CN101666433A - High power LED source for heat conduction by using room temperature liquid metal - Google Patents
High power LED source for heat conduction by using room temperature liquid metal Download PDFInfo
- Publication number
- CN101666433A CN101666433A CN200910101818A CN200910101818A CN101666433A CN 101666433 A CN101666433 A CN 101666433A CN 200910101818 A CN200910101818 A CN 200910101818A CN 200910101818 A CN200910101818 A CN 200910101818A CN 101666433 A CN101666433 A CN 101666433A
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- packaging
- liquid metal
- radiator
- base plate
- room temperature
- Prior art date
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- Granted
Links
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 82
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims description 98
- 239000000565 sealant Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000011135 tin Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 6
- 239000010410 layer Substances 0.000 abstract 3
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 238000003466 welding Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101018181A CN101666433B (en) | 2009-08-27 | 2009-08-27 | High power LED source for heat conduction by using room temperature liquid metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101018181A CN101666433B (en) | 2009-08-27 | 2009-08-27 | High power LED source for heat conduction by using room temperature liquid metal |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101666433A true CN101666433A (en) | 2010-03-10 |
CN101666433B CN101666433B (en) | 2011-01-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2009101018181A Active CN101666433B (en) | 2009-08-27 | 2009-08-27 | High power LED source for heat conduction by using room temperature liquid metal |
Country Status (1)
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CN (1) | CN101666433B (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103545272A (en) * | 2012-07-12 | 2014-01-29 | 三星电子株式会社 | Semiconductor chip including heat radiation portion and method of fabricating the semiconductor chip |
CN104534421A (en) * | 2014-12-24 | 2015-04-22 | 中国科学院半导体研究所 | LED light source module with highlight power density |
CN104966704A (en) * | 2015-07-23 | 2015-10-07 | 国网智能电网研究院 | Low-thermal-resistance crimping-type power device package |
CN105570733A (en) * | 2015-09-30 | 2016-05-11 | 浙江三磊科技有限公司 | LED module and LED point light source lamp |
CN108150978A (en) * | 2017-11-27 | 2018-06-12 | 安徽西马新能源技术有限公司 | A kind of vehicle LED radiating subassembly |
CN108369979A (en) * | 2015-12-17 | 2018-08-03 | 卡提公司 | Electro-optical package |
CN109413938A (en) * | 2018-10-24 | 2019-03-01 | 航天材料及工艺研究所 | A kind of efficient cooling means of composite material light and device |
CN109424911A (en) * | 2017-09-05 | 2019-03-05 | 株式会社小糸制作所 | Lamp unit and lamps apparatus for vehicle |
CN109882810A (en) * | 2017-12-06 | 2019-06-14 | 中国科学院工程热物理研究所 | The heat sink arrangement of full angle LED projection lamp |
CN110444646A (en) * | 2018-05-02 | 2019-11-12 | 态金材料科技股份有限公司 | The light emitting diode construction of energy gain light output efficiency |
CN110471219A (en) * | 2019-07-31 | 2019-11-19 | 厦门天马微电子有限公司 | LED substrate and display device |
CN114400278A (en) * | 2021-12-27 | 2022-04-26 | 江苏国中芯半导体科技有限公司 | LED packaging substrate and LED packaging equipment using same |
-
2009
- 2009-08-27 CN CN2009101018181A patent/CN101666433B/en active Active
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103545272A (en) * | 2012-07-12 | 2014-01-29 | 三星电子株式会社 | Semiconductor chip including heat radiation portion and method of fabricating the semiconductor chip |
CN104534421A (en) * | 2014-12-24 | 2015-04-22 | 中国科学院半导体研究所 | LED light source module with highlight power density |
CN104966704A (en) * | 2015-07-23 | 2015-10-07 | 国网智能电网研究院 | Low-thermal-resistance crimping-type power device package |
CN104966704B (en) * | 2015-07-23 | 2019-01-25 | 国网智能电网研究院 | A kind of compression joint type power device package of low thermal resistance |
CN105570733A (en) * | 2015-09-30 | 2016-05-11 | 浙江三磊科技有限公司 | LED module and LED point light source lamp |
CN105570733B (en) * | 2015-09-30 | 2018-04-03 | 浙江三磊科技有限公司 | A kind of LED module and LED point light source light fixture |
CN108369979A (en) * | 2015-12-17 | 2018-08-03 | 卡提公司 | Electro-optical package |
CN109424911A (en) * | 2017-09-05 | 2019-03-05 | 株式会社小糸制作所 | Lamp unit and lamps apparatus for vehicle |
CN108150978A (en) * | 2017-11-27 | 2018-06-12 | 安徽西马新能源技术有限公司 | A kind of vehicle LED radiating subassembly |
CN109882810A (en) * | 2017-12-06 | 2019-06-14 | 中国科学院工程热物理研究所 | The heat sink arrangement of full angle LED projection lamp |
CN109882810B (en) * | 2017-12-06 | 2024-03-19 | 中国科学院工程热物理研究所 | Radiator device of full-angle LED projection lamp |
CN110444646A (en) * | 2018-05-02 | 2019-11-12 | 态金材料科技股份有限公司 | The light emitting diode construction of energy gain light output efficiency |
CN109413938A (en) * | 2018-10-24 | 2019-03-01 | 航天材料及工艺研究所 | A kind of efficient cooling means of composite material light and device |
CN110471219A (en) * | 2019-07-31 | 2019-11-19 | 厦门天马微电子有限公司 | LED substrate and display device |
CN114400278A (en) * | 2021-12-27 | 2022-04-26 | 江苏国中芯半导体科技有限公司 | LED packaging substrate and LED packaging equipment using same |
Also Published As
Publication number | Publication date |
---|---|
CN101666433B (en) | 2011-01-19 |
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Owner name: HANGZHOU GUANGZHUI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FU JIAN Effective date: 20120227 |
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Effective date of registration: 20120227 Address after: 1508 room 328, A District, No. 310012 Wen two road, Xihu District, Zhejiang, Hangzhou Patentee after: Hangzhou Guangzhui Technology Co., Ltd. Address before: Hangzhou City, Zhejiang province 310012 Zijin building 24-701 Patentee before: Fu Jian |
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Owner name: SHANGHAI CEYUAN INDUSTRIAL CO., LTD. Free format text: FORMER OWNER: HANGZHOU GUANGZHUI TECHNOLOGY CO., LTD. Effective date: 20141226 |
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Free format text: CORRECT: ADDRESS; FROM: 310012 HANGZHOU, ZHEJIANG PROVINCE TO: 201424 FENGXIAN, SHANGHAI |
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Effective date of registration: 20141226 Address after: 201424 153-155, building 3270, No. 1, Shanghai Hangzhou Road, Tuo Lin Town, Shanghai, Fengxian District Patentee after: Shanghai Ceyuan Industry Co., Ltd. Address before: 1508 room 328, A District, No. 310012 Wen two road, Xihu District, Zhejiang, Hangzhou Patentee before: Hangzhou Guangzhui Technology Co., Ltd. |