CN112684630A - Backlight module assembly method, backlight module and terminal equipment - Google Patents
Backlight module assembly method, backlight module and terminal equipment Download PDFInfo
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- CN112684630A CN112684630A CN201910989360.1A CN201910989360A CN112684630A CN 112684630 A CN112684630 A CN 112684630A CN 201910989360 A CN201910989360 A CN 201910989360A CN 112684630 A CN112684630 A CN 112684630A
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Abstract
The disclosure relates to an assembly method of a backlight module, the backlight module and a terminal device, wherein the backlight module comprises: light emitting component and back casing, the method includes: mounting a light emitting unit for emitting light to a first surface of a flexible circuit board to form the light emitting assembly; bonding a second surface of the flexible circuit board mounted with the light emitting unit to a side surface of the rear surface case by an adhesive; wherein the second surface is opposite the first surface. Through this disclosed embodiment, the second surface of flexible circuit board among the light-emitting component is direct through the side bonding of adhesive and back casing, and it need not connect the flexible circuit board through the reinforcing plate alright realize the equipment, can reduce backlight unit's thickness, and then reduce liquid crystal display module's lower frame thickness.
Description
Technical Field
The present disclosure relates to the field of electronic devices, and in particular, to an assembling method of a backlight module, a backlight module and a terminal device.
Background
With the development of terminal devices, the terminal devices have entered the era of full-screen. In order to increase the screen occupation ratio of the terminal device, the terminal device is continuously compressing the thickness of the lower frame, so that the terminal device such as a mobile phone is developed towards a frameless direction. In the related art, the frame of the terminal is reduced step by step through various technologies, but the requirement of a narrow frame or no frame is still not satisfied.
Disclosure of Invention
The disclosure provides an assembling method of a backlight module, the backlight module and a terminal device.
According to a first aspect of the embodiments of the present disclosure, there is provided an assembling method of a backlight module, the backlight module including: a light emitting assembly and a back housing, the method comprising:
mounting a light emitting unit for emitting light to a first surface of a flexible circuit board to form the light emitting assembly;
bonding a second surface of the flexible circuit board mounted with the light emitting unit to a side surface of the rear surface case by an adhesive;
wherein the second surface is opposite the first surface.
In one embodiment, the method further comprises:
fixing the light emitting assembly by using a fixing piece, wherein a flexible contact surface of the fixing piece is in contact with the light emitting unit;
aligning a second surface of the flexible circuit board in the light emitting assembly fixed on the fixing piece to a side surface of the back shell;
the bonding the second surface of the flexible circuit board mounted with the light emitting unit to the side of the rear surface case by an adhesive includes:
after the second surface is aligned with the back shell, the second surface is bonded to the side of the back shell through the adhesive.
In one embodiment, the fixing member includes a suction member, and the fixing the light emitting member with the fixing member includes:
the flexible contact surface based on the adsorption component acts on the light-emitting unit, so that the light-emitting component is adsorbed on the adsorption component.
In one embodiment, the fixing member includes a process reinforcing film, and the fixing the light emitting element by the fixing member includes:
and the light-emitting unit is adhered to the flexible contact surface of the process reinforcing film, so that the light-emitting component is fixed on the process reinforcing film.
In one embodiment, the method further comprises:
placing the side surfaces of the back shell on a bearing surface in parallel;
applying said adhesive to the side of said back shell;
the second surface of the flexible circuit board in the light emitting module to be fixed on the fixing member is aligned with the side surface of the rear housing, and the method includes:
and aligning the second surface of the flexible circuit board in the light-emitting assembly fixed on the fixing piece with the side surface which is placed on the bearing surface in parallel and coated with the adhesive.
In one embodiment, the adhering the second surface to the side of the rear case by the adhesive after the second surface is aligned with the rear case includes:
after the second surface is aligned with the back shell, moving the fixing piece along the direction perpendicular to the carrying surface, so that the second surface of the flexible circuit board on the fixing piece is moved to the adhesive on the side surface of the back shell in parallel;
moving the second surface to the adhesive on the side of the back case in parallel based on the second surface, so that the second surface is adhered to the back case flatly.
In one embodiment, the second surface of the flexible circuit board is pasted with an adhesive glue, and the adhesive glue is covered with a protective film;
the method further comprises the following steps:
after the light-emitting component is fixed by the fixing piece, removing the protective film of the adhesive glue;
the second surface of the flexible circuit board in the light emitting module to be fixed on the fixing member is aligned with the side surface of the rear housing, and the method includes:
after the protective film of the adhesive glue is removed, the adhesive glue on the second surface of the flexible circuit board is aligned to the side face of the back shell.
