘结剂相同的各向异导电性粘结剂构成的,具有相同膜厚、相同面积的试验片,用表面平坦的两片试验板夹持,在与基板和电子部件的连接时的温度相同的温度下进行挤压,通过挤压力与试验板之间的距离,预先求解出挤压力与导电性粒子的粒径之间的关系。
并且,挤压添加在各向异导电性粘结剂中的导电性粒子使之变形,预先求解导电性粒子的破坏粒径。
并且,若预先求解出绝缘性粒子的粒径,则能知道绝缘性粒子的粒径和导电性粒子的破坏粒径哪一个更大,进而可以确定将以导电性粒子被破坏的破坏挤压力和后文说明的变形挤压力中的哪一个为上限值,以便在能够不破坏导电性粒子并且使导电性粒子在大于绝缘性粒子的范围下进行变形,从而正确计测导电性粒子的捕捉数。
另外,在制造各向异导电性粘结剂时,或者制造之后,若绝缘性粒子由于与分散溶剂的接触而发生膨胀时,则预先求解绝缘性粒子膨胀时的膨胀粒径,将使导电性粒子变成与膨胀粒径相同的挤压力设为变形挤压力。
按照本发明,绝缘性粒子不膨胀、不会大于导电性粒子。并且,导电性粒子就算被挤压也不会小于绝缘性粒子。因此,导电性粒子的粒径不会变为绝缘性粒子的粒径以下,绝缘性粒子不会妨碍导电性粒子的连接,因此导通电阻低。并且,在基板侧端子上,只在导电性粒子被夹持的部分上发生微小凸起,因此能对导电性粒子的捕捉数进行正确的计数。并且,由于导电性粒子不被破坏,所以导通可靠性高。绝缘性粒子不吸收分散溶剂,因此即使加热各向异导电性粘结剂,也不会发生空洞。
附图说明
图1是各向异导电性粘结剂的剖视图;
图2A是连接第一电子部件的工序的剖视图;
图2B是连接第二电子部件的工序的剖视图;
图3是粘结体的示意表示的主视图;
图4是说明连接后的检查工序的剖视图。
具体实施方式
(电子部件的连接方法)
本发明的电子部件的连接方法至少包含混合工序和热挤压工序,还包含根据需要适当选择的其它工序。
<混合工序>
所述混合工序为,对分散溶剂、溶解于所述分散溶剂的粘结剂树脂、导电性粒子、粒径小于所述导电性粒子的粒径的绝缘性粒子及根据需要适当选择的其它成分进行混合,从而制作各向异导电性粘结剂的工序。
-分散溶剂-
所述分散溶剂无特别限定,可根据目的适当选择。所述分散溶剂不限于醋酸乙酯和甲苯的混合溶剂,例如,还可使用甲乙酮(MEK)、甲苯、丙二醇单甲醚乙酸酯(PGMAC)及醋酸乙酯等有机溶剂。后文说明的有机无机混合粒子及硅树脂粒子,在这些有机溶剂中既不溶解也不膨胀。
-粘结剂树脂-
作为所述粘结剂树脂,只要能在所述分散溶剂中溶解,则无特别的限定,可根据目的适当选择。所述粘结剂树脂包含热固性树脂和热塑性树脂中的任意一个或同时包含两个。所述热固性树脂通过加热而聚合,从而使粘结剂硬化,所述热塑性树脂通过加热表现粘接性能,当加热结束后被冷却则使粘结剂固化。
——热固性树脂——
作为所述热固性树脂,无特别的限定,可根据目的适当选择,例如可以使用:将环氧树脂及微胶囊化胺系硬化剂作为硬化剂使用的阴离子硬化系环氧树脂、将鎓盐或锍盐作为硬化剂使用的阳离子硬化系环氧树脂、将有机过氧化物作为硬化剂使用的自由基硬化系树脂等。
——热塑性树脂——
作为所述热塑性树脂,无特别的限定,可根据目的适当选择,例如可以使用苯氧树脂、氨基甲酸酯树脂、聚酯树脂等。
-导电性粒子-
