CN101419928A - Receiving and converying device of workpiece and cutting device with the same - Google Patents
Receiving and converying device of workpiece and cutting device with the same Download PDFInfo
- Publication number
- CN101419928A CN101419928A CNA2008101706187A CN200810170618A CN101419928A CN 101419928 A CN101419928 A CN 101419928A CN A2008101706187 A CNA2008101706187 A CN A2008101706187A CN 200810170618 A CN200810170618 A CN 200810170618A CN 101419928 A CN101419928 A CN 101419928A
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- 239000004065 semiconductor Substances 0.000 abstract description 28
- 239000002574 poison Substances 0.000 abstract 2
- 231100000614 poison Toxicity 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 129
- 230000007246 mechanism Effects 0.000 description 18
- 238000007689 inspection Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000007723 transport mechanism Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The invention provides a work-piece containing/conveying device and cutter having the same; the work-piece containing/conveying device can reliably prevent the work pieces, as semiconductor chip from protruding from the work-piece containing part; the work-piece containing/conveying device comprises a first work-piece containing part for containing multiple work pieces; a second work-piece containing part arranged at the lower part of the first work-piece containing part; the second work-piece containing part comprises a frame body which has a first conveying inlet at the side of the work-piece conveying component and a second conveying inlet at the side of the operator; a work-piece bearing table which can be pulled out from the second conveying inlet in sliding way. The work-piece bearing table is connected with the frame body via the pulling-out sliding tracks; the bottom of the work-piece bearing table is equipped with a frame location pin applied with an upward force; when the work-piece bearing table is pulled to the predetermined poison in the frame body, the frame location pin and the guide block fixed on the bottom of the frame body are locked, so as to downwards pull the frame location pin to the predetermined poison.
Description
Technical field
The workpiece that the present invention relates to be used to take in workpiece such as semiconductor wafer is taken in carrying device and is had the topping machanism that this workpiece is taken in carrying device.
Background technology
Integrated circuit), LSI (Large Scale Integration: the device of One's name is legion such as large scale integrated circuit) semiconductor wafer is formed with IC (Integrated Circuit: from the teeth outwards, and device is cut apart preset lines (spacing track) and is divided and to come one by one, about this semiconductor wafer, utilize cutter sweep (topping machanism) to cut and cut apart preset lines after grinding is machined to preset thickness the back side being carried out by grinding attachment.Thereby be divided into device one by one, and be used in electric equipments such as mobile phone, personal computer.
Topping machanism comprises: the box carrying mechanism, and it has the box mounting table, and this box mounting table mounting is taken in the box of semiconductor wafer; Use wafer storage portion with checking, the bottom that it is provided in the box carrying mechanism is used to accommodate a block semiconductor wafer that becomes the inspection object.
Topping machanism also comprises: wafer transfer mechanism, and it is to being accommodated in box or checking and move into and take out of with the semiconductor wafer in the wafer storage portion; Chuck table, the semiconductor wafer that its maintenance is taken out of by wafer transfer mechanism; And cutting mechanism, it cuts (for example, with reference to TOHKEMY 2006-74004 communique) to the semiconductor wafer that remains on the chuck table.
Such mechanism has also been proposed: check all to be provided with opening in wafer transfer mechanism side and these both sides of operator's side with wafer storage portion, when the operator takes out semiconductor wafer, semiconductor wafer is slided so that take out (for example, with reference to No. 2997766 communique of Japan's special permission) to operator's side.
Use in the wafer storage portion in inspection, check with the mounting in the wafer storage portion have the slide mechanism of semiconductor wafer to slide, can easily take out with semiconductor wafer checking to operator's side by making by the operator with such mechanism.
After check finishing, by with semiconductor wafer once more mounting to slide mechanism, and in checking, slide with wafer storage portion, can easily use in the wafer storage portion to checking checking with semiconductor wafer storage.
