CN101584051A - 用于太阳能电池板划线的激光束校准的方法和设备 - Google Patents
用于太阳能电池板划线的激光束校准的方法和设备 Download PDFInfo
- Publication number
- CN101584051A CN101584051A CNA2007800413144A CN200780041314A CN101584051A CN 101584051 A CN101584051 A CN 101584051A CN A2007800413144 A CNA2007800413144 A CN A2007800413144A CN 200780041314 A CN200780041314 A CN 200780041314A CN 101584051 A CN101584051 A CN 101584051A
- Authority
- CN
- China
- Prior art keywords
- cell panel
- optical device
- lines
- device unit
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 68
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000000608 laser ablation Methods 0.000 claims abstract description 3
- 230000003287 optical effect Effects 0.000 claims description 115
- 239000000758 substrate Substances 0.000 description 10
- 238000012937 correction Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000001915 proofreading effect Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 4
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000001788 irregular Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012634 optical imaging Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0622232.7A GB0622232D0 (en) | 2006-11-08 | 2006-11-08 | Method and apparatus for laser beam alignment for solar panel scribing |
GB0622232.7 | 2006-11-08 | ||
PCT/GB2007/004210 WO2008056116A1 (en) | 2006-11-08 | 2007-11-05 | Method and apparatus for laser beam alignment for solar panel scribing |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101584051A true CN101584051A (zh) | 2009-11-18 |
CN101584051B CN101584051B (zh) | 2013-05-01 |
Family
ID=37594528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800413144A Expired - Fee Related CN101584051B (zh) | 2006-11-08 | 2007-11-05 | 用于太阳能电池板划线的激光束校准的方法和设备 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8779326B2 (zh) |
EP (2) | EP2080234B1 (zh) |
JP (1) | JP2010509067A (zh) |
KR (1) | KR101430277B1 (zh) |
CN (1) | CN101584051B (zh) |
GB (1) | GB0622232D0 (zh) |
TW (1) | TWI456780B (zh) |
WO (1) | WO2008056116A1 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102756212A (zh) * | 2011-04-26 | 2012-10-31 | 竑腾科技股份有限公司 | 高精度太阳能玻璃激光划线方法 |
CN102756213A (zh) * | 2011-04-26 | 2012-10-31 | 竑腾科技股份有限公司 | 太阳能玻璃激光划线方法 |
CN102916074A (zh) * | 2011-08-05 | 2013-02-06 | 耶恩光学自动化技术股份有限公司 | 将一施覆的基材作线型构造化以制造薄层太阳电池模块的方法 |
CN103000752A (zh) * | 2011-09-19 | 2013-03-27 | 无锡尚德太阳能电力有限公司 | 薄膜太阳电池划线机及其方法 |
CN103586584A (zh) * | 2012-08-17 | 2014-02-19 | 微劲科技股份有限公司 | 划线设备 |
CN105229446A (zh) * | 2013-03-15 | 2016-01-06 | 伊雷克托科学工业股份有限公司 | 以影像辨识为基础的烧蚀图案位置收回 |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008032555B3 (de) * | 2008-07-10 | 2010-01-21 | Innolas Systems Gmbh | Strukturierungsvorrichtung für die Strukturierung von plattenförmigen Elementen, insbesondere von Dünnschicht-Solarmodulen, entsprechendes Strukturierungsverfahren sowie Verwendung derselben |
DE102008059813A1 (de) | 2008-07-17 | 2010-01-21 | Lss Laser Scribing Systems Ag | Laser-Scribing-System zum Strukturieren von Substraten für Dünnschichtsolarmodule |
US8633420B2 (en) | 2008-10-10 | 2014-01-21 | Ipg Microsystems Llc | Laser machining systems and methods with debris extraction |
US20100294746A1 (en) * | 2008-11-19 | 2010-11-25 | Applied Materials, Inc. | Laser scribing platform with moving gantry |
DE102008059763A1 (de) * | 2008-12-01 | 2010-06-02 | Lpkf Laser & Electronics Ag | Verfahren zur Laserbearbeitung |
