CN101258268B - 锡和锡合金的水系抗氧化剂 - Google Patents

锡和锡合金的水系抗氧化剂 Download PDF

Info

Publication number: CN101258268B
Authority: CN; China
Prior art keywords: tin; antioxidant; tin alloy; carbonatoms; salt
Prior art date: 2005-09-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN2006800328749A

Other languages

English (en)

Chinese (zh)

Other versions

CN101258268A (zh

Inventor

大内高志

土田克之

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JX Nippon Mining and Metals Corp

Original Assignee

Nippon Mining and Metals Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-09-07

Filing date

2006-08-31

Publication date

2010-11-10

2006-08-31 Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd

2008-09-03 Publication of CN101258268A publication Critical patent/CN101258268A/zh

2010-11-10 Application granted granted Critical

2010-11-10 Publication of CN101258268B publication Critical patent/CN101258268B/zh

Status Active legal-status Critical Current

2026-08-31 Anticipated expiration legal-status Critical

Links

230000003078 antioxidant effect Effects 0.000 title claims abstract description 60
239000003963 antioxidant agent Substances 0.000 title claims abstract description 55
229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 38
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 30
125000000217 alkyl group Chemical group 0.000 claims abstract description 30
150000001875 compounds Chemical class 0.000 claims abstract description 27
150000003014 phosphoric acid esters Chemical class 0.000 claims abstract description 19
150000003839 salts Chemical class 0.000 claims abstract description 16
-1 alkali metal salt Chemical class 0.000 claims description 49
125000004432 carbon atom Chemical group C* 0.000 claims description 28
ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical group OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 20
239000000758 substrate Substances 0.000 claims description 17
239000000463 material Substances 0.000 claims description 16
238000005476 soldering Methods 0.000 claims description 16
239000013543 active substance Substances 0.000 claims description 14
238000004381 surface treatment Methods 0.000 claims description 12
238000000034 method Methods 0.000 claims description 10
239000000843 powder Substances 0.000 claims description 10
238000003466 welding Methods 0.000 claims description 10
125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
229910052783 alkali metal Inorganic materials 0.000 claims description 4
150000003863 ammonium salts Chemical class 0.000 claims description 3
125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
238000011068 loading method Methods 0.000 abstract description 10
238000010438 heat treatment Methods 0.000 abstract description 5
239000004094 surface-active agent Substances 0.000 abstract description 2
230000001050 lubricating effect Effects 0.000 abstract 1
235000006708 antioxidants Nutrition 0.000 description 43
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 23
229910052718 tin Inorganic materials 0.000 description 23
229910000679 solder Inorganic materials 0.000 description 20
230000000052 comparative effect Effects 0.000 description 19
229910000147 aluminium phosphate Inorganic materials 0.000 description 13
238000007747 plating Methods 0.000 description 13
238000012360 testing method Methods 0.000 description 13
239000002253 acid Substances 0.000 description 11
229910045601 alloy Inorganic materials 0.000 description 10
239000000956 alloy Substances 0.000 description 10
230000003647 oxidation Effects 0.000 description 10
238000007254 oxidation reaction Methods 0.000 description 10
QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
238000005406 washing Methods 0.000 description 10
GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 9
229910020994 Sn-Zn Inorganic materials 0.000 description 9
229910009069 Sn—Zn Inorganic materials 0.000 description 9
LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 9
230000003068 static effect Effects 0.000 description 9
239000000203 mixture Substances 0.000 description 8
229910019142 PO4 Inorganic materials 0.000 description 7
239000002585 base Substances 0.000 description 7
150000002148 esters Chemical group 0.000 description 7
239000010452 phosphate Substances 0.000 description 7
RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 6
239000010949 copper Substances 0.000 description 6
238000007598 dipping method Methods 0.000 description 6
150000002500 ions Chemical class 0.000 description 6
