US20100155023A1 - Heat dissipation apparatus having heat pipes inserted therein - Google Patents

Heat dissipation apparatus having heat pipes inserted therein Download PDF

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Publication number
US20100155023A1
US20100155023A1 US12/423,816 US42381609A US2010155023A1 US 20100155023 A1 US20100155023 A1 US 20100155023A1 US 42381609 A US42381609 A US 42381609A US 2010155023 A1 US2010155023 A1 US 2010155023A1
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US
United States
Prior art keywords
fin group
heat
fan
heat dissipation
dissipation apparatus
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Abandoned
Application number
US12/423,816
Inventor
Shi-Wen Zhou
Jun Cao
Qing-Song Xu
Chun-Chi Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CAO, JUN, CHEN, CHUN-CHI, XU, Qing-song, ZHOU, SHI-WEN
Publication of US20100155023A1 publication Critical patent/US20100155023A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure generally relates to heat dissipation apparatuses and, particularly, to a heat dissipation apparatus utilizing a plurality of heat pipes for dissipating heat generated by electronic components.
  • a typical heat dissipation apparatus in one typical heat dissipation apparatus, it includes a heat sink consisting of a plurality of fins arranged in a circle and a plurality of heat pipes having condensation sections inserted through the fins of the heat sink.
  • the condensation sections cooperatively form a circular configuration.
  • the condensation sections are inserted into the fins of the heat sink by moving the fins over the condensation sections of the heat pipes one by one.
  • the movement of the condensation sections of the heat pipes through holes of the fins may scrape solder out of the holes of the fins, whereby after assembly, the condensation sections of the heat pipes cannot have an intimate and firm connection with the fins, whereby the heat dissipation effectiveness and structural strength of the heat dissipation apparatus can not be as good as expected.
  • FIG. 1 is an assembled, isometric view of a heat dissipation apparatus in accordance with an embodiment of the disclosure.
  • FIG. 2 is an exploded, isometric view of the heat dissipation apparatus of FIG. 1 .
  • FIG. 3 is another exploded view of the heat dissipation apparatus of FIG. 1 .
  • FIG. 4 is an assembled view of the heat dissipation apparatus of FIG. 1 , with a cover separated therefrom.
  • FIG. 5 is a side view of the heat dissipation apparatus of FIG. 1 .
  • the heat dissipation apparatus includes a base 10 , a heat sink 30 , a heat pipe assembly 20 thermally connecting the base 10 with the heat sink 30 , a fan assembly 40 embedded in a top of the heat sink 30 and a cover 50 engaging a periphery of the heat sink 30 to cover the fan assembly 40 .
  • the base 10 is made of a material with high heat conductivity, such as copper and aluminum.
  • the base 10 comprises a first plate 12 and a second plate 14 attached to a bottom surface of the first plate 12 .
  • the first plate 12 defines two elongated receiving grooves 120 in a middle part of the bottom surface thereof.
  • the two receiving grooves 120 are separated, parallel to each other and adapted for receiving the heat pipe assembly 20 .
  • Four mounting hole 122 are respectively defined in four corners of the first base 12 and adapted for receiving fixtures (not shown) therein to secure the heat sink assembly to a heat-dissipating electronic component (not shown) mounted on a printed circuit board (not shown).
  • the rectangular second base 14 is smaller than the first plate 12 and thermally connects with the heat-generating electronic component at a bottom surface thereof.
  • Two elongated receiving grooves 140 are defined in the top surface of the second plate 14 for cooperating with the receiving grooves 120 of the first plate 12 to accommodate the heat pipe assembly 20 .
  • the heat pipe assembly 20 includes two bent heat pipes 22 .
  • Each heat pipe 22 is bent to have an evaporation section 222 , a condensation section 224 and an adiabatic section 226 interconnecting the evaporation section 222 and the condensation section 224 .
  • the evaporation section 222 is received in one of receiving channels formed by the corresponding receiving grooves 120 , 140 of the first and second plates 12 , 14 .
  • the adiabatic section 226 extends upwardly from one end of the evaporation section 222 .
  • the condensation section 224 is bent into a substantially semicircular configuration, and extends from an upper end of the adiabatic section 226 along a horizontal plane.
