CN101092049A - Method of managing the processing result of wafer - Google Patents
Method of managing the processing result of wafer Download PDFInfo
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- CN101092049A CN101092049A CN 200710112096 CN200710112096A CN101092049A CN 101092049 A CN101092049 A CN 101092049A CN 200710112096 CN200710112096 CN 200710112096 CN 200710112096 A CN200710112096 A CN 200710112096A CN 101092049 A CN101092049 A CN 101092049A
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- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000012545 processing Methods 0.000 title claims description 129
- 238000005520 cutting process Methods 0.000 claims abstract description 143
- 238000003860 storage Methods 0.000 claims abstract description 48
- 230000008569 process Effects 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims description 186
- 238000007726 management method Methods 0.000 claims description 28
- 230000009471 action Effects 0.000 claims description 22
- 230000008859 change Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract 2
- 238000012216 screening Methods 0.000 abstract 2
- 238000012769 bulk production Methods 0.000 abstract 1
- 230000004438 eyesight Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 241000196324 Embryophyta Species 0.000 description 34
- 238000007689 inspection Methods 0.000 description 20
- 238000013500 data storage Methods 0.000 description 11
- 238000003754 machining Methods 0.000 description 11
- 230000006870 function Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
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- 235000013351 cheese Nutrition 0.000 description 3
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- 238000012790 confirmation Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
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- 230000007246 mechanism Effects 0.000 description 2
- 240000008168 Ficus benjamina Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
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Abstract
The present invention provides a method for managing the manufacturing result of the crystal plate on the base that the managing of manufacturing quality is easy when do bulk production and expects that the secular change of the surface quality can be affirmed by eyesight. Every time it makes the formed cutting groove locating at the screening device and do screening and lancing checking (process S108), it correlates the generated cutting groove date and the image information together to the position information and accumulate and store it in the storage installation (process S110), besides, when display the shape of the crystal plate and the mode chart of the dividing prescribed line as the wafer map, it also display the mark which represents the position information of the lancing checking at the wafer map (process S111), it can simultaneously make the cutting groove date and the image information reappear at the display panel with assigning the expected lacing checking position which uses the make.
Description
Technical field
The present invention relates to the processing result management method of the wafer in the processing unit (plant) of topping machanism etc.
Background technology
The wafer that is formed with the device of a plurality of IC, LSI etc. forms predetermined thickness through back side grinding, is divided into each device and is used in the electronic equipment of mobile phone, PC etc. by the processing unit (plant) of cutter sweep etc.Herein, when using blade to cut off wafer by cutter sweep, sometimes produce flange (tipping) on section, or be subjected to the influence of the thermal deformation of main shaft (spindle) or blade, the position of otch (kerf) is from the off-centring of sight line (hair line).
Therefore, in cutter sweep, carry out the otch inspection of blade according to predefined timing.The otch audit function that is used to cut condition monitoring is to utilize electron microscope to take the cutting slot (kerf) of blade cut, captured image information is carried out image to be handled, measured value to the cutting slot position carries out calibration, when with predefined reference position (sight line) when departing from, automatically carry out revisal (sight line contraposition).In addition, also measure the size of kerf width and flange (tipping).When carrying out such otch inspection, in the certifiable mode of operator, the information of the side-play amount (offset) of demonstration incision site and a reference value, kerf width, flange (tipping) size etc. in display frame.
[patent documentation 1] spy opens flat 7-130806 communique
But in the past, carried out the otch audit function, upgraded detailed otch check measurement data at every turn when carrying out the otch audit function in order to carry out the sight line contraposition, only only with numeric data as log data and record.Thereby, when utilizing otch check measurement data in the production management of the quality affirmation in mass-production process etc., only from log data, extract otch check measurement data and output with regard to spended time.In addition, because there is not otch to check the image information of position, from the viewpoint of using, there is reliability problems in the affirmation again of indispensable surface quality in the time of can't managing on the thing of using otch check measurement data qualitative control.
Summary of the invention
The present invention proposes in view of the above problems, and purpose is to provide a kind of processing result management method of wafer, on the basis of the management of the processing quality when producing in batches easily, can change by the timeliness of Visual Confirmation surface quality in hope.