JP2010162586A (ja) * | 2009-01-19 | 2010-07-29 | Toray Eng Co Ltd | レーザ加工方法及びレーザ加工装置 |
CN101811229B (zh) * | 2009-02-19 | 2013-12-25 | 株式会社日立高科技 | 激光加工方法、激光加工装置以及太阳能电池板制造方法 |
JP2010188396A (ja) * | 2009-02-19 | 2010-09-02 | Hitachi High-Technologies Corp | レーザ加工方法、レーザ加工装置及びソーラパネル製造方法 |
JP5328406B2 (ja) * | 2009-02-19 | 2013-10-30 | 株式会社日立ハイテクノロジーズ | レーザ加工方法、レーザ加工装置及びソーラパネル製造方法 |
US8333843B2 (en) | 2009-04-16 | 2012-12-18 | Applied Materials, Inc. | Process to remove metal contamination on a glass substrate |
WO2010144778A2 (en) * | 2009-06-12 | 2010-12-16 | Applied Materials, Inc. | Methods and systems for laser-scribed line alignment |
US20100330711A1 (en) * | 2009-06-26 | 2010-12-30 | Applied Materials, Inc. | Method and apparatus for inspecting scribes in solar modules |
WO2011017569A2 (en) * | 2009-08-06 | 2011-02-10 | Applied Materials, Inc. | Methods and related systems for thin-film laser scribing with enhanced throughput |
WO2011017572A2 (en) * | 2009-08-06 | 2011-02-10 | Applied Materials, Inc. | Laser modules and processes for thin film solar panel laser scribing |
WO2011017570A2 (en) * | 2009-08-06 | 2011-02-10 | Applied Materials, Inc. | In-line metrology methods and systems for solar cell fabrication |
WO2011037787A1 (en) * | 2009-09-24 | 2011-03-31 | Esi-Pyrophotonics Lasers, Inc. | Method and apparatus to scribe a line in a thin film material using a burst of laser pulses with beneficial pulse shape |
US8890025B2 (en) | 2009-09-24 | 2014-11-18 | Esi-Pyrophotonics Lasers Inc. | Method and apparatus to scribe thin film layers of cadmium telluride solar cells |
WO2011043734A1 (en) * | 2009-10-07 | 2011-04-14 | Manufacturing Integration Technology Ltd | Laser scribing of thin-film solar cell panel |
JP5384284B2 (ja) * | 2009-10-09 | 2014-01-08 | 株式会社ディスコ | レーザー加工装置 |
WO2011056900A2 (en) * | 2009-11-03 | 2011-05-12 | Applied Materials, Inc. | Multi-wavelength laser-scribing tool |
JP2011156583A (ja) * | 2010-02-03 | 2011-08-18 | Sharp Corp | 光電変換装置の製造方法および光ビーム照射加工装置 |
KR101140308B1 (ko) * | 2010-04-06 | 2012-05-02 | 주식회사 제우스 | 레이저 패터닝 장치 및 방법 |
GB2483922B (en) * | 2010-09-25 | 2013-11-20 | M Solv Ltd | Method and apparatus for dividing thin film device into separate cells |
TWI519372B (zh) * | 2011-07-19 | 2016-02-01 | 三星鑽石工業股份有限公司 | 雷射加工裝置 |
JP5468046B2 (ja) * | 2011-07-20 | 2014-04-09 | 三星ダイヤモンド工業株式会社 | レーザ加工装置 |
JP5931537B2 (ja) * | 2012-03-28 | 2016-06-08 | 東レエンジニアリング株式会社 | レーザの光軸アライメント方法およびそれを用いたレーザ加工装置 |
TW201414561A (zh) * | 2012-06-20 | 2014-04-16 | Tel Solar Ag | 雷射劃線系統 |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
TWI730945B (zh) | 2014-07-08 | 2021-06-21 | 美商康寧公司 | 用於雷射處理材料的方法與設備 |
WO2016010954A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
US9625180B2 (en) | 2014-10-07 | 2017-04-18 | Kevin King | Solar panel installation tool |
US20160158890A1 (en) * | 2014-12-05 | 2016-06-09 | Solarcity Corporation | Systems and methods for scribing photovoltaic structures |
EP3226797B1 (en) | 2014-12-05 | 2024-03-20 | Convergent Dental, Inc. | Systems for alignment of a laser beam |
US9899546B2 (en) | 2014-12-05 | 2018-02-20 | Tesla, Inc. | Photovoltaic cells with electrodes adapted to house conductive paste |
US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
WO2018081031A1 (en) * | 2016-10-24 | 2018-05-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