  • the condensation sections 224 of the heat pipes 22 are approximately at the same level and have their free ends join each other to cooperatively form a circle.
  • the heat sink 30 is annular and includes a first fin group 32 and a second fin group 34 mounted on a top of the first fin group 32 .
  • the first fin group 32 has a bowl-shaped configuration with a breached sector in a periphery thereof for receiving the adiabatic sections 226 of the two heat pipes 22 .
  • the first fin group 32 defines a circular concave part 324 in a central part thereof and an annular top surface (not labeled) surrounding the concave part 324 .
  • the annular top surface is located at a level higher than that of the concave part 324 .
  • a through hole 326 is defined vertically in a center of the concave part 324 for airflow from the fan assembly 40 flowing therethrough to reach the base 10 .
  • the first fin group 32 consists of a plurality of first fins 32 each having a substantially L-shaped main body and extending outwardly from the through hole 326 along a radial direction.
  • the first fins 320 are perpendicularly arranged on the base 10 with central parts of lower ends of the first fins 320 standing on the base 10 .
  • An annular first groove 322 is defined in the annular top surface of the first fin group 32 and extends along a periphery direction of the heat sink 30 to surround the concave part 324 .
  • the first groove 322 has a semicircular cross section.
  • a plurality of flanges extend perpendicularly from top ends of the first fins 320 to form the annular top surface of the first fin group 32 .
  • the top surface of the first fin group 32 has a semicircular contacting face in the first groove 322 for contacting the heat pipes 20 , and two upper, annular engaging faces at two opposite sides of the first groove 322 for engaging with the second fin group 34 .
  • the engaging faces of the first group 32 face upwardly.
  • the second fin group 34 is ring-shaped and has a breached sector corresponding to the breached sector of the first fin group 32 .
  • the second fin group 34 has an annular bottom face and consists of a plurality of second fins 340 .
  • the annular bottom face has the same configuration with the annular top face of the first fin group 32 and fitly engages the annular top face of the first fin group 32 .
  • a second groove 342 is defined in the annular bottom face of the second fin group 34 and cooperate with the first groove 322 of the first fin group 32 to form a circular channel through the heat sink 30 , which can wholly receive the condensation sections 224 of the heat pipes 22 therein.
  • Each second fin 340 is substantially trapeziform, arranged along a radial direction and perpendicular to the base 10 and the annular top surface of the first fin group 32 .
  • the second fin group 34 extends a plurality of flanges from the bottom thereof to form an annular bottom surface.
  • the bottom surface has a semicircular contacting face in the second groove 342 for contacting the heat pipes 20 , and two lower, annular engaging faces at two opposite sides of the second groove 342 for engaging with the engaging faces of the first fin group 32 .
  • the engaging faces of the second group 34 face downwardly.
  • the breached sectors of the first and second fin group 32 , 34 are aligned with each other and cooperatively form a breached sector of the heat sink 30 .
  • the fan assembly 40 comprises a fan 42 and a mounting plate 44 fixed to a top of the fan 42 .
  • the cover 50 comprises an annular frame 52 engaging a periphery of the second fin group 34 and a circular lattice window 54 formed on a top of the frame 52 .
  • the adiabatic sections 226 of the heat pipes 22 are received in the breached sector of the heat sink 30 .
  • the condensation sections 224 of the heat pipes 22 are positioned in the first groove 322 with a lower portion thereof contacting the contacting face of the first fin group 32 .
  • the second fin group 34 is positioned on the first fin group 32 with the contacting face thereof thermally contacting an upper portion of the condensation sections 224 .
  • the condensation sections 224 of the heat pipes 20 are sandwiched between the first and second fin groups 32 , 34 and soldered thereto.
  • the condensation sections 224 are received in the channel cooperatively formed by the first and second grooves 322 , 342 by simply putting the condensation sections 224 in the first groove 322 and then putting the second fin group 34 on the first fin group 32 , the mounting of the condensation sections 224 in the channel will not scrape solder out of the grooves 322 , 342 .
  • the engaging faces of the second fin group 34 contact and secure with the engaging faces of the first fin group 32 at two sides of the condensation sections 224 of the heat pipes 20 by soldiering.
  • the fan assembly 40 is placed in the concave part 324 of the first fin group 32 and surrounded by the condensation sections 224 of the heat pipes 22 .