In order to solve above-mentioned problem, realize purpose, the processing result management method of wafer of the present invention is the processing result management method that is arranged in the wafer of processing unit (plant), this processing unit (plant) has the chuck table that keeps wafer; To the filming apparatus that the wafer that remains on this chuck table is taken, show the display floater of the image that this filming apparatus is taken; The processing unit (plant) that the wafer that remains on the above-mentioned chuck table is processed; Relatively on X-direction, process the processing conveying device of carrying this processing unit (plant) and above-mentioned chuck table; Relatively calibration is carried the calibration conveying device of above-mentioned processing unit (plant) and above-mentioned chuck table on Y direction, and the processing result management method of described wafer is characterised in that to have: the cutting step that makes the action of above-mentioned processing conveying device and above-mentioned calibration conveying device and form cutting slot by above-mentioned processing unit (plant) on the preset lines in cutting apart of wafer; Make the above-mentioned cutting slot that cuts in this cutting step be positioned at above-mentioned filming apparatus place termly or randomly, take this cutting slot and generate image information, generate the cutting slot data simultaneously, the position of above-mentioned filming apparatus and wafer is associated with the positional information of representing with X Y coordinate, and above-mentioned image information and above-mentioned cutting slot data are stored in storing step in the storage device; Shape with wafer on above-mentioned display floater shows as wafer map that with the ideograph of cutting apart preset lines display list is shown in the step display of the mark of the above-mentioned positional information of being stored in the above-mentioned storing step simultaneously; Specify in the above-mentioned mark that shows in this step display, on above-mentioned display floater, reproduce the corresponding above-mentioned image information and the reproduction step of above-mentioned cutting slot data.
The processing result management method of wafer of the present invention is characterised in that: in foregoing invention, id information with particular wafer, in above-mentioned storage device, store the wafer information of above-mentioned wafer map, above-mentioned image information and above-mentioned cutting slot data at each wafer, based on the above-mentioned id information of appointment from the above-mentioned wafer information of above-mentioned storage device to the corresponding wafer of above-mentioned display floater output.
The processing result management method of wafer of the present invention is characterised in that: in foregoing invention, will be in above-mentioned storing step and above-mentioned step display canned data be stored in and have in the ambulant storage medium.
The processing result management method of wafer of the present invention is characterised in that: in foregoing invention, above-mentioned cutting slot data are the sight line of center of the above-mentioned filming apparatus of expression and the side-play amount at cutting slot center.
The processing result management method of wafer of the present invention is characterised in that: in foregoing invention, above-mentioned cutting slot data comprise one of the width of cutting slot and flange size.
Processing result management method according to wafer of the present invention, make the cutting slot of formation be positioned at filming apparatus place and shooting at every turn, when carrying out the otch inspection, the cutting slot data that generated and image information are associated with its positional information together and are stored in the storage device cumulatively, so the management of the processing quality when processing the batch process of processing continuously for many pieces of wafers becomes easy, in addition, when checking, goes back at each otch store image information, the shape of wafer and the ideograph of cutting apart preset lines are shown as wafer map, the mark that also on wafer map, shows the positional information that the expression otch is checked simultaneously in the lump, utilize the desirable otch check point of understanding easily of this mark by appointment, with the cutting slot data, renders image information on display floater, so the desirable moment can change with the timeliness of Visual Confirmation surface quality in the processing way or after the processing, plays and also can be used on the medium effect of processing that is reflected in the back.
In addition, processing result management method according to wafer of the present invention, has such effect: for example handle aspect the many pieces of wafers processing continuously by box (cassette) unit, id information with particular wafer, for each wafer memory chip figure in memory device, the wafer information of image information and cutting slot data, export the wafer information of corresponding wafer to display floater from storage device based on the id information of appointment, thereby desirable wafer for the completion of processing in the same box, if specify the id information of this wafer in the moment of hope, then can on display floater, reproduce the otch check result that comprises image information.
Description of drawings
Fig. 1 is the approximate three-dimensional map of structure example of processing unit (plant) of the processing result management method of the expression wafer of implementing embodiment of the present invention.
Fig. 2 is the plane that expression is suitable for the structure example of wafer in the present embodiment.
Fig. 3 is the general positive map of the structure example of expression processing unit (plant) etc.
Fig. 4 is the general block diagram of the structure example of the built-in control section of the processing unit (plant) of expression present embodiment.
Fig. 5 is the key diagram that data storage partial data storage example is represented in medelling.
Fig. 6 is the key diagram of the data storage example of medelling presentation video memory portion.
Fig. 7 is the key diagram that the data storage example of wafer map memory portion is represented in medelling.
Fig. 8 is the general flowchart of the processing result management method of the expression wafer of following machining action.
Fig. 9 is that the otch information that expression can be inserted for the processing of Fig. 8 shows the general flowchart that inserts the processing example.
Figure 10 is the general positive map that is illustrated in the demonstration example of the display floater in the processing processing.
Figure 11 is the general positive map that the expression otch is checked the demonstration example of the display floater in the data demonstration.
Figure 12 is the general positive map of the demonstration example of the expression otch check result display floater of selecting usefulness.
The specific embodiment
The following processing result management method that is used to implement the wafer of best mode of the present invention with reference to description of drawings.
