CN101335130B - Manufacturing method of multi-chip type multilayered capacitor - Google Patents
Manufacturing method of multi-chip type multilayered capacitor Download PDFInfo
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- CN101335130B CN101335130B CN2008100212090A CN200810021209A CN101335130B CN 101335130 B CN101335130 B CN 101335130B CN 2008100212090 A CN2008100212090 A CN 2008100212090A CN 200810021209 A CN200810021209 A CN 200810021209A CN 101335130 B CN101335130 B CN 101335130B
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Abstract
The present invention provides a production method of a multi-chip typed multilayer capacitor, which has simple production process, low cost, convenient assembly and high qualification rate. The production method of the invention is characterized by comprising the following steps: different metal sheet base plates are respectively cut into a plurality of separated anode strips and cathode strips, the extension part of which are still connected with the base plates: after being punched out a through hole which is corresponding to and smaller than the cathode strips and the anode strips, a separated sheet with multiple pores is used as an isolating layer between the cathode strips and the anode strips; and then the cathode strips, the anode strips and the isolating layer are stacked and pressed in order of the cathode strip, the isolating layer, the anode strip, the isolating layer and the cathode strip to form at least one layer of laminated structure of the cathode strip, the isolating layer and the anode strip; and then the laminated structure is dipped in an electrolyte solution to absorb electrolytes, and thermally polymerizing is carried out to cause the isolating layer between the anode strips and the cathode strips to form a macromolecule polymer electrolyte layer with electrical conductivity; finally the laminated structure is cut to derive an anode guide plate and a cathode guide plate, and then the multi-chip typed multilayer capacitor is completed.
Description
Technical field
The present invention relates to the capacitor technology field, be specially the manufacture method of multi-chip type multilayered capacitor.
Background technology
Because the evolution of semiconductor technology, make the product of semi-conductor packaging under the market demand improves, constantly develop and more accurate, more advanced electronic building brick.With present semiconductor technology,, all in semiconductor industry, occupy indispensable status such as the technology of crystal covered package, the design of laminated substrate and the design of passive component etc.To cover crystalline substance/ball lattice array packaging structure is example, chip system is disposed on the surface of base plate for packaging, and chip and base plate for packaging electrically connect, and base plate for packaging is multi-layered patterned circuit layer, and the multilayer dielectric layer productive set forms, wherein patterned circuit layer can be defined via the mode of lithography and be formed, and insulating barrier is disposed between adjacent two patterned circuit layer.In addition, in order to obtain better electrical characteristic, also dispose passive components such as electric capacity, inductance and resistance on the surface of base plate for packaging, it can electrically connect with chip and other electronic building brick by the internal wiring of base plate for packaging.
In the design of passive component, because chip is under high-speed computation, can produce high heat, and the heat energy that chip produced reaches passive component after can reaching base plate for packaging again.Therefore even, also can not influence its electrical characteristic, must design passive component, and microminiature lamination capacitor promptly is an example wherein with high temperature resistant and high stability in order to make passive component under the environment of high temperature.
General microminiature lamination capacitor, main system is formed by multilayer dielectric layer and multiple layer metal layer stack, wherein, the dielectric series of strata are by the material of high-k, as: ba titanate is formed, and the metal series of strata by as: silver, the conductive material of silver palladium alloy is formed, and the multiple layer metal layer forms a plurality of sun, electrode (Internal electrode) within negative electrode replaces, and interior electrode and dielectric series of strata constitute a capacitance structure, and its both sides also dispose a pair of terminal electrode, electrically connect sun respectively, electrode within the negative electrode, form anode and negative electrode, and these anodes and cathode surface can form a surface metal-layer, as: nickel, in case oxidation.And the volume microminaturization can increase the utilization scope, still, its processing procedure complexity, the cost height, short circuit ratio is a lot, manufacture process and assembling difficulty.Moreover, U.S. US6249424 patent has also disclosed single aluminium chip capacitor 7, see Fig. 1, this capacitor system is made of anode 1 and negative electrode 2 intermediate isolating one separator 3, wherein be coated with dielectric oxide film (Al2O3) 2 on the anode 1, between negative electrode 2 that conductive carbon glue-line 5 and elargol layer 6 are constituted and the anode 1 electroconductive polymer layer 4 is arranged then, and separator 3 isolated negative electrodes 2 constitute aluminium chip capacitor 7 with anode 1.Yet, the capacitor desire increases its capacitance system in the mode of being connected in parallel, make several capacitor stack and make the capacitance addition of these capacitors, obtain the bigger capacitance (shown in the 2nd figure) after several capacitance additions, and the aluminium chip capacitor 7 behind the storehouse encapsulated 9, and draw lead foot 8 respectively from anode 1 and cathode terminal, form complete capacitor, but, the stack capacitor device needs with tool 11 extruded aluminium chip capacitors 7 (shown in the 3rd figure), so processing procedure complexity (increase with tool 11 and pressing and going up elargol 10 supervisors), the cost height, short circuit ratio is a lot, and when encapsulation, produce thermal stress easily and cause capacitance damage, and for example U.S. US6421227 patent also discloses the storehouse mode of electric capacity difference, sees also 4a, 4b, shown in the 4c figure, it shows plants different storehouse modes more than the icon of this patent, yet, no matter which kind of storehouse mode also as above-mentioned U.S. US6249424 patent, can't overcome capacitor and damage easily, the processing procedure complexity, the cost height, the shortcoming that short circuit ratio is very high.Therefore, how can development and Design go out a kind of multi-chip type multilayered capacitor, will be that relevant industry is demanded the problem of effort urgently.
