CN101588889A - 无铅焊锡合金 - Google Patents

无铅焊锡合金 Download PDF

Info

Publication number: CN101588889A
Authority: CN; China
Prior art keywords: sample surfaces; experiment; free solder; find; solder alloy
Prior art date: 2006-12-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CNA200780047594XA

Other languages

English (en)

Chinese (zh)

Inventor

李东宁

金相范

姜奎植

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Iljin Copper Foil Corp

Original Assignee

Iljin Copper Foil Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-12-29

Filing date

2007-12-28

Publication date

2009-11-25

2007-12-28 Application filed by Iljin Copper Foil Corp filed Critical Iljin Copper Foil Corp

2009-11-25 Publication of CN101588889A publication Critical patent/CN101588889A/zh

Status Pending legal-status Critical Current

Links

229910045601 alloy Inorganic materials 0.000 title claims abstract description 85
239000000956 alloy Substances 0.000 title claims abstract description 85
229910000679 solder Inorganic materials 0.000 title claims abstract description 71
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 28
229910052790 beryllium Inorganic materials 0.000 claims abstract description 12
229910052796 boron Inorganic materials 0.000 claims abstract description 11
ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 6
ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims abstract description 6
239000000203 mixture Substances 0.000 claims description 57
239000010949 copper Substances 0.000 claims description 44
229910052718 tin Inorganic materials 0.000 claims description 31
239000012535 impurity Substances 0.000 claims description 20
229910052802 copper Inorganic materials 0.000 claims description 9
229910052709 silver Inorganic materials 0.000 claims description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
239000004332 silver Substances 0.000 claims description 4
239000000523 sample Substances 0.000 description 162
238000002474 experimental method Methods 0.000 description 126
230000035939 shock Effects 0.000 description 53
230000002706 hydrostatic effect Effects 0.000 description 51
230000000052 comparative effect Effects 0.000 description 30
229910001385 heavy metal Inorganic materials 0.000 description 21
238000005476 soldering Methods 0.000 description 16
238000002360 preparation method Methods 0.000 description 15
238000003723 Smelting Methods 0.000 description 9
239000006101 laboratory sample Substances 0.000 description 9
239000000463 material Substances 0.000 description 9
239000013078 crystal Substances 0.000 description 8
229910017944 Ag—Cu Inorganic materials 0.000 description 6
PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
229910020220 Pb—Sn Inorganic materials 0.000 description 5
229910020888 Sn-Cu Inorganic materials 0.000 description 5
229910019204 Sn—Cu Inorganic materials 0.000 description 5
229910000881 Cu alloy Inorganic materials 0.000 description 4
150000001875 compounds Chemical class 0.000 description 4
239000000155 melt Substances 0.000 description 4
229910052751 metal Inorganic materials 0.000 description 4
239000002184 metal Substances 0.000 description 4
229910052759 nickel Inorganic materials 0.000 description 4
229910052698 phosphorus Inorganic materials 0.000 description 4
238000003466 welding Methods 0.000 description 4
229910017770 Cu—Ag Inorganic materials 0.000 description 3
XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
230000006835 compression Effects 0.000 description 3
238000007906 compression Methods 0.000 description 3
238000009792 diffusion process Methods 0.000 description 3
230000000694 effects Effects 0.000 description 3
229910000765 intermetallic Inorganic materials 0.000 description 3
229910020836 Sn-Ag Inorganic materials 0.000 description 2
229910020988 Sn—Ag Inorganic materials 0.000 description 2
239000006071 cream Substances 0.000 description 2
238000005538 encapsulation Methods 0.000 description 2
229920001296 polysiloxane Polymers 0.000 description 2
239000000843 powder Substances 0.000 description 2
239000000758 substrate Substances 0.000 description 2
229910018471 Cu6Sn5 Inorganic materials 0.000 description 1
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
229910020830 Sn-Bi Inorganic materials 0.000 description 1
229910020994 Sn-Zn Inorganic materials 0.000 description 1
229910018728 Sn—Bi Inorganic materials 0.000 description 1
229910009069 Sn—Zn Inorganic materials 0.000 description 1
238000003491 array Methods 0.000 description 1
238000005266 casting Methods 0.000 description 1
229910052804 chromium Inorganic materials 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
229910017052 cobalt Inorganic materials 0.000 description 1
239000010941 cobalt Substances 0.000 description 1
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
229910001325 element alloy Inorganic materials 0.000 description 1
230000005496 eutectics Effects 0.000 description 1
239000005350 fused silica glass Substances 0.000 description 1
229910052733 gallium Inorganic materials 0.000 description 1
229910052732 germanium Inorganic materials 0.000 description 1
229910052738 indium Inorganic materials 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
230000013011 mating Effects 0.000 description 1
230000008018 melting Effects 0.000 description 1
238000002844 melting Methods 0.000 description 1
238000000034 method Methods 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
239000011574 phosphorus Substances 0.000 description 1
238000005498 polishing Methods 0.000 description 1
229920006395 saturated elastomer Polymers 0.000 description 1
238000010025 steaming Methods 0.000 description 1
229910052725 zinc Inorganic materials 0.000 description 1