HPEUEJRPDGMIMY-IFQPEPLCSA-N molybdopterin Chemical compound O([C@H]1N2)[C@H](COP(O)(O)=O)C(S)=C(S)[C@@H]1NC1=C2N=C(N)NC1=O HPEUEJRPDGMIMY-IFQPEPLCSA-N 0.000 description 6
229910020816 Sn Pb Inorganic materials 0.000 description 5
229910020922 Sn-Pb Inorganic materials 0.000 description 5
229910008783 Sn—Pb Inorganic materials 0.000 description 5
239000003795 chemical substances by application Substances 0.000 description 5
239000000470 constituent Substances 0.000 description 5
230000004907 flux Effects 0.000 description 5
239000000243 solution Substances 0.000 description 5
239000002904 solvent Substances 0.000 description 5
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
239000007864 aqueous solution Substances 0.000 description 4
239000012298 atmosphere Substances 0.000 description 4
229910052802 copper Inorganic materials 0.000 description 4
230000006355 external stress Effects 0.000 description 4
230000001737 promoting effect Effects 0.000 description 4
229910052725 zinc Inorganic materials 0.000 description 4
239000011701 zinc Substances 0.000 description 4
229910000952 Be alloy Inorganic materials 0.000 description 3
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 3
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
239000003513 alkali Substances 0.000 description 3
125000005907 alkyl ester group Chemical group 0.000 description 3
239000011230 binding agent Substances 0.000 description 3
238000001035 drying Methods 0.000 description 3
238000005516 engineering process Methods 0.000 description 3
238000011156 evaluation Methods 0.000 description 3
235000019602 lubricity Nutrition 0.000 description 3
NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
229920000642 polymer Polymers 0.000 description 3
229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 3
239000001103 potassium chloride Substances 0.000 description 3
235000011164 potassium chloride Nutrition 0.000 description 3
239000000126 substance Substances 0.000 description 3
239000013008 thixotropic agent Substances 0.000 description 3
QLYHVLWJJRLFJQ-UHFFFAOYSA-N CCC(CCCCC)(CC)P(O)(O)=O.OCC Chemical compound CCC(CCCCC)(CC)P(O)(O)=O.OCC QLYHVLWJJRLFJQ-UHFFFAOYSA-N 0.000 description 2
PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
229910020836 Sn-Ag Inorganic materials 0.000 description 2
229910020830 Sn-Bi Inorganic materials 0.000 description 2
229910020988 Sn—Ag Inorganic materials 0.000 description 2
229910018728 Sn—Bi Inorganic materials 0.000 description 2
239000000654 additive Substances 0.000 description 2
230000000996 additive effect Effects 0.000 description 2
238000003287 bathing Methods 0.000 description 2
BNMJSBUIDQYHIN-UHFFFAOYSA-N butyl dihydrogen phosphate Chemical compound CCCCOP(O)(O)=O BNMJSBUIDQYHIN-UHFFFAOYSA-N 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
239000006071 cream Substances 0.000 description 2
230000007812 deficiency Effects 0.000 description 2
238000005238 degreasing Methods 0.000 description 2
238000011161 development Methods 0.000 description 2
SEGLCEQVOFDUPX-UHFFFAOYSA-N di-(2-ethylhexyl)phosphoric acid Chemical compound CCCCC(CC)COP(O)(=O)OCC(CC)CCCC SEGLCEQVOFDUPX-UHFFFAOYSA-N 0.000 description 2
230000000694 effects Effects 0.000 description 2
230000005496 eutectics Effects 0.000 description 2
KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
238000000227 grinding Methods 0.000 description 2
230000005764 inhibitory process Effects 0.000 description 2
239000007788 liquid Substances 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
238000005065 mining Methods 0.000 description 2
150000003008 phosphonic acid esters Chemical class 0.000 description 2
238000002203 pretreatment Methods 0.000 description 2
229910052709 silver Inorganic materials 0.000 description 2
230000035882 stress Effects 0.000 description 2
239000012756 surface treatment agent Substances 0.000 description 2
238000010301 surface-oxidation reaction Methods 0.000 description 2
229910000906 Bronze Inorganic materials 0.000 description 1
229940120146 EDTMP Drugs 0.000 description 1
206010028980 Neoplasm Diseases 0.000 description 1
IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
239000002202 Polyethylene glycol Substances 0.000 description 1
NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical class OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical class CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
238000003916 acid precipitation Methods 0.000 description 1
150000001298 alcohols Chemical class 0.000 description 1
150000008431 aliphatic amides Chemical class 0.000 description 1