Summary of the invention
At the problems referred to above, the invention provides the manufacture method of multi-chip type multilayered capacitor, its manufacturing process is simple, cost is low, easy to assembly, qualification rate is high.
The manufacture method of multi-chip type multilayered capacitor: it is characterized in that: different sheet metal substrates cut out several separation respectively and anode strip and cathode sheets that its extension still links to each other with substrate, with the isolation sheet stamping of many pores property go out with cathode sheets, anode strip is corresponding and than behind the little through hole of cathode sheets, anode strip as the separator between cathode sheets, the anode strip; Then cathode sheets, anode strip and separator are carried out storehouse and pressing according to the order of cathode sheets, separator, anode strip, separator, cathode sheets, form the lamination structure of one deck cathode sheets, separator, anode strip at least; Again this lamination structure be impregnated in the solution of electrolyte afterwards,, and give thermal polymerization, make the separator between anode strip and the cathode sheets form the electroconductive polymer polyelectrolyte floor with absorbed electrolyte; At last this lamination structure is cut, and draw anode lead, cathode lead, promptly finish the laminated capacitor of multi-chip type.
It is further characterized in that: lamination structure be impregnated in electrolyte solution before with this lamination structure carbonization; Lamination structure cuts the outer enclosure cover layer of back at lamination, and described tectal internal layer is a fabric strip;
The manufacture method of multi-chip type multilayered capacitor, it is characterized in that: different sheet metal substrates is cut out several separation respectively and anode strip and cathode sheets that its extension still links to each other with substrate, with the isolation sheet stamping of many pores property go out with cathode sheets, anode strip is corresponding and than behind the little through hole of cathode sheets, anode strip as the separator between cathode sheets, the anode strip; With anode strip, cathode sheets and separator are according to cover layer, the fine band of carbon, be according to separator then, cathode sheets, separator, anode strip, separator, cathode sheets, separator, anode strips etc. carry out storehouse and pressing in proper order and form at least that one deck is followed successively by separator, cathode sheets, separator, the lamination structure of anode strip, be followed successively by separator at last, fabric strip, the order of cover layer is storehouse and pressing mutually, and draw the anode lead that is connected with anode strip, an and cathode lead that is connected with cathode sheets, as outer electrode, promptly form multi-chip type multilayered capacitor.
It is further characterized in that: the material of described anode strip is an aluminium foil; The separator material is paper, adhesive-bonded fabric fiber, carbonizing paper, carbon is fine and synthetic fiber cloth, carbon fibre and paper fiber etc.; The material of cathode sheets is the metal forming of metal forming, lining; The metal forming of described lining comprises metal substrate and one or more layers coating, and the material and the coating of described metal substrate are identical or different, and coating utilizes splash, dipping, plating or other coating method to be formed on the substrate; Described electrolyte is liquid electrolyte or is the monomer of electric conductive polymer solid electrolyte; The anode lead that described laminated capacitor is drawn, cathode lead are bent to the ambroin laminar surface and fit.
Adopt the present invention to process capacitor, its cathode sheets, anode strip and separator can the while cutting processing go out respectively, immerse electrolyte behind the stacked heap again and form dielectric substrate, and whole process is simple, and cost reduces, and easy to assembly, the qualification rate of product is higher.
Description of drawings
Fig. 1 is the structural representation of existing unit chip type multilayered capacitor;
Fig. 2, Fig. 3, Fig. 4 a, Fig. 4 b, Fig. 4 c are for having the schematic diagram of multi-chip type multilayered capacitor now;
Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10, Figure 11 a, Figure 11 b, Figure 11 c are that single aluminium chip capacitor is made the process step component;
Figure 12 is the schematic diagram of lamination structure among the present invention;
Figure 13 a, Figure 13 b, Figure 13 c, Figure 13 d are respectively the vertical view of lamination multicore chip capacitor device;
Figure 14 is a manufacturing process schematic diagram of the present invention.
