CN101492809A - Vacuum magnetron sputtering coil film coating apparatus - Google Patents
Vacuum magnetron sputtering coil film coating apparatus Download PDFInfo
- Publication number
- CN101492809A CN101492809A CNA2009100372130A CN200910037213A CN101492809A CN 101492809 A CN101492809 A CN 101492809A CN A2009100372130 A CNA2009100372130 A CN A2009100372130A CN 200910037213 A CN200910037213 A CN 200910037213A CN 101492809 A CN101492809 A CN 101492809A
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- vacuum
- magnetron sputtering
- coating apparatus
- film coating
- coil film
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- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 47
- 239000007888 film coating Substances 0.000 title claims description 17
- 238000009501 film coating Methods 0.000 title claims description 17
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000000498 cooling water Substances 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000000576 coating method Methods 0.000 abstract description 13
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000010849 ion bombardment Methods 0.000 abstract description 4
- 230000003746 surface roughness Effects 0.000 abstract description 4
- 238000004804 winding Methods 0.000 abstract 4
- 238000007747 plating Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000005086 pumping Methods 0.000 description 4
- 238000005477 sputtering target Methods 0.000 description 3
- 238000013022 venting Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
A vacuum magnetron sputtering winding coating device comprises a vacuum cavity, a vacuum generating system, target electrodes, and a winding and unwinding system, wherein, the vacuum generating system is arranged on the vacuum cavity to cause the interior of the vacuum cavity to be in vacuum state at work, the target electrodes for magnetron sputtering are arranged at the magnetron sputtering area in the vacuum cavity, two rows of target electrodes are arranged, and the winding and unwinding system is respectively arranged at the tow sides of the magnetron sputtering area. The invention has the advantages that: (1) the vacuum cavity is designed as round to provide uniform vacuum degree without forming air suction dead angles; oil returning doses not appear in the vacuum chamber; and the work efficiency is improved; (2) two winding and unwinding systems are adopted to satisfy dual-coating of one roll and single-coating of two rolls with full width of the magnetron sputtering area as well as single-and dual-coating of two rolls with half width of the coating area, so that the function is comprehensive; (3) ion bombardment is carried out on the base material surface to enhance the surface roughness of the base material and guarantee the peel strength between the base material and the film.
Description
Technical field
The present invention relates to a kind of under high vacuum state the filming equipment field at various substrate surface magnetron sputtering continuous film formings, be specially a kind of vacuum magnetron sputtering coil film coating apparatus that can be applied in one or more layers metal of sputter on the web-like base material.
Background technology
Vacuum magnetic-control sputtering equipment can obtain one or more layers uniform settled layer at conductive base and non-conductive substrate, is the visual plant of the acquisition of multiple function film, can be applied to EMI, flexible circuit board, industries such as optical coating.At present, the vacuum magnetic-control sputtering coating equipment of widespread usage is big to being made up of vacuum chamber, vacuum acquiring system, reel system, sputtering target system and automatic control system.Its schedule of operation is as follows: material loading-pass door for vacuum chamber-Kai mechanical pump is taken out black vacuum-Kai diffusion pump and is taken out local vacuum-fill Ar air to open target power supply-explained hereafter-stop mechanical pump (diffusion pump continues heating)-next working cycle.
Above-mentioned vacuum magnetic-control sputtering coating equipment is the required metal level of single face sputter on the web-like base material, have following shortcoming: (one), coating equipment vacuum cavity are selected square cavity usually for use, vacuum acquiring system is selected the oil diffusion pump system for use, be distributed in the both sides of vacuum chamber, this distribution form causes the interior vacuum tightness of vacuum chamber inhomogeneous, thereby causes forming sputtering film thickness also inhomogeneous; Oil diffusion pump often returns oily phenomenon, form oil film on the workpiece base material that can be in vacuum chamber, causes between sputter rete and the base material bonding force poor; The oil diffusion pump power consumption is bigger in addition, because its control mode is switching value control, so even also can only full power output when making the technology pumping speed and diminish, energy consumption be very big.(2), usually only dispose a cover unwinding and rewinding system, so can only roll up inefficiency by sputter one.(3), only supporting sputtering target usually, do not match ion source and handle, when some base material of plating, can cause between rete and the base material stripping strength not enough.
Summary of the invention
The objective of the invention is in order to overcome the deficiency that above-mentioned vacuum magnetic-control sputtering coating equipment exists, provide and can twoly roll up sputter, sputtered layer directly combines closely with base material, a kind of vacuum magnetron sputtering coil film coating apparatus that improves the quality of products, saves energy and reduce the cost.