125000005037 alkyl phenyl group Chemical group 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
150000001413 amino acids Chemical class 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
229960003237 betaine Drugs 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
229910052797 bismuth Inorganic materials 0.000 description 1
239000010974 bronze Substances 0.000 description 1
238000005266 casting Methods 0.000 description 1
230000008859 change Effects 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
239000003153 chemical reaction reagent Substances 0.000 description 1
239000004020 conductor Substances 0.000 description 1
KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
238000005336 cracking Methods 0.000 description 1
238000010586 diagram Methods 0.000 description 1
238000009792 diffusion process Methods 0.000 description 1
NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 description 1
238000003912 environmental pollution Methods 0.000 description 1
230000003628 erosive effect Effects 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
239000012467 final product Substances 0.000 description 1
150000002334 glycols Chemical class 0.000 description 1
230000006872 improvement Effects 0.000 description 1
229910052738 indium Inorganic materials 0.000 description 1
239000011261 inert gas Substances 0.000 description 1
238000007689 inspection Methods 0.000 description 1
150000002576 ketones Chemical class 0.000 description 1
238000005461 lubrication Methods 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
230000007246 mechanism Effects 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
230000005499 meniscus Effects 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
229940055577 oleyl alcohol Drugs 0.000 description 1
XMLQWXUVTXCDDL-UHFFFAOYSA-N oleyl alcohol Natural products CCCCCCC=CCCCCCCCCCCO XMLQWXUVTXCDDL-UHFFFAOYSA-N 0.000 description 1
230000001590 oxidative effect Effects 0.000 description 1
239000006174 pH buffer Substances 0.000 description 1
125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
239000000047 product Substances 0.000 description 1
230000001105 regulatory effect Effects 0.000 description 1
238000011160 research Methods 0.000 description 1
229920006395 saturated elastomer Polymers 0.000 description 1
239000004332 silver Substances 0.000 description 1
238000003860 storage Methods 0.000 description 1
BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
235000012976 tarts Nutrition 0.000 description 1
230000003685 thermal hair damage Effects 0.000 description 1
238000007669 thermal treatment Methods 0.000 description 1
101150095744 tin-9.1 gene Proteins 0.000 description 1
125000004417 unsaturated alkyl group Chemical group 0.000 description 1
239000002699 waste material Substances 0.000 description 1
238000009736 wetting Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
- C23G1/066—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors phosphorus-containing compounds
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M137/00—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing phosphorus
- C10M137/12—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing phosphorus having a phosphorus-to-carbon bond
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/167—Phosphorus-containing compounds
- C23F11/1673—Esters of phosphoric or thiophosphoric acids
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/167—Phosphorus-containing compounds
- C23F11/1676—Phosphonic acids
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2223/00—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions
- C10M2223/06—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions having phosphorus-to-carbon bonds
- C10M2223/061—Metal salts
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2223/00—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions
- C10M2223/06—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions having phosphorus-to-carbon bonds
- C10M2223/063—Ammonium or amine salts
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2010/00—Metal present as such or in compounds
- C10N2010/02—Groups 1 or 11
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2010/00—Metal present as such or in compounds
- C10N2010/08—Groups 4 or 14
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/10—Inhibition of oxidation, e.g. anti-oxidants
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Oil, Petroleum & Natural Gas (AREA)
Preventing Corrosion Or Incrustation Of Metals (AREA)