  • a lower part of the fan 42 is received in the concave part 324 of the first fin group 32 and surrounded by the annular top surface of the first fin group 32 .
  • An upper part of the fan 42 is enclosed and surrounded by the second fin group 34 .
  • the cover 50 covering the heat sink 30 encloses the second fin group 34 and the condensation sections 224 of the heat pipes 22 therein.
  • the mounting plate 44 of the fan assembly 40 engages the lattice window 54 of the cover 50 to securely suspend the fan 42 in the heat sink 30 .
  • the base 10 absorbs heat from the heat generating electronic component, which is transferred to the heat sink 30 via the heat pipe assembly 20 .
  • the fan 42 produces airflow through the heat sink 30 , and dissipates the heat from the heat sink 30 into ambient air.
  • the heat sink 30 since the heat sink 30 includes the two fin groups 32 , 34 , the heat pipe assembly 20 can be assembled into the first and second fin groups 32 , 34 easily. Thus, the heat dissipation apparatus is conveniently assembled even though the heat pipes 22 are bent to have semicircular condensation sections 224 , respectively.
  • the fan 42 is mounted inside the heat sink 30 and enclosed by the heat sink 30 , which makes the airflow produced by the fan 42 flow throughout the first and second fin groups 32 , 34 .
  • the heat sink 30 enclosing the fan 42 severs as a part of a housing for accommodating the fan 42 , which saves material for constructing the heat dissipation apparatus and enable the heat dissipation apparatus to have a compact structure.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure generally relates to heat dissipation apparatuses and, particularly, to a heat dissipation apparatus utilizing a plurality of heat pipes for dissipating heat generated by electronic components.
  • 2. Description of Related Art
  • It is well known that if heat generated by electronic components, such as integrated circuit chips, during operation is not efficiently dissipated, these electronic components may suffer damage. Thus, heat dissipation apparatuses are often used to cool the electronic components.
  • In one typical heat dissipation apparatus, it includes a heat sink consisting of a plurality of fins arranged in a circle and a plurality of heat pipes having condensation sections inserted through the fins of the heat sink. The condensation sections cooperatively form a circular configuration. The condensation sections are inserted into the fins of the heat sink by moving the fins over the condensation sections of the heat pipes one by one. Such an assembling process is time consuming and laborious. Furthermore, the movement of the condensation sections of the heat pipes through holes of the fins may scrape solder out of the holes of the fins, whereby after assembly, the condensation sections of the heat pipes cannot have an intimate and firm connection with the fins, whereby the heat dissipation effectiveness and structural strength of the heat dissipation apparatus can not be as good as expected.
  • What is needed, therefore, is a heat dissipation apparatus which overcomes the above-described limitations.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present heat dissipation apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosed heat dissipation apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled, isometric view of a heat dissipation apparatus in accordance with an embodiment of the disclosure.
  • FIG. 2 is an exploded, isometric view of the heat dissipation apparatus of FIG. 1.
  • FIG. 3 is another exploded view of the heat dissipation apparatus of FIG. 1.
  • FIG. 4 is an assembled view of the heat dissipation apparatus of FIG. 1, with a cover separated therefrom.
  • FIG. 5 is a side view of the heat dissipation apparatus of FIG. 1.
    •  DETAILED DESCRIPTION
  • Referring to FIGS. 1 and 2, a heat dissipation apparatus in accordance with an embodiment of the disclosure is shown. The heat dissipation apparatus includes a base 10, a heat sink 30, a heat pipe assembly 20 thermally connecting the base 10 with the heat sink 30, a fan assembly 40 embedded in a top of the heat sink 30 and a cover 50 engaging a periphery of the heat sink 30 to cover the fan assembly 40.
  • The base 10 is made of a material with high heat conductivity, such as copper and aluminum. The base 10 comprises a first plate 12 and a second plate 14 attached to a bottom surface of the first plate 12. The first plate 12 defines two elongated receiving grooves 120 in a middle part of the bottom surface thereof. The two receiving grooves 120 are separated, parallel to each other and adapted for receiving the heat pipe assembly 20. Four mounting hole 122 are respectively defined in four corners of the first base 12 and adapted for receiving fixtures (not shown) therein to secure the heat sink assembly to a heat-dissipating electronic component (not shown) mounted on a printed circuit board (not shown). The rectangular second base 14 is smaller than the first plate 12 and thermally connects with the heat-generating electronic component at a bottom surface thereof. Two elongated receiving grooves 140 are defined in the top surface of the second plate 14 for cooperating with the receiving grooves 120 of the first plate 12 to accommodate the heat pipe assembly 20.
