CN101532154B - 电解铜箔表面无铬钝化处理方法 - Google Patents
电解铜箔表面无铬钝化处理方法 Download PDFInfo
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- CN101532154B CN101532154B CN2009103007302A CN200910300730A CN101532154B CN 101532154 B CN101532154 B CN 101532154B CN 2009103007302 A CN2009103007302 A CN 2009103007302A CN 200910300730 A CN200910300730 A CN 200910300730A CN 101532154 B CN101532154 B CN 101532154B
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- China
- Prior art keywords
- copper foil
- electrolytic copper
- electrolytic
- chromium
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 239000011889 copper foil Substances 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000005516 engineering process Methods 0.000 claims abstract description 14
- 238000002161 passivation Methods 0.000 claims abstract description 12
- 238000004070 electrodeposition Methods 0.000 claims abstract description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000151 deposition Methods 0.000 claims abstract description 6
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000005868 electrolysis reaction Methods 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 5
- 239000008151 electrolyte solution Substances 0.000 claims description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229940095064 tartrate Drugs 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 6
- 229910052804 chromium Inorganic materials 0.000 abstract description 3
- 239000011651 chromium Substances 0.000 abstract description 3
- 239000003792 electrolyte Substances 0.000 abstract description 3
- 231100000614 poison Toxicity 0.000 abstract description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052785 arsenic Inorganic materials 0.000 abstract description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 abstract description 2
- 238000011161 development Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 229910052711 selenium Inorganic materials 0.000 abstract description 2
- 239000011669 selenium Substances 0.000 abstract description 2
- 239000003440 toxic substance Substances 0.000 abstract description 2
- 231100000252 nontoxic Toxicity 0.000 abstract 2
- 230000003000 nontoxic effect Effects 0.000 abstract 2
- 230000001174 ascending effect Effects 0.000 abstract 1
- 238000005137 deposition process Methods 0.000 abstract 1
- 230000009849 deactivation Effects 0.000 description 3
- 238000004500 asepsis Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2009103007302A CN101532154B (zh) | 2009-03-06 | 2009-03-06 | 电解铜箔表面无铬钝化处理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103007302A CN101532154B (zh) | 2009-03-06 | 2009-03-06 | 电解铜箔表面无铬钝化处理方法 |
Publications (2)
Publication Number | Publication Date |
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CN101532154A CN101532154A (zh) | 2009-09-16 |
CN101532154B true CN101532154B (zh) | 2011-01-12 |
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CN2009103007302A Active CN101532154B (zh) | 2009-03-06 | 2009-03-06 | 电解铜箔表面无铬钝化处理方法 |
Country Status (1)
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CN (1) | CN101532154B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102610545B (zh) * | 2012-03-02 | 2014-10-08 | 迅力光能(昆山)有限公司 | 一种薄膜光电子器件短路缺陷钝化方法及其装置 |
CN107641825A (zh) * | 2017-09-18 | 2018-01-30 | 乐凯特科技铜陵有限公司 | 一种载体超薄铜箔表面钝化工艺 |
CN109137013A (zh) * | 2018-07-13 | 2019-01-04 | 铜陵市华创新材料有限公司 | 一种电解铜箔表面电沉积zn-ni-p-la合金工艺 |
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2009
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CN101532154A (zh) | 2009-09-16 |
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Owner name: HUBEI ZHONGYI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WANG HANPING Effective date: 20111018 |
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Free format text: CORRECT: ADDRESS; FROM: 432407 XIAOGAN, HUBEI PROVINCE TO: 432500 XIAOGAN, HUBEI PROVINCE |
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Effective date of registration: 20111018 Address after: 432500 Xiaogan City Economic Development Zone Hubei County of Yunmeng province Mengzhe Avenue South, No. 47 Patentee after: Hubei Zhongyi Technology Co., Ltd. Address before: 432407 Hubei province city along the Hubei Road East mafang factory Yili copper limited liability company Patentee before: Wang Hanping |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An electrolytic copper foil surface Chromium-free passivating treatment method Effective date of registration: 20120719 Granted publication date: 20110112 Pledgee: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgor: Hubei Zhongyi Technology Co., Ltd. Registration number: 2012990000390 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20160926 Granted publication date: 20110112 Pledgee: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgor: Hubei Zhongyi Technology Co., Ltd. Registration number: 2012990000390 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 432500 Xiaogan City Economic Development Zone Hubei County of Yunmeng province Mengzhe Avenue South, No. 47 Patentee after: Hubei China Polytron Technologies Inc Address before: 432500 Xiaogan City Economic Development Zone Hubei County of Yunmeng province Mengzhe Avenue South, No. 47 Patentee before: Hubei Zhongyi Technology Co., Ltd. |