Embodiment
Below in conjunction with embodiment the course of processing of the present invention is described:
(1) sees Fig. 5, Fig. 6, the anode strip 8,9,10 that sheet metal substrate 1 is stamped out several separation and links to each other with substrate 1 with extension 3 respectively ... reach the cathode sheets 11,12,13 that sheet metal substrate 2 is stamped out several separation and links to each other with substrate with extension 3 respectively ... the isolation thin plate 4 of pore more than is stamped out and anode strip 8,9,10 ..., cathode sheets 11,12,13 ... corresponding and than behind the little through hole 16 of yin, yang pole piece, as yin, yang pole piece 8,9,10 ..., 11,12,13 ... between separator 17;
(2) see Fig. 7, then with anode strip 8,9,10 ..., separator 17, cathode sheets 11,12,13 ... order according to cathode sheets, separator, anode strip, separator, cathode sheets is carried out storehouse and pressing, forms the lamination structure 5 of one deck cathode layer, anode layer and separator at least;
(3) see Fig. 8, Fig. 9, Figure 10, Figure 11 a, again this lamination structure 5 be impregnated in the electrolyte solution groove 6,, form dielectric substrate with absorbed electrolyte;
(4) see Figure 11 b, lamination structure 5 is cut, corresponding anode strip, separator, cathode sheets are formed laminated capacitor structure 7, keep the anode lead 3 that is connected with anode strip 8,9,10 respectively when cutting, and respectively with cathode sheets 11,12,13 ... the cathode lead 3 that is connected is as the outer electrode of external electrical connection use;
(5) see Figure 11 c, on this laminated capacitor structure 7, encapsulate cover layer 19 at last again, promptly obtain the laminated capacitor 20 of multi-chip type.
See Figure 12, with anode strip 8,9,10 ..., cathode sheets 11,12,13 ... and separator 17 according to cover layer (cover) 18, carbon fibre be with 21, separator 17, cathode sheets, separator, anode strip, separator, cathode sheets, separator ... the order of cathode sheets, separator, fabric strip, cover layer is storehouse and pressing mutually, and draw and anode strip 8,9,10 ... the anode lead 3 that is connected, and one and cathode sheets 11,12,13 ... the cathode lead 3 that is connected, as outer electrode, promptly form multi-chip type multilayered capacitor 20.
Coating soluble conductive Polymer Solution is adopted on the surface of separator 17, makes solid electrolytes such as its absorption electroconductive polymer list amount body, forms dielectric substrate; Separator 17 is for containing the non-weaving cloth or the paper of carbon fibre.
In the present invention, see also shown in 13a, 13b, 13c, the 13d figure, the demand of the present invention's laminated capacitor 20 visual uses is drawn three cathode lead (two anode lead 14, cathode lead 15 or anode lead 14, two cathode lead 15) (shown in 13a figure) in its three side; Or draw four cathode lead (two anode lead 14, two cathode lead 15) (shown in the 15th figure) respectively in its four side; Or draw anode lead 14, cathode lead 15 (shown in 13c figure) respectively in its two adjacent side; Or draw anode lead 14, cathode lead 15 (shown in 13d figure) in arbitrary side.
See also shown in the 14th figure, anode strip 8,9,10 ..., cathode sheets 11,12,13 ... and the mutual storehouse and the pressing mode of separator 17, can before and after storehouse, pressing mode carry out, make as the guide card 15 of negative electrode and as the guide card 14 of anode and lay respectively at the front and back ends of lamination structure 5, carry out follow-up operation again.22 are dipping line (Dipping line).
Claims (10)
1. the manufacture method of multi-chip type multilayered capacitor, it is characterized in that: different sheet metal substrates is cut out several separation respectively and anode strip and cathode sheets that its extension still links to each other with substrate, with the isolation sheet stamping of many pores property go out with cathode sheets, anode strip is corresponding and than behind the little through hole of cathode sheets, anode strip as the separator between cathode sheets, the anode strip; Then cathode sheets, anode strip and separator are carried out storehouse and pressing according to the order of cathode sheets, separator, anode strip, form the lamination structure of one deck cathode sheets, anode strip and separator at least; Again this lamination structure be impregnated in the solution of electrolyte, with absorbed electrolyte afterwards; The solution of described electrolyte is polyelectrolyte solution, at high temperature gives thermal polymerization, makes the separator between anode strip and the cathode sheets form the electroconductive polymer polyelectrolyte floor; At last this lamination structure is cut, and draw anode lead, cathode lead, promptly finish the laminated capacitor of multi-chip type.