In one embodiment, the method further comprises:
after the second surface of the flexible circuit board is attached to the side face of the back face shell, the fixing piece is maintained for a preset time length of the fixing state of the light emitting assembly, and then the fixing piece is removed.
In one embodiment, the mounting the light emitting unit for emitting light to the first surface of the flexible circuit board to form the light emitting assembly includes:
and mounting the light emitting unit for emitting light to the first surface of the flexible circuit board by a surface mounting process to form the light emitting assembly.
According to a second aspect of the embodiments of the present disclosure, there is provided a backlight module, including:
a back housing;
a light emitting assembly comprising: a light emitting unit and a flexible circuit board; wherein the light emitting unit for emitting light is mounted on a first surface of the flexible circuit board;
the second surface of the flexible circuit board is bonded on the side surface of the back shell through an adhesive, wherein the second surface is opposite to the first surface.
According to a third aspect of the embodiments of the present disclosure, a terminal device is provided, where the terminal device at least includes the backlight module provided in the above embodiments.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
in the process of assembling the backlight module, the second surface of the flexible circuit board in the light-emitting component is directly bonded with the side face of the back shell through a bonding object, the flexible circuit board is not required to be connected through a reinforcing plate, so that the assembly can be realized, the thickness of the backlight module can be reduced due to the reduction of the thickness of the reinforcing plate, the thickness of a frame covering the backlight module in the terminal equipment is further reduced, and the frame of the terminal equipment is further narrowed.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a first schematic assembly diagram of a backlight module according to an exemplary embodiment.
Fig. 2 is a front view illustrating a light emitting assembly in a backlight module according to an exemplary embodiment.
Fig. 3 is a schematic diagram illustrating an upside-down mounting of a light emitting assembly in a backlight module according to an exemplary embodiment.
Fig. 4 is a side-mounted schematic view of a light emitting assembly in a backlight module according to an exemplary embodiment.
Fig. 5 is a first schematic view illustrating the mounting of a light emitting assembly according to an exemplary embodiment.
Fig. 6 is a second schematic view of a mounting of a light emitting assembly according to an exemplary embodiment.
FIG. 7 is a schematic illustration showing placement of a back housing according to an exemplary embodiment.
Fig. 8 is an assembly diagram illustrating a light emitting unit and a flexible circuit board in a light emitting assembly according to an exemplary embodiment.
Fig. 9 is a first schematic view illustrating alignment bonding of a light emitting assembly and a back housing according to an exemplary embodiment.
Fig. 10 is a second schematic view illustrating alignment bonding of a light emitting assembly and a back housing according to an exemplary embodiment.
Fig. 11 is a schematic diagram illustrating assembly of the backlight module according to an exemplary embodiment.
Fig. 12 is a second schematic view illustrating an assembly of a backlight module according to an exemplary embodiment.
Fig. 13 is a third schematic assembly diagram of a backlight module according to an exemplary embodiment.
Fig. 14 is a block diagram illustrating a structure of a terminal device according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
The embodiment of the present disclosure provides an assembling method of a backlight module, and fig. 1 is a first assembly schematic diagram of the backlight module according to an exemplary embodiment. As shown in fig. 1, the backlight module includes: the assembly method of the backlight module at least comprises the following steps:
s101, mounting a light-emitting unit for emitting light to a first surface of a flexible circuit board to form a light-emitting assembly;
s102, adhering the second surface of the flexible circuit board provided with the light-emitting unit to the side surface of the back shell through an adhesive; wherein the second surface is opposite to the first surface.
In the embodiment of the disclosure, the backlight module and the liquid crystal display are important components of the liquid crystal display module, and the backlight module is used for providing a backlight light source and generating uniform surface light; the liquid crystal panel is used for processing light by pixels to display an image. The backlight module comprises a light-emitting component and a back shell, wherein the light-emitting component is used for providing a backlight source, and the back shell is used for fixing the light-emitting component.
It should be noted that, in the process of assembling the backlight module, the light emitting assembly needs to be assembled first, and then the light emitting assembly is bonded to the back surface housing through the adhesive, so as to realize the assembly of the backlight module.
The above light emitting assembly includes: a light emitting unit emitting light and a Flexible Circuit board (FPC) for driving the light emitting unit, the FPC having a first surface on which the light emitting unit is mounted and a second surface on which a rear surface case is bonded. The light emitting unit includes, but is not limited to, a light emitting unit constituted by a light emitting diode.
