CN101275257A

CN101275257A - Method for electroplating gold on surface of circuit board

Info

Publication number: CN101275257A
Application number: CNA2007100274162A
Authority: CN
Inventors: 黄晴; 曹振辉; 李贵荣
Original assignee: Foxlink Electronics Dongguan Co Ltd; Cheng Uei Precision Industry Co Ltd
Current assignee: Foxlink Electronics Dongguan Co Ltd; Cheng Uei Precision Industry Co Ltd
Priority date: 2007-03-30
Filing date: 2007-03-30
Publication date: 2008-10-01
Anticipated expiration: 2027-03-30
Also published as: CN100585022C

Abstract

The invention discloses a method for electrogilding on the surface of a circuit board. The method comprises the following steps: (1) cutting the to-be processed circuit board; (2) drilling the product pores and positioning pores; (3) adhering wet film on the copper-clad layer and generating dry film on the area which is beyond the electrogilding area by exposure and development; (4) removing the wet film at the electrogilding area, plating an electrogilding layer on the surface of the electrogilding area by taking copper-clad layer as electrode; peeling the dry film beyond the electrogilding area after the plating; (5) adhering the wet film on the circuit board and generating the dry film of the electrogilding area and the lines after the exposure and development; (6) corroding the electrogilding area covered with the dry film and the copper clad beyond the lines, then peeling the dry film; (7) pressing protective film on the circuit board; (8) manufacturing the circuit board as finished product. The method takes the copper-clad layer as plating electrode, so the method effectively reduces the process procedure and enhances the qualification rate of the plating product and shortens the producing period.

Description

A kind of method of electroplating gold on surface of circuit board

Affiliated technical field

The present invention relates to a kind of method for electroplating surface, relate in particular to the method for electroplating surface that a kind of pad to circuit card welding exterior electrical components carries out electrogilding.

Background technology

Electroplating technology is under the effect of DC electric field, constitutes the loop by anode and negative electrode in electrolyte solution (plating bath), makes the solution metal ion deposition to the lip-deep process of negative electrode plating piece.Electroplating technology has important use as the method that obtains metal plating at material surface in the electrogilding of circuit board surface is handled.The electrogilding of circuit board surface is plating one deck Gold plated Layer on the pad of circuit board surface welding exterior electrical components, to increase the electric connection of circuit in exterior electrical components and the circuit card.

Be electrogilding zone plating one deck Gold plated Layer at circuit board surface, usually add the Two electroplate lead wire in the electrogilding zone of circuit board surface with as galvanized anode and negative electrode, it is existing that circuit board surface is carried out the procedure of processing of electrogilding is as follows: 1. clipper circuit plate, to determine the specification of circuit card; 2. on the circuit card of step 1 cutting, bore product hole and pilot hole; 3. on the copper foil layer of step 2 generative circuit plate, paste wet film, and generate dry film through exposure and development treatment; 4. copper foil layer is etched into the circuit that needs and etches electroplate lead wire, then the dry film of strip step 3 generations; 5. on the circuit card that step 4 generates, paste wet film again, and generate dry film in zone in addition, shielding electrogilding zone (welding disking area) through exposure and development treatment; 6. remove the wet film in electrogilding zone, carry out electrogilding processing in the zone of electrogilding, then the dry film of strip step 5 generations by electroplate lead wire; 7. paste wet film on the circuit card that step 6 generates, the zone beyond electroplate lead wire generates dry film through overexposure and development treatment, removes wet film then to expose electroplate lead wire; 8. remove electroplate lead wire by etching, and the dry film of strip step 7 generations; 9. to the board layer voltage protection film of step 8; 10. with the circuit card punching out finished product of step 9.

Because the existing working method that circuit board surface is carried out electrogilding need etch the step that electroplate lead wire is removed in electroplate lead wire and etching, therefore production process is many, the product yield is low, the production cycle is long, and when electroplate lead wire is removed in etching, because too much or fail to remove fully electroplate lead wire, the product of production can form breach or salient point at the electroplate lead wire place.

Summary of the invention

The method that the purpose of this invention is to provide a kind of electroplating gold on surface of circuit board, the method by this electroplating gold on surface of circuit board can make circuit card non-notch or the salient point that processes, and the manufacturing procedure of product is few, product yield height, with short production cycle.

For achieving the above object, the invention provides a kind of method of electroplating gold on surface of circuit board, this method comprises the steps:

(1) cuts circuit card to be processed;

(2) on the circuit card of step 1 cutting, be drilled with product hole and pilot hole;

(3) on the copper foil layer of step 2 generative circuit plate, paste wet film, and make zone in addition, electrogilding zone generate dry film through exposure and development treatment;

(4) removing the wet film of electrogilding location in the step 3, is that electroplated electrode is electroplated one deck electrogilding layer to the electrogilding region surface that needs electrogilding with the copper foil layer, finish back and divest dry film beyond the electrogilding zone of electrogilding;

(5) on the circuit card that step 4 generates, paste wet film, and on circuit card, generates the dry film of the regional and circuit of electrogilding through exposure and development treatment;

(6) circuit card that generates of etching step 5 erodes the electrogilding zone that is covered with dry film on the circuit card and the circuit Copper Foil with exterior domain, peels the dry film on the regional and circuit of electrogilding then off and generates circuit;

(7) the circuit card upper strata voltage protection film that generates in step 6;

(8) the circuit card punching out that step 7 is generated becomes finished product.