Patent documentation 1: TOHKEMY 2006-74004 communique
Patent documentation 2: No. 2997766 communique of Japan's special permission
Patent documentation 3: Japanese Utility Model is registered communique No. 3122771
But, utilizing semiconductor wafer storage after slide mechanism will be checked under check with the situation in the wafer storage portion, if the operator firmly pushes slide mechanism, the impetus on the fore-and-aft direction during then owing to frequent the slip, wafer can fly out to the transport mechanism side sometimes.
If semiconductor wafer flies out to the transport mechanism side like this, then when box carrying mechanism or transport mechanism are up and down, there is danger with the semiconductor wafer collision.Therefore as disclosed in the patent documentation 1, proposed like this with inferior countermeasure: be provided for detecting the member of the protrusion of checking the usefulness wafer, perhaps the wafer mounting partly be provided as stopper ladder so that inspection can not protrude with wafer.
In patent documentation 1, taked such method: under wafer transfer mechanism takes out of from inspection semiconductor wafer with wafer storage portion situation, the binding clasp of transport mechanism will be equipped with the ring-shaped frame clamping of semiconductor wafer through cutting belt, cross ladder by lifting ring-shaped frame, thereby ring-shaped frame is pulled out to the transport mechanism direction.
But, at ring-shaped frame that clamped device clamps upward under the situation of perk (when particularly wafer diameter is big, even the perk angle is very little, it is very big that the perk amount also can become), in order to cross ladder, need to strengthen the amount of lifting, and only can not make ring-shaped frame cross ladder, thereby produced the conveyance mistake with the amount of drawing on the binding clasp.
Summary of the invention
The present invention finishes in view of these problems, and its purpose is, provides a kind of and can be accommodated in workpiece in the workpiece incorporating section reliably and can prevent that the workpiece of the conveyance mistake of workpiece from taking in carrying device.
According to the present invention, provide a kind of workpiece to take in carrying device, it is characterized in that this workpiece is taken in carrying device and comprised: the first workpiece incorporating section, it takes in a plurality of workpiece; The second workpiece incorporating section, it is provided in the bottom of the above-mentioned first workpiece incorporating section; Lift component, it makes above-mentioned first workpiece incorporating section and the lifting simultaneously of the above-mentioned second workpiece incorporating section; And work transporting member, it is with respect to above-mentioned first workpiece incorporating section or the above-mentioned second workpiece incorporating section approximate horizontal ground conveyance workpiece, the above-mentioned second workpiece incorporating section comprises: framework, and it has and is opened in first of above-mentioned work transporting member side and moves into mouthful and be opened in second of operator's side and move into mouth; The workpiece mounting table, it can second move into mouthful to slide and pull out from this; Two parallel sliding rails of pulling out, their ends separately are fixed in above-mentioned workpiece mounting table, and the other end is fixed in above-mentioned framework; At least one framework alignment pin, it to be can up and down mode running through the bottom of above-mentioned workpiece mounting table, and by the movable spring that cooperates by the application of force upward; And guiding elements, it is provided in the bottom of above-mentioned framework, this guide member can engage with the said frame alignment pin and this framework alignment pin is drop-down, when above-mentioned workpiece mounting table is pulled in above-mentioned framework inside or surpass certain position, above-mentioned guiding elements engages with the said frame alignment pin, thereby this framework alignment pin is pulled down to the precalculated position.
Preferably, the above-mentioned sliding rail of respectively pulling out comprises: spring, and it is to the direction application of force of above-mentioned workpiece mounting table in being pulled into above-mentioned framework; Locking component is drawn out to the above-mentioned sliding rail of pulling out under the state in precalculated position at the above-mentioned spring of opposing, and this locking component fixes on this springlock on the position of having extended; The latch-release member, when above-mentioned workpiece mounting table was pushed into the precalculated position with respect to above-mentioned framework, this latch-release member was removed the locking of above-mentioned locking component; And buffer component, behind latch-release, by the active force of above-mentioned spring, above-mentioned workpiece mounting table is drawn in the above-mentioned framework automatically, and this buffer component cushions the speed of the workpiece mounting table of this moment.