The flexible circuit board is as follows: flexible printed circuit boards, which can be bent, are usually made of a thin flexible plastic sheet, which includes an outermost insulating layer and a circuit located in the insulating layer and electronic components electrically connected to the circuit. The electronic component may include: a light emitting unit. The light emitting unit includes one or more point light sources. The point light source may include: an Organic Light-Emitting Diode (OLED). A plurality of light emitting units are mounted in parallel on the first surface of the flexible circuit board to form a line light source. If the light emitting units are arranged in multiple rows on the flexible circuit board, a surface light source is formed.
In the embodiment of the disclosure, the light emitting assembly in the backlight module is directly connected with the side surface of the back shell through the flexible circuit board, that is, the light emitting assembly in the backlight module of the embodiment of the disclosure is a top light emitting assembly, so that the light emitting assembly and the back shell are relatively arranged at intervals, and the thickness of the backlight module can be reduced.
The side surface of the rear surface case is a surface to which the second surface is bonded. The adhesive for bonding the second surface and the side surface of the back shell can be various colloids, and the light-emitting unit is bonded to the side surface of the back shell through the self viscosity of the colloids. For example, the colloid may be a liquid colloid, and may also be a solid colloid, and the embodiments of the present disclosure are not limited.
In the process of designing the adhesive to bond the second surface and the back shell, since different forms of the adhesive affect the bonding manner of the second surface and the back shell, the embodiment of the disclosure can actually determine the assembly manner of the second surface and the back shell according to the forms of the adhesive.
Illustratively, when the adhesive is in a solid state, such as a double-sided tape or a fixing tape, the second surface and the side of the back case may be directly bonded without considering the placement direction of the second surface and the back case; when the adhesive is in a liquid state, such as a liquid gel, the second surface and the side of the back housing cannot be directly bonded, and the position of the adhesive and the bonding direction of the second surface and the back are required to be set.
As shown in fig. 2, in the process of actually assembling the light emitting device and the back housing, the light emitting device 10 can be assembled in a front-mounted manner, and the thickness of the corresponding backlight module is 3.65 mm by verification. As shown in fig. 3, the light emitting device 10 can be assembled by flip-chip method, and the thickness of the corresponding backlight module can be reduced to 2 mm by verification.
As shown in fig. 4, the light emitting module may be assembled in a side-mounted manner, the light emitting unit 14 of the light emitting module is mounted on the flexible circuit board 13, the flexible circuit board 13 is connected to the reinforcing plate 15, and the reinforcing plate 15 is connected to the rear case 11 through the adhesive 12. Generally, the thickness of the flexible circuit board is 0.1 mm, and the length is more than 60 mm, in the process of side-mounting the light-emitting assembly, the flexible circuit board needs to be supported by the strength and hardness of the reinforcing plate, and then the reinforcing plate is adhered by the adhesive tape so that the light-emitting assembly is mounted on the back shell. The thickness of the stiffener is usually 0.3 mm, so in order to reduce the thickness of the backlight module, the thickness of the adhesive connecting the stiffener and the back housing needs to be reduced, and the thickness of the adhesive between the stiffener and the back housing in the side mounting is usually between 0.03 mm and 0.05 mm. The thickness of the backlight module corresponding to the existing side-mounted mode can be reduced to 1.8 mm through verification.
Therefore, the backlight module is assembled by the existing backlight module assembling mode, the thickness of the backlight module needs to be reduced by increasing the reinforcing plate to reduce the thickness of the adhesive, and the problems of poor adhesive property and unreliable adhesion of the adhesive exist. Meanwhile, the conventional assembly method can only enable the thickness of the backlight module to be more than 1.8 mm, and cannot meet the requirement that the thickness of the backlight module is less than 1.8 mm.
Compared with the existing assembly mode, the design mode of the top light-emitting component is adopted in the embodiment of the disclosure, in the process of assembling the backlight module, the second surface of the flexible circuit board in the light-emitting component is directly bonded with the side surface of the back shell through the bonding object, and the assembly can be realized without connecting the flexible circuit board through the reinforcing plate. The thickness of the backlight module assembled according to the embodiment of the present disclosure is 1.5 mm, which can further reduce the thickness of the backlight module.