  • The heat pipe assembly 20 includes two bent heat pipes 22. Each heat pipe 22 is bent to have an evaporation section 222, a condensation section 224 and an adiabatic section 226 interconnecting the evaporation section 222 and the condensation section 224. The evaporation section 222 is received in one of receiving channels formed by the corresponding receiving grooves 120, 140 of the first and second plates 12, 14. The adiabatic section 226 extends upwardly from one end of the evaporation section 222. The condensation section 224 is bent into a substantially semicircular configuration, and extends from an upper end of the adiabatic section 226 along a horizontal plane. The condensation sections 224 of the heat pipes 22 are approximately at the same level and have their free ends join each other to cooperatively form a circle.
  • Also referring to FIGS. 3 and 4, the heat sink 30 is annular and includes a first fin group 32 and a second fin group 34 mounted on a top of the first fin group 32. The first fin group 32 has a bowl-shaped configuration with a breached sector in a periphery thereof for receiving the adiabatic sections 226 of the two heat pipes 22. The first fin group 32 defines a circular concave part 324 in a central part thereof and an annular top surface (not labeled) surrounding the concave part 324. The annular top surface is located at a level higher than that of the concave part 324. A through hole 326 is defined vertically in a center of the concave part 324 for airflow from the fan assembly 40 flowing therethrough to reach the base 10. The first fin group 32 consists of a plurality of first fins 32 each having a substantially L-shaped main body and extending outwardly from the through hole 326 along a radial direction. The first fins 320 are perpendicularly arranged on the base 10 with central parts of lower ends of the first fins 320 standing on the base 10. An annular first groove 322 is defined in the annular top surface of the first fin group 32 and extends along a periphery direction of the heat sink 30 to surround the concave part 324. The first groove 322 has a semicircular cross section. To increase a contacting area of the first fins 320 and the heat pipes 22 and the second fin group 34, a plurality of flanges (not labeled) extend perpendicularly from top ends of the first fins 320 to form the annular top surface of the first fin group 32. The top surface of the first fin group 32 has a semicircular contacting face in the first groove 322 for contacting the heat pipes 20, and two upper, annular engaging faces at two opposite sides of the first groove 322 for engaging with the second fin group 34. The engaging faces of the first group 32 face upwardly.
  • The second fin group 34 is ring-shaped and has a breached sector corresponding to the breached sector of the first fin group 32. The second fin group 34 has an annular bottom face and consists of a plurality of second fins 340. The annular bottom face has the same configuration with the annular top face of the first fin group 32 and fitly engages the annular top face of the first fin group 32. A second groove 342 is defined in the annular bottom face of the second fin group 34 and cooperate with the first groove 322 of the first fin group 32 to form a circular channel through the heat sink 30, which can wholly receive the condensation sections 224 of the heat pipes 22 therein. Each second fin 340 is substantially trapeziform, arranged along a radial direction and perpendicular to the base 10 and the annular top surface of the first fin group 32. The second fin group 34 extends a plurality of flanges from the bottom thereof to form an annular bottom surface. The bottom surface has a semicircular contacting face in the second groove 342 for contacting the heat pipes 20, and two lower, annular engaging faces at two opposite sides of the second groove 342 for engaging with the engaging faces of the first fin group 32. The engaging faces of the second group 34 face downwardly. In addition, the breached sectors of the first and second fin group 32, 34 are aligned with each other and cooperatively form a breached sector of the heat sink 30.
  • The fan assembly 40 comprises a fan 42 and a mounting plate 44 fixed to a top of the fan 42. The cover 50 comprises an annular frame 52 engaging a periphery of the second fin group 34 and a circular lattice window 54 formed on a top of the frame 52.
