CN101350339A - 带载基板和半导体器件 - Google Patents

带载基板和半导体器件 Download PDF

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Publication number
CN101350339A
CN101350339A CN 200810131639 CN200810131639A CN101350339A CN 101350339 A CN101350339 A CN 101350339A CN 200810131639 CN200810131639 CN 200810131639 CN 200810131639 A CN200810131639 A CN 200810131639A CN 101350339 A CN101350339 A CN 101350339A
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CN
China
Prior art keywords
band
width
base board
base material
slit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200810131639
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English (en)
Chinese (zh)
Inventor
小坂幸广
中村嘉文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN101350339A publication Critical patent/CN101350339A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN 200810131639 2007-07-17 2008-07-16 带载基板和半导体器件 Pending CN101350339A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007185133 2007-07-17
JP2007185133 2007-07-17
JP2008110806 2008-04-22

Publications (1)

Publication Number Publication Date
CN101350339A true CN101350339A (zh) 2009-01-21

Family

ID=40269049

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200810131639 Pending CN101350339A (zh) 2007-07-17 2008-07-16 带载基板和半导体器件

Country Status (2)

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JP (1) JP2009044126A (ja)
CN (1) CN101350339A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102608777A (zh) * 2011-11-04 2012-07-25 深圳市华星光电技术有限公司 一种cof封装单元及cof封装卷带
CN106028620A (zh) * 2016-06-03 2016-10-12 苏州同佳精密五金厂 一种硬板模
CN107854137A (zh) * 2016-09-21 2018-03-30 精工爱普生株式会社 安装构造体以及电子设备
CN111793445A (zh) * 2019-07-22 2020-10-20 宜兴市文晖文具有限公司 一种带有金葱粉的胶带及其制备方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102608777A (zh) * 2011-11-04 2012-07-25 深圳市华星光电技术有限公司 一种cof封装单元及cof封装卷带
US8780577B2 (en) 2011-11-04 2014-07-15 Shenzhen China Star Optoelectronics Technology Co., Ltd. COF packaging unit and COF packaging tape
CN106028620A (zh) * 2016-06-03 2016-10-12 苏州同佳精密五金厂 一种硬板模
CN107854137A (zh) * 2016-09-21 2018-03-30 精工爱普生株式会社 安装构造体以及电子设备
CN111793445A (zh) * 2019-07-22 2020-10-20 宜兴市文晖文具有限公司 一种带有金葱粉的胶带及其制备方法

Also Published As

Publication number Publication date
JP2009044126A (ja) 2009-02-26

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20090121