CN101536125B - 层合型软磁片的制备方法 - Google Patents
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Abstract
本发明提供层合型软磁片的制备方法,该方法将用涂布法制作的薄软磁片层合,可制备片厚变化得到抑制、且磁导率的变动也较小的层合型软磁片。层合型软磁片的制备方法具有以下步骤:(A)将软磁性组合物涂布在剥离基材上,在软磁性组合物实质上不发生固化反应的温度T1下进行干燥,除去剥离基材,获得固化性软磁片的步骤,其中,所述软磁性组合物是将至少扁平的软磁性粉末、具有缩水甘油基的丙烯酸类橡胶、环氧树脂、环氧树脂用潜在固化剂、以及溶剂混合而成的;(B)准备2片以上该固化性软磁片,将它们层合,获得层合物的步骤;(C)在固化反应实质上不发生的温度T2下,通过施加线压力的层压机,以线压力P1、线压力P2和线压力P3(P1<P2<P3)对所得层合物依次进行压缩的步骤;以及(D)接着在固化反应发生的温度T3下,用施加面压力的压缩机对被压缩的层合物进行压缩,使其固化,获得层合型软磁片的步骤。
Description
技术领域
本发明涉及具有磁性优异、厚度变化小的特性的软磁片的制备方法。
背景技术
在各种电子设备中使用的软磁片的制备通常是通过混炼压延法进行的。该方法中,将扁平软磁性粉末与橡胶和氯化聚乙烯等粘合剂按规定比例用捏合机混炼,将所得混炼物在压辊等装置中压延成规定厚度,再根据需要使粘合剂加热交联,由此获得单层的软磁片。该方法具有可以高密度填充软磁性粉末、可以通过压延使软磁性粉末在面内方向取向、片的厚度容易调节的优点。
但是,混炼压延法中,混炼时软磁性粉末产生应变,因此软磁性粉末本身的磁性降低,有无法增大软磁片的磁导率的问题。另外,在高温或高温高湿环境下片的厚度朝着增厚的方向变化,有磁导率降低的问题。
因此,通过用难以使软磁性粉末产生应变的涂布法代替混炼压延法,制备了软磁片(专利文献1)。该方法中,将含有扁平软磁性粉末和橡胶、树脂、溶剂的软磁片形成用液状组合物涂布在剥离基材上,进行干燥,由此获得在高温、高温高湿下片的厚度变化小的软磁片。
专利文献1:日本特开2000-243615号公报
发明内容
但是,涂布法适合于制作片厚度较小的软磁片的情况,不适合于制备比较厚的软磁片。这是由于如果涂布得较厚,则容易发生涂布厚度不均,干燥也困难。因此,本发明人尝试在软磁片形成用液状组合物中配合固化性树脂及其固化剂,通过涂布法制作固化性的薄软磁片,将多个该片在较低温下进行预压合,接着在较高温下进行最终压合,由此将软磁片制成层合型。但是,将通过涂布法制作的薄软磁片层合制作的层合型软磁片,虽然每个薄软磁片的片厚度变化小,但是与通过混炼压延法制备的较厚的单层软磁片同样,在高温或高温高湿环境下片厚度朝着增厚的方向变化,出现磁导率降低的问题。
本发明为解决上述以往的技术问题而设,其目的在于:提供可将用涂布法制作的多个薄软磁片层合、制备片厚变化得到抑制、且磁导率变化也较小的层合型软磁片的方法。
本发明人认为,将通过涂布法制作的薄软磁片层合而制作的层合型软磁片在高温或高温高湿环境下片厚度向增厚的方向变化、磁导率降低的原因有如下两种可能性:一种是空气进入到构成层合型软磁片的薄软磁片中间,由于高温使该空气膨胀,由此片厚度增大;另一种是在热压合时,扁平软磁性粉末产生的应变因高温而得到缓和,构成片的树脂部分收缩,由此片厚度增大。