作为所述导电性粒子,无特别的限定,可根据目的适当选择,例如可列举,在由苯代三聚氰胺、苯乙烯、二乙烯苯、丙烯酸化合物、甲基丙烯酸化合物的单聚体或共聚体形成的有机树脂球状微粒子的表面上,镀敷镍、金的导电性粒子,或者,在镍微粒子等无机粒子表面上镀金的导电性粒子等。
所述导电性粒子的变形量无特别的限定,基于导电可靠性的观点,优选的是将导电性粒子的变形量(粒径的减少量)设为20%以上。
导电性粒子为金属覆膜树脂粒子的情况下,一般被破坏时的变形量为60%,破坏粒径为变形前粒径的0.4倍。
所述导电性粒子优选的是具有CV值在20%以下、优选的是在10%以下的粒度精度。CV值是指标准偏差除以粒径而得到的值。
-绝缘性粒子-
所述绝缘性粒子只要其粒径小于所述导电性粒子的粒径,则无特别的限定,可根据目的适当选择,例如可以列举硅树脂粒子等有机无机混合粒子。所述绝缘性粒子不溶解于分散溶剂中,不会吸收分散溶剂而产生膨胀,因此绝缘性粒子的粒径不发生变化,其粒径维持在小于导电性粒子的粒径的状态。
所述绝缘性粒子由于不吸收分散溶剂,因此加热时,在粘结剂中不产生空洞。基板与电子部件被固化了的粘结剂牢固地机械性连接。
所述绝缘性粒子的含量范围,优选大于导电性粒子总体积的0.05倍,小于导电性粒子总体积的2.5倍,更为优选的是导电性粒子总体积的0.2倍以上2倍以下。
所述绝缘性粒子除有机无机混合粒子、树脂粒子之外,还可以使用玻璃粒子等陶瓷粒子,但是导电性粒子为金属覆膜树脂粒子的情况时,由于陶瓷粒子与导电性粒子的比重差大,因此在各向异导电性粘结剂中的分散性上可能带来问题。
所述绝缘性粒子优选的是具有CV值在20%以下、优选的是10%以下的粒度精度。CV值是指标准偏差除以粒径而得到的值。
——有机无机混合粒子——
所述有机无机混合粒子无特别的限定,可根据目的适当选择,例如:
1.在无机粒子的表面,无机材料的构成材料与官能单体结合的有机无机混合粒子
2.在有机粒子的表面,有机粒子的构成材料与无机材料结合的有机无机混合粒子
3.由预先在有机聚合物骨架中至少化学性地结合有一个无机材料的无机含有树脂构成的有机无机混合粒子等。
在所述有机无机混合材料粒子中所使用的无机粒子,无特别的限定,可根据目的适当选择,例如可以列举二氧化硅粒子、碳酸钙粒子等。
所述官能单体无特别的限定,可根据目的适当选择,例如可以列举乙烯单体、丙烯酸单体、甲基丙烯酸单体、环氧单体、环氧丙烷单体及异氰酸酯单体等。在一个无机粒子上结合的官能单体的种类可以为一种,还可以为两种以上。
在表面露出有机化合物的有机无机混合粒子根据混合溶剂的种类还存在该有机化合物膨胀的情况。但是在有机无机混合粒子的表面上层积的有机化合物仅仅是几个分子的程度,该有机化合物的层厚较之有机无机混合粒子整体的粒径(例如,2μm以上4μm以下)小到可以忽视的程度,因此即使在混合溶剂中膨胀,膨胀率也不会超过30%。
在表面露出官能单体的有机无机混合粒子较之只露出无机材料的无机粒子,与粘结剂树脂的亲和性较高,因此各向异导电性粘结剂中的分散性优秀。
并且,在粘结剂树脂中,若包含有能够与官能单体的官能基聚合的树脂,则该树脂在正式压接时与官能单体聚合,使硬化后的各向异导电性粘结剂的机械强度进一步提高。
