CN101588675B - 柔性印刷线路及其制造方法 - Google Patents

柔性印刷线路及其制造方法 Download PDF

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CN101588675B
CN101588675B CN2008103017634A CN200810301763A CN101588675B CN 101588675 B CN101588675 B CN 101588675B CN 2008103017634 A CN2008103017634 A CN 2008103017634A CN 200810301763 A CN200810301763 A CN 200810301763A CN 101588675 B CN101588675 B CN 101588675B
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flexible printed
printed wiring
connector
belt body
link
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CN101588675A (zh
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林宏达
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Shenzhen Futaihong Precision Industry Co Ltd
Chi Mei Communication Systems Inc
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Shenzhen Futaihong Precision Industry Co Ltd
Chi Mei Communication Systems Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本发明提供一种柔性印刷线路，其包括一主体及至少一接地层，该主体包括一第一连接端、一带体部及一第二连接端。所述第一连接端与第二连接端分别位于该带体部的两端，且所述第一连接端及第二连接端上分别设置有一第一连接器及一第二连接器。该带体部内预设有包括接地线路的若干层线路，所述第一连接器及第二连接器通过设置于带体部内部的线路相互电性连接。所述带体部上贯通开设有若干通路孔，所述接地层布设于所述主体的至少一表面上；该接地层通过所述通路孔与带体部内的接地线路电性连接。本发明还涉及一种柔性印刷线路的制造方法。

Description

柔性印刷线路及其制造方法
技术领域
本发明涉及一种柔性印刷线路，尤其涉及一种可增加接地接触方式的柔性印刷线路及其制造方法。
背景技术
柔性印刷线路(flexible printed circuit，FPC)由于其重量轻、厚度薄、便于折叠后立体组装以及可承受多次动态绕曲等特点，广泛运用于移动电话、个人数字助理(personal digital assistant，PDA)等各类电子装置中。
随着电子装置的体积逐渐缩小，使得其内用于装设各电子元器件的空间越来越有限，而电子装置的功能却变得越来越多，从而必然使得装设于电子装置内的各电子元器件变得越来越集成化。在电子装置工作时，装设于该电子装置内的各电子元器件及电路经常会产生静电放电(electro static discharge，E SD)。如果这些产生的静电放电得不到有效的释放和接地处理，将会使各电子元器件之间互相干扰、损伤，严重影响到电子装置的正常运行或缩短、损坏各电子元器件的使用寿命。为避免静电放电对电子装置内各电子元器件造成损坏，传统的处理方法是将产生的静电通过一预设的接地装置进行接地处理，例如：将所述产生的静电通过所述柔性印刷线路引入电路板，然后接地处理。
但是，受限于柔性印刷线路两端的连接器的尺寸限制，该柔性印刷线路无法提供较多的接地针脚(grounding pin)，即，该柔性印刷线路无法提供较大面积的接地接触，以使各电子元器件及电路中产生的静电放电通过柔性印刷线路快速、完全地接地处理。
发明内容
有鉴于此，有必要提供一种可有效增加接地接触面积的柔性印刷线路。
还有必要提供一种制造所述柔性印刷线路的方法。
一种柔性印刷线路，其包括一主体，该主体包括一第一连接端、一带体部及一第二连接端；所述第一连接端与第二连接端分别位于该带体部的两端，且所述第一连接端及第二连接端上分别设置有一第一连接器及一第二连接器；该带体部内预设有包括接地线路的若干层线路，所述第一连接器及第二连接器通过设置于带体部内部的线路相互电性连接；所述带体部上贯通开设有若干通路孔，所述柔性印刷线路还包括至少一接地层，其布设于所述主体的至少一表面上；该接地层通过所述通路孔与带体部内的接地线路电性连接。
一种柔性印刷线路的制造方法，其包括以下步骤：
提供一传统的柔性印刷线路；该传统的柔性印刷线路包括一第一连接端、一带体部及一第二连接端；所述第一连接端与第二连接端分别位于该带体部的纵向延伸的相对的两端；
在所述传统的柔性印刷线路的带体部上贯通开设若干通路孔；
在所述带体部的至少一表面上布设一接地层，所述接地层通过所述通路孔与带体部内的接地线路电性连接。
相较于现有技术，本发明所述柔性印刷线路通过在传统的普通柔性印刷线路板上布设一接地层，从而使得所述柔性印刷线路板具有较大面积的接地面，具有较高的静电放电能力。所述柔性印刷线路装设于电子装置内时，其可有效地疏导静电放电路径，以避免静电放电对电子装置中各电子元器件造成损伤。
附图说明
图1为本发明柔性印刷线路较佳实施例的立体示意图。
具体实施方式
请参阅图1，所述柔性印刷线路100呈条形带状，其包括一主体10及至少一接地层30。所述主体10为一传统的柔性印刷线路板，其包括一第一连接端11、一带体部12及一第二连接端13。所述第一连接端11与第二连接端13分别位于该带体部12的纵向延伸的相对的两端，且所述第一连接端11及第二连接端13上分别设置有一第一连接器112及一第二连接器132。所述带体部12上贯通开设有若干通路孔(via hole)(图未示)，该带体部12内预设有若干层线路(图未示)。其中，所述若干层线路中包括有接地线路，所述第一连接器112及第二连接器132通过设置于带体部12内部的若干层线路相互电性连接。
所述接地层30呈条性带状，其由导电性材质如铜制成并布设于所述主体10的至少一表面上。所述接地层30通过所述带体部12上贯通开设的若干通路孔与该带体部12内的接地线路电性导通。在本实施例中，所述接地层30布设于所述主体10的设有第一连接器112及第二连接器132的表面上。所述接地层30包括一贴合部31、一第一延伸部32及一第二延伸部33，所述贴合部31大致呈矩形条状，其贴附于所述柔性印刷线路100的主体10的设有第一连接器112及第二连接器132一侧的表面上，所述第一连接器112及第二连接器132穿过所述贴合部31，并露出于所述贴合部31。所述第一延伸部32及第二延伸部33分别由所述贴合层31的两端靠近所述第一连接器112及第二连接器132位置处向外延伸弯折形成，以进一步增大所述接地层30的接地面积。
可以理解，所述接地层30也不限于本实施例中所述的条形带状，其也可以是若干布设于所述柔性印刷线路100的主体10的表面上的接地点或由所述主体10周侧延伸弯折形成的柔性接地带。
可以理解，所述第一延伸部32及第二延伸部33的数量也可以根据实际需要增加或减少，其形状也不限于图中所述的形状，其也可以根据实际需要设计成各种图案状。
制造所述柔性印刷线路100时，包括以下步骤：
首先，提供一传统的柔性印刷线路(即主体10)；该传统的柔性印刷线路包括一第一连接端11、一带体部12及一第二连接端13；所述第一连接端11与第二连接端13分别位于该带体部12的纵向延伸的相对的两端，且所述第一连接端11及第二连接端13上分别设置有一第一连接器112及一第二连接器132；
接下来，在所述传统的柔性印刷线路的带体部12上贯通开设若干通路孔；
最后，在所述带体部12的至少一表面上布设一接地层30，所述接地层30通过所述通路孔与带体部12内的接地线路电性连接。
可以理解，所述接地层30可以为一涂敷于所述带体部12表面上的铜层。
所述柔性印刷线路100通过在传统的普通柔性印刷线路板(即主体10)上布设一接地层30，从而使得所述柔性印刷线路100具有较大面积的接地面，具有较高的静电放电能力。所述柔性印刷线路100装设于电子装置内时，其可有效地疏导静电放电路径，以避免静电放电对电子装置中各电子元器件造成损伤。
另外，本领域技术人员还可在本发明权利要求公开的范围和精神内做其他形式和细节上的各种修改、添加和替换。当然，这些依据本发明精神所做的各种修改、添加和替换等变化，都应包含在本发明所要求保护的范围之内。

