CN201111125Y

CN201111125Y - Non-contact smart card

Info

Publication number: CN201111125Y
Application number: CNU2007201442866U
Authority: CN
Inventors: 朱阁勇; 池侠; 邱海涛
Original assignee: SHANGHAI LUNENG SMART CARD CO Ltd
Current assignee: SHANGHAI LUNENG SMART CARD CO Ltd
Priority date: 2007-11-02
Filing date: 2007-11-02
Publication date: 2008-09-03
Anticipated expiration: 2017-11-02

Abstract

The utility model relates to a non-contact smart card which includes a core layer composed of a chip, a polymer base containing an antenna as well as a packing layer, the thickness of the packing layer is more than or equal to the thickness of the chip, and the chip connected with the antenna is positioned in a hole arranged in the packing layer. The non-contact smart card adopts the etching antenna, then the bending resistance of the antenna is greatly improved, thus increasing the stability of the product, and the smart card can also be used in a humid and hot environment with low cost; the packaging cost of the chip is saved due to the direct connected between the chip and the etching antenna on the polymer base; and the punched packing layer reduces the pressure on the chip when in lamination, increasing the protection to the chip and improve the finished product rate.

Description

A kind of contactless smart card

Technical field

The utility model relates to a kind of contactless smart card.

Background technology

Contactless smart card being applied to more and more widely is often used in as means such as identification and small amount payments in the daily life.The method for making of present contactless smart card was divided into for three steps substantially:

The first step is that packaged chip is filled in the hole on the polymeric base layer;

Second step was to make antenna on polymeric base layer.What the method application of manufacturing antenna was maximum has two kinds, and a kind of ultrasound wave that is to use is embedded to copper cash in the polymeric base layer, a kind of antenna that is to use serigraphy;

The 3rd step was the mode by welding, made packaged chip be connected with metal antenna in the basic unit;

The 4th step was respectively to adhere to the several layers polymkeric substance up and down in basic unit, and band printing or not with the polymkeric substance surface layer of printing, and they are carried out overall fixed, carried out lamination (heating, pressurization) then and final production goes out contactless smart card.

And currently used antenna manufacture craft, majority is the serigraphy method for making.Serigraphy is that silk fabrics, synthetic fabrics or wire gauze are stretched tight on screen frame, utilize photosensitive material to make screen printing forme (making the silk screen hole of picture and text part on the screen printing forme is through hole, and the silk screen hole of non-graphic part is plugged) by photomechanical method.By the extruding of scraper plate, printing ink is transferred on the stock by the mesh of picture and text part during printing, formed the picture and text the same with original copy.When serigraphy is used for common printed product, convenient and simple and with low cost, but during the antenna of making in this way, but exist yield rate not high, the shortcoming of cost an arm and a leg (use the fine silver powder and solidify glue).And the curing glue poor ductility of printed antenna, make that the anti-bending of making of card is relatively poor.And owing to the stable bad restriction that is subjected to environment for use of solidifying glue, under some maximum conditions, under high humidity, low temperature environment, solidify glue qualitative change can take place, thereby have influence on the electric conductivity of antenna, the situation of the electrical property inefficacy of card appears.

And the method for chip is welded and directly pasted to the module that fabrication is at present adopted, but shortcoming is respectively arranged: the cost of module package is too high; The method of direct obedient chip, not enough again to the protection of chip, cause card to damage easily.

In the link of hot pressing, because conventional art, the sandwich layer and the card material layer of band antenna are difficult to pressing, cause the peel strength of card not enough.

Therefore, this smart card of being made by packaged chip exists several shortcomings, and when first pair of finished product smart card bent, stress is more to be concentrated on the chip that encapsulates, and causes chip to damage or solder joint is thrown off and caused inefficacy; The second, cost is higher after the Chip Packaging.

Summary of the invention

Technical problem to be solved in the utility model is: at the problem of above-mentioned existence, provide a kind of reliability height, contactless smart card that cost is low.