Fig. 1 is the approximate three-dimensional map of structure example of processing unit (plant) of the processing result management method of the expression wafer of implementing embodiments of the present invention, Fig. 2 is the plane of structure example that expression is applicable to the wafer of present embodiment, and Fig. 3 is the general positive map of the structure example of expression processing unit (plant) etc.The processing unit (plant) 10 of present embodiment is applicable to along the topping machanism of two cutting (dual cut) modes of cutting apart preset lines cutting wafer W, has as basic formation: the chuck table 11, filming apparatus 12, display floater 13, processing unit (plant) 14, processing conveying device 15 (with reference to Fig. 4), calibration conveying device 16 (with reference to Fig. 3), input/output unit 17, conveying device 18, cleaning device 19 and the conveying device 20 that keep wafer W.
At first, wafer W sticks on the surface of the stickup band T on the framework F that is installed on annular as shown in Figure 2, is being accommodated in the box 21 by pasting under the state of band T by the framework F support of annular.Herein, 1 box 21 for example can be taken in 25 pieces of wafer W, by making 21 two sections in 2 boxes overlapping, maximum 50 pieces wafer W can be set.Wafer W is cut apart preset lines S and is marked off a plurality of zones by forming cancellate many on surperficial Wa as shown in Figure 2, forms the semiconductor chip 22 of IC, LSI etc. in the zone that this marks off.The wafer W of Gou Chenging is that upside, the back side stick on the stickup band T that is installed on the annular frame F with surperficial Wa like this.
Input-output device 17 is outputing in the mounting zone that conveying device 18 can carry being accommodated in wafer W in the box 21, and the wafer W that cutting is handled is input in the box 21.Conveying device 18 is transported to the wafer W that input-output device 17 outputs to the mounting zone on the chuck table 11.In addition, the wafer W that disposes of 19 pairs of processing unit (plant)s 14 of cleaning device is cleaned.Conveying device 20 is transported to cleaning device 19 to the wafer W that processing unit (plant) 14 disposes from chuck table 11.
Chuck table 11 also can be rotated with not shown drive source binding.In addition, chuck table 11 is arranged to and can be moved on X-direction by the processing conveying device 15 of the known configurations of cheese head screw, nut, pulse motor etc., and the relative processing unit (plant) 14 of wafer W that carries is relatively processed conveying on X-direction.
Filming apparatus 12 is electron microscopes that the CCD camera of taking the surperficial Wa remain on the wafer W on the chuck table 11 etc. is installed, in that to aim at (alignment) and otch shared in checking.Herein, when being used on time, the image information that obtains according to filming apparatus 12 detects the area part that cut, and carries out the location use of processing action for processing unit (plant) 14.In addition, when being used for the otch inspection, be positioned at by the cutting slot that makes cutting on the camera site of filming apparatus 12, when taking this cutting slot and generating image information, generate the use of cutting slot data for handling through image.
Processing unit (plant) 14 as shown in Figure 3, its structure is to remain on as thin as a wafer cutting tip 22a, the 22b of wafer W by the ring-type of rotating on the chuck table 11 simultaneously or individually along cutting apart two cutting structures that preset lines S cuts, and possesses cutting tip 22a, 22b are installed in a pair of main shaft 23a, 23b on the front end.The mode that a pair of main shaft 23a, 23b stand facing each other abreast with cutting tip 22a, 22b is configured on the roughly same straight line, and feed conveying device 24a, the 24b by cheese head screw, nut, pulse motor etc. is arranged to and can moves on Z-direction independently respectively.In addition, relative the chuck table 11 and processing unit (plant) 14 calibration conveying device 16 that relatively calibration is carried on Y direction is had: be made up of cheese head screw, nut, pulse motor etc., individually calibration is carried single calibration conveying mechanism 16a, the 16b of cutting tip 22a, 22b on Y direction; The processing unit (plant) 14 integral body whole calibration conveying mechanism 16c that calibration is carried on Y direction.
The processing unit (plant) 10 that constitutes like this makes cutting tip 22a, the 22b incision wafer W of high speed rotating on one side with predetermined depth of cut, on one side carry chuck table 11, thereby on can while machining wafer W 2 are cut apart preset lines S and are formed cutting slot (kerf) by the processing relatively on X-direction of processing conveying device 15 relative processing unit (plant)s 14.Therefore, for example make cutting tip 22a, 22b (perhaps from the inside all sides of the outer circumferential side of wafer W, conversely from interior all side direction outer circumferential sides) use calibration conveying device 16 calibration conveying relatively on Y direction successively by the interval of cutting apart preset lines S, thus can form cutting slot to unidirectional whole preset lines S (route channel 1) of cutting apart.Then, the rotation by chuck table 11 makes wafer W rotate 90 °, utilizes processing unit (plant) 14 to repeat same machining for the whole preset lines S (route 2) of cutting apart that newly is configured on the X-direction, thereby can be divided into single semiconductor chip 22.