能够与所述丙烯酸单体及所述甲基丙烯酸单体聚合的树脂有丙烯树脂等,能够与所述乙烯单体、所述环氧单体及所述环氧丙烷单体聚合的树脂有环氧树脂等,能够与所述异氰酸盐单体聚合的树脂有氨基甲酸酯树脂。
在所述有机无机混合粒子中,所述“在有机粒子的表面,有机粒子的构成材料与无机材料结合的有机无机混合粒子”是指,在有机微粒子(树脂粒子)的表面上结合有聚硅氧烷等无机化合物的有机无机混合粒子,例如可以列举“soliostar 15”。所述“soliostar 15”使具有硅氧烷骨架的丙烯酸系聚合物聚合,由此在丙烯酸树脂粒子的表面上结合无机化合物(硅)。
并且,在所述有机无机混合粒子中,所述“由预先在有机聚合物骨架中至少化学性地结合有一个无机材料的无机含有树脂构成的有机无机混合粒子”是指,在有机聚合物骨架中至少聚合一个具有聚硅氧烷骨架的化合物的有机无机混合粒子,例如有硅树脂粒子。
所述硅树脂粒子的聚硅氧烷骨架以下述的化学式(1)的丙烯酸结构作为重复单元。
[化1]
硅树脂在聚硅氧烷骨架的丙烯酸结构的一部分或全部上结合烷基、苯基等有机取代基。
这种有机无机混合粒子,不仅具有良好的耐药品性、耐膨胀性、耐热性,并且热涨率低,即使加热,粒径也不会变得大于导电性粒子的粒径。尤其,硅树脂粒子的价格比其他有机无机混合粒子便宜,因此作为绝缘性粒子使用硅树脂粒子,则能够降低各向异导电性粘结剂的制造成本。
绝缘性粒子不限于有机无机混合粒子,只要不在各向异导电性粘结剂中的分散溶剂中膨胀,还可以使用树脂粒子。
作为所述树脂粒子,只要不在分散溶剂中溶解、膨胀即可,无特别的限定,可根据目的适当选择。对所述树脂粒子的有机聚合物骨架并不以分子量、组成、结构、官能基的有无等来进行特别的限定,可列举,丙烯酸单体、甲基丙烯酸单体、丙烯腈的聚合物,苯代三聚氰胺、三聚氰胺的甲醛缩合物等。
-其他成分-
在各向异导电性粘结剂的固态成分中,除热固性树脂、热塑性树脂之外,还可添加硬化剂、硅烷、填充料、着色剂等各种添加剂。
<热挤压工序>
所述热挤压工序是指,隔着所述各向异导电性粘结剂使基板的基板侧端子与电子部件的部件侧端子对置,在所述基板和所述电子部件上施加热及挤压力,通过所述基板侧端子及所述部件侧端子夹持所述导电性粒子,由此使所述导电性粒子变形的工序。
-基板-
所述基板无特别的限定,可根据目的适当选择,例如可列举LCD(液晶显示器)的透明板。
-电子部件-
所述电子部件无特别的限定,可根据目的适当选择,例如可以列举在薄膜状基板上搭载有半导体芯片的薄膜状设备(COF、TAB设备)。
<其他工序>
其他工序无特别的限定,可根据目的适当选择。
以下,参照附图对本发明所使用的各向异导电性粘结剂的制造工序的一个例子进行说明。
图1为将各向异导电性粘结剂10模式化表示的剖视图。该各向异导电性粘结剂10具有粘结剂树脂溶解于分散溶剂中的呈胶状的粘结剂11和分别分散在粘结剂11中的导电性粒子15和绝缘性粒子12,整体呈胶状。
各向导向性粘结剂10可以直接以胶状使用,还可以进行薄膜化之后使用。
若说明薄膜化的一个例子的话,将含有混合溶剂(分散溶剂)的胶状各向异导电性粘结剂10通过刮涂等涂敷方法涂敷在剥离薄膜的表面上,形成规定膜厚的涂敷层后,加热该涂敷层,去除多余的混合溶剂,就能得到薄膜状各向异导电性粘结剂(粘结薄膜)。