  • In assembly of the heat dissipation apparatus, the adiabatic sections 226 of the heat pipes 22 are received in the breached sector of the heat sink 30. The condensation sections 224 of the heat pipes 22 are positioned in the first groove 322 with a lower portion thereof contacting the contacting face of the first fin group 32. The second fin group 34 is positioned on the first fin group 32 with the contacting face thereof thermally contacting an upper portion of the condensation sections 224. The condensation sections 224 of the heat pipes 20 are sandwiched between the first and second fin groups 32, 34 and soldered thereto. Since the condensation sections 224 are received in the channel cooperatively formed by the first and second grooves 322, 342 by simply putting the condensation sections 224 in the first groove 322 and then putting the second fin group 34 on the first fin group 32, the mounting of the condensation sections 224 in the channel will not scrape solder out of the grooves 322, 342. The engaging faces of the second fin group 34 contact and secure with the engaging faces of the first fin group 32 at two sides of the condensation sections 224 of the heat pipes 20 by soldiering. The fan assembly 40 is placed in the concave part 324 of the first fin group 32 and surrounded by the condensation sections 224 of the heat pipes 22. A lower part of the fan 42 is received in the concave part 324 of the first fin group 32 and surrounded by the annular top surface of the first fin group 32. An upper part of the fan 42 is enclosed and surrounded by the second fin group 34. The cover 50 covering the heat sink 30 encloses the second fin group 34 and the condensation sections 224 of the heat pipes 22 therein. The mounting plate 44 of the fan assembly 40 engages the lattice window 54 of the cover 50 to securely suspend the fan 42 in the heat sink 30.
  • During operation of the heat dissipation apparatus, the base 10 absorbs heat from the heat generating electronic component, which is transferred to the heat sink 30 via the heat pipe assembly 20. The fan 42 produces airflow through the heat sink 30, and dissipates the heat from the heat sink 30 into ambient air.
  • In the heat dissipation apparatus, since the heat sink 30 includes the two fin groups 32, 34, the heat pipe assembly 20 can be assembled into the first and second fin groups 32, 34 easily. Thus, the heat dissipation apparatus is conveniently assembled even though the heat pipes 22 are bent to have semicircular condensation sections 224, respectively. In addition, the fan 42 is mounted inside the heat sink 30 and enclosed by the heat sink 30, which makes the airflow produced by the fan 42 flow throughout the first and second fin groups 32, 34. Meanwhile, the heat sink 30 enclosing the fan 42 severs as a part of a housing for accommodating the fan 42, which saves material for constructing the heat dissipation apparatus and enable the heat dissipation apparatus to have a compact structure.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (19)

1. A heat dissipation apparatus, comprising:
a base;
a heat sink comprising a first fin group placed on the base and a second fin group located on the first fin group, each of the first and second fin groups having a circular configuration with a breached sector, the breached sectors being aligned with each other;
two heat pipes each comprising an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section; and
a fan embedded in the heat sink;
wherein the condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan.
2. The heat dissipation apparatus of claim 1, wherein the heat sink defines a concave space in a top thereof for receiving the fan therein.
3. The heat dissipation apparatus of claim 1, wherein the condensation sections of the heat pipes curve away from each other from the adiabatic sections along a periphery direction of the heat sink and join each other at ends thereof distant from the adiabatic sections of the heat pipes to thereby form a circle surrounding the fan.
4. The heat dissipation apparatus of claim 1, wherein the first fin group defines a concave part in a central part thereof for receiving the fan and an annular top face surrounding the fan.
5. The heat dissipation apparatus of claim 4, wherein the first fin group defines a through hole in a center of a bottom the concave part for allowing airflow generated by the fan to flow downwardly therethrough and comprises a plurality of first fins extending outwardly from the through hole along a radial direction.
6. The heat dissipation apparatus of claim 5, wherein the second fin group surrounding the fan is a ring-shaped and has an annular bottom face engaging the annular top face of the first fin group.
7. The heat dissipation apparatus of claim 6, wherein two curving grooves are respectively defined in the annular top face of the first fin group and the annular bottom face of the second fin group, the condensation sections of the heat pipes being received in the grooves.
8. The heat dissipation apparatus of claim 7, wherein the second fin group comprises a plurality of second fins arranged in a radial direction, the annular top face of the first fin group and the annular bottom face of the second fin group are formed by a plurality of flanges extending perpendicularly from upper ends of the first fins and lower ends of the second fins.