Preferably, the said frame alignment pin has large diameter head in the lower end, and above-mentioned guiding elements has: the groove that inserts this framework alignment pin; With the inclined-plane that can engage with the head of this framework alignment pin, this framework alignment pin above-mentioned head be inserted in the above-mentioned guiding groove when the above-mentioned inclined-plane of above-mentioned guiding elements engages, this framework alignment pin is pulled down to above-mentioned precalculated position at leisure thus.
According to the present invention, owing to can prevent reliably that workpiece from protruding from the second workpiece incorporating section, and need on the second workpiece incorporating section, ladder be set, so can prevent the conveyance mistake that causes by the perk of ladder and ring-shaped frame.
In addition, to adopt the workpiece mounting table of pulling out sliding rail during to the framework side closure, even close fiercely, by pulling out the buffer component of sliding rail, automatically the speed of drawing in framework is minimized, thus the airborne dust that has suppressed unwanted vibration and noise and caused by the collision of parts, and, even close, also can close reliably by the spring of pulling out sliding rail with very little power.
Description of drawings
Fig. 1 has the stereoscopic figure that workpiece of the present invention is taken in the topping machanism of carrying device.
Fig. 2 is the exploded stereogram of expression first and second wafer storage portions and lift component.
Fig. 3 is the stereogram of bootstrap block.
Fig. 4 (A) is the end view of pulling out sliding rail, and Fig. 4 (B) is the vertical view of pulling out sliding rail.
Fig. 5 is the exploded perspective view of application of force buffer gear.
Fig. 6 is the end view of slide lock parts.
Fig. 7 (A)～Fig. 7 (D) is the sectional view of the effect of explanation present embodiment.
Fig. 8 (A)～Fig. 8 (C) is the sectional view of the state of taking out of of the ring-shaped frame of explanation present embodiment.
Label declaration
2: topping machanism; 4: the first wafer storage portions; 6: the second wafer storage portions; 10: the first wafer transfer members; 11: framework; 12: the second wafer transfer members; 13: the wafer mounting table; 14: the wafer guide rail; 15: pull out sliding rail; 16: chuck table; 17: framework mounting portion; 18: cutting member; 19: ring-shaped frame; 20: cleaning element; 25: lift component (elevating mechanism); 66: main shaft; 68: cutting tool; 92: the framework alignment pin; 94: bootstrap block; 100: trapped orbit; 102: the first sliding rails; 104: the second sliding rails; 110: application of force buffer gear; 111: sliding stand; 114: hydraulic cylinder; 122: sliding shoe; 128: disc spring; 132: the slide lock parts.
Embodiment
Below, the execution mode that present invention will be described in detail with reference to the accompanying.With reference to Fig. 1, expression can be used the stereoscopic figure that workpiece of the present invention is taken in the topping machanism of carrying device (cutter sweep) 2.
The first wafer transfer member 10 is taken out of wafer from the first wafer storage portion 4 or the second wafer storage portion 6, and with the wafer transfer of taking out of to chuck table 16.And, will move into once more in the first wafer storage portion 4 or the second wafer storage portion 6 by the wafer that cleaning element 20 cleaned.
The first wafer transfer member 10 comprises: wafer supporting main part 22, clamp wafer clamp system 24, adsorption section 26, vertical moving parts 28, move horizontally parts 30, make air cylinder 32 that the vertical moving parts move in vertical direction, with move horizontally the ball-screw 36 that parts engage and the motor 38 of driving ball-screw 36.
Utilize the clamp system 24 of the first wafer transfer member 10 to clamp wafers wafer taken out from the first wafer storage portion 4 or the second wafer storage portion 6, and with the wafer mounting to a pair of wafer guide rail 14.
Then, make after clamp system 24 turns on the wafer supporting main part 22, CD-ROM drive motor 38 makes wafer supporting main part 22 move on the chuck table 16 along Y direction, and air cylinder 32 actions are moved in vertical direction.
Then, after by adsorption section 26 absorption wafers, the direction that a pair of wafer guide rail 14 separates is towards each other opened, wafer is positioned on the chuck table 16, and by chuck table 16 absorption wafers.
