CN101346046A - Plastering apparatus and method for printed circuit board - Google Patents
Plastering apparatus and method for printed circuit board Download PDFInfo
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- CN101346046A CN101346046A CNA2008101330520A CN200810133052A CN101346046A CN 101346046 A CN101346046 A CN 101346046A CN A2008101330520 A CNA2008101330520 A CN A2008101330520A CN 200810133052 A CN200810133052 A CN 200810133052A CN 101346046 A CN101346046 A CN 101346046A
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Abstract
The invention relates to adhering device and method for printed circuit board. A covering film is adhered to surface of printed circuit substrate and adhering position is precise and deviation can not occur even if size of printed circuit substrate changes and possesses deviation. The device comprises a temporary adhering device, composed of bottom heating board and top heating board; the bottom heating board, disposed on bottom surface of long strip FPC, is placed with scissored covering film; the top heating board is opposite to the bottom heating board and disposed at upper of long strip FPC; the device enables FPC workpiece and covering film contrapositioned, and can be temporarily fixed by the bottom and top heating boards; a first image reading platform, shooting for target preset in FPC before temporarily fixing covering film, detecting size change of workpiece; temperature of bottom heating board is partly changed according to change data of size of workpiece detected by the first image reading platform, size of covering film is forcefully changed.
Description
Technical field
The present invention relates to the sticker and the method for attaching of printed circuit board (PCB), the surface protection applying of cover film that in particular, the present invention relates to the internal layer of flexible printed circuit board (being called FPC below), multi-layer FPC.
Background technology
This printed circuit board (PCB) forms circuit on rectangular baseplate material, then, fit on the rectangular baseplate material cutting out cover film in blocks, makes.Such as, Fig. 8 (a), Fig. 8 (b) are the key diagram of the sticker of printed circuit board (PCB) in the past, Fig. 8 (a) is a vertical view, the end view of Fig. 8 (b) for watching from the arrow C direction of Fig. 8 (a).Be rectangular cover film 10 that the roller shape reels by transporting clip 21 and fixing clip 22, size is extracted out according to the rules, by cutting out mechanism 23, cuts out with sheet.The cover film of having cut out 11 is positioned on the placement head (bottom side described later heating plate) 25, is adsorbed fixing.The cover film 11 of sheet is fixed in state on the placement head 25 in absorption, shown in double dot dash line, shifts to the bottom position of the FPC30 that rolls out from roller.In addition, label 24 is represented and the collection box of the discharge film that sheet cover film 11 is peeled off.
In absorption fixedly on the placement head 25 of the cover film 11 of sheet, be built-in with the heater of heater etc., be used as bottom side heating plate 25.On the other hand, face with this bottom side heating plate 25, above above-mentioned FPC30, top side heating plate 26 is set, form interim bonding agency 40, by being arranged at the contraposition mechanism (not shown) on the bottom side heating plate 25, the workpiece 31 of relative FPC30 is with cover film 11 contrapositions, then, bottom side heating plate 25 and top side heating plate 26 are engaged temporary fixed cover film 11.Behind temporary fixed cover film 11,, that cover film 11 is bonding by thermal compressor 41.
General people know, when the applying cover film, the contraposition sign is carried out image read, cover film is positioned at absorption is fixed on the baseplate material on the platform, with it is bonding temporarily (such as, with reference to patent documentation 1).
Here, rectangular FPC rolls out, is involved in from roller repeatedly in forming circuit etc., produces change in size.Especially at etching step, carry out tensioning, cover Copper Foil, thus, after the tendency of shrinking when removing tension force bigger.Generally, rule of thumb value compensates the size of cutting out of cover film, and still, FPC can take place shrink according to the above degree of anticipation, or opposite situation of not shrinking according to the anticipation degree.Particularly, follow the coiling of roller to begin, the end of reeling, or the change in size by the device FPC that between roller, uses, dislocation when fitting in cover film on the workpiece, produced.
Fig. 9 (a), Fig. 9 (b) are the key diagram of its shape cover film 11 identical with rectangular workpiece 31 on being formed at rectangular FPC30 of fitting.Shown in the image pattern 9 (a) like that, in the occasion of change in size as estimating of the L of roller side and R side, the shape of workpiece 31 relatively, applying cover film 11 under the situation that does not produce dislocation.Relative this situation, shown in the image pattern 9 (b) like that, have the occasion that departs from the change in size of the L of roller side and R side, workpiece 31 is trapezoidal shape, if fit rectangular cover film 11, then produces dislocation mutually.