In one embodiment, the method further comprises:
fixing the light-emitting assembly by using a fixing piece, wherein the flexible contact surface of the fixing piece is in contact with the light-emitting unit;
aligning a second surface of the flexible circuit board in the light emitting assembly fixed on the fixing piece to the side surface of the back shell;
the second surface of the flexible circuit board mounted with the light emitting unit is adhered to a side surface of the rear cover by an adhesive, including:
after the second surface is aligned with the back cover, the second surface is bonded to the side of the back cover by an adhesive.
In the embodiment of the disclosure, after the light emitting assembly is formed, the fixing member is used to fix the light emitting assembly, and then the second surface of the flexible circuit board in the light emitting assembly fixed on the fixing member is aligned with the side surface of the back housing.
It should be noted that the process of aligning the second surface of the flexible circuit board and the side surface of the rear housing in the light emitting module fixed on the fixing member includes: firstly, placing a back shell on a bearing surface, and then moving a fixing piece to enable a light-emitting assembly on the fixing piece and the back shell to be positioned on the same plane, wherein the same plane comprises a horizontal plane or a vertical plane; and finally, adjusting the position of the fixing piece to enable the second surface of the flexible circuit board in the light-emitting assembly on the fixing piece to be aligned with the side face of the back shell, wherein the position of the fixing piece can be adjusted in a mode of aligning marks to enable the second surface to be aligned with the side face of the back shell.
In the embodiment of the present disclosure, the fixing member is not only used for fixing the light emitting assembly, but also has a certain hardness for supporting the light emitting assembly, so that the position of the light emitting assembly can be changed by moving the fixing member. It will be appreciated that securing the light assembly by the securing member and aligning the second surface of the flexible circuit secured in the light assembly with the side of the rear housing facilitates a flat mounting of the light assembly on the side of the rear housing during assembly. Moreover, the contact surface of the fixing piece and the light-emitting unit is a flexible contact surface, so that the situation that the backlight assembly is damaged in the process of installing the light-emitting assembly and the back shell through the fixing piece can be reduced.
Illustratively, the fixing member may be a film having certain adhesiveness and strength, for example, the fixing member may be a process reinforcing film. Of course, the fixing member may also be a jig, such as an adsorption member, and the contact surface between the adsorption member and the light emitting member is a flexible contact surface, wherein the flexible contact surface may be a surface formed by rubber or other soft materials, so as to reduce damage to the light emitting member.
In one embodiment, the fixing member includes a suction member, and the fixing member fixes the light emitting member, including:
the flexible contact surface based on the adsorption component acts on the light-emitting unit, so that the light-emitting component is adsorbed on the adsorption component.
In the embodiment of the disclosure, the absorption component is used for fixing the light emitting component in a physical form, and the light emitting unit in the light emitting component is fixed. The adsorption component makes the flexible contact surface of the adsorption component contact with the light-emitting unit in the light-emitting component in the process of fixing the light-emitting component, and the adsorption side and the far-away adsorption side of the light-emitting unit generate air pressure difference through the formation of vacuumizing, so that the light-emitting component is adsorbed on the adsorption component through the air pressure difference.
It should be noted that, the flexible circuit board is a circuit board formed by a flexible material, and based on the soft characteristic of the flexible circuit board, the adsorption assembly according to the embodiment of the present disclosure fixes the light emitting assembly by grabbing the light emitting unit, and since the light emitting unit is relatively easy to be damaged, in the process of grabbing the light emitting unit by the adsorption assembly, the adsorption assembly and the contact surface acting on the light emitting unit are set as flexible contact surfaces to reduce the damage to the light emitting unit.
As shown in fig. 5, a first side of the light emitting unit 14 and a third side of the light emitting unit 14 in the light emitting assembly are connected to the suction assembly 16, a second side of the light emitting unit 14 is connected to the flexible circuit board 13, the second side of the light emitting unit 14 is opposite to the first side of the light emitting unit 14, and the third side of the light emitting unit 14 is connected to the second side of the light emitting unit 14 and the first side of the light emitting unit 14, respectively, so that the light emitting assembly can be fixed to the suction assembly 16 by an air pressure difference.
It can be understood that, through the fixed light emitting component of formation of physics, its flexible contact surface can reduce to cause the damage to light emitting component on the one hand, and on the other hand only need stop the evacuation can separate absorption subassembly and light emitting component, can be convenient for the installation of follow-up other subassemblies.
In one embodiment, the fixing member includes a process reinforcing film, and the fixing member is used to fix the light emitting device, including:
the light-emitting unit is adhered to the flexible contact surface of the process reinforcing film, so that the light-emitting component is fixed on the process reinforcing film.
