CN101151946A - 柔性覆铜层叠基板的制造方法以及多层层叠体 - Google Patents
柔性覆铜层叠基板的制造方法以及多层层叠体 Download PDFInfo
- Publication number
- CN101151946A CN101151946A CNA2006800102174A CN200680010217A CN101151946A CN 101151946 A CN101151946 A CN 101151946A CN A2006800102174 A CNA2006800102174 A CN A2006800102174A CN 200680010217 A CN200680010217 A CN 200680010217A CN 101151946 A CN101151946 A CN 101151946A
- Authority
- CN
- China
- Prior art keywords
- resin bed
- copper foil
- ultrathin copper
- carrier
- expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
Description
(初期的)固化温度(℃) | 剥离前的卷曲(mm) | 剥离后的卷曲(mm) | 热膨胀系数(ppm/K) | 剥离强度(kN/m) | 耐热保持率(%) | 判定 | |
实施例1 | 140 | -3.8 | +0.9 | 19.0 | 1.0 | 80 | ○ |
实施例2 | 138 | -4.5 | +0.2 | 18.8 | 1.0 | 80 | ○ |
比较例1 | 135 | -10.5 | -7.7 | 18.1 | 1.0 | 80 | × |
比较例2 | 130 | -0.4 | +6.2 | 20.8 | 1.0 | 80 | × |
比较例3 | 150 | +2.8 | +7.4 | 22.2 | 1.0 | 80 | × |
ta/tc | (ta+tc)/tb | 薄膜卷曲(mm) | 剥离前卷曲(mm) | 热膨胀系数(ppmK) | 剥离后卷曲(mm) | 剥离强度(kN/m) | 耐热保持率(%) | 判定 | |
实施例3 | 0.26 | 0.41 | -2 | -3 | 18.5 | +1 | 1.0 | 80 | ○ |
实施例4 | 0.50 | 0.33 | 0 | -5 | 20.8 | 0 | 1.0 | 80 | ○ |
比较例4 | 0.16 | 0.37 | 筒状 | +9 | 21.3 | +11 | 1.0 | 80 | × |
比较例5 | 1.44 | 0.46 | 筒状 | -16 | 23.3 | -6 | 1.0 | 80 | × |
比较例6 | 0.30 | 0.29 | -2 | +12 | 14.5 | +15 | 1.0 | 80 | × |
比较例7 | 0.75 | 0.63 | -2 | 筒状 | 31.0 | 筒状 | 1.0 | 80 | × |
比较例8 | 0 | 0.22 | 0 | -6 | 15.0 | -1 | 0.1 | 0 | × |
Claims (10)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP104156/2005 | 2005-03-31 | ||
JP2005104156 | 2005-03-31 | ||
JP2006030635A JP4762742B2 (ja) | 2006-02-08 | 2006-02-08 | フレキシブル銅張積層基板の製造方法 |
JP030635/2006 | 2006-02-08 | ||
PCT/JP2006/306447 WO2006106723A1 (ja) | 2005-03-31 | 2006-03-29 | フレキシブル銅張積層基板の製造方法及び多層積層体 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101151946A true CN101151946A (zh) | 2008-03-26 |
CN101151946B CN101151946B (zh) | 2010-10-27 |
Family
ID=37073287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800102174A Expired - Fee Related CN101151946B (zh) | 2005-03-31 | 2006-03-29 | 柔性覆铜层叠基板的制造方法以及多层层叠体 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101245791B1 (zh) |
CN (1) | CN101151946B (zh) |
TW (1) | TW200701852A (zh) |
WO (1) | WO2006106723A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102131345A (zh) * | 2010-01-14 | 2011-07-20 | 住友金属矿山株式会社 | 金属化聚酰亚胺薄膜以及使用该薄膜的柔性电路板 |
CN103212505A (zh) * | 2013-03-18 | 2013-07-24 | 深圳市振勤电子科技有限公司 | 金属材料喷涂的遮挡结构 |
CN107241877A (zh) * | 2016-03-29 | 2017-10-10 | 味之素株式会社 | 印刷布线板的制造方法 |
CN107926109A (zh) * | 2015-08-21 | 2018-04-17 | 施赖纳集团两合公司 | 具有在载体结构上的导体结构和电子单元的物品 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101441235B1 (ko) * | 2013-03-14 | 2014-09-17 | 홍익대학교 산학협력단 | 강성도 경사형 신축성 기판과 그 제조방법 및 그 신축성 기판을 이용하여 이루어지는 신축성 전자소자 패키지와 그 제조방법 |
JP6427454B2 (ja) * | 2015-03-31 | 2018-11-21 | 日鉄ケミカル&マテリアル株式会社 | 銅張積層板及びプリント配線板 |
JP6252567B2 (ja) * | 2015-09-03 | 2017-12-27 | 王子ホールディングス株式会社 | 剥離シート、剥離シートの製造方法及び積層体 |
JP6652111B2 (ja) * | 2017-07-18 | 2020-02-19 | トヨタ自動車株式会社 | 太陽電池の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2216318Y (zh) * | 1994-11-24 | 1995-12-27 | 刘宝申 | 聚酯薄膜柔性覆铜箔板和覆膜线路板 |
JP3641952B2 (ja) * | 1998-11-05 | 2005-04-27 | ソニーケミカル株式会社 | ポリイミドフィルム及びフレキシブル基板 |
JP2000286514A (ja) * | 1999-03-29 | 2000-10-13 | Sumitomo Bakelite Co Ltd | 接着剤付きフレキシブルプリント回路用基板 |
JP4504602B2 (ja) * | 2001-09-04 | 2010-07-14 | 三井化学株式会社 | ポリイミド銅張積層板及びその製造方法 |
CN1180006C (zh) * | 2002-11-22 | 2004-12-15 | 中国科学院长春应用化学研究所 | 聚醚酰亚胺柔性印刷线路基材的制备方法 |
-
2006
- 2006-03-24 TW TW095110408A patent/TW200701852A/zh not_active IP Right Cessation
- 2006-03-29 WO PCT/JP2006/306447 patent/WO2006106723A1/ja active Application Filing
- 2006-03-29 KR KR1020077024675A patent/KR101245791B1/ko active IP Right Grant
- 2006-03-29 CN CN2006800102174A patent/CN101151946B/zh not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102131345A (zh) * | 2010-01-14 | 2011-07-20 | 住友金属矿山株式会社 | 金属化聚酰亚胺薄膜以及使用该薄膜的柔性电路板 |
CN102131345B (zh) * | 2010-01-14 | 2014-11-19 | 住友金属矿山株式会社 | 金属化聚酰亚胺薄膜以及使用该薄膜的柔性电路板 |
CN103212505A (zh) * | 2013-03-18 | 2013-07-24 | 深圳市振勤电子科技有限公司 | 金属材料喷涂的遮挡结构 |
CN103212505B (zh) * | 2013-03-18 | 2017-08-29 | 深圳市振勤电子科技有限公司 | 金属材料喷涂的遮挡结构 |
CN107926109A (zh) * | 2015-08-21 | 2018-04-17 | 施赖纳集团两合公司 | 具有在载体结构上的导体结构和电子单元的物品 |
CN107926109B (zh) * | 2015-08-21 | 2021-05-11 | 施赖纳集团两合公司 | 具有在载体结构上的导体结构和电子单元的物品 |
US11202366B2 (en) | 2015-08-21 | 2021-12-14 | Schreiner Group Gmbh & Co. Kg | Object having an electronic unit and conductor structures on a carrier structure |
CN107241877A (zh) * | 2016-03-29 | 2017-10-10 | 味之素株式会社 | 印刷布线板的制造方法 |
CN107241877B (zh) * | 2016-03-29 | 2021-05-18 | 味之素株式会社 | 印刷布线板的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20070120555A (ko) | 2007-12-24 |
TW200701852A (en) | 2007-01-01 |
CN101151946B (zh) | 2010-10-27 |
TWI372006B (zh) | 2012-09-01 |
KR101245791B1 (ko) | 2013-03-20 |
WO2006106723A1 (ja) | 2006-10-12 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: NIPPON STEEL + SUMITOMO METAL CORPORATION Free format text: FORMER NAME: NIPPON SEEL CHEMICAL CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Nippon Steel Chemical Co. Address before: Tokyo, Japan Patentee before: Nippon Seel Chemical Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191213 Address after: No.13-1, No.1, No.1, No Patentee after: Nippon Iron Chemical Materials Co., Ltd. Address before: Tokyo, Japan Patentee before: Nippon Steel Chemical Co. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101027 Termination date: 20210329 |