9. The heat dissipation apparatus of claim 1, wherein the two adiabatic sections of the two heat pipes are received in the breached sectors.
10. The heat dissipation apparatus of claim 9, wherein the breached sector of the second fin cooperates with the breached sector of the first fin group to form a breached sector of the heat sink.
11. The heat dissipation apparatus of claim 1, further comprising a cover mounted on a top of the heat sink, a top of the fan being engaged with a bottom of the cover to suspend the fan inside the heat sink.
12. The heat dissipation apparatus of claim 11, wherein the cover comprises an annular frame engaging with an periphery of the second fin group and a circular lattice window formed on a top of the frame and engaging the top of the fan.
13. The heat dissipation apparatus of claim 1, wherein the base comprises a first base on which the heat sink is placed and a second plate attached to a bottom of the first plate, and the evaporation sections of the heat pipes are sandwiched between the first and second plates.
14. A heat dissipation apparatus, comprising:
a base;
a heat sink defining a concave space in a top thereof and comprising a first fin group placed on the base and a second fin group located on the first fin group and surrounding the concave space;
two heat pipes each comprising an evaporation section connected to the base, a condensation section sandwich between the first and second fin groups and an adiabatic section interconnecting the evaporation section and the condensation section; and
a fan received in the concave space of the heat sink and surrounded by the condensation sections of the heat pipes.
15. The heat dissipation apparatus of claim 14, wherein the condensation sections of the heat pipes curve away from each other from the adiabatic sections of the heat pipes along a periphery direction of the heat sink and join each other at ends distant from the adiabatic sections of the heat pipes to thereby form a circle surrounding the fan.
16. The heat dissipation apparatus of claim 14, wherein the first fin group defines an annular top face surrounding the fan.
17. The heat dissipation apparatus of claim 16, wherein the second fin group surrounding the fan is a ring-shaped and has an annular bottom face engaged with the annular top face of the first fin group.
18. The heat dissipation apparatus of claim 17, wherein two curving grooves are respectively defined in the annular top face of the first fin group and the annular bottom face of the second fin group and cooperate with each other to form a circular channel receiving the condensation sections of the heat pipes therein.
19. The heat dissipation apparatus of claim 14, further comprising a lattice window covers a top of the second fin group and is connected to a top of the fan to suspend the fan in the concave space of the heat sink.
US12/423,816 2008-12-22 2009-04-15 Heat dissipation apparatus having heat pipes inserted therein Abandoned US20100155023A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810306445.7A CN101765351B (en) 2008-12-22 2008-12-22 Heat-dissipation device
CN200810306445.7 2008-12-22

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100097763A1 (en) * 2008-10-20 2010-04-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110024090A1 (en) * 2009-08-03 2011-02-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110083830A1 (en) * 2009-10-12 2011-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20120055653A1 (en) * 2010-09-03 2012-03-08 Wistron Corporation Heat Dissipating Unit And Heat Dissipating Device Having The Heat Dissipating Unit
JP2019217596A (en) * 2018-06-20 2019-12-26 株式会社マキタ Electric power tool and portable circular saw
US10875170B2 (en) 2017-09-13 2020-12-29 Makita Corporation Electric power tool
US11219957B2 (en) 2018-06-20 2022-01-11 Makita Corporation Controller and power tool including the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102819302A (en) * 2011-06-09 2012-12-12 富准精密工业(深圳)有限公司 Radiator
CN106211704B (en) * 2015-05-08 2020-01-03 技嘉科技股份有限公司 Combined heat radiation module

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020017378A1 (en) * 2000-08-09 2002-02-14 Hu Chin Yi Heat ventilation device
US20020162647A1 (en) * 2001-05-01 2002-11-07 Wagner Guy R. Heat sink device manufacture
US6698499B1 (en) * 1996-02-01 2004-03-02 Agilent Technologies, Inc. Cooling device and method
US6874565B2 (en) * 2001-12-03 2005-04-05 Agilent Technologies, Inc. Cooling apparatus
