CN101211906B - 封装芯片结构 - Google Patents
封装芯片结构 Download PDFInfo
- Publication number
- CN101211906B CN101211906B CN 200610171604 CN200610171604A CN101211906B CN 101211906 B CN101211906 B CN 101211906B CN 200610171604 CN200610171604 CN 200610171604 CN 200610171604 A CN200610171604 A CN 200610171604A CN 101211906 B CN101211906 B CN 101211906B
- Authority
- CN
- China
- Prior art keywords
- chip
- flash
- printed circuit
- pcb
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Wire Bonding (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200610171604 CN101211906B (zh) | 2006-12-31 | 2006-12-31 | 封装芯片结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200610171604 CN101211906B (zh) | 2006-12-31 | 2006-12-31 | 封装芯片结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101211906A CN101211906A (zh) | 2008-07-02 |
CN101211906B true CN101211906B (zh) | 2011-09-14 |
Family
ID=39611749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200610171604 Expired - Fee Related CN101211906B (zh) | 2006-12-31 | 2006-12-31 | 封装芯片结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101211906B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107799513A (zh) * | 2017-10-23 | 2018-03-13 | 南京矽邦半导体有限公司 | 一种芯片封装结构 |
CN111987066B (zh) * | 2020-08-25 | 2022-08-12 | 维沃移动通信有限公司 | 芯片封装模组及电子设备 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1531085A (zh) * | 2003-03-12 | 2004-09-22 | ��ʽ���������Ƽ� | 半导体器件 |
-
2006
- 2006-12-31 CN CN 200610171604 patent/CN101211906B/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1531085A (zh) * | 2003-03-12 | 2004-09-22 | ��ʽ���������Ƽ� | 半导体器件 |
Also Published As
Publication number | Publication date |
---|---|
CN101211906A (zh) | 2008-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: BEIJING HUAQI CODE TECH. LAB. CO., LTD. Effective date: 20120627 Owner name: AIGO DIGITAL TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: BEIJING HUAQI INFORMATION + DIGITAL TECHNOLOGY CO., LTD. Effective date: 20120627 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120627 Address after: 100080 Beijing, North Fourth Ring Road West, No. 58, International Building, ideal level 11, Patentee after: Aigo Digital Technology Co., Ltd. Address before: 100080 Beijing, North Fourth Ring Road West, No. 58, International Building, ideal level 11, Co-patentee before: Beijing Huaqi Code Tech. Lab. Co., Ltd. Patentee before: Beijing Huaqi Information & Digital Technology Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110914 Termination date: 20131231 |