The second wafer transfer member 12 be used for the cutting after wafer from chuck table 16 conveyances to cleaning element 20.The second wafer transfer member 12 comprises: wafer supporting main part 40, adsorption section 42, vertical moving parts 44, move horizontally parts 46, make air cylinder 48 that vertical moving parts 44 move in vertical direction, with move horizontally the ball-screw 50 that parts 46 engage and the motor 52 of driving ball-screw 50.
Chuck table 16 can move on X-direction by chuck workbench moving arrangement 58, and these chuck table 16 mountings are on chuck table support unit 54.Chuck workbench moving arrangement 58 has: pedestal 56, the motor 64 that is installed in pair of guide rails 60 on the pedestal 56, ball-screw 62 and drives ball-screw 62.
Cutting member 18 sets to being positioned on the chuck table 16, and this chuck table 16 moves on X-direction by chuck workbench moving arrangement 58.Cutting member 18 is made of main shaft 66 and cutting tool 68, and main shaft 66 rotates by not shown motor, and cutting tool 68 is installed on the main shaft 66.
On the other hand, move horizontally the horizontal mobile mechanism 84 of piece 74, move in the horizontal direction along the pair of guide rails 86 that is fixed in support unit 82 by constituting by ball-screw 88 and motor 90.
Preferably as shown in Figure 2, wafer case 7 on box mounting table 5 constitutes by box mounting table 5 and mounting in the first wafer storage portion 4, be formed with a plurality of wafer mountings in the inboard two sides of box 7 with grooves 9, these wafer mountings are used for mounting with groove 9 and are installed in semiconductor wafer on the ring-shaped frame through cutting belt.
The second wafer storage portion 6 is arranged on the bottom of the first wafer storage portion 4, the second wafer storage portion 6 constitutes by the framework 11 of box-shaped with respect to the wafer mounting table 13 that framework 11 can be come in and gone out, and described framework 11 has and is opened in first of wafer transfer member side and moves into mouthful and be opened in second of operator's side and move into mouth.
On the top board 11a of framework 11, be formed with two snap fit tabs 23, lower surface in the wafer mounting table 5 of the first wafer storage portion 4 is formed with the engaging recessed part that engages with these snap fit tabs 23, by snap fit tabs 23 being engaged in the engaging recessed part of wafer mounting table 5, the first wafer storage portion 4 is stabilized the ground mounting to the second wafer storage portion 6.
On the bottom surface of the wafer mounting table 13 that can pull out of the second wafer storage portion 6, be provided with the two framework mounting portions (framework mounting track) 17 that are parallel to each other.Mounting ring-shaped frame 19 in these framework mounting portions 17.
Though do not illustrate especially, on ring-shaped frame 19, semiconductor wafer be installed through cutting belt.The second wafer storage portion 6 is the wafer storage portions that check usefulness, is installed in semiconductor wafer on the ring-shaped frame 19 and is the semiconductor wafer that is cut the inspection usefulness that device 2 cut cross.
Wafer mounting table 13 is mounted to by a pair of sliding rail 15 of pulling out and can comes in and goes out with respect to framework 11.The 21st, be used for the handle that wafer mounting table 13 is pulled out.
Through-wafer mounting table 13 bottomlands are provided with framework alignment pin 92, and this framework alignment pin 92 is by the following movable spring that the cooperates application of force upward.In the bottom of framework 11, be fixed with the bootstrap block 94 that engages with this framework alignment pin 92.
As shown in Figure 3, bootstrap block 94 is formed with: the guiding groove 96 that inserts framework alignment pin 92; The inclined-plane 94a that engages with the head of framework alignment pin 92; With framework alignment pin 92 is pulled down to the snap-latch surface 94b precalculated position, parallel with upper surface.Bootstrap block 94 is fixed in the bottom surface of framework 11 by screw 98.
Then, with reference to Fig. 4 to Fig. 6, the structure of pulling out sliding rail 15 is described.Fig. 4 (A) is the end view of pulling out sliding rail 15, and Fig. 4 (B) is the vertical view of pulling out sliding rail 15.Pulling out sliding rail 15 has: the trapped orbit 100 that is fixed in the framework 11 of the second wafer storage portion 6; First sliding rail 102 that can slide with respect to trapped orbit 100; And second sliding rail 104 that can slide with respect to first sliding rail 102.