The present invention is achieved in that a kind of vacuum magnetron sputtering coil film coating apparatus, comprise vacuum cavity, vacuum acquiring system, the target utmost point and unwinding and rewinding system, vacuum cavity is provided with vacuum acquiring system, vacuum acquiring system makes vacuum cavity inside be vacuum state when work, the intravital magnetron sputtering area of vacuum chamber is provided with the target utmost point of magnetron sputtering, and the target utmost point of magnetron sputtering is provided with two rows, and the magnetron sputtering area both sides are respectively arranged with the unwinding and rewinding system.
Described unwinding and rewinding system by unreeling shaft, Scroll, guide roller, tensioning roller, go up drive roll and following drive roll is formed, base material in the unreeling shaft enters magnetron sputtering area by guide roller, tensioning roller and following drive roll, the base material that magnetron sputtering area is come out through last drive roll, tensioning roller and guide roller rolling in Scroll.
Described vacuum acquiring system can be molecular pump, and having guaranteed does not have the phenomenon of returning oil in the vacuum chamber.
Be provided with the deep cooling water trap in the described vacuum cavity,, thereby improved working efficiency with the pumping speed of raising to base material venting in the continuous coating process.
Described deep cooling water trap can cryopump.
Be provided with the ion source treatment unit between described drive roll down and the magnetron sputtering area inlet,, improve the substrate surface roughness, guarantee the stripping strength between rete and the base material substrate surface is carried out ion bombardment.
Have in the described vacuum cavity and be circular vacuum chamber.
Compared with prior art, the advantage that the present invention has is: (1) vacuum cavity can not form the dead angle of bleeding for circular, and vacuum tightness is even; Vacuum acquiring system is that molecular pump does not have oil system, has guaranteed not have in the vacuum chamber and has returned oil; The cryopump of configuration improves the pumping speed to base material venting in the continuous coating process, thereby has improved working efficiency.(2) adopt two unwinding and rewinding system, can satisfy wide two-sided plating of volume of magnetron sputtering area full width and two volume single faces platings; Also can satisfy two wide volume plating single face and two-sided platings of plating district half range, complete function.
(3) establish the ion source treatment unit entering the magnetron sputtering area place, substrate surface is carried out ion bombardment, improve the substrate surface roughness, guarantee the stripping strength between rete and the base material.
Description of drawings
Fig. 1 is a kind of vacuum magnetron sputtering coil film coating apparatus structural representation of the present invention;
Fig. 2 is structural representation Fig. 1 of unwinding and rewinding system;
Fig. 3 is structural representation Fig. 2 of unwinding and rewinding system;
Fig. 4 is structural representation Fig. 3 of unwinding and rewinding system;
Fig. 5 is structural representation Fig. 4 of unwinding and rewinding system;
Fig. 6 is structural representation Fig. 5 of unwinding and rewinding system;
Fig. 7 is the structural texture synoptic diagram between the target utmost point, unwinding and rewinding system and the vacuum cavity;
Fig. 8 is the vacuum cavity structural representation.
Embodiment
Below in conjunction with the drawings and specific embodiments a kind of vacuum magnetron sputtering coil film coating apparatus of the present invention is described in detail.
A kind of vacuum magnetron sputtering coil film coating apparatus, as Fig. 1, Fig. 7 and shown in Figure 8, comprise vacuum cavity 16, vacuum acquiring system 1, the target utmost point 7, the target utmost point 7 and unwinding and rewinding system 15, vacuum cavity 16 is provided with vacuum acquiring system 1, vacuum acquiring system 1 makes vacuum cavity 16 inside be vacuum state when work, and the magnetron sputtering area in the vacuum cavity 16 is provided with the target utmost point 7 of magnetron sputtering.The target utmost point 7 of magnetron sputtering is provided with two rows, and two row's target utmost points 7 can also can be the alternative form setting for form setting relatively.The magnetron sputtering area both sides are respectively arranged with unwinding and rewinding system 15.The target utmost point 7 is arranged in the target utmost point car 14, and target utmost point car 14 is connected with rear flange 13 movable sealings of vacuum cavity 16.Unwinding and rewinding system 15 vacuum cavities 16 also are that movable sealing connects.In order to make unwinding and rewinding system 15 and target utmost point car 14 aspect the unlatching, be arranged with guide rail 17 at vacuum cavity 16 in vacuum cavity 16, unwinding and rewinding system 15 and target utmost point car 14 are installed on the guide rail 17.Unwinding and rewinding system 15 is made up of unreeling shaft 2, Scroll 4, guide roller 5, tensioning roller 6, last drive roll 8 and following drive roll 9, base material in the unreeling shaft 2 enters magnetron sputtering area by guide roller 5, tensioning roller 6 and following drive roll 9, the base material that magnetron sputtering area is come out through last drive roll 8, tensioning roller 6 and guide roller 5 rollings in Scroll 4.Have circular vacuum chamber in the vacuum cavity 16, install around it at least 2 can arbitrarily angled installation vacuum acquiring system 1.Vacuum acquiring system 1 can be selected molecular pump for use.Deep cooling water trap 12 has been installed in the vacuum cavity 16, and deep cooling water trap 12 can cryopump.Cryopump has improved the pumping speed to base material venting in the continuous coating process, thereby has improved working efficiency.Be provided with ion source treatment unit 3 between drive roll 9 and the magnetron sputtering area inlet down,, improving the substrate surface roughness, guaranteeing the stripping strength between rete and the base material substrate surface is carried out ion bombardment.