本发明人假设前者为主要原因,发现在将多个软磁片临时热压合时如果施加较高的压力,则片厚度以无法忽视的水平变化。另外,假设后者为主要因素,发现在将多个软磁片临时热压合时如果施加较低压力,则片厚度依然以无法忽视的水平变化。
鉴于在临时热压合时单纯地施加相对高的压力或低的压力无法实现本发明的目的,本发明人使用特定材料作为软磁片形成用的软磁性组合物,对于由此形成的薄软磁片的层合物的加热方式和压力施加方式进行了详细的研究,发现在热固化不进行的温度下、以低、中、高三阶段的线压力进行预压合,然后在热固化进行的温度下、以面压力进行最终压合,可实现上述目的,从而完成了本发明。
即,本发明提供层合型软磁片的制备方法,其特征在于具有以下的步骤(A)-(D):
(A)将软磁性组合物涂布在剥离基材上,在软磁性组合物实质上不发生固化反应的温度T1下进行干燥,除去剥离基材,获得固化性软磁片的步骤,其中,所述软磁性组合物是将至少扁平的软磁性粉末、具有缩水甘油基的丙烯酸类橡胶、环氧树脂、环氧树脂用潜在固化剂、溶剂混合而成的;
(B)准备2片以上该固化性软磁片,将它们层合,获得层合物的步骤;
(C)在固化反应实质上不发生的温度T2下,通过施加线压力的层压机,以线压力P1、线压力P2和线压力P3(P1<P2<P3)对所得层合物依次进行压缩的步骤;以及
(D)接着在固化反应发生的温度T3下,用施加面压力的压缩机对被压缩的层合物进行压缩,获得层合型软磁片的步骤。
根据本发明,使用特定组合物作为软磁片形成用的软磁性组合物,关于对由此形成的薄软磁片的层合物进行的加热方式和压力施加方式,是在热固化不进行的温度下、以低、中、高三阶段的线压力进行预压合,接着在热固化进行的温度下、以面压力进行最终压合。由此,即使在高温或高温高湿环境下也可以抑制片厚的变化,结果可以使磁导率不降低。
附图简述
图1是实施例1的层合型软磁片的截面电子显微镜照片。
图2是比较例1的层合型软磁片的截面电子显微镜照片。
图3是比较例2的层合型软磁片的截面电子显微镜照片。
图4是比较例3的层合型软磁片的截面电子显微镜照片。
图5是比较例4的层合型软磁片的截面电子显微镜照片。
实施发明的最佳方式
本发明的层合型软磁片的制备方法至少具有以下步骤(A)-(D)。对每一步骤进行说明。
步骤(A)
将软磁性组合物涂布在剥离基材上,在软磁性组合物实质上不发生固化反应的温度T1下进行干燥,除去剥离基材,获得固化性磁性片,其中,所述软磁性组合物是将至少扁平的软磁性粉末、具有缩水甘油基的丙烯酸类橡胶、环氧树脂、环氧树脂用潜在固化剂、溶剂混合而成的。
在剥离基材上涂布软磁性组合物的方法可利用刮板涂布法、Comma Coater涂布法等公知的方法。涂布厚度可根据固化性软磁片的用途或层合数适当决定,通常以干燥厚度达到50-200μm的厚度进行涂布。
将软磁性组合物涂布在剥离基材上之后进行干燥,除去剥离基材,获得固化性软磁片,该干燥是在软磁性组合物的固化反应实质上不发生的温度T1下进行的。在软磁性组合物的固化反应实质上不发生的温度T1下进行干燥的理由是:如果固化反应进行,则压缩性变差,μ’无法升高,如果将进行了固化反应的材料压缩,则在高温高湿环境下的厚度变化增大。这里,“固化反应实质上不发生”的含义是:不仅完全不发生固化反应的情形,在不损害本发明效果的范围内也可以发生稍许固化反应,是指在最终步骤中均匀进行交联反应。使固化反应实质上不发生的具体方法有:将温度T1设定为比固化反应起始温度低5℃以上。具体的温度T1根据软磁性组合物的组成而不同,通常为130℃以下。干燥的具体方法可采用温风干燥炉、电加热炉、红外线加热炉等公知的方法。
