TWI456780B - 對準太陽板刻劃之雷射光束之方法與裝置 - Google Patents

對準太陽板刻劃之雷射光束之方法與裝置 Download PDF

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Publication number
TWI456780B
TWI456780B TW096142002A TW96142002A TWI456780B TW I456780 B TWI456780 B TW I456780B TW 096142002 A TW096142002 A TW 096142002A TW 96142002 A TW96142002 A TW 96142002A TW I456780 B TWI456780 B TW I456780B
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Prior art keywords
solar panel
optical unit
alignment detector
detector system
scored
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TW096142002A
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TW200849631A (en
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Philip Rumsby
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Tel Solar Ag
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Photovoltaic Devices (AREA)

Claims (19)

  1. 一種用於精確定位雷射刻劃線條的方法，其特徵在於：處理一材料的頂部薄層，此層覆蓋住一或多個其他下方層，下方層上已有許多被刻劃用於製作太陽板的線條，其係藉由以下所述達成此目的：一光學單元，用於產生一或多道雷射光束以便在太陽板頂層刻劃出一或多道線條；一對準偵測器系統，被附著到光學單元上，其與光學單元之間相隔一段距離，以便偵測器測量下方層內、太陽板中即將在後續時間被劃上刻線的區域內其中一道刻線的位置；一控制與運動系統，自附著於光學單元的對準偵測器系統接收資料，並將該資料用於修正在垂直於刻劃方向上、光學單元相關於太陽板的相對位置，以便使雷射刻劃線得以精確地擺放在相對於已經刻劃在一下方層的刻劃線的位置上；以及一運動系統，以相對於光學單元的方式來移動太陽板，而對準偵測器遵循已經被刻劃在下方層其中一層上一或多條刻劃線的路徑，並測量一道或多道刻線在全部長度方向上的位置，而由光學單元在頂層所作的雷射刻劃則在太陽板上的不同區域內同時進行。
  2. 如申請專利範圍第1項所述之方法，其特徵在於：光學單元與相關的對準偵測器系統將單道光束遞送給太陽板。
  3. 如申請專利範圍第1項所述之方法，其特徵在於：光學單元與相關的對準偵測器系統將多道光束遞送給太陽板。
  4. 如申請專利範圍第1或2項所述之方法，其特徵在於：單一光學單元及相關的對準偵測器系統用於在太陽板上刻劃出一系列的單線條。
  5. 如申請專利範圍第1項所述之方法，其特徵在於：有多部各自擁有自己的對準偵測器系統且各自可在一垂直於刻劃線方向的方向上獨立移動的光學單元用於平行地在太陽板上刻劃出一系列的刻劃線條組。
  6. 如申請專利範圍第1項所述之方法，其特徵在於：光學單元與相關的對準偵測器系統放置在太陽板的披覆側上。
  7. 如申請專利範圍第1項所述之方法，其特徵在於：太陽板的基板材料是不透光材料。
  8. 如申請專利範圍第1項所述之方法，其特徵在於：光學單元與相關的對準偵測器系統放置在太陽板上披覆側的相對側上。
  9. 如申請專利範圍第1項所述之方法，其特徵在於：太陽板的基板材料是透光材料。
  10. 如申請專利範圍第1項所述之方法，其特徵在於：太陽板的基板材料是剛性材料。
  11. 如申請專利範圍第1項所述之方法，其特徵在於：太陽板的基板材料是彈性材料。
  12. 如申請專利範圍第1項所述之方法，其特徵在於：對準偵測器系統由一光學系統所構成，其可在一諸如CCD照相機的一維或二維陣列式偵測器上產生在下方層上一預先刻劃線的影像。
  13. 如申請專利範圍第1項所述之方法，其特徵在於：對準偵測器系統包含用於偵測及測量下方層中預先刻劃線的位置的其他光學方法
  14. 如申請專利範圍第1項所述之方法，其特徵在於：太陽板在一線性平臺之一軸上移動，而光學單元與相關的對準偵測器系統則在一安裝於太陽板之上或之下的正交平臺上獨立移動。
  15. 如申請專利範圍第1項所述之方法，其特徵在於：太陽板在刻劃期間維持固定不動，而光學單元及相關的對準偵測器系統在一安裝在太陽板之上或之下的正交平臺上獨立移動，此平臺安裝在另一將第一平臺沿著太陽板的全部長度移動的平臺上。
  16. 如申請專利範圍第1項所述之方法，其特徵在於：單一光學單元與相關的對準偵測器系統在刻劃期間維持固定不動，且太陽板在兩軸上移動以便覆蓋全部的板區。
  17. 如申請專利範圍第1項所述之方法，其特徵在於：太陽板在兩軸上移動以便覆蓋住全部的板區，且有多於一部之各具有其相關對準偵測器系統的光學單元用於在太陽板上刻劃線條，其中之一光學單元是固定的，而所有其他光學單元則可在一平臺上垂直於刻劃線方向的方向上獨立移動。
  18. 一種用於精確定位雷射刻劃線條之雷射燒蝕工具，當處理一材料的頂部薄層，此層覆蓋住一或多個其他下方層，下方層上已有許多被刻劃用於製作太陽板的線條，其特徵在於該雷射燒蝕工具包括：一光學單元，用於產生一或多道雷射光束以便在太陽板頂層刻劃出一或多道線條；一對準偵測器系統，被附著到光學單元上，其與光學單元之間相隔一段距離，以便在下方層內、太陽板中即將在後續時間被劃上刻線的區域內其中一道刻線的位置可由偵測器測量；一控制與運動系統，自附著於光學單元的對準偵測器系統接收資料，並將該資料用於修正在垂直於刻劃方向上、光學單元相關於太陽板的相對位置，以便使雷射刻劃線得以精確地擺放在相對於已經刻劃在一下方層的刻劃線的位置上；以及一運動系統，以相對於光學單元的方式來移動太陽板，而對準偵測器遵循已經被刻劃在下方層其中一層上一或多條刻劃線的路徑，並測量一道或多道刻線在全部長度方向上的位置，而由光學單元在頂層所作的雷射刻劃則在太陽板上的不同區域內同時進行。
  19. 一種太陽板，其特徵在於：其係採用前述專利申請範圍第1到17項中任一項所述之方法所製成。
TW096142002A 2006-11-08 2007-11-07 對準太陽板刻劃之雷射光束之方法與裝置 TWI456780B (zh)

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Application Number Priority Date Filing Date Title
GBGB0622232.7A GB0622232D0 (en) 2006-11-08 2006-11-08 Method and apparatus for laser beam alignment for solar panel scribing

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TWI456780B true TWI456780B (zh) 2014-10-11

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US (1) US8779326B2 (zh)
EP (2) EP2080234B1 (zh)
JP (1) JP2010509067A (zh)
KR (1) KR101430277B1 (zh)
CN (1) CN101584051B (zh)
GB (1) GB0622232D0 (zh)
TW (1) TWI456780B (zh)
WO (1) WO2008056116A1 (zh)

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US8779326B2 (en) 2014-07-15
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US20090324903A1 (en) 2009-12-31
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EP2080234B1 (en) 2014-09-17
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