Images

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Manufacture Of Alloys Or Alloy Compounds (AREA)

CNA200780047594XA 2006-12-29 2007-12-28 无铅焊锡合金 Pending CN101588889A (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
KR20060138548		2006-12-29
KR1020060138548		2006-12-29
KR1020070139767		2007-12-28

Publications (1)

Publication Number	Publication Date
CN101588889A true CN101588889A (zh)	2009-11-25

Family

ID=39815104

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CNA200780047594XA Pending CN101588889A (zh)	2006-12-29	2007-12-28	无铅焊锡合金

Country Status (7)

Country	Link
US (1)	US20100092335A1 (ko)
EP (1)	EP2101951A4 (ko)
JP (1)	JP5210323B2 (ko)
KR (2)	KR101042031B1 (ko)
CN (1)	CN101588889A (ko)
TW (1)	TWI366497B (ko)
WO (1)	WO2008082191A1 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103056543A (zh) *	2013-01-18	2013-04-24	江苏师范大学	一种含Yb、Al、B的纳米无铅钎料
CN105149809A (zh) *	2015-10-10	2015-12-16	南京青锐风新材料科技有限公司	一种适用于SnAgCu或SnCu焊料的抗氧化剂及其制备方法
CN105834611A (zh) *	2016-05-04	2016-08-10	中南大学	一种适用于电子封装的高电导高可靠性Ce-Sn-Ag-Cu焊料
CN105834612A (zh) *	2016-05-04	2016-08-10	中南大学	一种适用于电子封装的高尺寸稳定性Sn-Ag-Cu焊料
CN107877031A (zh) *	2017-11-27	2018-04-06	东莞市千岛金属锡品有限公司	一种无铅低温焊料及其制备方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR101042031B1 (ko)	2006-12-29	2011-06-16	일진머티리얼즈 주식회사	무연 솔더 합금
JP5245568B2 (ja) *	2008-06-23	2013-07-24	新日鉄住金マテリアルズ株式会社	無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
KR20240060350A (ko)	2022-10-28	2024-05-08	(주)에버텍엔터프라이즈	소결접합용 은 페이스트 조성물

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2024545A (en) *	1933-10-04	1935-12-17	L D Caulk Company	Dental alloy
US3827884A (en) *	1970-07-15	1974-08-06	Daido Metal Co	Tin based white metal bearing alloys producing good bond with backing material
GB2201545B (en) *	1987-01-30	1991-09-11	Tanaka Electronics Ind	Method for connecting semiconductor material
JP2778171B2 (ja) *	1990-01-10	1998-07-23	三菱マテリアル株式会社	半導体装置組み立て用Ｐｂ合金はんだ材
JP3226213B2 (ja) *	1996-10-17	2001-11-05	松下電器産業株式会社	半田材料及びそれを用いた電子部品
US5837191A (en) *	1996-10-22	1998-11-17	Johnson Manufacturing Company	Lead-free solder
JP3306007B2 (ja) *	1998-06-30	2002-07-24	株式会社東芝	ハンダ材
JP3833829B2 (ja) *	1998-07-07	2006-10-18	内橋エステック株式会社	はんだ合金及び電子部品の実装方法
JP2002248596A (ja) *	2001-02-27	2002-09-03	Toshiba Tungaloy Co Ltd	耐酸化性に優れる鉛レス半田ボール
KR100698662B1 (ko) *	2003-12-02	2007-03-23	에프씨엠 가부시끼가이샤	주석-은-구리 3원합금으로 이루어지는 표면을 형성한단자, 그것을 갖는 부품 및 제품
JP2005288544A (ja) *	2004-03-09	2005-10-20	Toshiba Corp	無鉛はんだ、はんだ付け方法および電子部品
JP2005288478A (ja) *	2004-03-31	2005-10-20	Toshiba Corp	無鉛はんだ接合部
JP2005319470A (ja) *	2004-05-06	2005-11-17	Katsuaki Suganuma	鉛フリーはんだ材料、電子回路基板およびそれらの製造方法
JP4471825B2 (ja) *	2004-12-09	2010-06-02	日本電波工業株式会社	電子部品、及び電子部品の製造方法
JP4471824B2 (ja) *	2004-12-09	2010-06-02	日本電波工業株式会社	高温はんだ及びクリームはんだ
JP4617485B2 (ja) *	2004-12-13	2011-01-26	ナノジョイン株式会社	はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ
JP2008030047A (ja) *	2006-07-26	2008-02-14	Eishin Kogyo Kk	無鉛ハンダ
KR101042031B1 (ko)	2006-12-29	2011-06-16	일진머티리얼즈 주식회사	무연 솔더 합금

