CN111987066B - 芯片封装模组及电子设备 - Google Patents

芯片封装模组及电子设备 Download PDF

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CN111987066B
CN111987066B CN202010861960.2A CN202010861960A CN111987066B CN 111987066 B CN111987066 B CN 111987066B CN 202010861960 A CN202010861960 A CN 202010861960A CN 111987066 B CN111987066 B CN 111987066B
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conductive elastic
section
bearing plate
strip
chip
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CN111987066A (zh
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张岳刚
罗雷
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Priority to CN202010861960.2A priority Critical patent/CN111987066B/zh
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Priority to PCT/CN2021/114027 priority patent/WO2022042472A1/zh
Priority to JP2023511667A priority patent/JP2023537644A/ja
Priority to EP21860307.4A priority patent/EP4207271A4/en
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Publication of CN111987066B publication Critical patent/CN111987066B/zh
Priority to US18/171,746 priority patent/US20230207510A1/en
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Abstract

本申请公开一种芯片封装模组及电子设备，所公开的芯片封装模组包括承载板(100)、晶粒(200)、导电胶(300)、加强连接部(400)和封装层(500)，其中，所述晶粒(200)通过导电胶(300)与所述承载板(100)电连接，所述加强连接部(400)与所述承载板(100)相连，且所述加强连接部(400)的至少部分设置在所述导电胶(300)内，所述封装层(500)设置在所述承载板(100)上，所述封装层(500)覆盖所述晶粒(200)、所述导电胶(300)和所述加强连接部(400)。上述方案能够解决电子设备的电路板装置在进行回流焊时，芯片封装模组的内部结构由于热胀冷缩程度不同而容易发生分层的问题。