The technical solution of the utility model:

A kind of contactless smart card comprises the sandwich layer that is made of chip, the polymeric base layer that contains antenna and packed layer, and the thickness of described packed layer is more than or equal to the thickness of described chip, and the chip that links to each other with described antenna is arranged in the hole that described packed layer is provided with.

Described antenna is an etching antenna.

The upper and lower surface of described sandwich layer is respectively equipped with polymer protective layer.

The beneficial effects of the utility model:

The utility model has adopted etching antenna, the good ductility of metal is much better than the printshop and adopts the ductility of solidifying glue, thereby makes the anti-bending of antenna improve greatly, has increased the stability of product, in the environment of some humidities, high temperature, also can use, and cost is low.

Owing to directly chip is connected with etching antenna on the polymeric base layer, has saved the cost of Chip Packaging; By using the packed layer of punching, to the pressure of chip, increased protection when having reduced lamination to chip, improved the product row yielding.

Have the punch technology of packed layer and the perfect adaptation of flip chip process, material surface has obtained to have reduced the chip spoilage again than the high in the past pressure that manys when making lamination, thereby has promptly improved surface quality, has guaranteed that again chip is not damaged.

See that from the peeling force of each layer of actual measurement card body the peeling force of its each layer all Duos 30～50% than technology in the past.

Because the area of chip of encapsulation is not about 1/40th to 1/50th of the area of chip that encapsulate, thus when bending at first stress can too much not focus on the chip, next suffered stress of chip also significantly reduces, and has improved reliability.

Description of drawings

Accompanying drawing 1 is the structural representation of packed layer.

Accompanying drawing 2 is the structural representation of sandwich layer.

Accompanying drawing 3 is the side view of Fig. 2.

Embodiment

Below in conjunction with accompanying drawing the utility model is further described.

A kind of contact type intelligent card of the present utility model comprises polymeric base layer 12, packed layer 14; Polymeric base layer 12 is provided with etching antenna 11 and chip 10, and the chip hole 13 on the packed layer 14 just in time is enclosed within on the chip 10 of polymeric base layer 12, and the thickness of packed layer 14 is more than or equal to the thickness of chip 10, as Fig. 1, Fig. 2 and shown in Figure 3.

Make the method for this contact type intelligent card, can use the commercially available sheet machine of losing money instead of making money.

At first lose money instead of making money the sheet operation.The thin polymer film that carries etching antenna 11 is installed in loses money instead of making money on the sheet machine.Nation's allocation on antenna is coated different in nature conducting resinl, and chip 10 is put into nation's allocation from filling out after wafer takes off; By chip 10 is pressurizeed up and down, heats, make conductive glue solidify then, thereby chip 10 and etching antenna 11 tightly are bonded together, form the galvanic circle, as shown in Figure 2.

Secondly, select thickness to be greater than the polymkeric substance packed layer that equals chip thickness, punching thereon, as shown in Figure 2.

The polymeric base layer 12 that will have chip 10 and an etching antenna 11 is with after packed layer 14 aligns, keep flat on the commercially available binder, by heating, pressurize with two-layer stapled together, and make the aperture on the packed layer just in time be enclosed within on the chip of basic unit, as shown in Figure 3, then that other each polymeric material is stapled together successively.

Stapled material is moved in the laminating machine, make each layer fully softening, thereby be bonded together, laminating temperature generally uses 90～150 degrees centigrade.

Claims

1, a kind of contactless smart card, comprise the sandwich layer that constitutes by chip, the polymeric base layer that contains antenna and packed layer, it is characterized in that: the thickness of described packed layer is more than or equal to the thickness of described chip, and the chip that links to each other with described antenna is arranged in the hole that described packed layer is provided with.

2, contactless smart card according to claim 1 is characterized in that: described antenna is an etching antenna.

3, contactless smart card according to claim 1 and 2 is characterized in that: the upper and lower surface of described sandwich layer is respectively equipped with polymer protective layer.