CN101130188A - 基板清洗装置 - Google Patents
基板清洗装置 Download PDFInfo
- Publication number
- CN101130188A CN101130188A CNA200710106113XA CN200710106113A CN101130188A CN 101130188 A CN101130188 A CN 101130188A CN A200710106113X A CNA200710106113X A CN A200710106113XA CN 200710106113 A CN200710106113 A CN 200710106113A CN 101130188 A CN101130188 A CN 101130188A
- Authority
- CN
- China
- Prior art keywords
- gas
- mentioned
- cleaning device
- soup
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Liquid Crystal (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060079981A KR20080017993A (ko) | 2006-08-23 | 2006-08-23 | 기판 세정 장치 |
KR1020060079981 | 2006-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101130188A true CN101130188A (zh) | 2008-02-27 |
Family
ID=39127685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA200710106113XA Pending CN101130188A (zh) | 2006-08-23 | 2007-05-25 | 基板清洗装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2008053679A (ja) |
KR (1) | KR20080017993A (ja) |
CN (1) | CN101130188A (ja) |
TW (1) | TW200811940A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101758036B (zh) * | 2008-11-18 | 2012-07-04 | 细美事有限公司 | 基板清洁单元和具有该清洁单元的基板处理装置 |
CN103264022A (zh) * | 2013-05-15 | 2013-08-28 | 京东方科技集团股份有限公司 | 基板清洗装置、***及方法 |
CN104646337A (zh) * | 2013-11-19 | 2015-05-27 | 三星显示有限公司 | 清洁基板的设备 |
CN111048443A (zh) * | 2018-10-15 | 2020-04-21 | 细美事有限公司 | 模具脱模装置 |
CN113745132A (zh) * | 2021-09-03 | 2021-12-03 | 长鑫存储技术有限公司 | 一种晶圆清洗装置及清洗*** |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102117353B1 (ko) * | 2013-10-24 | 2020-06-01 | 세메스 주식회사 | 약액공급유닛 및 이를 가지는 기판처리장치 |
CN104841660B (zh) * | 2015-05-21 | 2017-03-15 | 北京七星华创电子股份有限公司 | 气液两相雾化清洗装置及清洗方法 |
KR101604438B1 (ko) * | 2015-09-22 | 2016-03-17 | (주) 앤에스알시 | 반도체 웨이퍼 세정용 고온 미스트형 디아이(di)를 통한 스마트 nr형 세정장치 |
CN110620031B (zh) * | 2018-06-20 | 2022-02-11 | 沈阳芯源微电子设备股份有限公司 | 一种晶圆表面颗粒清洗装置 |
KR102335726B1 (ko) | 2020-05-07 | 2021-12-07 | 무진전자 주식회사 | 온도 저하 방지 기능이 구비된 혼합 유체 분사장치 |
-
2006
- 2006-08-23 KR KR1020060079981A patent/KR20080017993A/ko not_active Application Discontinuation
-
2007
- 2007-02-26 JP JP2007045152A patent/JP2008053679A/ja active Pending
- 2007-05-25 CN CNA200710106113XA patent/CN101130188A/zh active Pending
- 2007-06-21 TW TW096122355A patent/TW200811940A/zh unknown
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101758036B (zh) * | 2008-11-18 | 2012-07-04 | 细美事有限公司 | 基板清洁单元和具有该清洁单元的基板处理装置 |
CN103264022A (zh) * | 2013-05-15 | 2013-08-28 | 京东方科技集团股份有限公司 | 基板清洗装置、***及方法 |
WO2014183339A1 (zh) * | 2013-05-15 | 2014-11-20 | 京东方科技集团股份有限公司 | 基板清洗装置、***及方法 |
CN103264022B (zh) * | 2013-05-15 | 2015-04-08 | 京东方科技集团股份有限公司 | 基板清洗装置、***及方法 |
CN104646337A (zh) * | 2013-11-19 | 2015-05-27 | 三星显示有限公司 | 清洁基板的设备 |
CN111048443A (zh) * | 2018-10-15 | 2020-04-21 | 细美事有限公司 | 模具脱模装置 |
CN111048443B (zh) * | 2018-10-15 | 2023-09-15 | 细美事有限公司 | 模具脱模装置 |
CN113745132A (zh) * | 2021-09-03 | 2021-12-03 | 长鑫存储技术有限公司 | 一种晶圆清洗装置及清洗*** |
CN113745132B (zh) * | 2021-09-03 | 2023-10-27 | 长鑫存储技术有限公司 | 一种晶圆清洗装置及清洗*** |
Also Published As
Publication number | Publication date |
---|---|
JP2008053679A (ja) | 2008-03-06 |
KR20080017993A (ko) | 2008-02-27 |
TW200811940A (en) | 2008-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080227 |