CN2006800328749A 2005-09-07 2006-08-31 锡和锡合金的水系抗氧化剂 Active CN101258268B (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2005258826		2005-09-07
JP258826/2005		2005-09-07
PCT/JP2006/317199 WO2007029589A1 (ja)	2005-09-07	2006-08-31	錫および錫合金の水系酸化防止剤

Publications (2)

Publication Number	Publication Date
CN101258268A CN101258268A (zh)	2008-09-03
CN101258268B true CN101258268B (zh)	2010-11-10

Family

ID=37835708

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN2006800328749A Active CN101258268B (zh)	2005-09-07	2006-08-31	锡和锡合金的水系抗氧化剂

Country Status (5)

Country	Link
JP (1)	JP4601670B2 (ja)
KR (1)	KR100964063B1 (ja)
CN (1)	CN101258268B (ja)
TW (1)	TW200712257A (ja)
WO (1)	WO2007029589A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN114086169A (zh) *	2021-11-09	2022-02-25	南通群安电子材料有限公司	锡面保护剂

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2007197791A (ja) *	2006-01-27	2007-08-09	Daiwa Fine Chemicals Co Ltd (Laboratory)	めっき後処理剤組成物
US7883738B2 (en) *	2007-04-18	2011-02-08	Enthone Inc.	Metallic surface enhancement
EP2180081B1 (en) *	2008-10-21	2011-05-11	ATOTECH Deutschland GmbH	Post-treatment composition for increasing corrosion resistance of metal or metal alloy surfaces
WO2012118075A1 (ja) *	2011-03-02	2012-09-07	千住金属工業株式会社	フラックス
JP5928142B2 (ja) *	2011-05-13	2016-06-01	上村工業株式会社	錫又は錫合金めっき皮膜用後処理剤、及び錫又は錫合金めっき皮膜の処理方法
JP5427945B2 (ja) *	2012-06-27	2014-02-26	Ｊｘ日鉱日石金属株式会社	電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
JP6029435B2 (ja) *	2012-06-27	2016-11-24	Ｊｘ金属株式会社	電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
JP6050664B2 (ja) *	2012-06-27	2016-12-21	Ｊｘ金属株式会社	電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
CN104471113B (zh) *	2012-07-25	2016-08-24	Jx日矿日石金属株式会社	电子部件用金属材料及其制造方法、使用其的连接器端子、连接器及电子部件
JP5667152B2 (ja) *	2012-09-19	2015-02-12	Jx日鉱日石金属株式会社	表面処理めっき材およびその製造方法、並びに電子部品
KR101696796B1 (ko) *	2014-12-10	2017-01-16	주식회사피엔티	동합금재의 주석 도금 방법
CN107326413A (zh) *	2017-07-04	2017-11-07	苏州道蒙恩电子科技有限公司	一种电镀锡抗变色处理剂及使用方法
CN107829093A (zh) *	2017-09-27	2018-03-23	西安泰力松新材料股份有限公司	一种光伏焊带用表面保护剂及其制备方法
US11344976B2 (en)	2017-11-24	2022-05-31	Senju Metal Industry Co., Ltd.	Solder material, solder paste, and solder joint
CN108315789A (zh) *	2018-03-01	2018-07-24	深圳市盛元半导体有限公司	一种铜基镀锡耐高温保护剂
JP6573019B1 (ja) *	2018-10-25	2019-09-11	千住金属工業株式会社	フラックス及びソルダペースト
MY189490A (en)	2019-05-27	2022-02-16	Senju Metal Industry Co	Solder alloy, solder paste, solder ball, solder preform, and solder joint
CN111962081A (zh) *	2020-08-11	2020-11-20	湖北工程学院	有机膦酸及其衍生物基铜箔防氧化添加剂及其制备方法
CN115070259A (zh) *	2022-07-15	2022-09-20	深圳市同方电子新材料有限公司	一种新型超细焊锡粉的环保无铅焊锡膏

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2004137574A (ja) *	2002-10-18	2004-05-13	Nikko Materials Co Ltd	Ｓｎ合金に対する表面処理剤及び表面処理方法
JP2005206860A (ja) *	2004-01-21	2005-08-04	Ebara Udylite Kk	スズまたはスズ合金めっきの変色除去・防止剤

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH1046385A (ja)	1996-08-02	1998-02-17	Daiwa Kasei Kenkyusho:Kk	電気・電子回路部品
JP2005296860A (ja)	2004-04-14	2005-10-27	Nitto Denko Corp	エアフィルタ濾材

2006
- 2006-08-31 KR KR1020087007170A patent/KR100964063B1/ko active IP Right Grant
- 2006-08-31 JP JP2007534363A patent/JP4601670B2/ja active Active
- 2006-08-31 WO PCT/JP2006/317199 patent/WO2007029589A1/ja active Application Filing
- 2006-08-31 CN CN2006800328749A patent/CN101258268B/zh active Active
- 2006-09-06 TW TW095132844A patent/TW200712257A/zh unknown

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2004137574A (ja) *	2002-10-18	2004-05-13	Nikko Materials Co Ltd	Ｓｎ合金に対する表面処理剤及び表面処理方法
JP2005206860A (ja) *	2004-01-21	2005-08-04	Ebara Udylite Kk	スズまたはスズ合金めっきの変色除去・防止剤

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN114086169A (zh) *	2021-11-09	2022-02-25	南通群安电子材料有限公司	锡面保护剂

Also Published As

Publication number	Publication date
KR100964063B1 (ko)	2010-06-16
WO2007029589A1 (ja)	2007-03-15
JPWO2007029589A1 (ja)	2009-03-19
CN101258268A (zh)	2008-09-03
KR20080049768A (ko)	2008-06-04
JP4601670B2 (ja)	2010-12-22
TWI327605B (ja)	2010-07-21
TW200712257A (en)	2007-04-01

