CN101651450B - Method for preparing quartz crystal devices by laser soldering seal - Google Patents
Method for preparing quartz crystal devices by laser soldering seal Download PDFInfo
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- CN101651450B CN101651450B CN2009100422430A CN200910042243A CN101651450B CN 101651450 B CN101651450 B CN 101651450B CN 2009100422430 A CN2009100422430 A CN 2009100422430A CN 200910042243 A CN200910042243 A CN 200910042243A CN 101651450 B CN101651450 B CN 101651450B
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- kovar alloy
- quartz crystal
- laser
- alloy ring
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Abstract
The invention relates to a method for preparing quartz crystal devices by laser soldering seal, including that: (1) a ceramic packaged foundation support internally provided with quartz element is prepared; (2) an opening is opened around the upper end of the ceramic packaged foundation support to form a kovar alloy ring; and (3) a metal cover and the kovar alloy ring are welded so as to package the ceramic packaged foundation support; the method is characterized in that in the step (3), a laser beam is utilized to weld the metal cover and the kovar alloy ring in a sealing way. Compared with prior art, the invention has the following advantages: non-contact distant laser welding technology is adopted, production efficiency is greatly improved, heat affected zone is small, welding point is pollution free, welding quality is greatly improved, and deformation and dislocation problem of the traditional metal cover is avoided. The encapsulation method of the invention has high production efficiency, fast welding speed, large depth and small deformation and is especially applicable to small size micro welding and mass production.
Description
Technical field
The present invention relates to the basic components and parts of electricity field, be specifically related to can be used as the preparation method of the quartz crystal device of resonator, oscillator, surface acoustic wave device etc.
Background technology
Along with electronic product develops towards portable, miniaturization, networking and multimedization direction, double-digit growth appears in the demand of quartz crystal device, and quartz crystal and ceramic encapsulated base size thereof are also more and more littler.
The production process of traditional quartz crystal device mainly comprises: quartz crystal is arranged on ceramic encapsulated base inside; (kovar alloy is also claimed the Kovar alloy on ceramic encapsulated base, to form the kovar alloy ring; Mainly be applicable to the glass sealing alloy of electric elements and Bohemian glass, soft glass, ceramic matched seal), the top then crown cap that covers is through electric resistance welding; Through roll extrusion crown cap edge, crown cap and ceramic encapsulated base are welded together.Because be that resistance welded through the roll extrusion limit realizes encapsulation, its crown cap easy deformation walks, particularly for undersized ceramic encapsulated base, accurately the location welding is the devil, and welding back air-tightness is bad, and production cost is high always.Existing production technology makes the output of quartz crystal device and miniaturization also be restricted, and can not be satisfied with the growing market demand far away.Therefore, break through the technical difficulty in existing small size ceramic encapsulated base and the crown cap encapsulation, it is extremely urgent to seek a kind of new manufacturing approach.
Summary of the invention
The objective of the invention is to solve prior art to small size ceramic encapsulated base sealing difficulty, and sealing crown cap defective of poor quality, inefficient.
Above-mentioned purpose is achieved by following technical scheme:
A kind ofly prepare the method for quartz crystal device through laser soldering seal, comprising: (1) provides the step of the ceramic encapsulated base of set inside quartz crystal; (2) form the step of kovar alloy ring around the ceramic encapsulated base open upper end; (3) thus with crown cap and kovar alloy loops welded step with said ceramic encapsulated base encapsulation; It is characterized in that step (3) specifically comprises: a. places crown cap on the kovar alloy ring, and b. places the semi-finished product after above-mentioned steps in the airtight transparent space that is full of inert gas; C., laser beam is provided, utilizes laser beam crown cap and kovar alloy ring sealing welding.
In the said step (2); The concrete grammar that becket is set on ceramic encapsulated base is: around said ceramic encapsulated base open upper end printing tungsten metal level nickel plating or gold, place silver-copper brazing alloy then and under 850 ± 20 ℃ of reducing atmospheres, weld the kovar alloy ring that punching press obtains.
Said laser beam is by CO
2Laser or YAG laser provide, and focus on through prism.
