CN101130188A - 基板清洗装置 - Google Patents

基板清洗装置 Download PDF

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Publication number
CN101130188A
CN101130188A CNA200710106113XA CN200710106113A CN101130188A CN 101130188 A CN101130188 A CN 101130188A CN A200710106113X A CNA200710106113X A CN A200710106113XA CN 200710106113 A CN200710106113 A CN 200710106113A CN 101130188 A CN101130188 A CN 101130188A
Authority
CN
China
Prior art keywords
gas
mentioned
cleaning device
soup
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200710106113XA
Other languages
English (en)
Chinese (zh)
Inventor
李晟熙
李铉雨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of CN101130188A publication Critical patent/CN101130188A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Liquid Crystal (AREA)
  • Cleaning In General (AREA)
CNA200710106113XA 2006-08-23 2007-05-25 基板清洗装置 Pending CN101130188A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060079981A KR20080017993A (ko) 2006-08-23 2006-08-23 기판 세정 장치
KR1020060079981 2006-08-23

Publications (1)

Publication Number Publication Date
CN101130188A true CN101130188A (zh) 2008-02-27

Family

ID=39127685

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200710106113XA Pending CN101130188A (zh) 2006-08-23 2007-05-25 基板清洗装置

Country Status (4)

Country Link
JP (1) JP2008053679A (ja)
KR (1) KR20080017993A (ja)
CN (1) CN101130188A (ja)
TW (1) TW200811940A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101758036B (zh) * 2008-11-18 2012-07-04 细美事有限公司 基板清洁单元和具有该清洁单元的基板处理装置
CN103264022A (zh) * 2013-05-15 2013-08-28 京东方科技集团股份有限公司 基板清洗装置、***及方法
CN104646337A (zh) * 2013-11-19 2015-05-27 三星显示有限公司 清洁基板的设备
CN111048443A (zh) * 2018-10-15 2020-04-21 细美事有限公司 模具脱模装置
CN113745132A (zh) * 2021-09-03 2021-12-03 长鑫存储技术有限公司 一种晶圆清洗装置及清洗***

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102117353B1 (ko) * 2013-10-24 2020-06-01 세메스 주식회사 약액공급유닛 및 이를 가지는 기판처리장치
CN104841660B (zh) * 2015-05-21 2017-03-15 北京七星华创电子股份有限公司 气液两相雾化清洗装置及清洗方法
KR101604438B1 (ko) * 2015-09-22 2016-03-17 (주) 앤에스알시 반도체 웨이퍼 세정용 고온 미스트형 디아이(di)를 통한 스마트 nr형 세정장치
CN110620031B (zh) * 2018-06-20 2022-02-11 沈阳芯源微电子设备股份有限公司 一种晶圆表面颗粒清洗装置
KR102335726B1 (ko) 2020-05-07 2021-12-07 무진전자 주식회사 온도 저하 방지 기능이 구비된 혼합 유체 분사장치

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101758036B (zh) * 2008-11-18 2012-07-04 细美事有限公司 基板清洁单元和具有该清洁单元的基板处理装置
CN103264022A (zh) * 2013-05-15 2013-08-28 京东方科技集团股份有限公司 基板清洗装置、***及方法
WO2014183339A1 (zh) * 2013-05-15 2014-11-20 京东方科技集团股份有限公司 基板清洗装置、***及方法
CN103264022B (zh) * 2013-05-15 2015-04-08 京东方科技集团股份有限公司 基板清洗装置、***及方法
CN104646337A (zh) * 2013-11-19 2015-05-27 三星显示有限公司 清洁基板的设备
CN111048443A (zh) * 2018-10-15 2020-04-21 细美事有限公司 模具脱模装置
CN111048443B (zh) * 2018-10-15 2023-09-15 细美事有限公司 模具脱模装置
CN113745132A (zh) * 2021-09-03 2021-12-03 长鑫存储技术有限公司 一种晶圆清洗装置及清洗***
CN113745132B (zh) * 2021-09-03 2023-10-27 长鑫存储技术有限公司 一种晶圆清洗装置及清洗***

Also Published As

Publication number Publication date
JP2008053679A (ja) 2008-03-06
KR20080017993A (ko) 2008-02-27
TW200811940A (en) 2008-03-01

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SE01 Entry into force of request for substantive examination
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Open date: 20080227