CN101656193A - 一种硅片加工工艺 - Google Patents
一种硅片加工工艺 Download PDFInfo
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- CN101656193A CN101656193A CN200810118667A CN200810118667A CN101656193A CN 101656193 A CN101656193 A CN 101656193A CN 200810118667 A CN200810118667 A CN 200810118667A CN 200810118667 A CN200810118667 A CN 200810118667A CN 101656193 A CN101656193 A CN 101656193A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 87
- 239000010703 silicon Substances 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000000227 grinding Methods 0.000 claims abstract description 49
- 230000007797 corrosion Effects 0.000 claims abstract description 36
- 238000005260 corrosion Methods 0.000 claims abstract description 36
- 238000005498 polishing Methods 0.000 claims abstract description 29
- 239000002253 acid Substances 0.000 claims abstract description 22
- 239000000243 solution Substances 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 239000011259 mixed solution Substances 0.000 claims abstract description 6
- 238000005516 engineering process Methods 0.000 claims description 17
- 229910001651 emery Inorganic materials 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000003518 caustics Substances 0.000 description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 238000003754 machining Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 241000226585 Antennaria plantaginifolia Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
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Priority Applications (1)
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CN 200810118667 CN101656193B (zh) | 2008-08-21 | 2008-08-21 | 一种硅片加工工艺 |
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CN 200810118667 CN101656193B (zh) | 2008-08-21 | 2008-08-21 | 一种硅片加工工艺 |
Publications (2)
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CN101656193A true CN101656193A (zh) | 2010-02-24 |
CN101656193B CN101656193B (zh) | 2011-09-28 |
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CN 200810118667 Active CN101656193B (zh) | 2008-08-21 | 2008-08-21 | 一种硅片加工工艺 |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102423872A (zh) * | 2011-12-07 | 2012-04-25 | 深圳深爱半导体股份有限公司 | 硅片的抛光方法 |
CN102528597A (zh) * | 2010-12-08 | 2012-07-04 | 有研半导体材料股份有限公司 | 一种大直径硅片制造工艺 |
CN103123865A (zh) * | 2013-02-26 | 2013-05-29 | 宁波韵升股份有限公司 | 一种磁性产品加工方法及自动分选设备 |
CN103144024A (zh) * | 2011-12-06 | 2013-06-12 | 有研半导体材料股份有限公司 | 使用高温热处理的300mm硅抛光片制造工艺 |
CN103567857A (zh) * | 2013-11-04 | 2014-02-12 | 上海申和热磁电子有限公司 | 硅片双面抛光工艺 |
CN107993936A (zh) * | 2017-11-30 | 2018-05-04 | 北京创昱科技有限公司 | 衬底加工方法 |
CN108054111A (zh) * | 2017-12-19 | 2018-05-18 | 大连鑫鑫创世科技发展有限公司 | 一种集成电路硅片的分割方法 |
CN108400081A (zh) * | 2017-02-08 | 2018-08-14 | 上海新昇半导体科技有限公司 | 硅片的制作方法 |
CN110010458A (zh) * | 2019-04-01 | 2019-07-12 | 徐州鑫晶半导体科技有限公司 | 控制半导体晶圆片表面形貌的方法和半导体晶片 |
CN110277307A (zh) * | 2019-05-28 | 2019-09-24 | 天津中环领先材料技术有限公司 | 一种制备单面高亮度酸腐片的工艺方法 |
CN110526201A (zh) * | 2018-05-25 | 2019-12-03 | 浙江清华柔性电子技术研究院 | 柔性硅片的制备方法 |
CN110526202A (zh) * | 2018-05-25 | 2019-12-03 | 浙江清华柔性电子技术研究院 | 柔性硅片的制备方法 |
CN111295740A (zh) * | 2017-12-25 | 2020-06-16 | 胜高股份有限公司 | 晶圆的双面研磨方法 |
CN111341884A (zh) * | 2020-03-20 | 2020-06-26 | 浙江晶科能源有限公司 | 一种硅片及其表面倒金字塔结构制备方法 |
CN112059736A (zh) * | 2020-09-08 | 2020-12-11 | 有研半导体材料有限公司 | 一种硅片制造工艺 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5837662A (en) * | 1997-12-12 | 1998-11-17 | Memc Electronic Materials, Inc. | Post-lapping cleaning process for silicon wafers |
CN1753154A (zh) * | 2004-09-23 | 2006-03-29 | 北京有色金属研究总院 | 一种晶圆氧化膜边缘的去除方法及装置 |
-
2008
- 2008-08-21 CN CN 200810118667 patent/CN101656193B/zh active Active