In the embodiment of the disclosure, the process reinforcing film can be attached to the light emitting component to fix the light emitting component, and has a certain strength to support the light emitting component, so that the position of the light emitting component fixed on the process reinforcing film can be changed by moving the support reinforcing film.
It should be noted that the backlight module does not include a process reinforcing film, which is only a tool for fixing the light emitting device, and in the process of assembling the subsequent device, the light emitting device and the process reinforcing film need to be separated first, and then the subsequent assembly is performed.
As shown in fig. 6, a first side of the light emitting unit 14 in the light emitting device is connected to the process reinforcing film 17, a second side of the light emitting unit 14 is connected to the flexible circuit board 13, and the second side of the light emitting unit 14 is opposite to the first side of the light emitting unit, so that the light emitting device can be fixed on the support reinforcing film 17.
It can be understood that, the light-emitting component is fixed by the process reinforcing film, so that damage to the light-emitting component can be reduced on one hand, and the process reinforcing film can be directly stripped from the light-emitting component in the subsequent component mounting process on the other hand, and the operation is convenient.
In one embodiment, the method further comprises:
placing the side surface of the back shell on the bearing surface in parallel;
coating an adhesive on the side surface of the back shell;
aligning a second surface of the flexible circuit board in the light emitting module to be fixed to the fixing member to a side surface of the rear cover, comprising:
and aligning the second surface of the flexible circuit board in the light-emitting assembly fixed on the fixing piece with the side surface which is arranged on the bearing surface in parallel and coated with the adhesive.
In the embodiment of the disclosure, after the light emitting assembly is formed, the side surface of the back shell can be placed on the bearing surface in parallel by a mechanical arm in cooperation with the charge coupled device; and coating an adhesive on the side surface of the back shell by a dispenser, aligning the second surface of the flexible circuit board to the side surface which is placed in parallel and coated with the adhesive by a fixing piece, and moving the fixing piece to enable the aligned second surface and the side surface coated with the adhesive to be bonded by the adhesive so as to complete the installation of the light-emitting component and the back shell.
As shown in fig. 7, the side of the back cover 11 is placed on the carrying surface in parallel, and the adhesive 12 is coated on the side of the back cover 11; as shown in fig. 8, the light emitting unit 14 in the light emitting module is assembled to the flexible circuit board 13; as shown in fig. 9, the suction member 16 acts on the light emitting unit 14 of the light emitting assembly so that the light emitting assembly including the light emitting unit 14 and the flexible circuit board 13 is fixed on the suction member 16, and by moving the suction member 16, the second surface of the flexible circuit board 13 of the light emitting assembly fixed on the suction member 16 is connected to the side surface of the rear surface case 11 by the adhesive 12.
The adhesive may be a liquid colloid, or a colloid that is liquid at a certain temperature or higher and solid at room temperature.
Illustratively, the adhesive includes a liquid glue or a hot melt adhesive, and the disclosed embodiments are not limited.
It can be understood that, since the liquid adhesive is coated, the fluidity of the liquid adhesive needs to be considered in the process of assembling the backlight assembly and the back cover, so that in the process of assembling, the side surface of the back cover is firstly placed on the bearing surface in parallel, then the adhesive is coated, and the side surface and the second surface of the back cover which are placed in parallel are aligned through the fixing piece, so that the backlight assembly can be flexibly assembled according to the form of the adhesive, and different requirements can be met. Meanwhile, the second surface and the back shell can be smoothly bonded together through the manufacturing process, a reinforcing plate is not needed to be added in the middle to support the flexible circuit board, and the thickness of the backlight module can be reduced.
In one embodiment, after the second surface is aligned with the back cover, the second surface is bonded to the side of the back cover by an adhesive, comprising:
after the second surface is aligned with the back shell, moving the fixing piece along the direction vertical to the bearing surface, so that the second surface of the flexible circuit board on the fixing piece moves to the adhesive on the side surface of the back shell in parallel;
the second surface is moved parallel to the adhesive on the side of the rear housing, so that the second surface is flatly adhered to the rear housing.
It can be understood that after the second surface is aligned with the side surface which is placed on the bearing surface in parallel and coated with the adhesive, the second surface is moved to the adhesive position on the side surface of the back shell in parallel by moving the fixing piece, so that the adhesive on the side surface of the back shell is uniformly dispersed, the adhesive is fully contacted with the second surface, the adhesive strength is improved, the second surface and the back shell can be smoothly attached, and the uneven condition of the adhesive surface is reduced.