US6988536B2 (en) * 2003-04-23 2006-01-24 Hon Hai Precision Ind. Co., Ltd Tubular heat dissipation device
US7063130B2 (en) * 2003-08-08 2006-06-20 Chu-Tsai Huang Circular heat sink assembly
US20060185821A1 (en) * 2005-02-24 2006-08-24 Comp Take Technology Co., Ltd. Thermal dissipation device
US7147045B2 (en) * 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US7163050B2 (en) * 2004-09-17 2007-01-16 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US7164582B2 (en) * 2004-10-29 2007-01-16 Hewlett-Packard Development Company, L.P. Cooling system with submerged fan
US7296619B2 (en) * 2004-10-21 2007-11-20 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with heat spreader
US7296617B2 (en) * 2004-09-15 2007-11-20 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat sink
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
US20080210404A1 (en) * 2007-03-01 2008-09-04 Peng Ji-Ping Cooling device with ringed fins
US20080310105A1 (en) * 2007-06-14 2008-12-18 Chia-Chun Cheng Heat dissipating apparatus and water cooling system having the same
US20090242176A1 (en) * 2008-03-27 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US7885072B2 (en) * 2008-10-20 2011-02-08 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Fixing device for heat sink

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2762348Y (en) * 2004-12-31 2006-03-01 协禧电机股份有限公司 Heat sink
CN101212884B (en) * 2006-12-27 2011-06-08 富准精密工业(深圳)有限公司 Heat radiator
CN201018750Y (en) * 2007-03-14 2008-02-06 讯凯国际股份有限公司 Fin annular-arranged heat radiator
CN101316495B (en) * 2007-06-01 2011-12-21 富准精密工业(深圳)有限公司 Heat sink assembly

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6698499B1 (en) * 1996-02-01 2004-03-02 Agilent Technologies, Inc. Cooling device and method
US7147045B2 (en) * 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US20020017378A1 (en) * 2000-08-09 2002-02-14 Hu Chin Yi Heat ventilation device
US20020162647A1 (en) * 2001-05-01 2002-11-07 Wagner Guy R. Heat sink device manufacture
US6874565B2 (en) * 2001-12-03 2005-04-05 Agilent Technologies, Inc. Cooling apparatus
US6988536B2 (en) * 2003-04-23 2006-01-24 Hon Hai Precision Ind. Co., Ltd Tubular heat dissipation device
US7063130B2 (en) * 2003-08-08 2006-06-20 Chu-Tsai Huang Circular heat sink assembly
US7296617B2 (en) * 2004-09-15 2007-11-20 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat sink
US7163050B2 (en) * 2004-09-17 2007-01-16 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US7296619B2 (en) * 2004-10-21 2007-11-20 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with heat spreader
US7164582B2 (en) * 2004-10-29 2007-01-16 Hewlett-Packard Development Company, L.P. Cooling system with submerged fan
US20060185821A1 (en) * 2005-02-24 2006-08-24 Comp Take Technology Co., Ltd. Thermal dissipation device
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
US20080210404A1 (en) * 2007-03-01 2008-09-04 Peng Ji-Ping Cooling device with ringed fins
US20080310105A1 (en) * 2007-06-14 2008-12-18 Chia-Chun Cheng Heat dissipating apparatus and water cooling system having the same
US20090242176A1 (en) * 2008-03-27 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US7885072B2 (en) * 2008-10-20 2011-02-08 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Fixing device for heat sink

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100097763A1 (en) * 2008-10-20 2010-04-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7916469B2 (en) * 2008-10-20 2011-03-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110024090A1 (en) * 2009-08-03 2011-02-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8579019B2 (en) * 2009-08-03 2013-11-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110083830A1 (en) * 2009-10-12 2011-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8430153B2 (en) * 2009-10-12 2013-04-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having heat sink enclosing conductive member therein
US20120055653A1 (en) * 2010-09-03 2012-03-08 Wistron Corporation Heat Dissipating Unit And Heat Dissipating Device Having The Heat Dissipating Unit
US10875170B2 (en) 2017-09-13 2020-12-29 Makita Corporation Electric power tool
JP2019217596A (en) * 2018-06-20 2019-12-26 株式会社マキタ Electric power tool and portable circular saw
US11219957B2 (en) 2018-06-20 2022-01-11 Makita Corporation Controller and power tool including the same
JP7066542B2 (en) 2018-06-20 2022-05-13 株式会社マキタ Power tools and portable circular saws

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