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102528597A (zh) * | 2010-12-08 | 2012-07-04 | 有研半导体材料股份有限公司 | 一种大直径硅片制造工艺 |
CN102528597B (zh) * | 2010-12-08 | 2015-06-24 | 有研新材料股份有限公司 | 一种大直径硅片制造工艺 |
CN103144024A (zh) * | 2011-12-06 | 2013-06-12 | 有研半导体材料股份有限公司 | 使用高温热处理的300mm硅抛光片制造工艺 |
CN102423872A (zh) * | 2011-12-07 | 2012-04-25 | 深圳深爱半导体股份有限公司 | 硅片的抛光方法 |
CN103123865A (zh) * | 2013-02-26 | 2013-05-29 | 宁波韵升股份有限公司 | 一种磁性产品加工方法及自动分选设备 |
CN103123865B (zh) * | 2013-02-26 | 2015-05-27 | 宁波韵升股份有限公司 | 一种磁性产品加工方法及自动分选设备 |
CN103567857A (zh) * | 2013-11-04 | 2014-02-12 | 上海申和热磁电子有限公司 | 硅片双面抛光工艺 |
CN108400081A (zh) * | 2017-02-08 | 2018-08-14 | 上海新昇半导体科技有限公司 | 硅片的制作方法 |
CN107993936A (zh) * | 2017-11-30 | 2018-05-04 | 北京创昱科技有限公司 | 衬底加工方法 |
CN108054111A (zh) * | 2017-12-19 | 2018-05-18 | 大连鑫鑫创世科技发展有限公司 | 一种集成电路硅片的分割方法 |
CN111295740B (zh) * | 2017-12-25 | 2023-04-18 | 胜高股份有限公司 | 晶圆的双面研磨方法 |
CN111295740A (zh) * | 2017-12-25 | 2020-06-16 | 胜高股份有限公司 | 晶圆的双面研磨方法 |
CN110526201B (zh) * | 2018-05-25 | 2022-11-01 | 浙江清华柔性电子技术研究院 | 柔性硅片的制备方法 |
CN110526201A (zh) * | 2018-05-25 | 2019-12-03 | 浙江清华柔性电子技术研究院 | 柔性硅片的制备方法 |
CN110526202A (zh) * | 2018-05-25 | 2019-12-03 | 浙江清华柔性电子技术研究院 | 柔性硅片的制备方法 |
CN110526202B (zh) * | 2018-05-25 | 2022-11-01 | 浙江清华柔性电子技术研究院 | 柔性硅片的制备方法 |
CN110010458A (zh) * | 2019-04-01 | 2019-07-12 | 徐州鑫晶半导体科技有限公司 | 控制半导体晶圆片表面形貌的方法和半导体晶片 |
CN110010458B (zh) * | 2019-04-01 | 2021-08-27 | 徐州鑫晶半导体科技有限公司 | 控制半导体晶圆片表面形貌的方法和半导体晶片 |
CN110277307B (zh) * | 2019-05-28 | 2022-02-11 | 天津中环领先材料技术有限公司 | 一种制备单面高亮度酸腐片的工艺方法 |
CN110277307A (zh) * | 2019-05-28 | 2019-09-24 | 天津中环领先材料技术有限公司 | 一种制备单面高亮度酸腐片的工艺方法 |
CN111341884A (zh) * | 2020-03-20 | 2020-06-26 | 浙江晶科能源有限公司 | 一种硅片及其表面倒金字塔结构制备方法 |
CN112059736A (zh) * | 2020-09-08 | 2020-12-11 | 有研半导体材料有限公司 | 一种硅片制造工艺 |
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CN101656193B (zh) | 2011-09-28 |
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Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS Effective date: 20120203 Free format text: FORMER OWNER: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Effective date: 20120203 |
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Effective date of registration: 20120203 Address after: 100088, 2, Xinjie street, Beijing Patentee after: GRINM Semiconductor Materials Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Co-patentee before: GRINM Semiconductor Materials Co., Ltd. Patentee before: General Research Institute for Nonferrous Metals |
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Owner name: GRINM ADVANCED MATERIALS CO., LTD. Free format text: FORMER NAME: GRINM SEMICONDUCTOR MATERIALS CO., LTD. |
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Address after: 100088, 2, Xinjie street, Beijing Patentee after: YOUYAN NEW MATERIAL CO., LTD. Address before: 100088, 2, Xinjie street, Beijing Patentee before: GRINM Semiconductor Materials Co., Ltd. |
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Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GRINM ADVANCED MATERIALS CO., LTD. Effective date: 20150612 |
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Effective date of registration: 20150612 Address after: 101300 Beijing city Shunyi District Shuanghe Linhe Industrial Development Zone on the south side of the road Patentee after: You Yan Semi Materials Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Patentee before: YOUYAN NEW MATERIAL CO., LTD. |
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Address after: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee after: Youyan semiconductor silicon materials Co.,Ltd. Address before: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee before: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd. |