JP7219590B2 (ja) * | 2018-10-30 | 2023-02-08 | 浜松ホトニクス株式会社 | レーザ加工装置 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB611718A (en) | 1941-11-27 | 1948-11-03 | Jacques Couelle | Improvements in or relating to moulded tubular elements particularly intended for use in the rapid construction of hutments or other structures |
GB611738A (en) | 1945-12-19 | 1948-11-03 | Benjamin Spalding Smith | Improvements in piezo-electric crystal vibrators |
US3549733A (en) * | 1968-12-04 | 1970-12-22 | Du Pont | Method of producing polymeric printing plates |
US4877939A (en) * | 1987-01-30 | 1989-10-31 | Duley Walter W | Means of enhancing laser processing efficiency of metals |
US4940879A (en) * | 1989-10-11 | 1990-07-10 | F.I.A. Futurologie Industrielle Automation Gmbh | Cutting head for use in a non-contact cutting process |
US5109148A (en) * | 1990-01-26 | 1992-04-28 | Mitsubishi Denki Kabushiki Kaisha | Positioning device for a machining apparatus |
US5801356A (en) | 1995-08-16 | 1998-09-01 | Santa Barbara Research Center | Laser scribing on glass using Nd:YAG laser |
DE69714553T2 (de) * | 1996-04-26 | 2003-04-10 | Servicio Industrial De Marcaje Y Codificacion, S.A. | System und verfahren zur markierung oder perforierung |
JPH10113785A (ja) * | 1996-10-08 | 1998-05-06 | Amada Co Ltd | レーザ加工装置 |
JP3091151B2 (ja) | 1997-01-27 | 2000-09-25 | 三洋電機株式会社 | 集積型光起電力装置の製造方法 |
JPH10303444A (ja) * | 1997-04-25 | 1998-11-13 | Sharp Corp | 太陽電池の製造方法 |
JPH11298017A (ja) * | 1998-04-14 | 1999-10-29 | Kanegafuchi Chem Ind Co Ltd | 集積型薄膜光電変換装置の製造方法 |
SE518454C2 (sv) * | 1999-01-15 | 2002-10-08 | Forskarpatent I Uppsala Ab | Metod för framställning av en elektrokemisk cell samt elektrokemisk cell |
US6562698B2 (en) * | 1999-06-08 | 2003-05-13 | Kulicke & Soffa Investments, Inc. | Dual laser cutting of wafers |
US6455347B1 (en) * | 1999-06-14 | 2002-09-24 | Kaneka Corporation | Method of fabricating thin-film photovoltaic module |
US6300593B1 (en) * | 1999-12-07 | 2001-10-09 | First Solar, Llc | Apparatus and method for laser scribing a coated substrate |
JP4672833B2 (ja) * | 2000-06-22 | 2011-04-20 | 株式会社カネカ | 薄膜のレーザスクライブ用アライメントマークの認識方法及び装置 |
JP4410401B2 (ja) | 2000-08-30 | 2010-02-03 | 株式会社カネカ | 薄膜太陽電池モジュール |
US6559411B2 (en) * | 2001-08-10 | 2003-05-06 | First Solar, Llc | Method and apparatus for laser scribing glass sheet substrate coatings |
US7259321B2 (en) | 2002-01-07 | 2007-08-21 | Bp Corporation North America Inc. | Method of manufacturing thin film photovoltaic modules |
ATE493226T1 (de) * | 2002-03-12 | 2011-01-15 | Hamamatsu Photonics Kk | Verfahren zum schneiden eines bearbeiteten objekts |
US6815636B2 (en) * | 2003-04-09 | 2004-11-09 | 3D Systems, Inc. | Sintering using thermal image feedback |
JP2005081715A (ja) | 2003-09-09 | 2005-03-31 | Sony Corp | レーザ加工装置およびレーザ加工方法 |
US20060012331A1 (en) * | 2004-04-21 | 2006-01-19 | Gillette William J Ii | Storage case with power and charging system |
JP4713100B2 (ja) | 2004-07-29 | 2011-06-29 | 株式会社カネカ | 光電変換装置の製造方法及び光電変換装置 |
GB2439962B (en) | 2006-06-14 | 2008-09-24 | Exitech Ltd | Process and apparatus for laser scribing |
DE102006051556A1 (de) | 2006-11-02 | 2008-05-08 | Manz Automation Ag | Verfahren zum Strukturieren von Solarmodulen und Strukturierungsvorrichtung |
-
2006
- 2006-11-08 GB GBGB0622232.7A patent/GB0622232D0/en active Pending
-
2007
- 2007-11-05 EP EP07848382.3A patent/EP2080234B1/en not_active Not-in-force
- 2007-11-05 KR KR1020097008787A patent/KR101430277B1/ko not_active IP Right Cessation