In recent years the densification and the requirement of granular relatively, the permissible value of the dislocation during the applying cover film are more and more harsher, require the technology of fitting with better precision.
Patent documentation 1: TOHKEMY 2004-319688 document
Summary of the invention
So, when the objective of the invention is on the surface that cover film is fitted in the printed circuit base material,, make positional precision more accurate even have under the situation about departing from the change in size of printed circuit base material, do not produce deviation.
The present invention proposes to achieve these goals, technical scheme 1 described invention provides the sticker of following printed circuit board (PCB), wherein, for to carrying out insulation protection by the circuit-formed printed circuit base material that is formed on the insulating substrate, on the rectangular printed circuit base material that rolls out from roller, the cover film that the size according to the rules of fitting is continuously cut out, this device is made of interim bonding agency and thermal compressor, this interim bonding agency is made of bottom side heating plate and top side heating plate, this bottom side heating plate is placed the above-mentioned cover film of cutting out, be arranged on the bottom surface of above-mentioned rectangular printed circuit base material, this top side heating plate and above-mentioned bottom side heating plate are faced, be arranged at the top of above-mentioned rectangular printed circuit base material, workpiece and cover film contraposition with above-mentioned printed circuit base material, by above-mentioned bottom side heating plate and top side heating plate and it is temporary fixed, this thermal compressor will be shifted to above-mentioned printed circuit base material that is involved in direction and the cover film crimping that is temporarily fixed on the printed circuit base material, it is characterized in that this device comprises that the 1st image reads platform, it is before temporary fixed above-mentioned cover film, the target that sets in advance on the printed circuit base material is made a video recording, detect the change in size of workpiece; Controlling organization, it controls the temperature of above-mentioned bottom side heating plate and top side heating plate according to reading the detected workpiece size data of platform by above-mentioned the 1st image, carries out the dimension compensation of cover film and printed circuit base material.
According to this scheme, before temporary fixed cover film, read platform by the 1st image, the target that is arranged on the printed circuit base material is made a video recording, detect the change in size of workpiece.When temporary fixed cover film, change in size according to detected workpiece, controlling organization is controlled the temperature of bottom side heating plate and top side heating plate respectively independently, utilize the thermal expansion of printed circuit base material and cover film, carry out dimension compensation, carry out the contraposition of the workpiece and the cover film of printed circuit base material.
According to this scheme, according to the change in size that reads the workpiece that platform detects by the 1st image, controlling organization carries out temperature control at every of bottom side heating plate at least, partly changes the temperature of heating plate, poor by thermal expansion changes the size of cover film forcibly.
According to such scheme, pass through image processing, obtain the target, corresponding with this target and be arranged at the corresponding center of the target that the punching press of the circle on the cover film produces of circular pattern in 4 bights of the workpiece that is arranged at the printed circuit base material, the occasion that staggers at both sides' center, the temperature of controlling organization control heating plate is carried out dimension compensation according to the mode of both sides' center unanimity.
According to this scheme, after temporary fixed cover film, read platform by the 2nd image, the target of printed circuit base material and the target of cover film are made a video recording, according to the center of both sides' target consistent mode having or not of confirming to misplace whether.
According to this scheme, before temporary fixed cover film, the target that is arranged on the printed circuit base material is made a video recording, detect the change in size of workpiece, according to detected change in size, partly change the temperature of heating plate, change the size of cover film forcibly, realize the contraposition of the workpiece of cover film and printed circuit base material.
In technical scheme 1 described invention, before interim cover film, read platform by the 1st image, the target that is arranged at the printed circuit base material is made a video recording, detect the change in size of workpiece, change in size according to detected workpiece, controlling organization is controlled the temperature of bottom side heating plate and top side heating plate respectively independently, thus, can adopt the both sides' of printed circuit base material and cover film thermal expansion, carry out dimension compensation, when temporary fixed, can correctly carry out the contraposition of the workpiece and the cover film of printed circuit base material.