The formation of the control system that the processing unit (plant) 10 of present embodiment is built-in then, is described.Fig. 4 is the general block diagram of the structure example of the built-in control section 30 of the processing unit (plant) 10 of expression present embodiment.Control section 30 for example has arithmetic processing apparatus or ROM, the RAM etc. that CPU etc. constitutes, and be the main body formation with the microprocessor 31 and the storage device 32 of the control of being responsible for processing unit (plant) 10 integral body.Processing unit (plant) 14, processing conveying device 15, calibration conveying device 16 and feed conveying device 24a, 24b are connected with microprocessor 31, are controlled the action of processing actions etc. by microprocessor 31.In addition, microprocessor 31 is read necessary demonstration information from storage device 32 or panel display pattern storage area 33, and via display control section 34 for display floater 13 control displaying contents, resolve the input information of indication operation on display floater 13 simultaneously, control, show uses such as control for the action of each several part.
In addition, the shooting action when 12 controls of 31 pairs of filming apparatus of microprocessor are checked punctual or otch is carried out processing controls to filming apparatus 12 captured image information simultaneously.Processing controls as this image information, carry out filming apparatus 12 captured image information former states are stored in control in the storage device 32, or carry out that in image processing section 35 image information is carried out image and handle and generate cutting slot data etc., these cutting slot data of generation etc. are stored in control in the storage device 32.Herein, image as accompanying image processing section 35 is handled and the cutting slot data of generation, in the present embodiment, comprise the flange maximum [mm] of size of width [mm], expression flange of sight line side-play amount [mm], the cutting slot that forms of side-play amount at the cutting slot center of the sight line that means the center of representing filming apparatus 12 and formation, and should zone [pix].In addition, but externally connect on the connectivity port 36 and freely be provided with the ambulant storage medium 37 of having of the data of downloaded stored in storage device 32.In the present embodiment, for example use USB storage as storage medium 37.
In addition, storage device 32 has data storage part 32a, video memory part 32b and wafer map memory portion 32c.Video memory part 32b is used for the many image informations of information memory capacity, in the present embodiment, carries out storing successively when otch is checked filming apparatus 12 captured image information at every turn.Wafer map memory portion 32c is for the situation of carrying out of the cutting confirming to be undertaken by cutting tip 22a (Z1 axle), 22b (Z2 axle) on the work sheet picture, at each route of each wafer W, the contour shape (circle) of each wafer W of generating in advance and the ideograph of cutting apart preset lines S are stored as the data of wafer map.
Herein, in the present embodiment, for corresponding with 50 pieces of wafers of maximum of 2 box amounts, in data storage part 32a as shown in Figure 5, set box hurdle a, wafer ID hurdle b, route hurdle c, otch inspection coordinate (X, Y) hurdle d, sight line side-play amount hurdle e, cutting slot width hurdle f, flange maximum g, flange zone hurdle h, otch check image pointer hurdle i, and wafer map pointer hurdle j, storage is set with the mode of each corresponding data in hurdle when checking with each otch.Promptly, having carried out the usefulness X Y coordinate (X that otch is checked, the Y coordinate all is that the center with chuck table 11 is 0 relative coordinate) positional information of expression is stored in otch and checks coordinate (X, Y) among the hurdle d, be associated with this positional information and each cutting data is stored in each corresponding hurdle e, f, g, among the h, and then, for specific corresponding image information, the pointer of the storage memory location that is stored in the presentation video information among the video memory part 32b as shown in Figure 6 in otch check image pointer hurdle i, and then, for the wafer map of specific correspondence, the pointer of the memory location of the storage expression wafer map data of in wafer map memory portion 32c, storing as shown in Figure 7 in wafer map pointer hurdle j.
And then, wafer for maximum 50 pieces of quantity, in order to obtain corresponding with the data of cutting slot, with will be about the data of the id information of specific each wafer, be that the difference of wafer id information, box, the mode that the difference of route also is stored among each self-corresponding hurdle a, b, the c are set.Herein, as the wafer id information, use for example to be accommodated in 2 boxes 21 and (backward also can) gives numbering successively wafer number from the top downwards.The epimere of supposing box 21 adopts 1, and hypomere adopts 2 (conversely also can).