软磁性组合物中,使用扁平形状的粉末(扁平软磁性粉末)作为软磁性粉末。将扁平软磁性粉末在平面的面内方向排列,可以实现高磁导率和大比重。
扁平软磁性粉末的原材料可以使用任意的软磁性合金,例如有磁性不锈钢(Fe-Cr-Al-Si合金)、铁硅铝合金(Fe-Si-Al合金)、坡莫合金(Fe-Ni合金)、硅铜(Fe-Cu-Si合金)、Fe-Si合金、Fe-Si-B(-Cu-Nb)合金、Fe-Si-Cr-Ni合金、Fe-Si-Cr合金、Fe-Si-Al-Ni-Cr合金、铁素体等。其中,从磁性角度考虑,可优选使用Fe-Si-Al合金或Fe-Si-Cr-Ni合金。
关于这些软磁性合金,应用于RFID通信时,优选使用复数相对磁导率的实数部分(磁导率)μ’的数值较大、复数相对磁导率的虚数部分(磁损耗)μ”的数值较小的软磁性合金。由此,可以防止由RFID通信用的天线线圈释放的磁场被金属体变换为涡电流,改善通信性能。
为了减小μ”的值从而降低涡流损耗,扁平软磁性合金优选使用电阻较大的合金。这种情况下,通过改***磁性合金的组成可以使电阻增大。例如为Fe-Si-Cr合金时,优选使Si的比例为9-15重量%。
扁平软磁性粉末可使用扁平形状的软磁性粉末,优选平均粒径为3.5-90μm、平均厚度0.3-3.0μm,更优选平均粒径为10-50μm、平均厚度0.5-2.5μm。因此,优选将扁平率设定为8-80、更优选设定为15-65。需说明的是,为了使扁平软磁性粉末的大小一致,可以根据需要使用筛子等进行分级。为了使软磁性材料的磁导率增大,增大扁平软磁性粉末的颗粒尺寸而减小颗粒之间的间隔、并且提高扁平软磁性粉末的长宽比而减小软磁片中反磁场的影响是有效的。
扁平软磁性粉末的振实密度和比表面积(BET法)互相为反比例关系,但是如果比表面积增大,则不仅是μ’值、不希望增大的μ”值也有增大倾向,因此可将这些数值范围设定为优选范围。具体来说,振实密度优选设定为0.55-1.45g/mL,更优选0.65-1.40g/mL,比表面积优选设定为0.40-1.20m2/g,更优选0.65-1.00m2/g。
扁平软磁性粉末可以使用例如用硅烷偶联剂等偶联剂进行了偶联处理的软磁性粉末。通过使用经偶联处理的软磁性粉末,可以提高扁平软磁性粉末与粘合剂树脂的界面的补强效果,使比重或耐腐蚀性提高。偶联剂例如可使用γ-甲基丙烯酰氧基丙基三甲氧基硅烷、γ-环氧丙氧基丙基三甲氧基硅烷、γ-环氧丙氧基丙基甲基二乙氧基硅烷等。需说明的是,上述偶联处理可以预先对软磁性粉末实施,也可以在将扁平软磁性粉末与粘合剂树脂混合的同时混合,结果可以进行上述偶联处理。
软磁性组合物中扁平软磁性粉末的用量如果过少,则无法获得所需磁性,过多则粘合剂树脂量相对减少,成型性降低,因此优选在除去溶剂的软磁性组合物中占70-90重量%,更优选80-85重量%。
为了使层合型软磁片具有良好的柔软性和耐热性,软磁性组合物使用丙烯酸类橡胶作为橡胶成分。为了提高与环氧树脂的相容性,该丙烯酸类橡胶必须具有1个以上的缩水甘油基。具体例子有:EA-AN、BA-EA-AN、BA-AN、BA-MMA等。
软磁性组合物中丙烯酸类橡胶的用量过少,则无法获得足够的热加工性,过多则橡胶弹性过大,热加工性变差,因此,优选在除去了溶剂的软磁性组合物中占9-16重量%,更优选12-14重量%。