Description

芯片封装模组及电子设备
技术领域
本申请涉及芯片封装技术领域，尤其涉及一种芯片封装模组及电子设备。
背景技术
随着电子设备的快速发展，电子设备的应用越来越广泛，诸如手机、平板电脑等电子设备在人们的工作、生活、娱乐等方面发挥着越来越多的作用。同时，随着用户需求的提升，电路板装置是电子设备的基础，为了确保在生产、使用时电子设备的稳定性和可靠性，电路板装置的封装技术尤为重要。
现有技术存在电路板装置在智能终端设备中进行回流焊(回流焊，从25℃上升到峰值温度260℃)工艺时，因为电路板装置的芯片封装模组的导电胶与承载板的热胀冷缩系数不同，因此很容易产生导电胶与承载板的分层现象，进而出现芯片封装模组的结构稳定性出现问题，甚至可能会导致芯片封装模组的内部电连接失效。
发明内容
本申请公开一种芯片封装模组及电子设备，能够解决目前的电子设备的电路板装置在进行回流焊时导电胶与承载板之间容易发生分层的问题。
为解决上述技术问题，本发明是这样实现的：
本申请实施例公开一种芯片封装模组及电子设备，包括：
第一方面，本申请公开一种芯片封装模组，包括承载板、晶粒、导电胶、加强连接部和封装层，其中，晶粒通过导电胶与承载板电连接，加强连接部与承载板相连，且加强连接部的至少部分设置在导电胶内，封装层设置在承载板上，封装层覆盖晶粒、导电胶和加强连接部。
第二方面，本申请公开一种电子设备，包括壳体、设置在壳体内的电路板和上述的芯片封装模组，芯片封装模组设在电路板上，且与电路板电连接。
本申请采用的技术方案能够达到以下有益效果：
本申请公开的芯片封装模组包括承载板、晶粒、导电胶、加强连接部和封装层，晶粒通过导电胶与承载板电连接，加强连接部与承载板相连，且加强连接部的至少部分设置在导电胶内，封装层设置在承载板上，封装层覆盖晶粒、导电胶和加强连接部，当芯片封装模组在进行回流焊焊接时，由于加强连接部能够起到辅助连接承载板与导电胶的作用，从而能够使得导电胶与承载板的连接更加稳定，能够有效地缓解由于导电胶与承载板之间由于热胀冷缩程度不同导致的分层现象，进而能够提高芯片封装模组的结构稳定性。
附图说明
为了更清楚地说明本申请实施例或背景技术中的技术方案，下面将对实施例或背景技术描述中所需要使用的附图作简单的介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例公开的芯片封装模组的部分结构示意图；
图2为本申请实施例公开的芯片封装模组的一个剖视图；
图3为本申请实施例公开的芯片封装模组的另一个剖视图。
附图标记说明：
100-承载板、110-第一焊盘、120-第二焊盘；
200-晶粒；
300-导电胶；
400-加强连接部、410-条状导电弹性件、411-第一段、412-第二段、413-第三段、420-球状导电弹性件；
500-封装层。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本发明具体实施例及相应的附图对本发明技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
以下结合附图，详细说明本申请各个实施例公开的技术方案。
请参考图1至图3，本申请实施例公开一种芯片封装模组，应用于电子设备，所公开的芯片封装模组包括承载板100、晶粒200、导电胶300、加强连接部400和封装层500。
其中，承载板100为芯片封装模组的基础构件，承载板100能够为芯片封装模组的其他部件提供安装基础，晶粒200通过导电胶300与承载板100粘接，并且晶粒200通过导电胶300与承载板100可以电连接。
晶粒200为芯片封装模组主要实现功能的构件，晶粒200可以通过导电胶300与承载板100粘接，加强连接部400与承载板100相连，加强连接部400的至少部分可以设置在导电胶300内。
封装层500可以设置在承载板100上，以使封装层500能够覆盖设置在承载板100上的晶粒200、导电胶300和加强连接部400，从而实现封装。
本申请公开的芯片封装模组包括承载板100、晶粒200、导电胶300、加强连接部400和封装层500，晶粒200通过导电胶300与承载板100电连接，加强连接部400与承载板100相连，且加强连接部400的至少部分设置在导电胶300内，当芯片封装模组在进行回流焊焊接时，由于加强连接部400能够起到辅助连接承载板100与导电胶300的作用，从而能够使得导电胶300与承载板100的连接更加稳定，能够有效地缓解由于导电胶300与承载板100之间由于热胀冷缩程度不同导致的分层现象，进而能够提高芯片封装模组的结构稳定性。
在本申请实施例中，封装层500能够覆盖设置在承载板100上的晶粒200、导电胶300和加强连接部400，从而使得封装层500起到防水、防尘和防震的作用，提高防护晶粒200、导电胶300和加强连接部400的效果，避免外部杂质(灰尘或者液体等)影响晶粒200的可靠性，进而提高芯片封装模组的可靠性。
在本申请实施例中，加强连接部400设置在承载板100上，且加强连接部400的至少部分设置在导电胶300内，具体的，加强连接部400的部分可以位于导电胶300内，另一部分可以位于导电胶300之外。
在一种可选的方案中，加强连接部400埋设在导电胶300内，使得加强连接部400完全位于导电胶300之内，使得加强连接部400的加强作用更好。与此同时，加强连接部400在导电胶300内也可以作为其骨架，在本申请公开的芯片封装模组进行回流焊工艺时，加强连接部400作为骨架可以抑制导电胶300受热产生的变形，有利于提高导电胶300与承载板100和晶粒200之间的粘接稳定性。
在本申请实施例中，加强连接部400与承载板100相连，具体的，加强连接部400与承载板100可以通过粘接、铆接等方式实现相连，当然还可以采用其他方式实现相连。
在一种可选的方式中，加强连接部400的制作材料可以为导电金属材料金属，加强连接部400可以强度焊接在承载板100上，加强连接部400可以电连接承载板100和晶粒200。具体的，在芯片封装模组进行回流焊工艺时，导电胶300与承载板100之间出现分层现象，晶粒200与承载板100之间可以通过加强连接部400进行电连接，从而有利于提高了晶粒200与承载板100之间电连接的稳定性。
具体的，加强连接部400可以为条状导电弹性件410，承载板100可以设置有第一焊盘110，条状导电弹性件410的两端可以分别与相对应的第一焊盘110焊接相连，条状导电弹性件410可以第一预设方向弯折，第一预设方向为承载板100到晶粒200的方向，从而方便在晶粒200安装后对金属弹性件410产生一定的预压作用，有利于金属弹性件410与晶粒200之间的电连接。
在上述连接方式中，条状导电弹性件410需要呈预压状态，条状导电弹性件410包括经弯折形成的第一段411、第二段412及第三段413，第一段411的第一端与承载板100相连，第一段411的第二端与第二段412的第一端相连，第二段412的第二端与第三段413的第一端相连，第三段413的第二端与承载板100相连，其中，晶粒200与第二段412接触，预压状态下的第二段412与晶粒200贴合面积较大，从而实现条状导电弹性件410与晶粒200之间的电连接。
如上文所述，条状导电弹性件410与承载板100焊接相连。条状导电弹性件410的数量可以为多条，承载板100可以相应的设置有多个第一焊盘110，多个条状导电弹性件410可以沿第二预设方向(例如承载板100的长度方向)并排设置，且与承载板100上设置的多个第一焊盘110一一对应焊接，多个条状金属弹片410可以增强对承载板100受热形变的抑制力，从而提高导电胶300对承载板100粘接的可靠性，进而更好的保证承载板100与晶粒200之间电连接的稳定性。
条状导电弹性件410的具体结构可以为金属棒、金属条等，在一种较优的方案中，条状导电弹性件410可以为金属片，金属片使用金属材料较少，且片状结构比较容易折弯，从而更方便操作人员将金属片焊接在承载板100上，也增大加强连接部400与导电胶300的连接强度。
当然，加强连接部400也可以为球状导电弹性件420，球状导电弹性件420可以设置在承载板100上，具体的，承载板100可以设置有第二焊盘120，球状导电弹性件420可以与第二焊盘120对应焊接相连，从而实现球状导电弹性件420与承载板100之间的连接。
在进一步的技术方案中，球状导电弹性件420的一侧可以与晶粒200贴合，从而球状导电弹性件420与晶粒200之间可以电连接，球状导电弹性件420可以焊接在承载板100上，从而使得球状导电弹性件420与承载板100之间可以电连接，承载板100与晶粒200之间可以通过球状导电弹性件420进行电连接，球状导电弹性件420可以完全位于导电胶300之内，进而有利于提高了晶粒200与承载板100之间电连接的稳定性。
如上文所述，球状导电弹性件420的一侧可以与晶粒200贴合，球状导电弹性件420可以为多个，多个球状导电弹性件420可以呈阵列分布。多个球状导电弹性件420可以与对应的第二焊盘120焊接相连，多个球状导电弹性件420使承载板100与其焊接的区域面积增加，使得承载板100受热时这部分区域形变量会变小，进而使得球状导电弹性件420能够抑制承载板100受热变形后，进而有利于缓解承载板100与导电胶300之间的分层现象，从而有利于提高导电胶300与承载板100和晶粒200之间的粘接稳定性。
基于本申请实施例公开的芯片封装模组，本申请实施例公开一种电子设备，所公开的电子设备包括壳体、设置在壳体内的电路板和上文实施例的芯片封装模组，芯片封装模组可以设置在电路板上，且与电路板电连接。
具体的，承载板100可以设置第三焊盘130，第三焊盘130与电路板焊接相连，从而实现承载板100与电路板相连且电连接。
在本申请实施例中，芯片封装模组和设置在壳体内的电路板经过回流焊工艺后，设置在壳体内的电路板和芯片封装模组之间的电连接正常稳定。
本申请上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上仅为本申请的实施例而已，并不用于限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (7)

