CN101203964A - 白色半导体发光元件及其制造方法 - Google Patents

白色半导体发光元件及其制造方法 Download PDF

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Publication number
CN101203964A
CN101203964A CN 200680022297 CN200680022297A CN101203964A CN 101203964 A CN101203964 A CN 101203964A CN 200680022297 CN200680022297 CN 200680022297 CN 200680022297 A CN200680022297 A CN 200680022297A CN 101203964 A CN101203964 A CN 101203964A
Authority
CN
China
Prior art keywords
light
emitting element
element chip
resin
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200680022297
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English (en)
Chinese (zh)
Inventor
西原大平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN101203964A publication Critical patent/CN101203964A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN 200680022297 2005-06-20 2006-06-19 白色半导体发光元件及其制造方法 Pending CN101203964A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP179660/2005 2005-06-20
JP179659/2005 2005-06-20
JP2005179659A JP4004514B2 (ja) 2005-06-20 2005-06-20 白色半導体発光素子

Publications (1)

Publication Number Publication Date
CN101203964A true CN101203964A (zh) 2008-06-18

Family

ID=37647525

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200680022297 Pending CN101203964A (zh) 2005-06-20 2006-06-19 白色半导体发光元件及其制造方法

Country Status (2)

Country Link
JP (1) JP4004514B2 (ja)
CN (1) CN101203964A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010267900A (ja) * 2009-05-18 2010-11-25 Citizen Holdings Co Ltd Ｌｅｄ光源装置の製造方法
CN103797596B (zh) * 2011-09-13 2016-11-09 株式会社小糸制作所 发光模块
JP6326830B2 (ja) * 2013-02-28 2018-05-23 日亜化学工業株式会社 発光装置及びそれを備える照明装置
KR102597399B1 (ko) * 2016-10-25 2023-11-03 서울반도체 주식회사 발광 다이오드 패키지 및 그것을 갖는 디스플레이 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3541709B2 (ja) * 1998-02-17 2004-07-14 日亜化学工業株式会社 発光ダイオードの形成方法
KR100691143B1 (ko) * 2003-04-30 2007-03-09 삼성전기주식회사 다층 형광층을 가진 발광 다이오드 소자

Also Published As

Publication number Publication date
JP4004514B2 (ja) 2007-11-07
JP2006352037A (ja) 2006-12-28

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication