CN101546737B - 化合物半导体元件的封装结构及其制造方法 - Google Patents
化合物半导体元件的封装结构及其制造方法 Download PDFInfo
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- CN101546737B CN101546737B CN200810086311A CN200810086311A CN101546737B CN 101546737 B CN101546737 B CN 101546737B CN 200810086311 A CN200810086311 A CN 200810086311A CN 200810086311 A CN200810086311 A CN 200810086311A CN 101546737 B CN101546737 B CN 101546737B
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- conducting film
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200810086311A CN101546737B (zh) | 2008-03-25 | 2008-03-25 | 化合物半导体元件的封装结构及其制造方法 |
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CN200810086311A CN101546737B (zh) | 2008-03-25 | 2008-03-25 | 化合物半导体元件的封装结构及其制造方法 |
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CN101546737A CN101546737A (zh) | 2009-09-30 |
CN101546737B true CN101546737B (zh) | 2012-09-12 |
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CN200810086311A Expired - Fee Related CN101546737B (zh) | 2008-03-25 | 2008-03-25 | 化合物半导体元件的封装结构及其制造方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101958390A (zh) * | 2010-08-13 | 2011-01-26 | 李刚 | 发光芯片封装结构 |
CN102044620A (zh) * | 2010-11-11 | 2011-05-04 | 深圳市瑞丰光电子股份有限公司 | 一种led基板及其制造方法和led |
CN102956761B (zh) * | 2011-08-25 | 2015-03-11 | 展晶科技(深圳)有限公司 | 发光二极管的封装方法 |
CN106057778B (zh) * | 2016-05-27 | 2018-11-30 | 矽力杰半导体技术(杭州)有限公司 | 封装结构及其制造方法 |
DE102017112235A1 (de) * | 2017-06-02 | 2018-12-06 | Osram Opto Semiconductors Gmbh | Laserdiode und Verfahren zum Herstellen einer Laserdiode |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1523681A (zh) * | 2003-02-18 | 2004-08-25 | 夏普株式会社 | 半导体发光装置及其制造方法和电子图像拾取装置 |
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CN1523681A (zh) * | 2003-02-18 | 2004-08-25 | 夏普株式会社 | 半导体发光装置及其制造方法和电子图像拾取装置 |
Non-Patent Citations (2)
Title |
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JP特开2000-77725A 2000.03.14 |
JP特开2006-156704A 2006.06.15 |
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