The present invention compared with prior art has the following advantages: the sealing gland encapsulation that the present invention is directed to ceramic encapsulated base and crown cap; Adopt the remote laser welding technology of noncontact; Production efficiency improves greatly, and the heat affected area is little, and solder joint is pollution-free; Improve the quality of welding greatly, avoided traditional electric resistance welding crown cap to be out of shape the problem that walks.Method for packing production efficiency of the present invention is high, and speed of welding is fast, the degree of depth is big, distortion is little, is specially adapted to small size micro welding, is fit to large-scale production.Its meaning is to enhance productivity, reduce production costs, and satisfies the growing market demand biglyyer.
Description of drawings
Fig. 1 is the decomposing schematic representation of the quartz crystal device of embodiment one production;
Fig. 2 is the sketch map of the finished product of the quartz crystal device produced of embodiment one;
Fig. 3 is the decomposing schematic representation of the quartz crystal device of embodiment two productions;
Fig. 4 is the sketch map of the finished product of the quartz crystal device produced of embodiment two;
Fig. 5 places the sketch map that carries out laser soldering and sealing in the airtight transparent space with quartz crystal device.
Embodiment
To combine embodiment and accompanying drawing that the present invention is done further detailed description below.
Embodiment one:
In conjunction with Fig. 1 and shown in Figure 2; Around printing tungsten metal level nickel plating of ceramic encapsulated base 8 open upper end or gold; Place silver-copper brazing alloy 7 then and under 850 ± 20 ℃ of reducing atmospheres, weld the kovar alloy ring 6 that punching press obtains, above kovar alloy ring 6, cover crown cap 5 afterwards; In conjunction with shown in Figure 5; The airtight transparent space 4 that will the semi-finished product 3 after above-mentioned steps places inert gases such as being full of nitrogen or argon gas; Lasing light emitter 20 is selected CO2 laser or YAG laser for use, and laser beam 1 carries out laser welding to crown cap 5 and kovar alloy ring 6 after focusing on through prism 2; Thereby quartz crystal is encapsulated in the four-layer structure that is made up of ceramic encapsulated base 8, silver-copper brazing alloy 7, kovar alloy ring 6 and crown cap 5, forms a quartz crystal device 9 (as shown in Figure 2).
Embodiment two:
In conjunction with Fig. 3 and shown in Figure 4, place quartz crystals in the ceramic encapsulated base 8, specifically quartz crystal is contained in (not shown) on the internal terminal with the ceramic encapsulated base 8 of outside terminal conducting; Around ceramic encapsulated base 8 open upper end printings form kovar alloy ring 10 and in 850 ± 20 ℃ of reducing atmospheres such as hydrogen sintering obtain ceramic encapsulated base with kovar alloy ring 10, above kovar alloy ring 10, cover crown cap 5 afterwards; Same combine shown in Figure 5ly, will the semi-finished product 3 after above-mentioned steps place the airtight transparent space 4 of inert gases such as being full of nitrogen or argon gas, lasing light emitter 20 is selected CO for use
2Laser or YAG laser; After laser beam 1 focuses on through prism 2; Crown cap 5 and kovar alloy ring 10 are carried out laser welding; Thereby quartz crystal is encapsulated in the three-decker that is made up of ceramic encapsulated base 8, kovar alloy ring 10 and crown cap 5, forms quartz crystal device 11 (see figure 4)s.
The present invention adopts the laser welding mode, in the airtight transparent cavity that is full of inert gases such as nitrogen or argon gas, implements noncontact and welds at a distance, has very big flexibility.With respect to traditional method for packing; Above-mentioned method for packing has solved the technical problem of production of small size pedestal package metals lid and difficult installation, and accurate except contraposition, production efficiency improves greatly; The heat affected area is little; Outside solder joint is pollution-free, avoid traditional electric resistance welding crown cap to be out of shape the problem that walks especially, can adapt to the seamless remote high-quality soldering and sealing of the miniature frequency components and parts of miniaturization day by day especially.