假设绝缘性粒子12吸收混合溶剂而膨胀,则其粒径就会变大。若绝缘性粒子12的粒径变大的话,涂敷时产生筋,其粒径超过所要形成的涂敷层的膜厚的情况下,不能得到膜厚均匀的粘结薄膜。
由于绝缘性粒子12在分散溶剂中不发生膨胀,涂敷时不产生筋,因此粘结薄膜的膜厚均匀。
下面,对各向异导电性粘结剂10的使用方法进行说明。
各向异导电性粘结剂10所包含的导电性粒子15为表面露出导电性物质,挤压则能够变形的粒子。
例如,导电性粒子15为,在树脂粒子16的表面形成有金属覆膜17的金属覆膜树脂粒子,或者金属粒子,金属覆膜树脂粒子因挤压发生弹性变形,金属粒子因挤压发生塑性变形。
通过预试验,求解导电性粒子15的破坏粒径,与使导电性粒子15变形至发生破坏时的挤压力及导电性粒子15的粒径之间的关系。
已知绝缘性粒子12的粒径,对绝缘性粒子12的粒径和导电性粒子15的破坏粒径进行比较。绝缘性粒子12的粒径达不到导电性粒子15的破坏粒径的情况时,从挤压力与导电性粒子15的粒径的关系,求解使导电性粒子15的粒径到达破坏粒径时的挤压力(破坏挤压力),将破坏挤压力设定为所述热挤压工序中的挤压力的上限值。
绝缘性粒子12的粒径在破坏粒径以上的情况时,从挤压力与导电性粒子15的粒径的关系,求解导电性粒子15的粒径达到与绝缘性粒子12的粒径同等时的挤压力(变形挤压力),将变形挤压力设定为所述热挤压工序中的挤压力的上限值。
在未达到设定的上限值的范围内,设定能使导电性粒子15变形的挤压力。
进而,对根据设定的挤压力,连接基板和电子部件的工序的一个例子进行说明。
图2A表示基板20。基板20具有板状基板本体21和配置在基板本体21表面上的基板侧端子25。基板侧端子25在基板本体21的表面边缘部分露出,在该表面边缘部分涂敷胶状各向异导电性粘结剂10,或粘贴薄膜状各向异导电性粘结剂10,将基板侧端子25的露出部分用各向异导电性粘结剂10包覆(临时粘贴)。
图2B表示COF设备、TAB设备等电子部件30。电子部件30具有细长的部件本体31和配置在部件本体31表面上的部件侧端子35,部件侧端子35露出在部件本体31的表面端部。
以使基板侧端子25和部件侧端子35夹持各向异导电性粘结剂10且相对置的方式,对基板20和电子部件30进行重叠后(临时固定),利用压接机40直接或通过缓冲材料43挤压基板20及电子部件30中的任意一个或两个(在这里为电子部件30)。
其中,在压接机40上设有未图示的加热装置,加热电子部件30的同时进行挤压,对电子部件30和基板20施加预先设定的挤压力,则因加热而软化的粘结剂11从基板侧端子25及部件侧端子35之间被挤出,从而导电性粒子15被基板侧端子25及部件侧端子35所夹持并被挤压而变形,因此,基板侧端子25和部件侧端子35通过导电性粒子15而构成电连接。
图4表示在基板20上电性和机械性地连接有电子部件30的粘结体1,对该粘结体1进行导电性粒子15的捕捉数的检查。
基板本体21由玻璃基板、塑料基板等透明基板所构成。
图4表示具有显微镜(例如,微分干涉显微镜、相位差显微镜等)的观察装置45,利用该观察装置45,从基板本体21的与配置有基板侧端子25一侧相反的一侧面,观察基板侧端子25的背面47,对发生在背面47上的微小凸起进行计数。
