CN101359602B - Assembly method for single chip foldable surface adhesive semi-conductor component - Google Patents
Assembly method for single chip foldable surface adhesive semi-conductor component Download PDFInfo
- Publication number
- CN101359602B CN101359602B CN200710143823XA CN200710143823A CN101359602B CN 101359602 B CN101359602 B CN 101359602B CN 200710143823X A CN200710143823X A CN 200710143823XA CN 200710143823 A CN200710143823 A CN 200710143823A CN 101359602 B CN101359602 B CN 101359602B
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- China
- Prior art keywords
- tablet
- semiconductor
- row
- shell spare
- tin cream
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000853 adhesive Substances 0.000 title claims description 14
- 230000001070 adhesive effect Effects 0.000 title claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000006071 cream Substances 0.000 claims abstract description 31
- 239000013078 crystal Substances 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 7
- 239000010439 graphite Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 61
- 238000005476 soldering Methods 0.000 claims description 9
- 230000004308 accommodation Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Die Bonding (AREA)
Abstract
The invention provides a method for assembling a single-chip surface-adhered foldable semiconductor subassembly, including the following steps: (a), dotting the lower tablets with tin cream: dotting tin cream on the lower tablets in the baseplate of the shell of a semiconductor which is provided with a plurality of upper tablets and lower tablets which are arranged in rows pairwise; (b)adhering the chips: placing the semiconductor chips on the lower tablets described in step(a); (c) dotting tin cream on the crystal grains: dotting tin cream on the surfaces of the crystal grains on the lower tablets of the baseplate of the shell of the semiconductor described in step(a); (d), doubling up and splicing lower and upper tablets: doubling up the upper tablets one by one to the lower tablets which are dotted with tin cream in step(c); (e), transferring the tablets: transferring the baseplate of the shell of the semiconductor whose upper tablets and lower tablets are doubled up and spliced in step(d)to a graphite plate; and (f), welding in a welding furnace: sending the baseplate of the shell of the semiconductor from step(e)to a welding furnace for welding and assembling into a semiconductor subassembly. The invention can greatly improve the fineness rate and quality of the assembling of the product.
Description
Technical field
The present invention relates to the processing method of semiconductor subassembly, relate in particular to a kind of use upper and lower shell spare tablet doubling and altogether structure in same housing substrate, to carry out the assembly method for single chip foldable surface adhesive semi-conductor component of the bonding and welding assembly of the accurate doubling of upper and lower shell spare materials and parts one.
Background technology
In the assembling manufacture process of existing surface adhering diode assembly, upper and lower shell spare need be docked bonding, for example: upper casing spare substrate A as shown in Figure 1 and lower shell substrate B shown in Figure 2, this upper casing spare substrate A is provided with several upper casing spares in a row A1, also is provided with several lower shell B1 in a row on this lower shell substrate B; Wherein, coat tin cream in each lower shell B1 of this lower shell substrate B, and diode chip for backlight unit is bonded in the lower shell B1, then each the upper casing spare Al in the upper casing spare substrate A is coated tin cream, and with lower shell B1 in a row among upper casing spare A1 in a row among the upper casing spare substrate A and the lower shell substrate B coincide dock bonding, enter in the solder furnace again and weld, thereby finish the assembling of this surface adhering diode assembly.
In the above-mentioned existing surface adhering diode assembly assemble method, this upper casing spare substrate A docks with lower shell substrate B in the bonding process and easily to produce skew and to make upper casing spare substrate A can't accurately dock bonding with lower shell substrate B, cause the defective products rate of diode assembly after welding assembly is finished too high, influence the quality of diode assembly assembling; In addition, this upper casing spare substrate A and lower shell substrate B belong to two different metal sheets, even if make the composition material of this upper casing spare substrate A and lower shell substrate B identical, this both metal heated coefficient of expansion also has difference, thereby after making upper casing spare substrate A and lower shell substrate B bonding, because expanded by heating center difference, cause the upper casing spare A1 of upper casing spare substrate A or the lower shell B1 of lower shell substrate B to produce torsional deformation, the diode chip for backlight unit that is coated is formed the stress of distortion, cause this diode chip for backlight unit to produce and destroy, influence the operational function of diode assembly.