The two cover unwinding and rewinding systems that are provided with can satisfy wide two-sided plating of volume of plating district full width and two volume single face platings.The plating district can be designed to 200～2300mm as required, promptly can carry out single face or double-faced sputter to the wide base material of 200～2300mm.The rolls line that detours has as Fig. 3～embodiment shown in Figure 6.Generally speaking, when single face or two-sided plating, unreeling shaft 2 unreels base material through guide roller 5, tensioning roller 6, guide roller 5 and following drive roll 9, after the ion source of ion source treatment unit 3 is handled, enter in the magnetron sputtering area through sputtering target 7 sputters, then just through last drive roll 8, guide roller 5, tensioning roller 6 and guide roller 5 rollings in Scroll 4.Unreeling shaft 2 and Scroll 4 can be provided with two respectively, the setting of can arranging in pairs or groups arbitrarily of unreeling shaft 2 and Scroll 4.Also can carry out single face plating to two volume base materials, the circuit of specifically reeling is referring to as shown in Figure 2, and promptly two unwinding and rewinding are opened simultaneously, and wherein unreeling shaft 2 is put a volume, and another unreeling shaft 2 is put a volume.Also can be used for width distinguishes the two volume base materials plating single faces of half or plates two-sided for plating.Two unwinding and rewinding system makes the vacuum plating pattern of base material have multiple choices, has strengthened the function of this vacuum magnetron sputtering coil film coating apparatus, satisfies the different requirements of various plating pieces.
Claims (8)
1, a kind of vacuum magnetron sputtering coil film coating apparatus, comprise vacuum cavity, vacuum acquiring system, the target utmost point and unwinding and rewinding system, it is characterized in that: vacuum cavity is provided with vacuum acquiring system, the intravital magnetron sputtering area of vacuum chamber is provided with the target utmost point of magnetron sputtering, the target utmost point of magnetron sputtering is provided with two rows, is respectively arranged with the unwinding and rewinding system in the magnetron sputtering area both sides.
2, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1, it is characterized in that: described unwinding and rewinding system by unreeling shaft, Scroll, guide roller, tensioning roller, go up drive roll and following drive roll is formed, base material in the unreeling shaft enters magnetron sputtering area by guide roller, tensioning roller and following drive roll, the base material that magnetron sputtering area is come out through last drive roll, tensioning roller and guide roller rolling in Scroll.
3, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: described vacuum acquiring system is a molecular pump.
4, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: be provided with the deep cooling water trap in the described vacuum cavity.
5, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 4 is characterized in that: described deep cooling water trap is a cryopump.
6, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: be provided with the ion source treatment unit between described drive roll down and the magnetron sputtering area inlet.
7, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: described vacuum cavity is for circular.
8, a kind of vacuum magnetron sputtering coil film coating apparatus as claimed in claim 1 is characterized in that: the described target utmost point is provided with two rows, two very alternative form settings of row's target.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100372130A CN101492809B (en) | 2009-02-17 | 2009-02-17 | Vacuum magnetron sputtering coil film coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100372130A CN101492809B (en) | 2009-02-17 | 2009-02-17 | Vacuum magnetron sputtering coil film coating apparatus |
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| Publication Number | Publication Date |
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| CN101492809A true CN101492809A (en) | 2009-07-29 |
| CN101492809B CN101492809B (en) | 2012-02-01 |
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| CN2009100372130A Active CN101492809B (en) | 2009-02-17 | 2009-02-17 | Vacuum magnetron sputtering coil film coating apparatus |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101892462A (en) * | 2010-07-13 | 2010-11-24 | 淮安富扬电子材料有限公司 | Production method and device of metallic binderless wire drawing film |