As mentioned above, the method of electroplating gold on surface of circuit board of the present invention does not need to etch the step that electroplate lead wire is removed in electroplate lead wire and etching, therefore the manufacturing procedure of the method for electroplating gold on surface of circuit board of the present invention is less, and the product yield can effectively be provided, and product non-notch or salient point after the processing.

Description of drawings

In Figure of description:

Fig. 1 is the local structure synoptic diagram of circuit card.

Fig. 2 is the schema of the course of processing of the method for electroplating gold on surface of circuit board of the present invention.

Fig. 3-1 is to Fig. 3-the 7th, the structural representation of the course of processing of the method for electroplating gold on surface of circuit board of the present invention.

The description of reference numerals of assembly is as follows among the figure:

Flexible circuit board 10 circuit cards 11

Pilot hole 12 product holes 13

Electrogilding zone 14 copper foil layers 15

Electrogilding layer 16 circuit 17

Wet film 20 dry films 30

Protective membrane 40

Embodiment

For describing technology contents of the present invention, structural attitude, the purpose of being reached and effect in detail, exemplify below that specific embodiment and conjunction with figs. are detailed gives explanation.

See also Fig. 1, the surface of circuit card 10 is provided with some electrogildings zone (welding disking area) 14, and electrogilding zone 14 is used for welding exterior electrical components is welded on circuit card 10 with the pin of exterior electrical components.Electrogilding zone 14 is connected with the circuit 17 that is etched into by the Copper Foil on the circuit card 10 (shown in Fig. 3-6), externally to form circuit between electronic component and the circuit 17.Begin to have pilot hole 12 and product hole 13 (shown in Fig. 3-2) to be used on the circuit card 10 and electroplate electrogilding zone 14 o'clock and circuit card 10 is fixed and located at circuit etching 17.

See also Fig. 2 and in conjunction with Fig. 3-1 to Fig. 3-7, when electrogilding was carried out on the surface of circuit card 10, the method for electroplating gold on surface of circuit board of the present invention comprised the steps:

(1) cutting circuit card 11 to be processed to determine the specification of circuit card 11, has copper foil layer 15 on this circuit card 11, and copper foil layer 15 has needs the electrogilding of electrogilding zone 14, shown in Fig. 3-1;

(2) on the circuit card 11 of step 1 cutting, be drilled with product hole 13 and pilot hole 12, shown in Fig. 3-2;

(3) on the copper foil layer 15 of step 2 generative circuit plate 11, paste wet film 20, and make zone in addition, electrogilding zone 14 generate dry film 30, shown in Fig. 3-3 through exposure and development treatment;

(4) remove the wet film 20 at 14 places, the zone of electrogilding in the step 3, with copper foil layer 15 is that electroplated electrode is electroplated one deck electrogilding layer 16 to the electrogilding region surface that needs electrogilding, electrogilding finishes back and divests electrogilding zone 14 dry film 30 in addition, as shown in Figure 3-4;

(5) on the circuit card 11 that step 4 generates, paste wet film 20, and on circuit card 11, generates the dry film 30 of electrogilding regional 14 and circuit 17, shown in Fig. 3-5 through exposure and development treatment;

(6) circuit card 11 that generates of etching step 5 erodes the electrogilding zone 14 that is covered with dry film 30 on the circuit card 11 and circuit 17 with the Copper Foil 15 of exterior domain, peels the dry film 30 on electrogilding zone 14 and the circuit 17 then off, shown in Fig. 3-6;

(7) the circuit card 11 upper strata voltage protection films 40 that generate in step 6 are shown in Fig. 3-7;

(8) circuit card 11 punching out that step 7 is generated become finished product.

The method of electroplating gold on surface of circuit board of the present invention Copper Foil 15 with circuit card 11 after generating dry film 30 beyond the electrogilding zone 14 is that electrogilding is carried out in electrode pair electrogilding zone 14, etching Copper Foil 15 generates circuit 17 again behind 14 electrogildings of electrogilding zone, therefore the method for electroplating gold on surface of circuit board of the present invention is made electrode and needn't be etched electroplate lead wire by Copper Foil 15, thereby the method for electroplating gold on surface of circuit board of the present invention needn't have and etches the step that electroplate lead wire is removed in electroplate lead wire and etching, so the method for electroplating gold on surface of circuit board of the present invention can effectively reduce manufacturing procedure, improve the yield of plated item, shorten the production cycle, and the product after the processing can not produce breach or salient point.

The above; therefore only be preferred embodiment of the present invention, can not limit protection scope of the present invention, anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or alternative all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of claims.

Claims

1. the method for an electroplating gold on surface of circuit board is characterized in that, this method comprises the steps:

(1) cuts circuit card to be processed;

(6) circuit card that generates of etching step 5 erodes the electrogilding zone that is covered with dry film on the circuit card and the circuit Copper Foil with exterior domain, peels the dry film on the regional and circuit of electrogilding then off;