CN101656233A - 薄膜晶体管基板的制造方法 - Google Patents
薄膜晶体管基板的制造方法 Download PDFInfo
- Publication number
- CN101656233A CN101656233A CN200810142026A CN200810142026A CN101656233A CN 101656233 A CN101656233 A CN 101656233A CN 200810142026 A CN200810142026 A CN 200810142026A CN 200810142026 A CN200810142026 A CN 200810142026A CN 101656233 A CN101656233 A CN 101656233A
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- CN
- China
- Prior art keywords
- film transistor
- type
- thin
- film
- contact region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title abstract description 15
- 239000010408 film Substances 0.000 claims abstract description 129
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 61
- 229920005591 polysilicon Polymers 0.000 claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 239000003990 capacitor Substances 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 8
- 238000002425 crystallisation Methods 0.000 claims description 4
- 230000008025 crystallization Effects 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000005224 laser annealing Methods 0.000 claims description 3
- GRPQBOKWXNIQMF-UHFFFAOYSA-N indium(3+) oxygen(2-) tin(4+) Chemical class [Sn+4].[O-2].[In+3] GRPQBOKWXNIQMF-UHFFFAOYSA-N 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- -1 boron ion Chemical class 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810142026A CN101656233B (zh) | 2008-08-22 | 2008-08-22 | 薄膜晶体管基板的制造方法 |
US12/583,461 US7985636B2 (en) | 2008-08-22 | 2009-08-21 | Method for fabricating low temperature poly-silicon thin film transistor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810142026A CN101656233B (zh) | 2008-08-22 | 2008-08-22 | 薄膜晶体管基板的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101656233A true CN101656233A (zh) | 2010-02-24 |
CN101656233B CN101656233B (zh) | 2012-10-24 |
Family
ID=41696758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810142026A Expired - Fee Related CN101656233B (zh) | 2008-08-22 | 2008-08-22 | 薄膜晶体管基板的制造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7985636B2 (zh) |
CN (1) | CN101656233B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104538353A (zh) * | 2014-12-30 | 2015-04-22 | 深圳市华星光电技术有限公司 | 低温多晶硅(ltps)产品结构及制造方法 |
CN105097667A (zh) * | 2015-06-24 | 2015-11-25 | 深圳市华星光电技术有限公司 | 低温多晶硅tft基板结构的制作方法及低温多晶硅tft基板结构 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101117643B1 (ko) * | 2010-04-08 | 2012-03-05 | 삼성모바일디스플레이주식회사 | 비정질 실리콘막의 결정화 방법, 그리고 박막 트랜지스터 및 이의 제조 방법 |
CN103762178A (zh) * | 2013-12-25 | 2014-04-30 | 深圳市华星光电技术有限公司 | 一种低温多晶硅薄膜晶体管及其制造方法 |
CN104538456B (zh) * | 2014-12-31 | 2018-07-17 | 深圳市华星光电技术有限公司 | 低温多晶硅薄膜晶体管及薄膜晶体管基板 |
CN104538354B (zh) * | 2014-12-31 | 2018-01-09 | 深圳市华星光电技术有限公司 | 一种ltps tft像素单元及其制造方法 |
US9520421B1 (en) * | 2015-06-29 | 2016-12-13 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Method for manufacturing LTPS TFT substrate and LTPS TFT substrate |
TWI552322B (zh) * | 2015-08-06 | 2016-10-01 | 友達光電股份有限公司 | 畫素結構 |
CN105655355A (zh) * | 2016-02-01 | 2016-06-08 | 武汉华星光电技术有限公司 | 一种阵列基板的制造方法 |
EP3561586A1 (en) * | 2016-12-24 | 2019-10-30 | Shenzhen Royole Technologies Co., Ltd. | Thin-film transistor array substrate, low temperature polysilicon thin-film transistor, and method for manufacturing same |
US11302561B2 (en) * | 2019-11-12 | 2022-04-12 | Palo Alto Research Center Incorporated | Transfer elements that selectably hold and release objects based on changes in stiffness |
US11348905B2 (en) | 2020-03-02 | 2022-05-31 | Palo Alto Research Center Incorporated | Method and system for assembly of micro-LEDs onto a substrate |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100265179B1 (ko) * | 1995-03-27 | 2000-09-15 | 야마자끼 순페이 | 반도체장치와 그의 제작방법 |