如上所述,由于挤压力没有超过导电性粒子15的破坏挤压力和变形挤压力,因此导电性粒子15不会被破坏,并且,导电性粒子15的粒径不会变得小于绝缘性粒子12的粒径,基板侧端子25和部件侧端子35之间的距离不会小于绝缘性粒子12的粒径。
绝缘性粒子12不会被基板侧端子25和部件侧端子35所挤压,只有导电性粒子15被挤压而发生变形,形成微小凸起,因此,微小凸起的个数与由基板侧端子25和部件侧端子35所挤压的导电性粒子15的个数一致。因此,能够正确求解出导电性粒子15的捕捉数。
以下,通过实施例及对比例对本发明作更为具体的说明,但是本发明不限于下述的实施例。
<粘结薄膜的制造工序>
在甲苯/醋酸乙酯=1/1(重量比)的分散溶剂中,溶解作为热塑性树脂的苯氧基树脂,获得苯氧基树脂30重量%的溶解品。
接着,以下表1所示的相对于苯氧基树脂的配合量,向溶解品中添加硬化剂、作为热固性树脂的环氧树脂、偶联剂、绝缘性粒子及导电性粒子,用甲苯进行调整使固态成分(苯氧基树脂、硬化剂、环氧树脂、偶联剂、绝缘性粒子及导电性粒子的总量)成为40重量%,从而获得六种粘接材料溶解品。
在膜厚为50μm的剥离薄膜表面上,涂敷粘接材料的溶解品,在温度为90℃的烤炉中放置三分钟,使溶剂挥发,获得膜厚为18μm的实施例1~4、对比例1及2的粘结薄膜(薄膜状的各向异导电性粘结剂)。
[表1]
表1:各向异导电性固态成分的组成(重量份)
(绝缘性粒子和导电性粒子为体积比)
另外,硬化剂、环氧树脂、苯氧基树脂及偶联剂的配合量分别为重量比,绝缘性粒子与导电性粒子的配合量为,去除了混合溶剂的粘结剂(固态成分)中的体积百分率。
在上述表1中,商品名[HX3941]为旭化成化学(株)公司制作的微胶囊型胺系环氧硬化剂,商品名[EP828]为日本环氧树脂(株)公司制作的双酚A型液状环氧树脂,商品名[YP50]为东都化成公司制作的双酚A型苯氧基树脂,商品名[KBE403]为信越化学工业(株)公司制作的环氧硅烷偶联剂。
导电性粒子15为积水化学工业(株)公司制作的商品名[AUL704]的,在丙烯酸树脂粒子的表面形成Ni/Au镀覆膜的金属覆膜树脂粒子(平均粒径4μm)。
在绝缘性粒子12中,商品名[Tospearl107]及商品名[Tospearl140]分别为Momentive Performance Materials Japan公司制作的硅树脂粒子,[Tospearl107]的粒径(平均粒径)为0.7μm,[Tospearl140]的粒径(平均粒径)为4.0μm。并且,商品名[soliostar15]为日本触媒公司制作的有机无机混合粒子(硅丙烯复合化合物),粒径(平均粒径)为1.5μm。这三种绝缘性粒子12均不在所述分散溶剂中膨胀或溶解。
<组装工序>
作为评价试验用基板20,使用在玻璃基板表面上形成有铝端子的铝布线玻璃基板(表面电阻10Ω/□,玻璃厚度为0.7mm),作为电子部件预备了在厚度为38μm的基材薄膜表面上形成有镀Sn铜端子的COF设备。
另外,铝布线玻璃基板和COF设备的端子之间的节距分别为38μm,L(端子宽度)/S(端子之间的距离)为23μm/15μm,COF设备的端子的顶部宽度为15μm。