2. according to the manufacture method of the described multi-chip type multilayered capacitor of claim 1, it is characterized in that: lamination structure be impregnated in electrolyte solution before with this lamination structure carbonization.
3. according to the manufacture method of the described multi-chip type multilayered capacitor of claim 2, it is characterized in that: lamination structure cuts the outer enclosure cover layer of back at lamination.
4. according to the manufacture method of the described multi-chip type multilayered capacitor of claim 3, it is characterized in that: described tectal internal layer is a fabric strip.
5. the manufacture method of multi-chip type multilayered capacitor, it is characterized in that: different sheet metal substrates is cut out several separation respectively and anode strip and cathode sheets that its extension still links to each other with substrate, with the isolation sheet stamping of many pores property go out with cathode sheets, anode strip is corresponding and than behind the little through hole of cathode sheets, anode strip as the separator between cathode sheets, the anode strip; Anode strip, cathode sheets and separator are with according to cover layer, carbon fibre, be to carry out storehouse according to the order of separator, cathode sheets, separator, anode strip, separator, cathode sheets, separator, anode strip to form the lamination structure that one deck at least is followed successively by separator, cathode sheets, separator, anode strip then, be followed successively by the order storehouse and the pressing mutually of separator, fabric strip, cover layer at last, and draw the anode lead that is connected with anode strip, an and cathode lead that is connected with cathode sheets, as outer electrode, promptly form multi-chip type multilayered capacitor.
6. according to the manufacture method of claim 1 or 5 described multi-chip type multilayered capacitors, it is characterized in that: the material of described anode strip is an aluminium foil.
7. according to the manufacture method of claim 1 or 5 described multi-chip type multilayered capacitors, it is characterized in that: described separator material is paper, non-weaving cloth fiber, carbon is fine and synthetic fiber cloth, carbon fibre and paper fiber.
8. according to the manufacture method of claim 1 or 5 described multi-chip type multilayered capacitors, it is characterized in that: the material of cathode sheets is the metal forming of metal forming, lining, the metal forming of lining comprises metal substrate and one or more layers coating, and the material of described metal substrate can be identical or different with coating.
9. the manufacture method of described multi-chip type multilayered capacitor according to Claim 8, it is characterized in that: described coating utilizes splash, dipping, plating or other coating method to be formed on the substrate.
10. according to the manufacture method of the described multi-chip type multilayered capacitor of claim 1, it is characterized in that: the material of cathode sheets is the metal forming of metal forming, lining, the metal forming of lining comprises metal substrate and one or more layers coating, and the material and the coating of described metal substrate are identical or different; Described coating utilizes splash, dipping, plating or other coating method to be formed on the substrate; Described electrolyte is liquid electrolyte or is the monomer of electric conductive polymer solid electrolyte.
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| CN2008100212090A CN101335130B (en) | 2008-07-21 | 2008-07-21 | Manufacturing method of multi-chip type multilayered capacitor |
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| CN2008100212090A CN101335130B (en) | 2008-07-21 | 2008-07-21 | Manufacturing method of multi-chip type multilayered capacitor |
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| CN101335130A CN101335130A (en) | 2008-12-31 |
| CN101335130B true CN101335130B (en) | 2011-09-28 |
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| CN2008100212090A Expired - Fee Related CN101335130B (en) | 2008-07-21 | 2008-07-21 | Manufacturing method of multi-chip type multilayered capacitor |
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| CN116768330B (en) * | 2023-07-13 | 2024-01-30 | 四川红杉岭环保科技有限公司 | Microchannel processor for sewage treatment, microchannel module and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096611A (en) * | 1992-09-18 | 1994-12-21 | 宾纳科尔研究院 | Energy storing device and manufacture method thereof |
| CN1345075A (en) * | 2001-11-02 | 2002-04-17 | 中国科学院上海冶金研究所 | Manufacture of high-voltage electrochemical capacitor |
| JP2006245149A (en) * | 2005-03-01 | 2006-09-14 | Nec Tokin Corp | Wet electrolytic capacitor and its manufacturing method |
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- 2008-07-21 CN CN2008100212090A patent/CN101335130B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096611A (en) * | 1992-09-18 | 1994-12-21 | 宾纳科尔研究院 | Energy storing device and manufacture method thereof |
| CN1345075A (en) * | 2001-11-02 | 2002-04-17 | 中国科学院上海冶金研究所 | Manufacture of high-voltage electrochemical capacitor |
| JP2006245149A (en) * | 2005-03-01 | 2006-09-14 | Nec Tokin Corp | Wet electrolytic capacitor and its manufacturing method |
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