Summary of the invention
Main purpose of the present invention is to overcome the above-mentioned shortcoming that existing product exists, and provide a kind of assembly method for single chip foldable surface adhesive semi-conductor component, have several pieces following tablets and go up the tablet antithesis semiconductor shell spare substrate of structure altogether, after putting tin cream, sticking crystalline substance on this time tablet and the crystal grain, directly carry out antithesis in a row on the shell spare substrate and amount to stickup partly leading with a slice, it is corresponding bonding that this time tablet and last tablet can accurately be coincide, and makes semiconductor subassembly can significantly promote the yield and the quality of product assembling after assembling.
A further object of the present invention is to provide a kind of assembly method for single chip foldable surface adhesive semi-conductor component, this time tablet reaches goes up the sheet metal formation of tablet at same chip semiconductor shell spare substrate, following tablet and on the tablet doubling bonding during with welding assembly, can make the tablet on this and the identical unanimity in expanded by heating center of tablet down, can torsional deformation after guaranteeing this time tablet and go up tablet to assemble and influence the operational function of the semiconductor die that is coated.
The objective of the invention is to realize by following technical scheme.
Assembly method for single chip foldable surface adhesive semi-conductor component of the present invention, the last tablet that semiconductor shell spare substrate is provided with several antithesis in a row reaches tablet down, tablet in a row is connected in series one by one on each, following tablet also in a row is connected in series one by one, and the structure of antithesis mutually in a row about on each between tablet and following tablet being, described method comprises step:
(a) following tablet point tin cream has the last tablet of several pieces antithesis in a row and puts upward tin cream in each time tablet in the semiconductor shell spare substrate of tablet down one;
(b) sticking brilliant, semiconductor chip is put and is pasted in each time tablet of step (a);
(c) put tin cream on the crystal grain, with tin cream on each blanking sheet crystal grain surface point of the semiconductor shell spare substrate of step (a);
(d) following tablet and last tablet doubling are bonding, will go up tablet has been finished some tin cream on the crystal grain with tabs mode doubling by row to step (c) each time tablet;
(e) tablet transfer is finished the bonding semiconductor shell spare substrate of tablet and following tablet doubling with step (d) and is passed on the graphite cake;
(f) send soldering furnace welding to, the semiconductor shell spare substrate that step (e) is finished the tablet transfer is sent in the soldering furnace and is welded, and the semiconductor assembly is finished in assembling,
Each row of semiconductor shell spare substrate in this step (a) goes up the tablet upper end and the lower end at least respectively is provided with a corresponding aperture, tablet upper end and lower end at least respectively are provided with a corresponding aperture under each row of semiconductor shell spare substrate in the described step (a), each row of semiconductor shell spare substrate in the described step (d) goes up tablet and tablet is bonding by the mutual doubling of an automatic tabs machine down, and the semiconductor shell spare in the described step (e) is passed on the graphite cake by the tablet transfer.
Aforesaid assembly method for single chip foldable surface adhesive semi-conductor component is characterized in that, each row of the semiconductor shell spare substrate in the described step (a) is provided with an accommodation chamber in the tablet down.
Aforesaid assembly method for single chip foldable surface adhesive semi-conductor component is characterized in that, by automatically sticking brilliant machine semiconductor chip is put and is bonded in each time tablet in the described step (b).
The beneficial effect of assembly method for single chip foldable surface adhesive semi-conductor component of the present invention, this method comprise down puts tin cream, tablet and go up that the tablet doubling is bonding, tablet is transferred and send step such as soldering furnace welding to down on tablet point tin cream, sticking brilliant, the crystal grain; Wherein, in this first tablet point tin cream step, be one have several pieces down tablets and on the tablet antithesis click and enter tin cream on the following tablet on the semiconductor shell spare substrate of structure altogether; Should sticking brilliant step be to be adhered to down in the tablet by the one side of automatically sticking brilliant machine with semiconductor chip; Point tin cream step is to click and enter tin cream at grain surface again on this crystal grain; This time tablet and last tablet doubling adhesion step are by an automatic tabs machine that the following tablet and the last tablet doubling by row of this semiconductor shell spare substrate is bonding; This tablet transfer step is to move on the graphite cake by the semiconductor shell spare substrate of tablet transfer machine after with tabs, and send to again and carry out welding assembly in the soldering furnace, go out the surface adhering semiconductor subassembly with further assembly, reach the inventive method and make semiconductor subassembly assembling quality, acceptance rate promote and guarantee the effect of semiconductor subassembly chip operational function.
Description of drawings:
Fig. 1 is the upper casing spare base plan figure of existing diode assembly assembling.
Fig. 2 is the lower shell base plan figure of existing diode assembly assembling.
Fig. 3 is an assemble method flow chart of the present invention.