2007
- 2007-12-28 KR KR1020070139767A patent/KR101042031B1/ko active IP Right Grant
- 2007-12-28 JP JP2009543954A patent/JP5210323B2/ja active Active
- 2007-12-28 WO PCT/KR2007/006951 patent/WO2008082191A1/en active Application Filing
- 2007-12-28 US US12/521,655 patent/US20100092335A1/en not_active Abandoned
- 2007-12-28 CN CNA200780047594XA patent/CN101588889A/zh active Pending
- 2007-12-28 EP EP07860735A patent/EP2101951A4/en not_active Withdrawn
2008
- 2008-06-26 TW TW097123948A patent/TWI366497B/zh active
2010
- 2010-11-22 KR KR1020100116460A patent/KR101165426B1/ko active IP Right Grant

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103056543A (zh) *	2013-01-18	2013-04-24	江苏师范大学	一种含Yb、Al、B的纳米无铅钎料
CN103056543B (zh) *	2013-01-18	2015-03-25	江苏师范大学	一种含Yb、Al、B的纳米无铅钎料
CN105149809A (zh) *	2015-10-10	2015-12-16	南京青锐风新材料科技有限公司	一种适用于SnAgCu或SnCu焊料的抗氧化剂及其制备方法
CN105834611A (zh) *	2016-05-04	2016-08-10	中南大学	一种适用于电子封装的高电导高可靠性Ce-Sn-Ag-Cu焊料
CN105834612A (zh) *	2016-05-04	2016-08-10	中南大学	一种适用于电子封装的高尺寸稳定性Sn-Ag-Cu焊料
CN105834612B (zh) *	2016-05-04	2018-02-23	中南大学	一种适用于电子封装的高尺寸稳定性Sn‑Ag‑Cu焊料
CN107877031A (zh) *	2017-11-27	2018-04-06	东莞市千岛金属锡品有限公司	一种无铅低温焊料及其制备方法

Also Published As

Publication number	Publication date
KR20100132470A (ko)	2010-12-17
JP5210323B2 (ja)	2013-06-12
TWI366497B (en)	2012-06-21
EP2101951A1 (en)	2009-09-23
JP2010514931A (ja)	2010-05-06
US20100092335A1 (en)	2010-04-15
TW200927358A (en)	2009-07-01
EP2101951A4 (en)	2010-01-27
KR101042031B1 (ko)	2011-06-16
WO2008082191A1 (en)	2008-07-10
KR20080063176A (ko)	2008-07-03
KR101165426B1 (ko)	2012-07-12

Legal Events

Date	Code	Title	Description
2009-11-25	C06	Publication
2009-11-25	PB01	Publication
2010-01-20	C10	Entry into substantive examination
2010-01-20	SE01	Entry into force of request for substantive examination
2014-01-01	C12	Rejection of a patent application after its publication
2014-01-01	RJ01	Rejection of invention patent application after publication	Application publication date: 20091125

Publication	Publication Date	Title
JP6912519B2 (ja)	2021-08-04	はんだ組成物
JP4787384B1 (ja)	2011-10-05	低銀はんだ合金およびはんだペースト組成物
CN101588889A (zh)	2009-11-25	无铅焊锡合金
EP2868424B1 (en)	2017-05-03	Solder alloy, solder paste, and electronic circuit board
US9221132B2 (en)	2015-12-29	Solder alloy, solder paste, and electronic circuit board
CN102066042B (zh)	2016-03-23	无铅焊料
CN105195915A (zh)	2015-12-30	一种低温无铅焊料合金
JP4770733B2 (ja)	2011-09-14	はんだ及びそれを使用した実装品
US20070172381A1 (en)	2007-07-26	Lead-free solder with low copper dissolution
CN101356293B (zh)	2010-12-29	低铜溶解的无铅焊料
WO2006122240A2 (en)	2006-11-16	Tin alloy solder compositions
KR102242388B1 (ko)	2021-04-19	땜납 합금, 땜납 접합 재료 및 전자회로 기판
JP4135268B2 (ja)	2008-08-20	無鉛はんだ合金
CN116689901A (zh)	2023-09-05	钎焊接合方法和钎焊接头
CN108723635B (zh)	2021-03-19	焊料组成合金及锡球
US20100059576A1 (en)	2010-03-11	Tin alloy solder composition
US10960496B2 (en)	2021-03-30	Solder alloy and package structure using same
KR101142814B1 (ko)	2012-05-08	저은 땜납 합금 및 땜납 페이스트 조성물
CN113385853A (zh)	2021-09-14	一种低银高可靠无铅软钎料及其制备方法、应用
KR20050094535A (ko)	2005-09-28	저온계 무연합금
CN1262638A (zh)	2000-08-09	无铅软钎焊料合金
CN100366376C (zh)	2008-02-06	含铈的Sn-Cu-Ni钎料
WO2021187271A1 (ja)	2021-09-23	はんだ合金、はんだボールおよびはんだ継手
CN117754178A (zh)	2024-03-26	SnBi系无铅焊料及其制备方法和用途
CN103753047A (zh)	2014-04-30	一种无铅钎料