在上述铝布线玻璃基板上,对以1.5mm的宽度切开的实施例1~4、对比例1及2的粘结薄膜,利用工具宽度为2.0mm的压接机,隔着由厚度为70μm的聚四氟乙烯薄膜(“Teflon”为注册商标)构成的缓冲材料,进行80℃、1MPa,2秒钟的挤压,实施临时粘贴。
接着,对COF设备,利用与临时粘贴时使用的压接机相同的压接机,在80℃、0.5MPa、0.5秒的条件下,进行临时固定。
最后,使用工具宽度为1.5mm的压接机40和由厚度为200μm的硅橡胶构成的缓冲材料43,进行190℃、3MPa,10秒钟的热挤压,进行正式压接,从而获得实施例1~4、对比例1及2的粘结体。另外,如图2B所示,在将压接机40从铝布线玻璃基板(基板20)的边缘偏离0.3mm的状态下进行主压接,故意使导电性粒子15凝聚。
<短路发生率、导通电阻>
图3为将粘结体模式化表示的主视图,如图3所示,在COF设备的端子(部件侧端子35)之间施加30V的电压测定绝缘电阻,将该测定的绝缘电阻在1.0×10-6Ω以下设为发生短路,求解“短路发生率”(初期)。在图3中,通过绝缘电阻的测定器39测定绝缘阻抗。
在所述部件侧端子35之间通上电的状态下,将各粘结体在温度为85℃、湿度为85%的高温高湿条件下放置500小时,之后再次检查“短路发生率”。并且,对于高温高湿条件下放置之后的粘结体,求解其铝布线玻璃基板的端子和COF设备的端子之间的“导通电阻”。
<捕捉判断>
利用微分干涉仪(微分显微镜)观察实施例1~4、对比例1及2的粘结体的铝端子背面,计数微小凸起(压痕)的个数。
接着,将COF设备从铝布线玻璃基板上剥离,计数实际残留在铝端子表面上的导电性粒子的个数。压痕数与残留的导电性粒子的个数一致时判定为○,导电性粒子比压痕数少时判定为×。
表2为“短路发生率”、“导通电阻”及“捕捉判断”的结果。
[表2]
表2:测定结果
(测定数N=200)
从上述表2中可以清楚地看出,在粘结薄膜中没有添加绝缘性粒子的对比例1中,在铝布线玻璃基板的边缘部发生导电性粒子的凝聚,因而在相邻的端子之间发生短路。
在上述的正式压接条件下,在对比例1及2、实施例1~4的粘结体中,导电性粒子不被破坏,发生10%以上60%以下的变形,在实施例1~4中,导电性粒子的粒径不会变成绝缘性粒子的粒径以下。
与此相对,对比例2中,导电性粒子的粒径没有达到绝缘性粒子的粒径,绝缘性粒子与导电性粒子一起被挤压而变形,因此,在捕捉判断中产生误差,并且,挤压力还会施加在绝缘性粒子上,因此导电性粒子的被破坏量变小,导通电阻变高。
实施例1~4相比对比例2,其导通电阻低,捕捉判断的结果也正确。
实施例2及实施例4中,其绝缘性粒子的种类不同,但是不管哪一个其“导通电阻”“短路发生率”“捕捉数判断”的结果不变。因此,只要变形后的导电性粒子的粒径在绝缘性粒子的粒径以上,就能够获得导通可靠性高的粘结体,与绝缘性粒子的种类无关。
实施例1相比对比例1,其短路发生率低,但短路发生率高于其他实施例。实施例1中,其绝缘性粒子的含量(总体积)非常少,仅为导电性粒子含量(总体积)的0.05倍,因此,为了更可靠地防止发生短路,有必要使绝缘性粒子的含量超过导电性粒子的0.05倍(体积比)。