In technical scheme 2 described inventions, because inciting somebody to action at least, the bottom side heating plate is divided into a plurality of, form according to carrying out temperature controlled mode at each piece, the effect of scheme 1 described invention so not only possess skills, even the change in size at the printed circuit base material has under the situation about departing from, still partly change the temperature of heating plate, change the size of cover film forcibly, thus, can further carry out the contraposition of the workpiece and the cover film of printed circuit base material exactly, even and have for change in size under the situation of workpiece of the printed circuit base material that departs from, still can be used as goods, can improve the qualification rate of goods.
In technical scheme 3 described inventions, obtain by image processing the workpiece that is arranged at the printed circuit base material 4 bights circular pattern target, be arranged at the corresponding center of target of the punching press of the circle on the cover film corresponding to this target, mode according to both sides' center unanimity is carried out dimension compensation, thus, the effect of scheme that not only possesses skills 1 or 2 described inventions, and can be accurately and easily carry out the contraposition of the workpiece and the cover film of printed circuit base material.
In technical scheme 4 described inventions, after temporary fixed cover film, read platform by the 2nd image, having or not of the dislocation of the workpiece of affirmation printed circuit base material and the mutual target of cover film, thus, scheme 1 not only possesses skills, the effect of 2 or 3 described inventions, even the mutual dislocation of printed circuit base material and cover film surpasses the occasion of allowed band, can give the alarm, stop production line, or feed back, can suppress temporary fixed rough sledding according to the temperature control program of heating plate up and down.
In technical scheme 5 described inventions, before temporary fixed cover film, the target that is arranged on the printed circuit base material is made a video recording, detect the change in size of workpiece,, partly change the temperature of heating plate according to the change in size of the workpiece that has detected, change the size of cover film forcibly, thus, when temporary fixed, can be accurately and easily carry out the contraposition of the workpiece and the cover film of printed circuit base material.In addition,, still can be used as goods, can improve the qualification rate of goods even have for change in size under the situation of workpiece of the printed circuit base material that departs from.
Description of drawings
Fig. 1 (a), Fig. 1 (b) are the key diagram of the sticker of expression printed circuit board (PCB) of the present invention;
Fig. 2 (a), Fig. 2 (b) are for being arranged at the workpiece of FPC and the key diagram of the target on the cover film;
Fig. 3 (a), Fig. 3 (b) are the key diagram of bottom side heating plate;
Fig. 4 is the key diagram of the difference of the thermal expansion of expression cover film;
Fig. 5 is illustrated in the key diagram of arranging an example of goods on the workpiece;
Fig. 6 is the key diagram of the L side of the expression workpiece occasion different with the change in size of R side;
Fig. 7 is corresponding with workpiece for expression, the result's of the size of change cover film key diagram;
Fig. 8 (a), Fig. 8 (b) are the key diagram of the sticker of expression printed circuit board (PCB) in the past;
The key diagram of the step that Fig. 9 (a), Fig. 9 (b) fit the workpiece in past and cover film for expression.
Embodiment
Enumerate preferred embodiment below, the sticker and the method for attaching of printed circuit board (PCB) of the present invention described.When fitting in cover film on the surface of printed circuit board (PCB),, still make positional precision more accurate, do not produce the purpose of deviation even have under the situation about departing from the change in size of printed circuit board (PCB) in order to be implemented in:
The present invention realizes by following manner, it relates to the sticker of following printed circuit board (PCB), wherein, for insulation protection by the circuit-formed printed circuit base material that is formed on the insulating substrate, on the rectangular printed circuit base material that rolls out from roller, the cover film that the size according to the rules of fitting is continuously cut out, this device is made of interim bonding agency and thermal compressor, this interim bonding agency is by placing the above-mentioned cover film of having cut out, be arranged at the bottom side heating plate of the bottom surface of above-mentioned rectangular printed circuit base material, with above-mentioned bottom side heating plate in the face of and the top side heating plate that is arranged at the top of above-mentioned rectangular printed circuit base material constitutes, workpiece and cover film contraposition with above-mentioned printed circuit base material, by above-mentioned bottom side heating plate and top side heating plate, they are temporary fixed, and this thermal compressor will be along being involved in the above-mentioned printed circuit base material that direction moves, be temporarily fixed on the cover film crimping on this printed circuit base material;
The 1st image is set reads platform and controlling organization, the 1st image read platform before temporary fixed above-mentioned cover film, the target that sets in advance on the printed circuit base material is made a video recording, detect the change in size of workpiece, this controlling organization is according to read the workpiece size data that platform detects by above-mentioned the 1st image, control the temperature of above-mentioned bottom side heating plate and top side heating plate, carry out the dimension compensation of cover film and printed circuit base material.
