CN101106116A - 半导体装置及其制造方法 - Google Patents
半导体装置及其制造方法 Download PDFInfo
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- CN101106116A CN101106116A CNA2007101281820A CN200710128182A CN101106116A CN 101106116 A CN101106116 A CN 101106116A CN A2007101281820 A CNA2007101281820 A CN A2007101281820A CN 200710128182 A CN200710128182 A CN 200710128182A CN 101106116 A CN101106116 A CN 101106116A
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Abstract
Description
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006194658A JP4818005B2 (ja) | 2006-07-14 | 2006-07-14 | 半導体装置及びその製造方法 |
JP2006194658 | 2006-07-14 | ||
JP2006-194658 | 2006-07-14 |
Publications (2)
Publication Number | Publication Date |
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CN101106116A true CN101106116A (zh) | 2008-01-16 |
CN101106116B CN101106116B (zh) | 2012-07-18 |
Family
ID=38948419
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CN2007101281820A Expired - Fee Related CN101106116B (zh) | 2006-07-14 | 2007-07-10 | 半导体装置及其制造方法 |
Country Status (3)
Country | Link |
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US (2) | US7626271B2 (zh) |
JP (1) | JP4818005B2 (zh) |
CN (1) | CN101106116B (zh) |
Cited By (8)
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CN102931100A (zh) * | 2012-11-08 | 2013-02-13 | 南通富士通微电子股份有限公司 | 半导体封装结构的形成方法 |
CN102931159A (zh) * | 2012-11-08 | 2013-02-13 | 南通富士通微电子股份有限公司 | 半导体封装结构 |
CN103325745A (zh) * | 2012-03-23 | 2013-09-25 | 株式会社东芝 | 半导体装置 |
CN101552244B (zh) * | 2008-03-31 | 2013-11-20 | Oki半导体株式会社 | 半导体器件及其制造方法 |
CN107527881A (zh) * | 2016-06-17 | 2017-12-29 | 南亚科技股份有限公司 | 晶片封装及其制造方法 |
CN107845622A (zh) * | 2017-12-04 | 2018-03-27 | 睿力集成电路有限公司 | 具有硅穿孔的芯片堆叠体及其制造方法 |
CN112363292A (zh) * | 2015-04-30 | 2021-02-12 | Lg伊诺特有限公司 | 透镜移动装置 |
TWI835227B (zh) * | 2022-03-16 | 2024-03-11 | 日商鎧俠股份有限公司 | 半導體裝置及半導體裝置之製造方法 |
Families Citing this family (10)
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JP4811520B2 (ja) * | 2009-02-20 | 2011-11-09 | 住友金属鉱山株式会社 | 半導体装置用基板の製造方法、半導体装置の製造方法、半導体装置用基板及び半導体装置 |
JP2011108733A (ja) | 2009-11-13 | 2011-06-02 | Casio Computer Co Ltd | 半導体装置及びその製造方法 |
US8669137B2 (en) * | 2011-04-01 | 2014-03-11 | International Business Machines Corporation | Copper post solder bumps on substrate |
JP2013232620A (ja) * | 2012-01-27 | 2013-11-14 | Rohm Co Ltd | チップ部品 |
JP6329059B2 (ja) | 2014-11-07 | 2018-05-23 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US20170141041A1 (en) * | 2015-11-12 | 2017-05-18 | Mediatek Inc. | Semiconductor package assembly |
US9953954B2 (en) * | 2015-12-03 | 2018-04-24 | Mediatek Inc. | Wafer-level chip-scale package with redistribution layer |
KR102109569B1 (ko) | 2015-12-08 | 2020-05-12 | 삼성전자주식회사 | 전자부품 패키지 및 이를 포함하는 전자기기 |
US20190259731A1 (en) * | 2016-11-09 | 2019-08-22 | Unisem (M) Berhad | Substrate based fan-out wafer level packaging |
KR20210077820A (ko) | 2019-12-17 | 2021-06-28 | 삼성전자주식회사 | 반도체 패키지 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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TW571373B (en) * | 1996-12-04 | 2004-01-11 | Seiko Epson Corp | Semiconductor device, circuit substrate, and electronic machine |
US6166441A (en) * | 1998-11-12 | 2000-12-26 | Intel Corporation | Method of forming a via overlap |
JP3408172B2 (ja) * | 1998-12-10 | 2003-05-19 | 三洋電機株式会社 | チップサイズパッケージ及びその製造方法 |
US6518675B2 (en) * | 2000-12-29 | 2003-02-11 | Samsung Electronics Co., Ltd. | Wafer level package and method for manufacturing the same |
JP2003243438A (ja) * | 2002-02-15 | 2003-08-29 | Sharp Corp | 配線基板、配線基板の製造方法、および、配線基板を備えた電子装置 |
JP3542350B2 (ja) | 2002-05-31 | 2004-07-14 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
CN1226787C (zh) * | 2002-07-02 | 2005-11-09 | 台湾积体电路制造股份有限公司 | 金属垫与接合垫区的结构 |
JP3580803B2 (ja) * | 2002-08-09 | 2004-10-27 | 沖電気工業株式会社 | 半導体装置 |
US7358608B2 (en) * | 2003-06-13 | 2008-04-15 | Oki Electric Industry Co., Ltd. | Semiconductor device having chip size package with improved strength |
JP4072141B2 (ja) | 2003-07-31 | 2008-04-09 | 沖電気工業株式会社 | 半導体装置の製造方法 |
-
2006
- 2006-07-14 JP JP2006194658A patent/JP4818005B2/ja active Active
-
2007
- 2007-07-10 CN CN2007101281820A patent/CN101106116B/zh not_active Expired - Fee Related
- 2007-07-12 US US11/826,119 patent/US7626271B2/en not_active Expired - Fee Related
-
2009
- 2009-10-21 US US12/603,106 patent/US8212362B2/en not_active Expired - Fee Related
Cited By (13)
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CN101552244B (zh) * | 2008-03-31 | 2013-11-20 | Oki半导体株式会社 | 半导体器件及其制造方法 |
CN103325745B (zh) * | 2012-03-23 | 2016-03-16 | 株式会社东芝 | 半导体装置 |
CN103325745A (zh) * | 2012-03-23 | 2013-09-25 | 株式会社东芝 | 半导体装置 |
CN102931100B (zh) * | 2012-11-08 | 2016-04-20 | 南通富士通微电子股份有限公司 | 半导体封装结构的形成方法 |
CN102931159A (zh) * | 2012-11-08 | 2013-02-13 | 南通富士通微电子股份有限公司 | 半导体封装结构 |
CN102931159B (zh) * | 2012-11-08 | 2016-04-06 | 南通富士通微电子股份有限公司 | 半导体封装结构 |
CN102931100A (zh) * | 2012-11-08 | 2013-02-13 | 南通富士通微电子股份有限公司 | 半导体封装结构的形成方法 |
CN112363292A (zh) * | 2015-04-30 | 2021-02-12 | Lg伊诺特有限公司 | 透镜移动装置 |
CN112363292B (zh) * | 2015-04-30 | 2023-08-18 | Lg伊诺特有限公司 | 透镜移动装置 |
US11988892B2 (en) | 2015-04-30 | 2024-05-21 | Lg Innotek Co., Ltd. | Lens moving apparatus and camera module and optical device including the same |
CN107527881A (zh) * | 2016-06-17 | 2017-12-29 | 南亚科技股份有限公司 | 晶片封装及其制造方法 |
CN107845622A (zh) * | 2017-12-04 | 2018-03-27 | 睿力集成电路有限公司 | 具有硅穿孔的芯片堆叠体及其制造方法 |
TWI835227B (zh) * | 2022-03-16 | 2024-03-11 | 日商鎧俠股份有限公司 | 半導體裝置及半導體裝置之製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080012129A1 (en) | 2008-01-17 |
US8212362B2 (en) | 2012-07-03 |
US20100038779A1 (en) | 2010-02-18 |
JP4818005B2 (ja) | 2011-11-16 |
CN101106116B (zh) | 2012-07-18 |
US7626271B2 (en) | 2009-12-01 |
JP2008021936A (ja) | 2008-01-31 |
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