为了使层合型软磁片具有良好的热加工性和尺寸稳定性,软磁性组合物使用环氧树脂。具体例子有:线性酚醛树脂、四缩水甘油基苯酚、邻甲酚酚醛树脂、四缩水甘油基胺、双酚A、双酚F、双酚A缩水甘油基醚等。
软磁性组合物中环氧树脂的用量过少,则无法获得足够的热加工性,过多则柔软性受损,因此优选在除去了溶剂的软磁性组合物中占1.0-6.0重量%,更优选1.5-4.0重量%。
软磁性组合物中为了使环氧树脂固化而使用环氧树脂用潜在固化剂,其具体例子有:胺类咪唑、聚酰胺酚酸酐等。
软磁性组合物中环氧树脂用潜在固化剂的用量过少,则产品的可靠性降低(保存特性降低),过多则涂料的寿命降低或片寿命降低,成本升高,因此,相对于100重量份环氧树脂,优选3-100重量份,更优选10-40重量份。
溶剂可使用常用的溶剂,例如可使用乙醇、正丙醇、异丙醇(IPA)、正丁醇等醇类,乙酸乙酯、乙酸正丁酯等酯类,丙酮、甲基乙基酮(MEK)、甲基异丁基酮(MIBK)、环己酮等酮类,四氢呋喃(THF)等醚类,乙基溶纤剂、正丁基溶纤剂、溶纤剂乙酸酯等溶纤剂类,甲苯、二甲苯、苯等芳族烃类等常用溶剂。其用量可根据软磁性组合物组成的种类或涂布法等适当选择。
剥离基材可使用通常的剥离基材。例如有将表面进行了有机硅剥离处理的聚酯片等。
软磁性组合物可按照常规方法将上述各成分均匀混合来制备。
步骤(B)
准备2片以上步骤(A)所得的固化性软磁片,将它们层合,获得层合物。层合数根据层合型软磁片的用途等确定。层合时,优选在软磁片的层合物的两侧配置剥离片。此时的剥离片可以使用上述的将表面进行了有机硅剥离处理的聚酯片等。
步骤(C)
接着,在固化反应实质上不发生的温度T2下,用施加线压力的层压机将步骤(B)所得的层合物以线压力P1、线压力P2和线压力P3(P1<P2<P3)依次压缩,进行预压合。这样,通过进行预压合,可以防止因片的偏移而出现次品,可通过除去气体提高可靠性,可防止延伸。
该步骤中,以固化反应实质上不发生的温度T2对软磁片加压是为了在施加面压力的状态下使其进行均匀的交联反应。这里,“固化反应实质上不发生”与步骤(A)的情形同样,不仅有完全不发生固化反应的情形,在不损害发明效果的范围内也可以发生些许固化反应,是指在最终步骤中均匀进行交联反应。使固化反应实质上不发生的具体方法有:将温度T2设定为比固化反应起始温度低5℃以上。具体的温度T2根据构成软磁片的软磁性组合物的组成而不同,通常为70-130℃,优选70-100℃。加热的具体方法可采用使用温风干燥炉、电加热炉、红外线加热炉等的公知的方法。
通过施加线压力的层压机来施加线压力是为了防止空气的卷入。以三个阶段缓慢地由低线压力至高线压力施加压力是为了结合片的柔软度和密度而有效地除去气体,并且不发生片的层合偏移。层压机的具体例子有:上下为金属辊、橡胶辊、金属辊与橡胶辊的组合等。
P1、P2、P3的具体数值根据软磁片的材料、层合数等而不同,P1优选2-10kgf/cm,更优选3-8kgf/cm;P2优选10-20kgf/cm、更优选12-18kgf/cm,P3优选20-50kgf/cm、更优选25-45kgf/cm。
本步骤的层压机的线速度如果过快则热无法传导、压缩无法进展,产生贴合不良等问题;过慢则生产效率变差,成本提高,因此优选0.1-5.0m/分钟,更优选0.5-3.0m/分钟。
步骤(D)
接着,在固化反应发生的温度T3下,将步骤(C)所得的压缩的层合物用施加面压力的压缩机压缩,使其固化,同时进行最终压合,获得本发明的层合型软磁片。所得层合型软磁片即使在高温或高温高湿环境下其片材厚度的变化也得到抑制,结果磁导率不降低。