With reference to Fig. 5, the exploded perspective view of the application of force buffer gear 110 of sliding rail 15 is pulled out in expression.In patent documentation 3, disclose this and pulled out the detailed content of the application of force buffer gear of sliding rail.
The sliding stand 111 of application of force buffer gear 110 is fixed in trapped orbit 100, the sliding tray 118 that this sliding stand 111 has hydraulic cylinder incorporating section 112 and extends along long side direction.Take in hydraulic cylinder 114 in hydraulic cylinder incorporating section 112, this hydraulic cylinder 114 has piston rod 116.
On the two sides of sliding stand 111, be formed with guiding groove 120 along sliding tray 118.The leading section of guiding groove 120 (right part among Fig. 5) 120a forms crooked bend downwards.
The 122nd, sliding shoe, it has a pair of lug boss 124 and the holding section 126 that is engaged in the guiding groove 120.The 132nd, the slide lock parts, as shown in Figure 6, slide lock parts 132 have: the snap fit tabs 134 that engages with the holding section 126 of sliding shoe 122; And be coupled to two pairs of projectioies 136,138 in the guiding groove 120 of sliding stand 111.
The front end of the piston rod 116 of hydraulic cylinder 114 is fixed in sliding shoe 122, one end 128a of disc spring 128 is engaged with the slot 130 of sliding stand 111, the other end 128b of disc spring 128 is engaged with the lug boss 124 of sliding shoe 122, with the snap fit tabs 134 of slide lock parts 132 engage with the holding section 126 of sliding shoe 122 carry out integrated, two pairs of lug bosses 136,138 of slide lock parts 132 are inserted in the guiding groove 120 of sliding stand 111, assemble application of force buffer gear 110 thus.
Then, with reference to Fig. 4 and Fig. 7 the summary of the action of application of force buffer gear 110 is described.Under the state in wafer mounting table 13 is accommodated in framework 11, the snap-latch piece 105 of second sliding rail 104 becomes the state that matches with the auxiliary section 146 of slide lock parts 132.
From this state, when holding handle 21 wafer mounting table 13 pulled out in framework 11, keeping under the state that engages of snap-latch piece 105 and first projection 142 of slide lock parts 132, the sliding shoe 122 and the slide lock parts 132 of engaging are drawn out mutually, so disc spring 114 extends at leisure.
When wafer mounting table 13 was drawn out to the precalculated position, second snap fit tabs 144 of slide lock parts 132 engaged with the connecting hole on the bottom surface that is formed on trapped orbit 100.By this engaging, second snap fit tabs 144 falls into connecting hole, so height step-down of first snap fit tabs 142, during by the further tractive wafer mounting table 13 of handle 21, first projection 142 of the snap-latch piece 105 of second sliding rail 104 and slide lock parts 132 engage disengaging, the active force of disc spring 128 disappears, so wafer mounting table 13 is drawn out fully.
Under this state, check with the cut state of semiconductor wafer that to checking this inspection semiconductor wafer is to be installed in the wafer that the cut on the ring-shaped frame 19 is crossed through cutting belt.At this moment, because second projection 144 of slide lock parts 132 engages with the connecting hole of trapped orbit 100, so application of force buffer gear 110 locks under the state that disc spring 128 has been elongated.
Shown in Fig. 7 (A), the framework alignment pin 92 that ring-shaped frame 19 is positioned on the wafer mounting table 13 has large diameter head 92a and the stop part 150 that is fixed in pin 92, by disc spring 152 activities being engaged between the bottom surface of stop part 150 and wafer mounting table 13, framework alignment pin 92 is always by towards the top application of force.
After having finished the inspection of semiconductor wafer, shown in Fig. 7 (A), under the state that pushes that has begun wafer mounting table 13, because framework alignment pin 92 more protrudes towards the top than framework mounting portion 17, therefore, about ring-shaped frame shown in Figure 2 19, because framework alignment pin 92 has played the effect as stop part, even so wafer mounting table 13 is pushed fiercely, the semiconductor wafer that is installed on ring-shaped frame 19 can not fly out from the second wafer storage portion 6 yet.