In one embodiment, the second surface of the flexible circuit board is adhered with an adhesive glue, and the adhesive glue is covered with a protective film;
the method further comprises the following steps:
after the light-emitting component is fixed by the fixing piece, removing the protective film of the adhesive;
aligning a second surface of the flexible circuit board in the light emitting module to be fixed to the fixing member to a side surface of the rear cover, comprising:
after the protective film of the adhesive is removed, the adhesive on the second surface of the flexible circuit board is aligned to the side surface of the back shell.
In the embodiment of the disclosure, before the second surface of the flexible circuit board in the light emitting module fixed on the fixing member is aligned with the side surface of the back surface shell, the second surface of the flexible circuit board is adhered with the adhesive glue, and the adhesive glue is covered with the protective film. The adhesive glue is provided with a first adhesive surface and a second adhesive surface, wherein the second adhesive surface is the back surface of the first adhesive surface.
The first adhesive surface is adhered to the second surface of the flexible circuit board, the second adhesive surface is covered with the protective film, and after the fixing member fixes the light emitting assembly, the protective film of the adhesive glue is removed and aligned with the side surface of the back shell and the second surface, so that the second adhesive surface of the adhesive glue fixed on the second surface can be adhered to the side surface of the back shell.
Illustratively, adhesive tapes include, but are not limited to, double-sided tapes.
As shown in fig. 10, the support reinforcing film 17 fixes the light emitting element by acting on the light emitting unit 14 of the light emitting element, and the second surface of the flexible circuit board 13 after alignment and the side surface of the rear surface case 11 coated with the adhesive 12 are bonded by the adhesive by moving the process reinforcing film 17.
It can be understood that the adhesive glue is firstly pasted on the second surface of the flexible circuit board, the back shell and the second surface are adhered after the adhesive glue is aligned, the second surface can be flatly adhered on the back shell through the adhesive glue, the second surface can be flatly adhered with the back shell through the processing procedure, the flexible circuit board is supported without a reinforcing plate in the middle, and the thickness of the backlight module can be reduced.
In one embodiment, a light emitting unit for emitting light is mounted to a first surface of a flexible circuit board to form a light emitting assembly, comprising:
the light emitting unit for emitting light is mounted to the first surface of the flexible circuit board through a surface mounting process to form a light emitting assembly.
It is understood that a Surface Mount Technology (SMT) directly attaches the light emitting unit to a corresponding position on the first Surface of the flexible circuit board, has a high packaging density, can reduce a mounting volume, and can achieve an automatic production to improve production efficiency.
In one embodiment, the method further comprises:
after the second surface of the flexible circuit board is attached to the side face of the back face shell, the fixing piece is removed after the fixing state of the fixing piece for the light emitting assembly is maintained for a preset time.
In an embodiment of the present disclosure, maintaining the preset duration of the fixing state of the fixing element to the light emitting element includes: after the second surface of the flexible circuit board is attached to the side face of the back face shell through the fixing piece, the fixing piece is not removed from the light emitting assembly, the fixing piece and the light emitting assembly are placed still, and the fixing piece is removed after a preset time.
It should be noted that the preset time period may be set according to the adhesive property of the adhesive. For example, the preset time period may be set to be half an hour, and the embodiment of the present disclosure is not limited.
It can be understood that maintaining the fixed state of the fixing member to the light emitting assembly for a preset time can realize pressure maintaining between the light emitting assembly and the back shell by using the fixing member, so that the light emitting assembly and the back shell are firmly bonded.
Fig. 11 is a view of continuing to assemble other components after removing the adsorption member 16 and the process reinforcing film 17 from fig. 9 and 10, and as shown in fig. 11, after assembling the flexible circuit board and the light emitting unit of the light emitting element on the rear housing, a light guide plate 18, a diffusion sheet 19, an upper prism sheet 20, a lower prism sheet 21, and the like may be further assembled.
To facilitate understanding of the above embodiments, the following examples are proposed:
the light emitting module and the back shell are assembled in the embodiment of the disclosure, wherein one is to assemble the light emitting module on the back shell by fixing the light emitting module by the adsorption module, and the other is to assemble the light emitting module on the back shell by the process increasing film.