Fig. 4 is the semiconductor shell spare substrate first embodiment plane graph of the inventive method.
Fig. 5 is an overall structure plane graph shown in Figure 4, wherein, shows that going up tablet antithesis in a row in the semiconductor shell spare substrate amounts to the state that is bonded in down tablet.
Fig. 6 is the semiconductor shell spare substrate second embodiment plane graph of the inventive method.
Fig. 7 amounts to for the last tablet antithesis in a row in the semiconductor shell spare substrate shown in Figure 6 and is bonded in the state diagram of blanking sheet.
Major label description in figure: 10 times tablet point tin creams, 20 is sticking brilliant, put tin cream on 30 crystal grain, the tablet doubling was bonding on 40 times tablets reached, the transfer of 50 tablets, 60 send the soldering furnace welding to, 100 semiconductor shell spare substrates, 100 ' semiconductor shell spare substrate, tablet on 110,110 ' goes up tablet, 111 corresponding apertures, 120 times tablets, 120 ' time tablet, 121 corresponding apertures, 122 accommodation chambers, 200 surface adhering semiconductor subassemblies, A upper casing spare substrate, A1 upper casing spare, B lower shell substrate, the B1 lower shell.
Embodiment
Consult Fig. 3, Fig. 4 and shown in Figure 5, wherein, Fig. 3 is the flow chart of assembly method for single chip foldable surface adhesive semi-conductor component of the present invention, Fig. 4 shows the semiconductor shell spare substrate 100 that uses in the inventive method, the last tablet 110 that this semiconductor shell spare substrate 100 is provided with several antithesis in a row reaches tablet 120 down, be that tablet 110 in a row is connected in series one by one on each, following tablet 120 also in a row is connected in series one by one, and on each tablet 110 and 120 of following tablets be about the mutual in a row structure of antithesis, and upper end and lower end that each row goes up in the tablet 110 at least respectively are provided with a corresponding aperture 111, and upper end and lower end under each row in the tablet 120 at least respectively are provided with a corresponding aperture 121, be provided with an accommodation chamber 122 in this time tablet 120, the step of this method comprises:
(10) tablet point tin cream under is gone up tin creams with point in the accommodation chamber 122 of each time tablet 120 in the semiconductor shell spare substrate 100 shown in Figure 4.
(20) sticking brilliant, semiconductor chip is put and is pasted on by sticking brilliant machine automatically in the accommodation chamber 122 of each time tablet 120 of step 10.
(30) put tin cream on the crystal grain, each semiconductor grain surface point of semiconductor shell spare substrate 100 shown in Figure 4 is gone up tin cream.
(40) following tablet and last tablet doubling are bonding, to go up tablet 110 and finish each time tablet 120 of putting tin cream on the crystal grain by automatic tabs machine with tabs mode doubling by row bonding (as shown in Figure 5) to step 30, corresponding aperture 111 of tablet 110 provides each row to go up tablet 110 and the bonding corresponding benchmark of following tablet 120 doublings with the corresponding aperture 121 of following tablet 120 on this.
(50) tablet transfer is finished the bonding semiconductor shell spare substrate 100 of tablet 110 and following tablet 120 doublings with step 40 and is passed on the graphite cake by tablet transfer machine.
(60) send soldering furnace welding to, the semiconductor shell spare substrate 100 that step 50 is finished the tablet transfer is sent in the soldering furnace and is welded, and assembly goes out surface adhering semiconductor subassembly 200 as shown in Figure 7.
Consult Fig. 6, shown in Figure 7, the applied semiconductor subassembly assembling of method of the present invention, be not limited to the last tablet 110 of above-mentioned semiconductor shell spare substrate 100 and the assembling of tablet 120 shapes down, the last tablet 110 ' of semiconductor shell spare substrate 100 ' as shown in Figure 6 reaches tablet 120 ' shape down, also can finish the accurate doubling assembling (as shown in Figure 7) of semiconductor subassembly by above-mentioned steps 10 to 60 assemble methods, thereby can finish the assembling of different face shaping semiconductor subassembly products, and then make the inventive method can be applicable to the surface adhering semiconductor subassembly assembling of various different face shapings.