并且,实施例3在短路发生率、捕捉数判断上同时获得了优良的结果,但是导通电阻高于其他实施例。
实施例3中,其绝缘性粒子的含量(总体积)过多,为导电性粒子含量(总体积)的2.5倍,因此从铝端子和铜端子之间排除粘结剂11的排除性差,导通电阻上升,从而成导致导通不良。因此,为了防止导通不良,有必要将绝缘性粒子控制成不足导电性粒子的2.5倍(体积比)。
在上述内容中,虽然仅对将各向异导电性粘结剂10临时粘贴在基板20之后临时固定电子部件30的情况进行了说明,但是本发明并不限于此,还可以将各向异导电性粘结剂10临时粘贴在电子部件30上,还可以同时临时粘贴在电子部件30和基板20上。并且,还可以利用与临时固定电子部件30时使用的压接机相同的压接机来进行正式压接。
本发明的连接方法不限于基板和电子部件的连接,还可以使用在半导体芯片、电阻元件、挠性布线板、刚性布线板等各种电子部件之间的连接上。
因此,绝缘性粒子12的粒径达不到导电性粒子15变形前粒径的0.4倍时,绝缘性粒子12的粒径达不到破坏粒径,因此将破坏挤压力设定为上述热挤压工序中的挤压力的上限值即可。
绝缘性粒子12的粒径优选是导电性粒子15变形前粒径的10%以上。当达不到10%时,在发生导电性粒子15的凝聚的情况下,缺乏防止短路的效果。
作为绝缘性粒子12,若使用在分散溶剂中即不膨胀也不溶解的粒子的话,绝缘性粒子12的粒径不会变大,用接近于变形挤压力的挤压力挤压时,即使各向异导电性粘结剂10的配合比例、加热温度等使用条件与预试验存在稍微的偏差,也不会使导电性粒子15的粒径变成小于绝缘性粒子12的粒径。
另外,在本发明中“不在分散溶剂中膨胀的绝缘性粒子”是指,将绝缘性粒子在与各向异导电性粘结剂中所使用的分散溶剂相同的分散溶剂中浸渍30分钟时的粒径da,在浸入该分散溶剂之前的粒径db的1.3倍以下(膨胀率在30%以下)的绝缘性粒子。
Claims (4)
1.一种各向异性导电接合体的制作方法,其特征在于,包括:
混合工序,将分散溶剂、溶解于所述分散溶剂的粘结剂树脂、导电性粒子和粒径比所述导电性粒子小的绝缘性粒子进行混合,从而制作各向异导电性粘结剂;
热挤压工序,隔着所述各向异导电性粘结剂,使基板的基板侧端子和电子部件的部件侧端子对置,在所述基板和所述电子部件上施加热及挤压力,用所述基板侧端子及所述部件侧端子夹持所述导电性粒子,进而使所述导电性粒子变形,
并且,所述热挤压工序中的挤压力,比破坏所述导电性粒子的破坏挤压力及使所述导电性粒子的粒径变得与所述绝缘性粒子的粒径相同的变形挤压力均小,
所述导电性粒子为镀敷树脂微粒子表面形成的,
所述绝缘性粒子为在无机粒子的表面上结合官能单体的有机无机混合粒子,粘结剂树脂包含能够与所述有机无机混合粒子中的所述官能单体聚合的聚合树脂。
2.如权利要求1所述的各向异性导电接合体的制作方法,绝缘性粒子的总体积为,导电性粒子总体积的0.2倍以上、2倍以下。
3.如权利要求1所述的各向异性导电接合体的制作方法,绝缘性粒子为,不会因与分散溶剂的接触而发生膨胀的绝缘性粒子。
4.一种各向异性导电接合体,其特征在于,使用如权利要求1所述的各向异性导电接合体的制作方法制成。
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