Fig. 1 (a), Fig. 1 (b) are the key diagram of the sticker of expression printed circuit board (PCB) of the present invention, and Fig. 1 (a) is a vertical view, and Fig. 1 (b) is the end view of the arrow A direction of Fig. 1 (a).Be rectangular cover film 10 that the roller shape reels by transporting clip 21 and fixing clip 22, length is extracted out according to the rules, cuts out in the form of sheets by cutting out mechanism 23.The cover film of cutting out in the form of sheets 11 be positioned over adsorb on placement head (the bottom side described later heating plate) 25A fixing.The cover film 11 of sheet is fixed in state on the placement head 25A in absorption, shown in double dot dash line, shifts to the bottom position of the FPC 30 that rolls out from roller.In addition, label 24 is represented and the collection box of the discharge film that the cover film 11 of sheet is peeled off.
As described later, in the inside of placement head 25A, be provided with the heater of heater etc., as bottom side heating plate 25A.In addition, in the face of bottom side heating plate 25A, above above-mentioned FPC30, the top side heating plate 26A that is built-in with heater is set, interim bonding agency 40 by bottom side heating plate 25A and top side heating plate 26A form is temporarily fixed on cover film 11 on the workpiece 31 of FPC30.
Here, the conveying channel of the FPC30 that rolls out from roller, the last procedure position in the interim mechanism 40 of adhering is provided with the 1st image and reads platform 42.Read platform 42 by the 1st image, the target that sets in advance in FPC 30 is made a video recording, detect the change in size of workpiece 31 relative standard's sizes.To send controlling organization 50 to by the sized data that the 1st image reads platform 42 detected workpiece 31.According to these data, as aftermentioned, controlling organization 50 is controlled the temperature of bottom side heating plate 25A and top side heating plate 26A, carries out the dimension compensation of cover film 11 and FPC30.
In addition, interim adhesion mechanism 40 in the back procedure position, the 2nd image is set reads platform 43.Read platform 43 by the 2nd image, the target of the target of FPC30 and temporary fixed cover film 11 is made a video recording, confirm having or not of mutual dislocation.Read platform 43 detected dislocation data by the 2nd image and send controlling organization 50 to.According to these data,,, or stop production line according to the temperature control program feedback of heating plate 26A, 25A up and down as described later.Reading platform 43 by the 2nd image, confirming the occasion of dislocation in allowed band of temporary fixed cover film 11, cover film 11 is being adhered on the workpiece 31 of FPC30 by thermal compressor 41.
In the present invention, when forming the circuit of FPC30, shown in image pattern 2 (a), Fig. 2 (b) like that, in advance in 4 bights of workpiece 31, by Copper Foil the target 32 of circular pattern is set, corresponding to this target 32, in 4 bights of cover film 11, form the target 12 of circular punching press.Compare with the diameter of the target 32 of workpiece 31, the diameter of the target 12 of cover film 11 is big slightly.When the applying of the workpiece 31 of FPC30 and cover film 11, the occasion of the state that does not misplace, aligns, shown in the image pattern 2 (a) like that, the center of the target 12 of cover film 11 is consistent with the center of the target 32 of workpiece 31, both sides' target 12,32 is a concentric circles.
Relative this situation, in the workpiece 31 of FPC30 and the occasion of cover film 11 mutual dislocation, shown in the image pattern 2 (b) like that, stagger in the center of the center of the target 12 of cover film 11 and the target 32 of workpiece 31.Setting the diameter of target 12,32 according to being fit to size in advance, dislocation surpasses the occasion of allowed band, if both sides' target 12,32 forms in the mode that overlaps, then can discern the generation of dislocation clearly.
The heating plate 25A of bottom side at least among up and down heating plate 26A, the 25A is divided into polylith.Shown in the image pattern 3 (a) like that, such as, vertically be divided into the 1st row～the 5 row, laterally be divided into a piece～f piece, control according to the mode that can control the temperature of heating plate respectively at every independently.As described later, by controlling organization 50,, carry out different temperature control at every of bottom side heating plate 25A, thus, can partly change the temperature of bottom side heating plate 25A, change the size of cover film 11 forcibly.