As shown in fig. 12, the specific steps of fixing the light emitting device by the suction device and assembling the light emitting device on the rear housing are as follows:
s201, mounting a light-emitting unit for emitting light to a first surface of a flexible circuit board through a surface mounting process to form a light-emitting assembly;
s202, placing the side face of the back shell on a bearing surface in parallel;
s203, acting on the light emitting unit based on the flexible contact surface of the adsorption component to enable the light emitting component to be adsorbed on the adsorption component;
s204, aligning the second surface of the flexible circuit board in the light-emitting assembly fixed on the adsorption assembly with the side surface which is parallelly arranged on the bearing surface and coated with the adhesive;
s205, after the second surface is aligned with the back shell, the second surface is bonded on the side surface of the back shell through an adhesive;
s206, after the second surface of the flexible circuit board is attached to the side face of the back shell, the fixing piece is removed after the preset time length of the fixing state of the fixing piece on the light emitting assembly is maintained.
And S207, converting the placing mode that the side surface of the back shell is parallel to the bearing surface into the placing mode that the side surface of the back shell is vertical to the bearing surface, and finishing the assembly of other assemblies.
As shown in fig. 13, the specific steps of assembling the light emitting device on the rear housing by the process increasing film are as follows:
s301, mounting a light-emitting unit for emitting light to a first surface of a flexible circuit board through a surface mounting process to form a light-emitting assembly;
s302, sticking a light-emitting unit on the flexible contact surface of the process reinforcing film to fix the light-emitting component on the process reinforcing film;
s303, removing the protective film of the adhesive after the light-emitting assembly is fixed by the process reinforcing film;
s304, after the protective film of the adhesive is removed, aligning the adhesive on the second surface of the flexible circuit board to the side surface of the back shell;
s305, after the second surface is aligned with the back shell, the second surface is bonded on the side surface of the back shell through an adhesive;
s306, after the second surface of the flexible circuit board is attached to the side face of the back shell, the fixing piece is removed after the preset time length of the fixing state of the fixing piece on the light emitting component is maintained.
It can be understood that the second surface and the back shell can be smoothly bonded together through the manufacturing process without adding a reinforcing plate in the middle to support the flexible circuit board, the thickness of the backlight module can be reduced, the thickness of the backlight module can be optimized from 1.8 mm to about 1.45 mm through verification, and the thickness of the terminal equipment frame is further reduced by reducing the thickness of the backlight module. Meanwhile, the mass production of products can be conveniently realized through the optimization of the manufacturing process.
The embodiment of the present disclosure provides a backlight module, which includes:
a back housing;
a light emitting assembly comprising: a light emitting unit and a flexible circuit board; wherein, the light-emitting unit used for emitting the light is installed on the first surface of the flexible circuit board;
the second surface of the flexible circuit board is bonded on the side surface of the back shell through an adhesive, wherein the second surface is opposite to the first surface.
It can be understood that, in the embodiment of the present disclosure, the back shell and the light emitting component are assembled by the method of the above embodiment, so that the second surface of the flexible circuit board in the light emitting component can be bonded on the side surface of the back shell by the adhesive, and the backlight module can be used for manufacturing the flexible circuit board without using a reinforcing plate, so that the light emitting component can be flatly installed on the back shell, the thickness of the backlight module is reduced, and further the thickness of the lower frame of the terminal device is also reduced.
The embodiment of the disclosure provides a terminal device, and the terminal device at least comprises the backlight module provided by the embodiment.
In the embodiment of the disclosure, the terminal device comprises a backlight module, and the backlight module is arranged on a middle frame of the terminal device. It should be noted that, when the middle frame is a rectangular middle frame, the back module is disposed on the short side of the middle frame and connected to the short side of the middle frame, and the thickness of the lower frame of the terminal device can be further reduced by reducing the thickness of the back module.
The terminal devices can be wearable electronic devices and mobile terminals; the mobile terminal comprises a mobile phone, a notebook computer and a tablet computer; this wearable electronic equipment includes intelligent wrist-watch, and this disclosed embodiment does not put a limit to.
It should be noted that "first", "second" and "third" in the embodiments of the present disclosure are merely for convenience of description and distinction, and have no other specific meaning.
Fig. 14 is a block diagram illustrating a structure of a terminal device according to an exemplary embodiment. For example, the terminal device 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.
Referring to fig. 14, terminal device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.
The processing component 802 generally controls overall operation of the terminal device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.
The memory 804 is configured to store various types of data to support operations at the terminal device 800. Examples of such data include instructions for any application or method operating on terminal device 800, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
The multimedia component 808 comprises a screen providing an output interface between the terminal device 800 and a user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. When the terminal device 800 is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera may receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.