Claims (10)

1.一种柔性印刷线路，其包括一主体，该主体包括一第一连接端、一带体部及一第二连接端；所述第一连接端与第二连接端分别位于该带体部的两端，且所述第一连接端及第二连接端上分别设置有一第一连接器及一第二连接器；该带体部内预设有包括接地线路的若干层线路，所述第一连接器及第二连接器通过设置于带体部内部的线路相互电性连接；其特征在于：所述带体部上贯通开设有若干通路孔，所述柔性印刷线路还包括至少一接地层，其布设于所述主体的至少一表面上；该接地层通过所述通路孔与带体部内的接地线路电性连接。
2.如权利要求1所述的柔性印刷线路，其特征在于：所述接地层包括一贴合部及至少一延伸部，所述贴合部贴附于所述柔性印刷线路的主体的表面上，所述延伸部由所述贴合层的一侧向外延伸弯折形成。
3.如权利要求2所述的柔性印刷线路，其特征在于：所述贴合部呈矩形条状，其贴附于所述主体的设有第一连接器及第二连接器一侧的表面上；所述第一连接器及第二连接器穿过所述贴合部，并露出于所述贴合部。
4.如权利要求2所述的柔性印刷线路，其特征在于：所述延伸部包括一第一延伸部及一第二延伸部，所述第一延伸部及第二延伸部分别由所述贴合层的两端靠近第一连接器及第二连接器位置处向外延伸弯折形成。
5.如权利要求1所述的柔性印刷线路，其特征在于：所述接地层为若干布设于主体表面上的接地点。
6.如权利要求1所述的柔性印刷线路，其特征在于：所述接地层由导电性材质制成。
7.一种柔性印刷线路的制造方法，其特征在于：其包括以下步骤：
提供一传统的柔性印刷线路；该传统的柔性印刷线路包括一第一连接端、一带体部及一第二连接端；所述第一连接端与第二连接端分别位于该带体部的纵向延伸的相对的两端；
在所述传统的柔性印刷线路的带体部上贯通开设若干通路孔；
在所述带体部的至少一表面上布设一接地层，所述接地层通过所述通路孔与带体部内的接地线路电性连接。
8.如权利要求7所述的柔性印刷线路的制造方法，其特征在于：所述接地层为一涂敷于所述带体部表面上的铜层。
9.如权利要求7所述的柔性印刷线路的制造方法，其特征在于：所述接地层包括一贴合部及至少一延伸部，所述贴合部贴附于所述柔性印刷线路的主体的表面上，所述延伸部由所述贴合层的一侧向外延伸弯折形成。
10.如权利要求9所述的柔性印刷线路的制造方法，其特征在于：所述第一连接端及第二连接端上分别设置有一第一连接器及一第二连接器。
CN2008103017634A 2008-05-23 2008-05-23 柔性印刷线路及其制造方法 Expired - Fee Related CN101588675B (zh)

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US12/199,896 US20090288860A1 (en) 2008-05-23 2008-08-28 Flexible printed circuit and method for making same

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CN106207540B (zh) * 2016-08-03 2019-05-24 京东方科技集团股份有限公司 一种柔性电路板连接器和电子设备
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