Then, with reference to the processing result management method of Fig. 8～Figure 12 following of illustrating that microprocessor 31 carries out along the wafer of the machining action of cutting apart preset lines of wafer W.Fig. 8 is the general flowchart of the processing result management method of the expression wafer of following machining action, Fig. 9 is that the otch information that expression can be inserted for the processing of Fig. 8 shows the general flowchart that inserts the processing example, Figure 10 is the general positive map of the demonstration example of the display floater 13 during expression processing is handled, Figure 11 is the general positive map that the expression otch is checked the demonstration example of the display floater 13 of data in showing, Figure 12 is the general positive map of the demonstration example of the expression otch check result display floater 13 of selecting usefulness.
At first, before processing is handled,, judge whether to finish the condition enactment (step S101) that is used for the device data making for each wafer W making apparatus data.At this moment, as the data class that should import,, also comprise the setting that otch is checked data except at the processing conditions of wafer W or automatically to the mutatis mutandis data.Check as otch to comprise the setting of data every several lines cutting apart preset lines S and to carry out the otch inspection, or 1/2 of each route is respectively carried out the setting of otch inspection several times etc.In the present embodiment, for example, set per 1/2 at each route for, and each of each wafer W, begin regularly to carry out the otch inspection in 2 positions of the 3rd line from the outer circumferential side of wafer W.
(step S101 when condition enactment finishes, be), judge whether the full-automatic key on the initial picture that is presented at display floater 13 presses (step S102), if press (step S102, be), then carry out the transition to along cutting apart the full-automatic action that preset lines S automatically carries out machining.
At first, the wafer W that becomes the machining object is input to (step S103) on the chuck table 11 from box 21.Then, make the wafer W of input be positioned at filming apparatus 12 places and take, the image information that obtains based on filming apparatus 12 detect should cut cut apart preset lines S, carry out automatic aligning (Working position identification) processing (step S104) that making 16 actions of calibration conveying device.This processing is carried out route 1,2.Then, make feed conveying device 24a, 24b and process conveying device 15 actions, carrying out is becoming the cutting processing (step S105, cutting step) that generates cutting slot on the preset lines S with cutting tip 22a, 22b of cutting apart of object.
In such processing is handled, set wafer map ray mode (wafer map linemode) for, on display floater 13, show wafer map (step S106).Figure 10 with reference to the demonstration example in the expression processing processing, otch image key 41a on the peripheral part in setting the main region 41 that is presented at display floater 13, check pointer key 41b, wafer map key 41c, XIS (the Extended Interface System of expansion interface system) key 41d, mode of operation key 41e, ray mode key 41f, upturning key 41g, downturning key 41h, temporarily stop to cut key 41i, among the otch inspection data display key 41j etc., check pointer key 41b, wafer map key 41c, ray mode checks that with key 41f and otch data display key 41j becomes the wafer map ray mode of demonstration, and the central authorities in this main region 41 show wafer Figure 42 of wafer map ray mode.Wafer Figure 42 is the shape (circle) of expression wafer W and cuts apart the ideograph of preset lines (many horizontal lines), with the situation of carrying out of the cutting that can visual mode be presented at cutting tip 22a, 22b on the wafer images.In illustrated embodiment, on wafer Figure 42, draw the zone that the cutting of cutting apart preset lines S that regional 42a that oblique line represents represents that cutting tip 22a (Z1 axle) carries out finishes, draw zone that the cutting of cutting apart preset lines S that regional 42b that different oblique lines represent represents that cutting tip 22b (Z2 axle) carries out finishes (in fact, for example regional 42a represented with blue the demonstration, zone 42b represents that with green the demonstration the unhewn preset lines S of cutting apart represents with the grey demonstration).
And in Figure 10, otch image key 41a is a key of selecting whether to show the photographic images of filming apparatus 12 when stock removal action stops on the background of main region 41.Check that pointer key 41b is a key of selecting the incident that should show on the line that is shown in the wafer Figure 42 on the main region 41, in the present embodiment, mark as go up the expression positional information at the line (cutting apart preset lines) of having carried out the otch inspection adopts and for example sets the demonstration asterisk for.Wafer map key 41c is the key that switches to the pattern that shows wafer map, and XIS key 41d switches to the key that is used for filming apparatus 12 is carried out the XIS pattern demonstration of light quantity adjustment, focus adjustment etc. in stock removal action stops.Mode of operation is in the wafer map pattern with key 41e, and the pattern that is used for searching target etc. automatically to mutatis mutandis teaching (teach) time is set and use key, and ray mode is the pattern setting key that shows wafer Figure 42 as shown in Figure 10 with key 41f.Upturning key 41g moves one key on the selection alignment that makes on wafer Figure 42 in stock removal action stops, downturning key 41h moves one key under the selection alignment that makes on wafer Figure 42 in stock removal action stops.Otch checks that data display key 41j is the key that is used to show the details relevant with the line of selecting on wafer Figure 42.