The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive an external audio signal when the terminal device 800 is in an operation mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.
The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.
In an exemplary embodiment, the terminal device 800 may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (11)
1. A method for assembling a backlight module, the backlight module comprising: a light emitting assembly and a back housing, the method comprising:
mounting a light emitting unit for emitting light to a first surface of a flexible circuit board to form the light emitting assembly;
bonding a second surface of the flexible circuit board mounted with the light emitting unit to a side surface of the rear surface case by an adhesive; wherein the second surface is opposite the first surface.
2. The method of claim 1, further comprising:
fixing the light emitting assembly by using a fixing piece, wherein a flexible contact surface of the fixing piece is in contact with the light emitting unit;
aligning a second surface of the flexible circuit board in the light emitting assembly fixed on the fixing piece to a side surface of the back shell;
the bonding the second surface of the flexible circuit board mounted with the light emitting unit to the side of the rear surface case by an adhesive includes:
after the second surface is aligned with the back shell, the second surface is bonded to the side of the back shell through the adhesive.
3. The method of claim 2, wherein the fixture includes a suction assembly, and wherein securing the light emitting assembly with the fixture includes:
the flexible contact surface based on the adsorption component acts on the light-emitting unit, so that the light-emitting component is adsorbed on the adsorption component.
4. The method of claim 2, wherein the fixing member comprises a process reinforcing film, and the fixing the light emitting assembly by the fixing member comprises:
and the light-emitting unit is adhered to the flexible contact surface of the process reinforcing film, so that the light-emitting component is fixed on the process reinforcing film.
5. The method according to any one of claims 2 to 4, further comprising:
placing the side surfaces of the back shell on a bearing surface in parallel;
applying said adhesive to the side of said back shell;
the second surface of the flexible circuit board in the light emitting module to be fixed on the fixing member is aligned with the side surface of the rear housing, and the method includes:
and aligning the second surface of the flexible circuit board in the light-emitting assembly fixed on the fixing piece with the side surface which is placed on the bearing surface in parallel and coated with the adhesive.
6. The method of claim 5, wherein said adhering the second surface to the side of the back shell with the adhesive after the second surface is aligned with the back shell comprises:
after the second surface is aligned with the back shell, moving the fixing piece along the direction perpendicular to the carrying surface, so that the second surface of the flexible circuit board on the fixing piece is moved to the adhesive on the side surface of the back shell in parallel;
moving the second surface to the adhesive on the side of the back case in parallel based on the second surface, so that the second surface is adhered to the back case flatly.
7. The method according to any one of claims 2 to 4, wherein the second surface of the flexible circuit board is pasted with an adhesive glue, and the adhesive glue is covered with a protective film;
the method further comprises the following steps:
after the light-emitting component is fixed by the fixing piece, removing the protective film of the adhesive glue;
the second surface of the flexible circuit board in the light emitting module to be fixed on the fixing member is aligned with the side surface of the rear housing, and the method includes:
after the protective film of the adhesive glue is removed, the adhesive glue on the second surface of the flexible circuit board is aligned to the side face of the back shell.
8. The method of claim 2, further comprising:
after the second surface of the flexible circuit board is attached to the side face of the back face shell, the fixing piece is maintained for a preset time length of the fixing state of the light emitting assembly, and then the fixing piece is removed.
9. The method of claim 1, wherein mounting a lighting unit for emitting light to a first surface of a flexible circuit board to form the lighting assembly comprises:
and mounting the light emitting unit for emitting light to the first surface of the flexible circuit board by a surface mounting process to form the light emitting assembly.
10. A backlight module is characterized in that the backlight module comprises:
a back housing;
a light emitting assembly comprising: a light emitting unit and a flexible circuit board; wherein the light emitting unit for emitting light is mounted on a first surface of the flexible circuit board;
the second surface of the flexible circuit board is bonded on the side surface of the back shell through an adhesive, wherein the second surface is opposite to the first surface.
11. A terminal device, characterized in that it comprises at least a backlight module as claimed in claim 10.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910989360.1A CN112684630A (en) | 2019-10-17 | 2019-10-17 | Backlight module assembly method, backlight module and terminal equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910989360.1A CN112684630A (en) | 2019-10-17 | 2019-10-17 | Backlight module assembly method, backlight module and terminal equipment |
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| CN112684630A true CN112684630A (en) | 2021-04-20 |
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