When wafer mounting table 13 is pushed into the precalculated position, the snap-latch piece 105 of second sliding rail 104 and the bearing surface 140a butt of the latch-release of slide lock parts 132 with projection 140, latch-release 140 is pressed into projection, thus the connecting hole of second snap fit tabs 144 of slide lock parts 132 and trapped orbit 100 engage disengaging.
Thus, wafer mounting table 13 is automatically drawn in the framework 11 by the active force of disc spring 128, but owing to the cushioning effect of its translational speed by hydraulic cylinder 114 cushioned, so wafer mounting table 13 is drawn in the framework 11 very lentamente.
At this moment, under the state shown in Fig. 7 (B), because framework alignment pin 92 and bootstrap block 94 butt not, so framework alignment pin 92 protrudes upward and plays the effect of stop part from framework mounting portion 17.
Shown in Fig. 7 (C), when wafer mounting table 13 is further drawn in, when the head 92a of framework alignment pin 92 engages with the inclined-plane 94a of bootstrap block 94, framework alignment pin 92 is by drop-down at leisure.
In the time of in wafer mounting table 13 is pushed into framework 11 fully, shown in Fig. 7 (D), because the head 92a of framework alignment pin 92 engages with the snap-latch surface 94b of bootstrap block 94, framework alignment pin 92 is pulled down to the position of submerging from the upper surface of framework mounting portion 17.
Thus, under this state, shown in Fig. 8 (A), make the clamp system 24 of the first wafer transfer member 10 close to the second wafer storage portion 6, shown in Fig. 8 (B), make movable clamp jaw 24b and move with respect to fixing to clamp pawl 24a, utilize clamp system 24 to clamp ring-shaped frame 19.
Since wafer orientation pin 92 by bootstrap block 94 be pulled than the upper surface of framework mounting portion 17 by time, so, shown in Fig. 8 (C), can ring-shaped frame 19 easily be pulled out from the second wafer storage portion 6 by clamp system 24, and can not be subjected to the obstruction of framework alignment pin 92.
Claims (4)
1. a workpiece is taken in carrying device, it is characterized in that,
This workpiece is taken in carrying device and is comprised:
The first workpiece incorporating section, it takes in a plurality of workpiece;
The second workpiece incorporating section, it is provided in the bottom of the above-mentioned first workpiece incorporating section;
Lift component, it makes above-mentioned first workpiece incorporating section and the lifting simultaneously of the above-mentioned second workpiece incorporating section; And
The work transporting member, it is with respect to above-mentioned first workpiece incorporating section or above-mentioned second workpiece incorporating section approximate horizontal ground conveyance workpiece,
The above-mentioned second workpiece incorporating section comprises: framework, and it has and is opened in first of above-mentioned work transporting member side and moves into mouthful and be opened in second of operator's side and move into mouth; The workpiece mounting table, it can second move into mouthful to slide and pull out from this; Two parallel sliding rails of pulling out, their ends separately are fixed in above-mentioned workpiece mounting table, and the other end is fixed in above-mentioned framework; At least one framework alignment pin, it to be can up and down mode running through the bottom of above-mentioned workpiece mounting table, and by the movable spring that cooperates by the application of force upward; And guiding elements, it is provided in the bottom of above-mentioned framework, and this guide member can engage with the said frame alignment pin and this framework alignment pin is drop-down,
When above-mentioned workpiece mounting table was pulled in above-mentioned framework inside or surpass certain position, above-mentioned guiding elements engaged with the said frame alignment pin, thereby this framework alignment pin is pulled down to the precalculated position.