KR100735193B1 (ko) * | 2000-12-30 | 2007-07-03 | 비오이 하이디스 테크놀로지 주식회사 | 박막 트랜지스터 액정표시장치 제조 방법 및 그에사용되는 마스크 |
TW586144B (en) * | 2002-11-15 | 2004-05-01 | Toppoly Optoelectronics Corp | Method of forming a liquid crystal display |
CN1324388C (zh) | 2003-03-14 | 2007-07-04 | 友达光电股份有限公司 | 低温多晶矽薄膜电晶体液晶显示器的制造方法 |
TW588463B (en) * | 2003-04-04 | 2004-05-21 | Au Optronics Corp | A method for forming a low temperature polysilicon complementary metal oxide semiconductor thin film transistor |
KR100584715B1 (ko) * | 2004-04-06 | 2006-05-29 | 엘지.필립스 엘시디 주식회사 | 구동회로 일체형 액정표시장치용 어레이 기판의 제조 방법 |
TWI256515B (en) | 2004-04-06 | 2006-06-11 | Quanta Display Inc | Structure of LTPS-TFT and fabricating method thereof |
JP2006030319A (ja) * | 2004-07-12 | 2006-02-02 | Hoya Corp | グレートーンマスク及びグレートーンマスクの製造方法 |
US7192815B2 (en) * | 2004-11-15 | 2007-03-20 | Chunghwa Picture Tubes, Ltd. | Method of manufacturing a thin film transistor |
US7867791B2 (en) * | 2005-07-29 | 2011-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device using multiple mask layers formed through use of an exposure mask that transmits light at a plurality of intensities |
KR20080000496A (ko) * | 2006-06-27 | 2008-01-02 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 어레이 기판 및 그 제조방법 |
TWI303888B (en) * | 2006-07-21 | 2008-12-01 | Au Optronics Corp | Ltps-lcd structure and method for manufacturing the same |
TWI325638B (en) * | 2007-01-22 | 2010-06-01 | Au Optronics Corp | Method for manufacturing pixel structure |
KR101431136B1 (ko) * | 2007-03-08 | 2014-08-18 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판의 제조 방법 |
CN101286515A (zh) * | 2007-04-13 | 2008-10-15 | 群康科技(深圳)有限公司 | 薄膜晶体管基板及其制造方法 |
TWI328259B (en) * | 2007-05-15 | 2010-08-01 | Au Optronics Corp | Semiconductor device and manufacturing method thereof |
TW201001624A (en) * | 2008-01-24 | 2010-01-01 | Soligie Inc | Silicon thin film transistors, systems, and methods of making same |
TWI371223B (en) * | 2008-02-20 | 2012-08-21 | Chimei Innolux Corp | Organic light emitting display device and fabrications thereof and electronic device |
-
2008
- 2008-08-22 CN CN200810142026A patent/CN101656233B/zh not_active Expired - Fee Related
-
2009
- 2009-08-21 US US12/583,461 patent/US7985636B2/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104538353A (zh) * | 2014-12-30 | 2015-04-22 | 深圳市华星光电技术有限公司 | 低温多晶硅(ltps)产品结构及制造方法 |
CN104538353B (zh) * | 2014-12-30 | 2018-01-02 | 深圳市华星光电技术有限公司 | 低温多晶硅(ltps)产品结构及制造方法 |
CN105097667A (zh) * | 2015-06-24 | 2015-11-25 | 深圳市华星光电技术有限公司 | 低温多晶硅tft基板结构的制作方法及低温多晶硅tft基板结构 |
Also Published As
Publication number | Publication date |
---|---|
US7985636B2 (en) | 2011-07-26 |
US20100047975A1 (en) | 2010-02-25 |
CN101656233B (zh) | 2012-10-24 |
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C06 | Publication | ||
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ASS | Succession or assignment of patent right |
Owner name: QIMEI ELECTRONIC CO LTD Free format text: FORMER OWNER: INNOLUX DISPLAY CO., LTD. Effective date: 20120227 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20120227 Address after: 518109 Longhua, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 1, floor 4, Applicant after: Qunkang Technology (Shenzhen) Co., Ltd. Co-applicant after: Chimei Optoelectronics Co., Ltd. Address before: 518109 Longhua, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 1, floor 4, Applicant before: Qunkang Technology (Shenzhen) Co., Ltd. Co-applicant before: Innolux Display Group |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121024 Termination date: 20200822 |
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CF01 | Termination of patent right due to non-payment of annual fee |