1.一种芯片封装模组，其特征在于，包括承载板(100)、晶粒(200)、导电胶(300)、加强连接部(400)和封装层(500)，其中，所述晶粒(200)通过导电胶(300)与所述承载板(100)电连接，所述加强连接部(400)与所述承载板(100)相连，且所述加强连接部(400)的至少部分设置在所述导电胶(300)内，所述封装层(500)设置在所述承载板(100)上，所述封装层(500)覆盖所述晶粒(200)、所述导电胶(300)和所述加强连接部(400)；
所述加强连接部(400)包括条状导电弹性件(410)，所述承载板(100)设置有第一焊盘(110)，所述条状导电弹性件(410)的两端分别与相对应的所述第一焊盘(110)焊接相连，所述条状导电弹性件(410)朝向第一预设方向弯折，所述第一预设方向为所述承载板(100)到所述晶粒(200)的方向，所述条状导电弹性件(410)呈预压状态，所述条状导电弹性件(410)包括经弯折形成的第一段(411)、第二段(412)及第三段(413)，所述第一段(411)的第一端与所述承载板(100)相连，所述第一段(411)的第二端与所述第二段(412)的第一端相连，所述第二段(412)的第二端与所述第三段(413)的第一端相连，所述第三段(413)的第二端与所述承载板(100)相连，所述晶粒(200)与所述第二段(412)接触，且电连接；或，
所述加强连接部(400)包括球状导电弹性件(420)，所述承载板(100)设置有第二焊盘(120)，所述球状导电弹性件(420)通过所述第二焊盘(120)焊接于所述承载板(100)。
2.根据权利要求1所述的芯片封装模组，其特征在于，所述加强连接部(400)埋设在所述导电胶(300)内。
3.根据权利要求1所述的芯片封装模组，其特征在于，所述加强连接部(400)焊接在所述承载板(100)上，所述加强连接部(400)电连接所述承载板(100)与所述晶粒(200)。
4.根据权利要求1所述的芯片封装模组，其特征在于，所述条状导电弹性件(410)的数量为多条，多条所述条状导电弹性件(410)沿第二预设方向并排设置。
5.根据权利要求1所述的芯片封装模组，其特征在于，所述球状导电弹性件(420)的一侧与所述晶粒(200)电连接，所述球状导电弹性件(420)通过所述第二焊盘(120)与所述承载板(100)电连接。
6.根据权利要求1所述的芯片封装模组，其特征在于，所述球状导电弹性件(420)的数量为多个，多个所述球状导电弹性件(420)呈阵列分布。
7.一种电子设备，其特征在于，包括壳体、设置在所述壳体内的电路板和权利要求1-6中任一项所述的芯片封装模组，所述芯片封装模组设在所述电路板上，且与所述电路板电连接。
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