In addition, in Figure 10, software keyboard zone 44 is adopted in zone, the following hurdle of display floater 13, and this software keyboard zone 44 for example has operation along with 4 function switch keys 43, the function key F1～F10 by the changeable key function of software.
Then, for the predetermined preset lines S of cutting apart, if after machining this to cut apart preset lines S be that predefined otch is checked line (step S107, be), the position by mobile chuck table 11 then, make to be formed on this cutting slot of cutting apart on the preset lines S and to be positioned at filming apparatus 12 places, and take cutting slots, carry out the otch inspection and handle (step S108) with filming apparatus 12.Promptly, take cutting slot and generate image information by filming apparatus 12, and then carry out image with 35 pairs of these image informations of image processing section and handle, generate cutting slot data (sight line side-play amount, cutting slot width, flange maximum and flange zone), generate simultaneously with X Y coordinate and represented to carry out the positional information that the position of filming apparatus 12 that this otch checks and wafer W concerns.This otch that generates is like this checked the image information of position, and cutting slot data etc. are presented on the main region 41 of display floater 13 (step S109).Demonstration in this case is the same with the situation of Figure 11 described later.
And, this image information, the cutting slot data of having carried out the otch inspection be associated with the positional information of representing with the XY coordinate and be stored in (step S110, storing step) in the storage device 32.At this moment, as with the machining of this cutting slot in the relevant information of wafer W, obtain kind, wafer ID, the route information of the box 21 that provides, as shown in Figure 5, be mapped with wafer ID and this image information, cutting slot data, and wafer map information is stored in the storage device 32.In the storage of this information, image information that information content is many and wafer map information are respectively as Fig. 6, shown in Figure 7, be stored among video memory part 32b or the wafer map memory portion 32c, pointer information by the memory location on storage representation video memory part 32b in data storage part 32a or the wafer map memory portion 32c associates with positional information.
In addition, the otch of cutting apart on the preset lines (cutting slot) after the otch inspection of the wafer Figure 42 that has shown on having carried out display floater 13 checks that the position epigraph shows the otch check mark 45 (step S111, step display) of asterisk.
Then, (step S107 when not being otch inspection line, not), cut apart preset lines S, judge whether the formation of cutting slot finishes (step S112) at route 1 usefulness all, there be not (step S112 under the situation about finishing,), do not return at the follow-up machining of cutting apart preset lines S and handle (step S105).
If the processing of route 1 finishes (step S112 is), judge then whether the processing of route 2 finishes (step S113), do not having (step S113, not), whether judgement finishes 90 ° (step S114) of rotation to this wafer W under the situation about finishing.Rotate 90 ° (step S114, not), then the wafer map information (step S115) of the correspondence of new record route 1 usefulness more in wafer map memory portion 32c makes chuck table 11 rotate 90 ° simultaneously, makes wafer W rotate 90 ° (step S116) if finish.In step S115, after cutting is finished completely,, update stored among the wafer map memory portion 32c as checking the data of having given wafer Figure 42 of mark 45 on the position at otch.After wafer W is finished when rotating 90 ° or rotated 90 ° (step S114 is step S116), (step S105) handled in the cutting of return route 2 usefulness.
If the processing of route 2 finishes (step S113 is), the wafer map information (step S117) of the correspondence of new record route 2 usefulness more in wafer map memory portion 32c then.That is, after cutting is finished completely, as checking the data of the wafer Figure 42 that has given mark 45 on the position at otch and updating stored among the wafer map memory portion 32c.
Then, cutting the wafer W that disposes is input in the box 21 (step S118) from chuck table 11 outputs and process matting etc.Then, judge in box 21, whether to remain untreated wafer W (step S119), when residue (step S119 is), similarly repeat the processing of above-mentioned steps S103～S118.Then, the machining of all wafer W in box 21 finishes, and (step S119 not), finishes a series of full automatic treatment when not remaining untreated wafer W in box 21.
And in this a series of processing, if the operator preserves data by desirable timing indication to external storage medium 37, the storage data that then are stored in the storage device 32 are stored in the external storage medium 37.
When such processing finishes, in data storage part 32a or video memory part 32b and wafer map memory portion 32c as Fig. 5～shown in Figure 7, become to have stored and check the relevant otch check result in position, the i.e. state of wafer information with all otch.If in the processing way, then become all otch of having stored with till this stage and check the relevant otch check result in position, the i.e. state of wafer information.
Then, insert the example of processing with reference to the otch information demonstration that Fig. 9 illustrates in processing is as shown in Figure 8 handled on the way or any time after the processing processing can insert.For example, in the demonstration of as shown in Figure 10 wafer Figure 42, when outside wafer Figure 42, finger 46 touched main region 41 when inner, just selected to point the line on the extended line of directions X of 46 positions that touched.Can select to cut apart preset lines S (cutting slot) like this, under the situation of cutting apart preset lines S (cutting slot) of having selected image show tags 45, just select to have indicated otch to check line.Line options also can be the operation of upturning key 41g or downturning key 41h.The line of selecting is for example expressed with redness.
Then, monitor the selection indication (step S201) that whether has otch to check line, (step S201 under the selection indication situation of cutting apart preset lines S (cutting slot) of image show tags 45 is being arranged, be), shown based on image and to have checked the positional information of position by the otch of mark 45 (32b reads corresponding image information from the video memory part for X, the Y) data in the retrieval storage devices 42, and reproduction is presented at (step S202 reproduces step) on the main region 41.And then the otch that judges whether to press detailed demonstration usefulness is checked data display key 41j (step S203), (step S203 when pressing, be), data storage part 32a from storage device 32 reads with the otch of selecting to indicate and checks the corresponding cutting slot data of positional information, reproduction is presented at (step S204 reproduces step) on the main region 41.
Check that with reference to the expression otch data show Figure 11 of the demonstration example of the display floater 13 in the way, show the image information 51 of the otch check result that filming apparatus 12 is taken on the main region 41.In image information 51,51a represents the semiconductor chip part, and 51b represents to cut the cutting slot of cutting apart preset lines and generating, and 51c is the sight line of the center of expression filming apparatus 12, and 51d represents the cutting slot center.And the utilization of cutting slot data has been avoided the part of cutting slot image information 51 partly and has been shown.In addition, display field 52 as a result is arranged on the right side of image information 51, this as a result display field show it for example is the cutting of which bar line, the Y coordinate when the cutting starting position on the X-axis, the cutting end position on the X-axis, cutting, the cutting result of the height of blade, transporting velocity etc.In addition, be arranged to Z1 axle/Z2 axle display field 53 on the top of display field 52 as a result, this display field 53 shows that the information that is now showing is the result of cutting tip 22a (Z1 axle), or the result of cutting tip 22b (Z2 axle).
Then, when pressing lower cut inspection data display key 41j once more (step S205 is), return to original wafer map show state (step S206) as shown in Figure 10.
On the other hand, for example, in the demonstration of as shown in Figure 10 wafer chip 42, among the function key F1 of monitoring software keyboard area 44～F10, for example distribute to the otch check result key of function key F1 and whether press (step S207), when supressing otch check result key (step S207 is), on display floater 13, show otch check result selection picture (step S208) as shown in Figure 12.That is, in order to select to wish to show box 21, wafer W and the route of otch check result, display box selects action bar 61a, wafer ID to select action bar 61b, route selection action bar 61c.61d is used for the display key that indicated number is handled, and 61e is the ESC Escape that is used to return the such common demonstration of Figure 10.
Then, selecting in the operation of action bar 61b, route selection action bar 61c about box operation selectionbar 61a, wafer ID, selection indication (the step S209 that desirable box 21, wafer ID, route are arranged, be), (step S210 when pressing display key 61d, be), read the wafer map information of the wafer W corresponding from storage device 32, and on main region 41, show wafer Figure 42 (step S211) with the box of selecting to indicate 21, wafer ID and route.Wafer Figure 42 shown in Figure 12 represents and all processes the corresponding demonstration example of the wafer W that disposes, is divided into two parts by regional 42a, 42b.In addition, also reproduce the mark 45 that shows expression otch inspection position.
And (step S212 not), then returns the determination processing of step S201, and the otch that is presented at the wafer Figure 42 on the main region 41 relatively checks that the selection indication of line can be target with the position of mark 45 if do not press ESC Escape 61e.That is, can carry out the processing of step S201 as described above～204.Thus, when wishing, can comprise this image, reproduce and be input to and process the relevant otch check result of wafer W that disposes in the box 21.
Like this, according to present embodiment, when the cutting slot that forms being positioned at filming apparatus 12 places at every turn and taking, carry out the otch inspection, make the cutting slot data that generated and image information is associated with its positional information together and accumulation storage in storage device 32, so the management of the processing quality when processing the batch process of processing continuously for many pieces of wafer W becomes easy.In addition, when checking, goes back at each otch store image information, the shape of wafer is shown as wafer Figure 42 with the ideograph of cutting apart preset lines, the mark 45 that on wafer Figure 42, also shows the positional information that the expression otch is checked simultaneously in the lump, utilized the desirable otch of understanding easily of mark 45 to check the position by appointment, with the cutting slot data, renders image information on display floater 13, so the desirable moment can change by the timeliness of Visual Confirmation surface quality in the processing way or after the processing, it is medium also to can be used for being reflected in later processing.Particularly process continuously by box 21 units handle many pieces of wafer W aspect, with the id information of particular wafer W, at the wafer information of every wafer W memory chip figure, image information and cutting slot data in storage device 32.Id information based on appointment, from storage device 32 the wafer information of corresponding wafer W is outputed to display floater 13, thereby, then can be reproduced in the otch check result that comprises image information on the display floater 13 for the desirable wafer of the completion of processing in the same box 21, as if the id information of specifying this wafer in the desirable moment.
In addition, according to present embodiment, also be stored in about the various information that are stored in the otch inspection that comprises image information in the storage device 32 in the storage medium 37 of UBS memory etc., so in the desirable PC beyond this processing unit (plant) 10 etc., can reproduce the otch check result that comprises image information at any time.
And, in the present embodiment, be illustrated as the example in the processing unit (plant) that is useful in two cutting ways, even if but use 2 cutting tips, 2 stages cuttings of branch to handle the same processing unit (plant)s of cutting apart ladders cutting (step cut) mode of preset lines, or use the situation of processing unit (plant) of single cutting (single cut) mode of 1 cutting tip, can be suitable for too.
In addition, be not limited to regularly carry out the situation that otch is checked, also be equally applicable to carry out at random the situation of mode.In addition, also can change timing, the number of times that cutting inspection is handled to each route and each wafer.And box 21 is not limited to 2 sections overlapping situations, only uses the situation of 1 box 21 also passable.In addition, be not limited to USB storage, can also use other various storage mediums of CD-R, DVD-R, use corresponding drive unit to get final product as storage medium 37.And storage medium 37 also can utilize wire/wireless LAN, the data of storage device 32 are transferred to external personal computer etc. carries out storage administration.
Claims (5)
1. the processing result management method of the wafer in the processing unit (plant), this processing unit (plant) has: the chuck table that keeps wafer; The filming apparatus that the wafer that remains on this chuck table is taken; The display floater that shows the image that this filming apparatus is taken; The processing unit (plant) that the wafer that remains on the above-mentioned chuck table is processed; Relatively on X-direction, process the processing conveying device of carrying this processing unit (plant) and above-mentioned chuck table; Relatively calibration is carried the calibration conveying device of above-mentioned processing unit (plant) and above-mentioned chuck table on Y direction, and the processing result management method of this wafer is characterised in that to have:
Make the action of above-mentioned processing conveying device and above-mentioned calibration conveying device, and the cutting step that forms cutting slot on the preset lines in cutting apart of above-mentioned wafer by above-mentioned processing unit (plant);
Make the above-mentioned cutting slot that in this cutting step, cuts be positioned at above-mentioned filming apparatus place termly or randomly, when taking this cutting slot and generating image information, generate the cutting slot data, the position of above-mentioned filming apparatus and wafer is associated with the positional information of representing with the XY coordinate, and in storage device, stores the storing step of above-mentioned image information and above-mentioned cutting slot data;
Shape with wafer on above-mentioned display floater shows as wafer map that with the ideograph of cutting apart preset lines display list is shown in the step display of the mark of the above-mentioned positional information of storing in the above-mentioned storing step simultaneously;
Specify in the above-mentioned mark that shows in this step display, and on above-mentioned display floater, reproduce the corresponding above-mentioned image information and the reproduction step of above-mentioned cutting slot data.
2. the processing result management method of wafer as claimed in claim 1, it is characterized in that: with the id information of particular wafer, in above-mentioned storage device, store the wafer information of above-mentioned wafer map, above-mentioned image information and above-mentioned cutting slot data at every wafer, based on the above-mentioned id information of appointment from the above-mentioned wafer information of above-mentioned storage device to the corresponding wafer of above-mentioned display floater output.
3. as the processing result management method of claim 1 or 2 described wafers, it is characterized in that: canned data is stored in and has in the ambulant storage medium in above-mentioned storing step and above-mentioned step display.
4. as the processing result management method of any described wafer in the claim 1～3, it is characterized in that: above-mentioned cutting slot data are the sight line of center of the above-mentioned filming apparatus of expression and the side-play amount at cutting slot center.
5. the processing result management method of wafer as claimed in claim 4 is characterized in that: above-mentioned cutting slot data comprise one of the width of cutting slot and flange size.
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| JP2006173729 | 2006-06-23 | ||
| JP2006173729A JP5134216B2 (en) | 2006-06-23 | 2006-06-23 | Wafer processing result management method |
| JP2006-173729 | 2006-06-23 |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP5134216B2 (en) | 2013-01-30 |
| CN101092049B (en) | 2011-12-28 |
| TW200818366A (en) | 2008-04-16 |
| JP2008004806A (en) | 2008-01-10 |
| TWI404153B (en) | 2013-08-01 |
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