本步骤中,将压缩的层合物以固化反应发生的温度T3加压是为了在使磁性粉末在面内排列的状态下使交联反应进行。具体的温度T3根据软磁性组合物的组成而不同,通常为140-200℃,优选150-180℃。以面压力进行加压是为了在面内均匀加压的状态下使其交联。面压力的值根据软磁片的材料、层合数等而不同,优选10-60kgf/cm2,更优选15-40kgf/cm2。
通过以上的制备方法得到的层合型软磁片的片厚变化得到抑制,且磁导率的变化也较小。
实施例
以下通过实施例具体说明本发明。
实施例1
(软磁片的制备)
将550重量份扁平软磁性粉末Fe·Si·Cr·Ni(株式会社MATE制备)、83重量份具有缩水甘油基的丙烯酸类橡胶(SG80H·3、Nagase ChemteX株式会社制备)、23.1重量份环氧树脂(EPICOAT 1031S、Japan EpoxyResins株式会社制备)、6.9重量份环氧树脂用潜在固化剂(HX3748,旭化成Chemicals株式会社制备)、270重量份甲苯、120重量份乙酸乙酯混合,制备软磁性组合物。关于所使用的扁平软磁性粉末的累积粒径D(μm),D10为9.4μm,D50为23.9μm,D90为49.1μm。堆密度为0.6g/cc,振实密度为1.30g/cc。
将该组合物用涂布机涂布在剥离聚酯(PET)基材上,以低于80℃的温度干燥,然后再以100℃干燥,在剥离PET基材上获得100μm厚度的软磁片。
(软磁片的层合物的制作)
由上述软磁片上剥离剥离PET基材,获得单层的软磁片。准备4片该单层软磁片,将它们层合,得到层合物。
(软磁片的层合物的预压合)
在辊温度设定为70℃的层压机(Sony Chemical & InformationDevice株式会社制备)中,使所得层合物以线速度0.5m/分钟、线压力3.3kgf/cm通过1次,接着以线压力14.8kgf/cm通过2次,再以线压力29.54kg/cm通过2次,进行预压合。
(层合型软磁片的制作)
接着,将预压合的层合物用真空压缩装置(北川精机制)、在165℃下、以24.9kgf/cm2的压力压缩10分钟,获得实施例1的层合型软磁片。该层合型软磁片的截面图如图1所示。由图1可知,磁性粉末以高密度被填充,在面方向上排列。
比较例1
(软磁片的制作)
与实施例1同样,在剥离PET基材上得到100μm厚的软磁片。
(软磁片的层合物的制作)
由上述软磁片上剥离剥离PET基材,获得单层的软磁片。准备4片该单层软磁片,将它们层合,得到层合物。
(软磁片的层合物的预压合)
在辊温度设定为70℃的层压机(Sony Chemical & InformationDevice株式会社制备)中,使所得层合物以线速度0.5m/分钟、线压力3.3kgf/cm通过5次,进行预压合。
(层合型软磁片的制作)
接着,将预压合的层合物用真空压缩装置(北川精机制)以24.9kgf/cm2的压力压缩,获得层合型软磁片。该层合型软磁片的截面图如图2所示。由图2可知,层合界面上空隙稍多。
比较例2
(软磁片的制作)
与实施例1同样,在剥离PET基材上得到100μm厚的软磁片。
(软磁片的层合物的制作)
由上述软磁片上剥离剥离PET基材,获得单层的软磁片。准备4片该单层软磁片,将它们层合,得到层合物。
(软磁片的层合物的预压合)