- 2007-11-05 EP EP10015225A patent/EP2284911A3/en not_active Withdrawn
- 2007-11-05 CN CN2007800413144A patent/CN101584051B/zh not_active Expired - Fee Related
- 2007-11-05 JP JP2009535126A patent/JP2010509067A/ja active Pending
- 2007-11-05 WO PCT/GB2007/004210 patent/WO2008056116A1/en active Application Filing
- 2007-11-05 US US12/513,770 patent/US8779326B2/en not_active Expired - Fee Related
- 2007-11-07 TW TW096142002A patent/TWI456780B/zh not_active IP Right Cessation
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102756212A (zh) * | 2011-04-26 | 2012-10-31 | 竑腾科技股份有限公司 | 高精度太阳能玻璃激光划线方法 |
CN102756213A (zh) * | 2011-04-26 | 2012-10-31 | 竑腾科技股份有限公司 | 太阳能玻璃激光划线方法 |
CN102916074A (zh) * | 2011-08-05 | 2013-02-06 | 耶恩光学自动化技术股份有限公司 | 将一施覆的基材作线型构造化以制造薄层太阳电池模块的方法 |
CN102916074B (zh) * | 2011-08-05 | 2016-07-06 | 耶恩光学自动化技术股份有限公司 | 将一施覆的基材作线型构造化以制造薄层太阳电池模块的方法 |
CN103000752A (zh) * | 2011-09-19 | 2013-03-27 | 无锡尚德太阳能电力有限公司 | 薄膜太阳电池划线机及其方法 |
CN103586584A (zh) * | 2012-08-17 | 2014-02-19 | 微劲科技股份有限公司 | 划线设备 |
CN105229446A (zh) * | 2013-03-15 | 2016-01-06 | 伊雷克托科学工业股份有限公司 | 以影像辨识为基础的烧蚀图案位置收回 |
CN105229446B (zh) * | 2013-03-15 | 2017-10-10 | 伊雷克托科学工业股份有限公司 | 以影像辨识为基础的烧蚀图案位置收回 |
US10026195B2 (en) | 2013-03-15 | 2018-07-17 | Elemental Scientific Lasers, Llc | Image recognition base ablation pattern position recall |
Also Published As
Publication number | Publication date |
---|---|
GB0622232D0 (en) | 2006-12-20 |
CN101584051B (zh) | 2013-05-01 |
TW200849631A (en) | 2008-12-16 |
EP2080234B1 (en) | 2014-09-17 |
TWI456780B (zh) | 2014-10-11 |
EP2284911A3 (en) | 2011-11-02 |
JP2010509067A (ja) | 2010-03-25 |
WO2008056116A1 (en) | 2008-05-15 |
EP2284911A2 (en) | 2011-02-16 |
EP2080234A1 (en) | 2009-07-22 |
KR20090086527A (ko) | 2009-08-13 |
US8779326B2 (en) | 2014-07-15 |
KR101430277B1 (ko) | 2014-08-18 |
US20090324903A1 (en) | 2009-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101584051B (zh) | 用于太阳能电池板划线的激光束校准的方法和设备 | |
CN101506999B (zh) | 激光刻印处理 | |
TWI448809B (zh) | 雷射處理多重元件平板 | |
CN102245339B (zh) | 具有多重细激光束传输***的激光加工***和方法 | |
US20090321397A1 (en) | Laser-scribing platform | |
US20080012189A1 (en) | System for structuring solar modules | |
US20100252543A1 (en) | Laser-scribing tool architecture | |
CN101990480A (zh) | 激光刻划平台与杂合书写策略 | |
US20110198322A1 (en) | In-line metrology methods and systems for solar cell fabrication | |
US20110139758A1 (en) | Latitudinal iso-line scribe, stitching, and simplified laser and scanner controls | |
US20110132884A1 (en) | Laser modules and processes for thin film solar panel laser scribing | |
US8129658B2 (en) | Systems for thin film laser scribing devices | |
CN102350592A (zh) | 具有可变束斑尺寸的激光处理*** | |
CN107209461B (zh) | 基板处理装置、元件制造***及元件制造方法 | |
JP2004170455A (ja) | レーザ加工装置、レーザ加工システム及び太陽電池 | |
JP2010264461A (ja) | レーザ加工方法、レーザ加工装置及びソーラパネル製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: OERLIKON SOLAR AG (TRUBACH) Free format text: FORMER OWNER: EXITECH LTD. Effective date: 20110309 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: MILTON KEYNES, THE UNITED KINGDOM TO: TRUBACH, SWITZERLAND |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20110309 Address after: Swiss Te Lui Bach Applicant after: Oerlikon Solar IP AG. Truebbach Address before: Milton Keynes Applicant before: Orlici Kangba Ercesi coatings (UK) Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130501 Termination date: 20151105 |
|
EXPY | Termination of patent right or utility model |