Shown in the image pattern 9 (b) like that, the L side of roller and the change in size of R side have and depart from, workpiece 31 is the occasion of trapezoidal shape, shown in the image pattern 3 (b) like that, the temperature of the piece 1a～1f of the L side of increase bottom side heating plate 25A, the piece 5a～5f of R side along inclined direction reduces the displacement of temperature.So, but shown in the image pattern 4 like that, the thermal expansion of the L side of cover film 11 is greater than the R side, with cover film 11 be workpiece 31 contrapositions that the trapezoidal shape size changes.
Like this, up and down heating plate 26A, 25A is divided into polylith, carries out temperature control, thus, the change in size of workpiece 31 relatively changes the change in size of cover film 11 forcibly, carries out contraposition.In addition, form the occasion of polylith the both sides of heating plate 26A, 25A that will be up and down, best, top side heating plate 26A relatively increases the quantity of cutting apart of bottom side heating plate 25A.In this occasion, the thermal coefficient of expansion of cover film 11 is greater than FPC30, and thus, the piece of the bottom side heating plate 25A that will directly contact with cover film 11 is cut apart quantity to be increased.
Method of attaching to printed circuit board (PCB) of the present invention describes below.Shown in image pattern 1 (a), Fig. 1 (b) like that, cover film 11 absorption of cutting out in the form of sheets are fixed on bottom side heating plate (placement head) 25A, shift to the bottom position of FPC30.The FPC30 that rolls out from roller reads platform 42 by the 1st image, detects the change in size of workpiece 31, sends the sized data of this workpiece 31 to controlling organization 50.
Fig. 5 is illustrated in an example arranging 30 goods 33 on 1 workpiece 31, and the change in size of workpiece 31 is as anticipation, the occasion that the L side is identical with the change in size of R side.Be arranged at workpiece 31 4 bights target 32 size longitudinally about be dimension D.The sized data that reads the workpiece 31 of platform 42 detections by the 1st image sends controlling organization 50 to, by this controlling organization 50, carries out the temperature control of heating plate 26A, 25A up and down.The occasion that change in size about workpiece 31 is identical, heating plate 26A, 25A up and down is that the identical mode in the left and right sides is controlled according to Temperature Distribution all, corresponding to the sized data of workpiece 31, about being resized to of cover film 11 is identical.
So, by temporary fixed mechanism 40, make the circular pattern in 4 bights that are arranged at workpiece 31 target 32, be arranged at the circle on the cover film 11 the target 12 of punching press consistent exactly, cover film 11 is temporarily fixed on the workpiece 31 of FPC 30.
Then, read platform 43, the target 32 of workpiece 31 and the target 12 of cover film 11 are made a video recording by the 2nd image, whether consistent according to the center of both sides' target, confirm having or not of dislocation.Have the occasion of dislocation at both sides' target, the data that will misplace feed back to controlling organization 50, then, from after carry out when temporary fixed, revise the temperature control of heating plate 26A, 25A up and down, adjust the change in size of cover film 11, correctly carry out contraposition.Surpass the occasion of allowed band in the dislocation of both sides' target, give the alarm, stop production line, remove as defective products.
If read platform 43 by the 2nd image, the center unanimity of both sides' target then will feed back to controlling organization 50 less than the affirmation data of dislocation, and give subsequent processing with FPC 30, by thermal compressor 41, cover film 11 formally will be adhered on the workpiece 31 of FPC30.
Here, temperature control to heating plate 26A, 25A up and down is described, because in FPC30 and cover film 11, thermal coefficient of expansion is different, if so change the temperature difference of bottom side heating plate 25A and top side heating plate 26A terrifically, then the FPC30 as the circuit base material produces warpage.So, for the warpage with FPC30 is converged in the reference range, the top side heating plate 26A of FPC30 side is in 70～90 ℃ scope, and the mode of bottom side heating plate 25A in 40～70 ℃ scope of cover film 11 sides carried out the temperature control of each piece of heating plate.
If in this temperature range, the amount of warpage in the time of then the length of FPC30 can being 100mm is suppressed at below the 2mm.In addition, the dimensions length of workpiece 31 can be followed relative 300mm, the change in size of arrival+0.07mm.