Legal Events

Date	Code	Title	Description
2008-09-03	C06	Publication
2008-09-03	PB01	Publication
2008-10-29	C10	Entry into substantive examination
2008-10-29	SE01	Entry into force of request for substantive examination
2010-11-10	C14	Grant of patent or utility model
2010-11-10	GR01	Patent grant
2014-06-04	ASS	Succession or assignment of patent right	Owner name: NIPPON MINING HOLDINGS INC. Free format text: FORMER OWNER: NIPPON MINING + METALS CO., LTD. Effective date: 20140509
2014-06-04	C41	Transfer of patent application or patent right or utility model
2014-06-04	C56	Change in the name or address of the patentee	Owner name: JX NIPPON MINING + METALS CORPORATION Free format text: FORMER NAME: NIPPON MINING HOLDINGS INC.
2014-06-04	CP01	Change in the name or title of a patent holder	Address after: Tokyo, Japan Patentee after: JX Nippon Mining & Metals Corp. Address before: Tokyo, Japan Patentee before: Nippon Mining Holdings Inc.
2014-06-04	TR01	Transfer of patent right	Effective date of registration: 20140509 Address after: Tokyo, Japan Patentee after: Nippon Mining Holdings Inc. Address before: Tokyo, Japan Patentee before: Nippon Mining & Metals Co.,Ltd.
2017-04-12	CP01	Change in the name or title of a patent holder
2017-04-12	CP01	Change in the name or title of a patent holder	Address after: Tokyo, Japan Patentee after: JX NIPPON MINING & METALS Corp. Address before: Tokyo, Japan Patentee before: JX Nippon Mining & Metals Corp.
2021-04-02	CP02	Change in the address of a patent holder	Address after: No.4, 10-fan, erdingmu, huzhimen, Tokyo, Japan Patentee after: JX NIPPON MINING & METALS Corp. Address before: Tokyo, Japan Patentee before: JX NIPPON MINING & METALS Corp.
2021-04-02	CP02	Change in the address of a patent holder

Publication	Publication Date	Title
CN101258268B (zh)	2010-11-10	锡和锡合金的水系抗氧化剂
KR101163427B1 (ko)	2012-07-13	납프리 땜납용 플럭스와 납땜 방법
KR101298780B1 (ko)	2013-08-22	전자제품에 은도금
DE69722476T2 (de)	2004-04-15	Schnittstelle für Anzeigevorrichtung
US6998036B2 (en)	2006-02-14	Electrolyte and method for depositing tin-silver alloy layers
CN1930323B (zh)	2012-06-27	金属的表面处理剂
JP3233268B2 (ja)	2001-11-26	はんだ付け方法
CZ20013830A3 (cs)	2002-05-15	Způsob regulace koncentrace mědi v pájecí ponořovací lázni
CN100439565C (zh)	2008-12-03	对Sn合金的表面处理剂及表面处理方法
JP3760586B2 (ja)	2006-03-29	半田組成物
DE10046600C2 (de)	2003-02-20	Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
Tanaka	2002	Factors leading to ionic migration in lead-free solder
EP3235588A1 (en)	2017-10-25	Solder alloy for plating and electronic component
US2904459A (en)	1959-09-15	Non-corrosive soldering flux for electrical application
JP5137317B2 (ja)	2013-02-06	電子部品
JP2004156094A (ja)	2004-06-03	Ｓｎ又はＳｎ合金に対する表面処理剤及び表面処理方法
JP5697641B2 (ja)	2015-04-08	ＳｎおよびＳｎ合金に対する表面処理剤
Adnan	2013	Effect of Corrosion on Printed Circuit Board
JPH0799044A (ja)	1995-04-11	ボタン型電池用負極缶の製造方法
JPH09157887A (ja)	1997-06-17	鉛無含有半田めっき浴およびそれにより得られた半田めっき皮膜
JP2001105181A (ja)	2001-04-17	はんだ付けフラックス

CN101258268B - 锡和锡合金的水系抗氧化剂 - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (3)

Publications (2)

Family

ID=37835708

Family Applications (1)

Country Status (5)

Cited By (1)

Families Citing this family (19)

Citations (2)

Family Cites Families (2)

Patent Citations (2)

Cited By (1)

Also Published As

Similar Documents

Legal Events