在辊温度设定为70℃的层压机(Sony Chemical & InformationDevice株式会社制备)中,使所得层合物以线速度0.5m/分钟、线压力29.5kgf/cm通过5次,进行预压合。
(层合型软磁片的制作)
接着,将预压合的层合物用真空压缩装置(北川精机制)以24.9kgf/cm2的压力压缩,获得比较例2的层合型软磁片。该层合型软磁片的截面图如图3所示。由图3可知,存在高密度高取向的位置和低密度取向不足的位置。
比较例3
(软磁片的制作)
与实施例1同样,在剥离PET基材上得到100μm厚的软磁片。
(软磁片的层合物的制作)
由上述软磁片上剥离剥离PET基材,获得单层的软磁片。准备4片该单层软磁片,将它们层合,得到层合物。该层合型软磁片的截面图如图4所示。由图4可知,残留有较多的空隙(空气)。
(层合型软磁片的制作)
接着,不经预压合,将层合物用真空压缩装置(北川精机制)以24.9kgf/cm2的压力进行压缩,获得比较例3的层合型软磁片。
比较例4
(软磁片的制作)
与实施例1同样,在剥离PET基材上得到100μm厚的软磁片。
(软磁片的层合物的制作)
由上述软磁片上剥离剥离PET基材,获得单层的软磁片。准备4片该单层软磁片,将它们层合,得到层合物。
(层合型软磁片的制作)
接着,不经预压合,将层合物用真空压缩装置(北川精机制)以34.7kgf/cm2的压力进行压缩,获得比较例4的层合型软磁片。该层合型软磁片的截面图如图5所示。由图5可知,清楚地分为高密度区域和空隙(空气)区域。
(评价)
对于所得层合型软磁片,首先测定厚度(t1)和磁导率(μ’)。从实际应用考虑,磁导率优选为38以上。在85℃、60Rh%的高温高湿环境下保持240小时后测定软磁片的厚度(t2),计算厚度变化率[(t1-t2)×100/t2](%)。优选厚度变化率接近0(表1中,将厚度变化率低于2.0时评价为G,除此之外为NG)。并且关于片的偏移发生率(%),是由制备的片数计算发生了片层合偏移的片数。所得结果如表1所示。
[表1]
实施例1 | 比较例1 | 比较例2 | 比较例3 | 比较例4 | |
层压机压力 | 分阶段 | 固定 | 固定 | 无 | 无 |
第1次通过,70℃[kgf/cm] | 3.3 | 3.3 | 29.5 | - | - |
第2、3次通过,70℃[kgf/cm] | 14.8 | 3.3 | 29.5 | - | - |
第4、5次通过,70℃[kgf/cm] | 29.5 | 3.3 | 25.9 | - | - |
真空压缩压力[kgf/cm2] | 24.9 | 24.9 | 24.9 | 24.9 | 37.4 |
磁导率μ’(13.56MHz) | 41.6 | 39.7 | 24.3 | 39.6 | 41.4 |
厚度变化率(%) | 1.70 | 3.20 | 2.80 | 3.80 | 3.60 |
评价 | G | NG | NG | NG | NG |
片偏移发生率(%) | 0 | 0 | 24 | 0 | 0 |
由表1可知,为实施例1的层合型软磁片时,在真空压缩之前使软磁片的层合物以三阶段的压力条件通过层压机,由此可以使磁导率μ’增大,在85℃、60Rh%、240小时下的厚度变化也被抑制到2%以下的较小程度。观察软磁片的截面,可知未有空气进入,未见到层合界面。制作50片层合型软磁片时,片的层合偏移导致的次品发生率为0%。
为比较例1的层合型软磁片时,在真空压缩前使软磁片通过层压机,由此可以使磁导率μ’增大,但85℃、60Rh%、240小时的片厚变化为3%以上,与实施例1比较,厚度变化变大。制作50片时片的偏移为0片,次品发生率为0%。