In addition, if the setting with said temperature scope is above 90 ℃, then the bonding agent of cover film 11 is in temporary fixed stage solidification, then, when carrying out the hot pressing of thermal compressor 41, the problem that bonding force reduces, at this moment, in order not give bottom side heating plate 25A with the temperature transfer of top side heating plate 26A, then maximum temperature difference must arrive 50 ℃.
Fig. 6 represents that the change in size of workpiece 31 is opposite with expectation, the occasion that the L side is different with the change in size of R side.For the size longitudinally of the target 32 in 4 bights that are arranged at workpiece 31, the right side is a dimension D, and the left side is a bit larger tham this size, forms dimension D+α.So, in the Temperature Distribution control identical by the left and right sides of Fig. 5 explanation, such as, for the R side, even make under the consistent situation of the target 12 of the target 32 of workpiece 31 and cover film 11, for the L side, the target 32 of workpiece 31 and the target 12 of cover film 11 stagger significantly.
In this occasion, partly change the temperature of bottom side heating plate 25A, change the size of cover film 11 forcibly, thus, can make cover film 11 consistent with corresponding articles 33.If such as, shown in the image pattern 3 (b) like that, increase the temperature of piece 1a～1f of the L side of bottom side heating plate 25A, the piece 5a～5f of R side along inclined direction reduces the displacement of temperature, then the thermal expansion of the L side of cover film 11 is greater than the R side.
So, shown in the image pattern 7 like that, for the R side, make the target 12 of the target 32 of workpiece 31 and cover film 11 consistent, equally for the L side, still can make the target 12 of the target 32 of workpiece 31 and cover film 11 consistent, can make the size contraposition of corresponding articles 33 and cover film 11.
Like this,, still can change heating plate 26A up and down, the temperature of 25A partly, change the size of cover film 11 forcibly, thus, can be used as goods, can improve the qualification rate of goods even under the situation that the workpiece 31 that departs from is arranged for change in size.
In addition, only otherwise break away from spirit of the present invention, the present invention can carry out various changes, in addition, obviously, the present invention relates to the scheme of this change.
Claims (5)
1. the sticker of a printed circuit board (PCB), wherein, for to carrying out insulation protection by the circuit-formed printed circuit base material that is formed on the insulating substrate, on the rectangular printed circuit base material that rolls out from roller, the cover film that the size according to the rules of fitting is continuously cut out, this device is made of interim bonding agency and thermal compressor, this interim bonding agency is made of bottom side heating plate and top side heating plate, this bottom side heating plate is placed the above-mentioned cover film of cutting out, be arranged on the bottom surface of above-mentioned rectangular printed circuit base material, this top side heating plate and above-mentioned bottom side heating plate are faced, be arranged at the top of above-mentioned rectangular printed circuit base material, workpiece and cover film contraposition with above-mentioned printed circuit base material, and it is temporary fixed, this thermal compressor will be shifted to above-mentioned printed circuit base material that is involved in direction and the cover film crimping that is temporarily fixed on this printed circuit base material by above-mentioned bottom side heating plate and top side heating plate;
It is characterized in that this device comprises:
The 1st image reads platform, and it was made a video recording to the target that sets in advance on the printed circuit base material before temporary fixed above-mentioned cover film, detects the change in size of workpiece;
Controlling organization, it controls the temperature of above-mentioned bottom side heating plate and top side heating plate according to reading the detected workpiece size data of platform by above-mentioned the 1st image, carries out the dimension compensation of cover film and printed circuit base material.
2. the sticker of printed circuit board (PCB) according to claim 1, it is characterized in that the heating plate of bottom side at least in the above-mentioned heating plate up and down is divided into polylith, according at every, can carry out temperature controlled mode forms, above-mentioned controlling organization is according to the change in size according to the workpiece that reads the platform detection by above-mentioned the 1st image, partly change the temperature of above-mentioned heating plate, the mode that changes the size of cover film forcibly forms.
3. the sticker of printed circuit board (PCB) according to claim 1 and 2, it is characterized in that on above-mentioned printed circuit base material, in advance in 4 bights of workpiece, by Copper Foil the target of circular pattern is set,, on above-mentioned cover film, forms circular punching press and the target that produces corresponding to this target, pass through image processing, obtain the center of the target of the center of target of above-mentioned printed circuit base material and cover film, above-mentioned controlling organization carries out the temperature control of above-mentioned heating plate, so that both sides' center unanimity.