Claims (2)
1. one kind prepares the method for quartz crystal device through laser soldering seal, and comprising: (1) provides the step of the ceramic encapsulated base of set inside quartz crystal; (2) form the step of kovar alloy ring around the ceramic encapsulated base open upper end; (3) thus with crown cap and the kovar alloy loops welded step with said ceramic encapsulated base encapsulation, specifically comprise: a. places crown cap on the kovar alloy ring, b. places the semi-finished product after above-mentioned steps in the airtight transparent space that is full of inert gas; C., laser beam is provided, utilizes laser beam crown cap and kovar alloy ring sealing welding; It is characterized in that; In the step (2); The concrete grammar that becket is set on ceramic encapsulated base is: around said ceramic encapsulated base open upper end printing tungsten metal level nickel plating or gold, place silver-copper brazing alloy then and under 850 ± 20 ℃ of reducing atmospheres, weld the kovar alloy ring that punching press obtains.
2. according to claim 1ly prepare the method for quartz crystal device, it is characterized in that said laser beam is by CO through laser soldering seal
2Laser or YAG laser provide, and focus on through prism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100422430A CN101651450B (en) | 2009-08-31 | 2009-08-31 | Method for preparing quartz crystal devices by laser soldering seal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100422430A CN101651450B (en) | 2009-08-31 | 2009-08-31 | Method for preparing quartz crystal devices by laser soldering seal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101651450A CN101651450A (en) | 2010-02-17 |
| CN101651450B true CN101651450B (en) | 2012-05-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100422430A Expired - Fee Related CN101651450B (en) | 2009-08-31 | 2009-08-31 | Method for preparing quartz crystal devices by laser soldering seal |
Country Status (1)
| Country | Link |
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| CN (1) | CN101651450B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325922B (en) * | 2013-06-05 | 2016-03-09 | 广州市鸿利光电股份有限公司 | A kind of LED encapsulation method |
| CN104112676B (en) * | 2014-06-27 | 2017-01-11 | 成都嘉纳海威科技有限责任公司 | SIP lead-tin packaging method and packaging structure thereof |
| CN108111139B (en) * | 2016-11-25 | 2023-10-31 | 四川明德亨电子科技有限公司 | SMD quartz resonator and processing equipment and method thereof |
| CN106847714B (en) * | 2016-12-29 | 2019-08-09 | 潮州三环（集团）股份有限公司 | Encapsulating structure and preparation method thereof |
| CN108788458B (en) * | 2018-05-25 | 2020-06-05 | 佛山市富兰激光科技有限公司 | Crystal welding equipment |
| CN109437912A (en) * | 2018-12-05 | 2019-03-08 | 南昌航空大学 | A kind of preparation method of the silica in situ cladding silicon carbide nuclear-shell structured nano-composite material of morphology controllable |
| CN112894140A (en) * | 2019-12-04 | 2021-06-04 | 大族激光科技产业集团股份有限公司 | Vacuum laser welding method and device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1329395A (en) * | 2000-03-10 | 2002-01-02 | 精工爱普生株式会社 | Package sealing method, method for manufacturing module fr electronic device sealing device and packafge element |
| JP2004090060A (en) * | 2002-09-02 | 2004-03-25 | Nippon Dempa Kogyo Co Ltd | Laser welding sealing device |
| CN1909367A (en) * | 2005-08-02 | 2007-02-07 | 珠海粤科清华电子陶瓷有限公司 | Ceramic packaging piece for crystal oscillator and its preparation method |
| CN201252519Y (en) * | 2008-09-11 | 2009-06-03 | 唐山汇通电子有限公司 | Metal-packaged SMD quartz resonator |
-
2009
- 2009-08-31 CN CN2009100422430A patent/CN101651450B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1329395A (en) * | 2000-03-10 | 2002-01-02 | 精工爱普生株式会社 | Package sealing method, method for manufacturing module fr electronic device sealing device and packafge element |
| JP2004090060A (en) * | 2002-09-02 | 2004-03-25 | Nippon Dempa Kogyo Co Ltd | Laser welding sealing device |
| CN1909367A (en) * | 2005-08-02 | 2007-02-07 | 珠海粤科清华电子陶瓷有限公司 | Ceramic packaging piece for crystal oscillator and its preparation method |
| CN201252519Y (en) * | 2008-09-11 | 2009-06-03 | 唐山汇通电子有限公司 | Metal-packaged SMD quartz resonator |
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| CN101651450A (en) | 2010-02-17 |
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Granted publication date: 20120523 Termination date: 20200831 |