2. workpiece as claimed in claim 1 is taken in carrying device, it is characterized in that,
The above-mentioned sliding rail of respectively pulling out comprises: spring, and it is to the direction application of force of above-mentioned workpiece mounting table in being pulled into above-mentioned framework; Locking component is drawn out to the above-mentioned sliding rail of pulling out under the state in precalculated position at the above-mentioned spring of opposing, and this locking component fixes on this springlock on the position of having extended; The latch-release member, when above-mentioned workpiece mounting table was pushed into the precalculated position with respect to above-mentioned framework, this latch-release member was removed the locking of above-mentioned locking component; And buffer component, behind latch-release, by the active force of above-mentioned spring, above-mentioned workpiece mounting table is drawn in the above-mentioned framework automatically, and this buffer component cushions the speed of the workpiece mounting table of this moment.
3. workpiece as claimed in claim 1 or 2 is taken in carrying device, it is characterized in that,
The said frame alignment pin has large diameter head in the lower end, above-mentioned guiding elements has: the groove that inserts this framework alignment pin; With the inclined-plane that can engage with the head of this framework alignment pin,
This framework alignment pin above-mentioned head be inserted in the above-mentioned guiding groove when the above-mentioned inclined-plane of above-mentioned guiding elements engages, this framework alignment pin is pulled down to above-mentioned precalculated position at leisure thus.
4. a topping machanism is characterized in that,
Any described workpiece that this topping machanism has in the claim 1 to 3 is taken in carrying device.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007273405A JP4921316B2 (en) | 2007-10-22 | 2007-10-22 | Work storage / conveyance device and cutting device including the work storage / conveyance device |
| JP2007273405 | 2007-10-22 | ||
| JP2007-273405 | 2007-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101419928A true CN101419928A (en) | 2009-04-29 |
| CN101419928B CN101419928B (en) | 2012-02-15 |
Family
ID=40630656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101706187A Active CN101419928B (en) | 2007-10-22 | 2008-10-22 | Receiving and converying device of workpiece and cutting device with the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4921316B2 (en) |
| CN (1) | CN101419928B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102117758A (en) * | 2009-11-27 | 2011-07-06 | 株式会社迪思科 | Transfer mechanism |
| CN110429044A (en) * | 2018-05-01 | 2019-11-08 | 株式会社迪思科 | Cutting apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011029550A (en) | 2009-07-29 | 2011-02-10 | Muratec Automation Co Ltd | Conveyor system, and setting method therefor |
| JP7061012B2 (en) * | 2018-05-01 | 2022-04-27 | 株式会社ディスコ | Processing equipment |
| KR102628311B1 (en) * | 2021-06-02 | 2024-01-24 | (주) 엔지온 | Inspection unit, inspection apparatus with the same, method for controllling the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03122771U (en) * | 1990-03-28 | 1991-12-13 | ||
| JPH10163094A (en) * | 1996-12-03 | 1998-06-19 | Nikon Corp | Light-exposing device, light-exposing method, and conveying device |
| JP2005045134A (en) * | 2003-07-25 | 2005-02-17 | Disco Abrasive Syst Ltd | Processing device of semiconductor wafer |
| WO2005082751A1 (en) * | 2004-03-01 | 2005-09-09 | Hirata Corporation | Substrate carrying in/out device and method of carrying in/out substrate |
| JP2006074004A (en) * | 2004-08-02 | 2006-03-16 | Disco Abrasive Syst Ltd | Work conveying housing equipment, and grinding equipment provided with the same |
-
2007
- 2007-10-22 JP JP2007273405A patent/JP4921316B2/en active Active
-
2008
- 2008-10-22 CN CN2008101706187A patent/CN101419928B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102117758A (en) * | 2009-11-27 | 2011-07-06 | 株式会社迪思科 | Transfer mechanism |
| CN102117758B (en) * | 2009-11-27 | 2015-09-02 | 株式会社迪思科 | Transport mechanism |
| CN110429044A (en) * | 2018-05-01 | 2019-11-08 | 株式会社迪思科 | Cutting apparatus |
| CN110429044B (en) * | 2018-05-01 | 2024-02-20 | 株式会社迪思科 | Cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101419928B (en) | 2012-02-15 |
| JP2009105109A (en) | 2009-05-14 |
| JP4921316B2 (en) | 2012-04-25 |
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