4. according to the sticker of claim 1,2 or 3 described printed circuit board (PCB)s, it is characterized in that it comprises that the 2nd image reads platform, it is made a video recording to the target of above-mentioned printed circuit base material and the target of cover film after temporary fixed above-mentioned cover film, confirms having or not of mutual dislocation.
5. the method for attaching of a printed circuit board (PCB); for to carrying out insulation protection by the circuit-formed printed circuit base material that is formed on the insulating substrate; on the rectangular printed circuit base material that rolls out from roller, the cover film that the size according to the rules of fitting is continuously cut out is characterized in that:
The target that sets in advance on above-mentioned printed circuit base material is made a video recording, pass through image processing, detect the change in size of workpiece, the bottom side heating plate by placing the cover film cut out, with this bottom side heating plate in the face of be arranged at above-mentioned rectangular printed circuit base material above the top side heating plate, clamping printed circuit base material and cover film and with it when temporary fixed, change in size corresponding to above-mentioned workpiece, change the temperature of above-mentioned heating plate partly, change the size of cover film forcibly, relative printed circuit base material, cover film is dislocation not.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007180502A JP5021384B2 (en) | 2007-07-10 | 2007-07-10 | Printed wiring board sticking device and sticking method |
| JP2007-180502 | 2007-07-10 | ||
| JP2007180502 | 2007-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101346046A true CN101346046A (en) | 2009-01-14 |
| CN101346046B CN101346046B (en) | 2012-02-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101330520A Expired - Fee Related CN101346046B (en) | 2007-07-10 | 2008-07-08 | Plastering apparatus and method for printed circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5021384B2 (en) |
| CN (1) | CN101346046B (en) |
| TW (1) | TW200904285A (en) |
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| CN114501821B (en) * | 2022-03-14 | 2023-09-01 | 江西众达泰科技有限公司 | Flexible circuit board manufacturing and processing machine and manufacturing and processing technology |
| CN114938564B (en) * | 2022-05-19 | 2023-05-05 | 深圳市邦正精密机械有限公司 | Full-automatic roll-to-roll reinforcing sheet laminating machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62132394A (en) * | 1985-12-04 | 1987-06-15 | 日立化成工業株式会社 | Manufacture of flexible wiring |
| JPH0521956A (en) * | 1991-07-11 | 1993-01-29 | Mitsubishi Electric Corp | Manufacture of multilayered printed circuit board |
| JPH06254888A (en) * | 1993-03-08 | 1994-09-13 | Hitachi Chem Co Ltd | Method and apparatus for producing laminated sheet |
| JPH08113764A (en) * | 1994-10-17 | 1996-05-07 | Sumitomo Electric Ind Ltd | Adhesive sheet, cover lay film, printed circuit board and production of printed circuit board |
-
2007
- 2007-07-10 JP JP2007180502A patent/JP5021384B2/en not_active Expired - Fee Related
-
2008
- 2008-06-18 TW TW97122610A patent/TW200904285A/en not_active IP Right Cessation
- 2008-07-08 CN CN2008101330520A patent/CN101346046B/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101951731A (en) * | 2010-10-18 | 2011-01-19 | 卓盈微电子（昆山）有限公司 | Improved heating platform for glue curing |
| CN106233823A (en) * | 2014-04-23 | 2016-12-14 | Zf腓德烈斯哈芬股份公司 | For protecting electronic circuit carrier from the Method and circuits module of environmental effect |
| CN112684630A (en) * | 2019-10-17 | 2021-04-20 | 北京小米移动软件有限公司 | Backlight module assembly method, backlight module and terminal equipment |
| CN112611324A (en) * | 2020-12-02 | 2021-04-06 | 南京尚孚电子电路有限公司 | Insulation film pasting detection system for flexible circuit board and detection method thereof |
| CN113619177A (en) * | 2021-07-07 | 2021-11-09 | 浙江明恩新材料科技有限公司 | Production equipment for high-temperature-resistant modified material product |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI376993B (en) | 2012-11-11 |
| JP2009021271A (en) | 2009-01-29 |
| TW200904285A (en) | 2009-01-16 |
| JP5021384B2 (en) | 2012-09-05 |
| CN101346046B (en) | 2012-02-29 |
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