为比较例2的层合型软磁片时,在真空压缩前使软磁片通过层压机,由此可以使磁导率μ’增大,但85℃、60Rh%、240小时的片厚变化为2%以上,与实施例1比较,厚度变化变大。制作50片时片的偏移为12片,次品发生率高。
为比较例3的层合型软磁片时,在用真空压缩机压缩之前未通过层压机,因此如图4所示,在构成层合型软磁片的单层的各软磁片的界面产生缝隙。另外,85℃、60Rh%、240小时的厚度的变化为2%以上,与实施例1比较,厚度变化变大。制作50片时片的层合偏移导致的次品发生率为0%。
为比较例4的层合型软磁片时,通过使真空压缩机的压力增大,可以获得与实施例1同等的磁导率μ’,层合界面的间隙变小,但是由于以过大的压力压缩,因此内部残留应变,成为在高温高湿环境下厚度变化的一个因素。另外,85℃、60Rh%、240小时的厚度的变化为2%以上,与实施例1比较,厚度变化变大。制作50片时片的层合偏移导致的次品发生率为0%。
产业实用性
本发明的制备方法中,使用特定的组合物作为软磁片形成用软磁性组合物,关于对由其形成的薄软磁片的层合物进行的加热方式和压力施加方式中,在热固化不进行的温度下、以低、中、高三阶段的线压力进行预压合,然后在热固化进行的温度下、以面压力进行最终压合,因此,即使在高温或高温高湿环境下也可以抑制层合型软磁片厚度的变化,结果不使磁导率降低。该软磁片可用作非接触式IC卡或IC标签等RFID***等中的磁通集中器、或者通常的电波吸收器。即,可用作RFID用柔性屏蔽材料、便携式数码照相机等电子设备的噪声电磁波吸收器。
Claims (4)
1.层合型软磁片的制备方法,其特征在于具有以下的步骤(A)~(D):
(A)将软磁性组合物涂布在剥离基材上,在软磁性组合物实质上不发生固化反应的温度T1下进行干燥,除去剥离基材,获得固化性软磁片的步骤,其中,所述软磁性组合物是将至少扁平的软磁性粉末、具有缩水甘油基的丙烯酸类橡胶、环氧树脂、环氧树脂用潜在固化剂、以及溶剂混合而成的;
(B)准备2片以上该固化性软磁片,将它们层合,获得层合物的步骤;
(C)在固化反应实质上不发生的温度T2下,通过施加线压力的层压机,以线压力P1、线压力P2和线压力P3对所得层合物依次进行压缩的步骤,其中P1<P2<P3;以及
(D)接着在固化反应发生的温度T3下,用施加面压力的压缩机将对压缩的层合物进行压缩,获得层合型软磁片的步骤。
2.权利要求1所述的制备方法,其中,P1为2~10kgf/cm,P2为10~20kgf/cm,P3为20~50kgf/cm,面压力为10~60kgf/cm2。
3.权利要求1所述的制备方法,其中,T1为50~90℃,T2为70~130℃,T3为140~200℃。
4.权利要求1~3中任一项所述的制备方法,其中,步骤(C)中层压机的线速度为0.1~5m/分钟。
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PCT/JP2007/069435 WO2008053662A1 (en) | 2006-10-31 | 2007-10-04 | Process for the production of laminate-type soft magnetic sheets |
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