| CN101914755A (en) * | 2010-07-13 | 2010-12-15 | 淮安富扬电子材料有限公司 | Manufacturing method and device of winding banded ITO conductive film |
| CN104169459A (en) * | 2012-01-18 | 2014-11-26 | 纳沃萨恩公司 | Systems for forming photovoltaic cells on flexible substrates |
| CN105239052A (en) * | 2015-11-17 | 2016-01-13 | 广东腾胜真空技术工程有限公司 | Double-release and double-collection winding film coating device and method |
| CN107513693A (en) * | 2017-08-07 | 2017-12-26 | 深圳市烯谷能源控股有限公司 | A kind of modular manufacturing multipurpose devices of coiled vacuum coating machine |
| CN107841718A (en) * | 2017-10-30 | 2018-03-27 | 深圳市西陆光电技术有限公司 | One kind is without glue double side flexible copper coated board production equipment |
| CN105986238B (en) * | 2016-06-27 | 2018-10-09 | 广东腾胜真空技术工程有限公司 | The equipment of electron beam assisted plasma sputter flexibility coat copper plate |
| CN109930119A (en) * | 2018-01-22 | 2019-06-25 | 无锡光润真空科技有限公司 | Vacuum coater |
| CN114752913A (en) * | 2022-05-05 | 2022-07-15 | 温岭市倍福机械设备制造有限公司 | Reciprocating type double-sided high vacuum winding coating machine |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2706479Y (en) * | 2004-04-14 | 2005-06-29 | 衡阳市真空机电设备有限公司 | Bisurface sputtering vacuum winding continuous film plating equipment |
| CN101348896A (en) * | 2008-08-27 | 2009-01-21 | 浙江大学 | Winding type two-sided coating equipment |
| CN201358299Y (en) * | 2009-02-17 | 2009-12-09 | 广州力加电子有限公司 | Vacuum magnetron-sputtering type winding film-coating device |
-
2009
- 2009-02-17 CN CN2009100372130A patent/CN101492809B/en active Active
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101892462A (en) * | 2010-07-13 | 2010-11-24 | 淮安富扬电子材料有限公司 | Production method and device of metallic binderless wire drawing film |
| CN101914755A (en) * | 2010-07-13 | 2010-12-15 | 淮安富扬电子材料有限公司 | Manufacturing method and device of winding banded ITO conductive film |
| CN101914755B (en) * | 2010-07-13 | 2012-07-18 | 淮安富扬电子材料有限公司 | Manufacturing method and device of winding banded ITO conductive film |
| CN101892462B (en) * | 2010-07-13 | 2012-11-21 | 淮安富扬电子材料有限公司 | Production method and device of metallic binderless wire drawing film |
| CN104169459B (en) * | 2012-01-18 | 2017-03-01 | 纳沃萨恩公司 | Form the system of photovoltaic cell on flexible substrates |
| CN104169459A (en) * | 2012-01-18 | 2014-11-26 | 纳沃萨恩公司 | Systems for forming photovoltaic cells on flexible substrates |
| CN105239052A (en) * | 2015-11-17 | 2016-01-13 | 广东腾胜真空技术工程有限公司 | Double-release and double-collection winding film coating device and method |
| CN105986238B (en) * | 2016-06-27 | 2018-10-09 | 广东腾胜真空技术工程有限公司 | The equipment of electron beam assisted plasma sputter flexibility coat copper plate |
| CN107513693A (en) * | 2017-08-07 | 2017-12-26 | 深圳市烯谷能源控股有限公司 | A kind of modular manufacturing multipurpose devices of coiled vacuum coating machine |
| CN107841718A (en) * | 2017-10-30 | 2018-03-27 | 深圳市西陆光电技术有限公司 | One kind is without glue double side flexible copper coated board production equipment |
| CN109930119A (en) * | 2018-01-22 | 2019-06-25 | 无锡光润真空科技有限公司 | Vacuum coater |
| CN114752913A (en) * | 2022-05-05 | 2022-07-15 | 温岭市倍福机械设备制造有限公司 | Reciprocating type double-sided high vacuum winding coating machine |
| CN114752913B (en) * | 2022-05-05 | 2023-11-28 | 温岭市倍福机械设备制造有限公司 | Reciprocating double-sided high-vacuum winding film plating machine |
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| Publication number | Publication date |
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| CN101492809B (en) | 2012-02-01 |
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Denomination of invention: A vacuum magnetron sputtering winding coating device Effective date of registration: 20211229 Granted publication date: 20120201 Pledgee: Guangzhou Development Zone sub branch of Huaxia Bank Co.,Ltd. Pledgor: GUANGZHOU FANG BANG ELECTRONICS Co.,Ltd. Registration number: Y2021440000411 |
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Denomination of invention: A Vacuum Magnetron Sputtering Winding Coating Device Effective date of registration: 20221027 Granted publication date: 20120201 Pledgee: Guangzhou Development Zone sub branch of Huaxia Bank Co.,Ltd. Pledgor: GUANGZHOU FANG BANG ELECTRONICS Co.,Ltd. Registration number: Y2022440000285 |
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Granted publication date: 20120201 Pledgee: Guangzhou Development Zone sub branch of Huaxia Bank Co.,Ltd. Pledgor: GUANGZHOU FANG BANG ELECTRONICS Co.,Ltd. Registration number: Y2022440000285 |