Above-mentioned Fig. 3 is to assembly method for single chip foldable surface adhesive semi-conductor component of the present invention shown in Figure 7, the wherein explanation that is disclosed and graphic, be for ease of illustrating technology contents of the present invention and technological means, the a corner of the preferred embodiment that discloses, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (3)
1. assembly method for single chip foldable surface adhesive semi-conductor component, the last tablet that semiconductor shell spare substrate is provided with several antithesis in a row reaches tablet down, tablet in a row is connected in series one by one on each, following tablet also in a row is connected in series one by one, and the structure of antithesis mutually in a row about on each between tablet and following tablet being, described method comprises step:
(a) following tablet point tin cream has the last tablet of several pieces antithesis in a row and puts upward tin cream in each time tablet in the semiconductor shell spare substrate of tablet down one;
(b) sticking brilliant, semiconductor chip is put and is pasted in each time tablet of step (a);
(c) put tin cream on the crystal grain, with tin cream on each blanking sheet crystal grain surface point of the semiconductor shell spare substrate of step (a);
(d) following tablet and last tablet doubling are bonding, will go up tablet has been finished some tin cream on the crystal grain with tabs mode doubling by row to step (c) each time tablet;
(e) tablet transfer is finished the bonding semiconductor shell spare substrate of tablet and following tablet doubling with step (d) and is passed on the graphite cake;
(f) send soldering furnace welding to, the semiconductor shell spare substrate that step (e) is finished the tablet transfer is sent in the soldering furnace and is welded, and the semiconductor assembly is finished in assembling, it is characterized in that:
Each row of semiconductor shell spare substrate in the described step (a) goes up the tablet upper end and the lower end at least respectively is provided with a corresponding aperture, and each row of the semiconductor shell spare substrate in the described step (a) tablet upper end and lower end down at least respectively is provided with a corresponding aperture,
By automatically sticking brilliant machine semiconductor chip is put and is bonded in each time tablet in the described step (b),
Semiconductor shell spare in the described step (e) is passed on the graphite cake by the tablet transfer.
2. assembly method for single chip foldable surface adhesive semi-conductor component according to claim 1 is characterized in that: each row of the semiconductor shell spare substrate in the described step (a) is provided with an accommodation chamber in the tablet down.
3. state according to power and require 1 described assembly method for single chip foldable surface adhesive semi-conductor component, it is characterized in that: each row of the semiconductor shell spare substrate in the described step (d) goes up tablet and tablet is bonding by the mutual doubling of an automatic tabs machine down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710143823XA CN101359602B (en) | 2007-08-03 | 2007-08-03 | Assembly method for single chip foldable surface adhesive semi-conductor component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710143823XA CN101359602B (en) | 2007-08-03 | 2007-08-03 | Assembly method for single chip foldable surface adhesive semi-conductor component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101359602A CN101359602A (en) | 2009-02-04 |
| CN101359602B true CN101359602B (en) | 2010-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200710143823XA Expired - Fee Related CN101359602B (en) | 2007-08-03 | 2007-08-03 | Assembly method for single chip foldable surface adhesive semi-conductor component |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103187317B (en) * | 2011-12-31 | 2015-08-05 | 百容电子股份有限公司 | The assemble method of semiconductor element |
| CN109473386B (en) * | 2018-12-28 | 2023-10-24 | 乐山希尔电子股份有限公司 | Semiconductor device assembling method and production line thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5224023A (en) * | 1992-02-10 | 1993-06-29 | Smith Gary W | Foldable electronic assembly module |
| US5614441A (en) * | 1993-06-14 | 1997-03-25 | Kabushiki Kaisha Toshiba | Process of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated package |
| US6562641B1 (en) * | 2000-08-22 | 2003-05-13 | Micron Technology, Inc. | Apparatus and methods of semiconductor packages having circuit-bearing interconnect components |
| CN1703768A (en) * | 2002-09-30 | 2005-11-30 | 英特尔公司 | Forming folded-stack packaged device using progressive folding tool |
-
2007
- 2007-08-03 CN CN200710143823XA patent/CN101359602B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5224023A (en) * | 1992-02-10 | 1993-06-29 | Smith Gary W | Foldable electronic assembly module |
| US5614441A (en) * | 1993-06-14 | 1997-03-25 | Kabushiki Kaisha Toshiba | Process of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated package |
| US6562641B1 (en) * | 2000-08-22 | 2003-05-13 | Micron Technology, Inc. | Apparatus and methods of semiconductor packages having circuit-bearing interconnect components |
| CN1703768A (en) * | 2002-09-30 | 2005-11-30 | 英特尔公司 | Forming folded-stack packaged device using progressive folding tool |
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| Publication number | Publication date |
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| CN101359602A (en) | 2009-02-04 |
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Granted publication date: 20100609 |