CN101064989A - Multi-layer flexible circuit board and its producing method - Google Patents
Multi-layer flexible circuit board and its producing method Download PDFInfo
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- CN101064989A CN101064989A CN 200610153502 CN200610153502A CN101064989A CN 101064989 A CN101064989 A CN 101064989A CN 200610153502 CN200610153502 CN 200610153502 CN 200610153502 A CN200610153502 A CN 200610153502A CN 101064989 A CN101064989 A CN 101064989A
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- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 241001232787 Epiphragma Species 0.000 claims description 26
- 230000003014 reinforcing effect Effects 0.000 claims description 26
- 239000011889 copper foil Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 230000002787 reinforcement Effects 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 6
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 126
- 239000003292 glue Substances 0.000 description 12
- 238000007731 hot pressing Methods 0.000 description 10
- 239000004642 Polyimide Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a multiple layer flexible circuitry board and preparing method, it includes three layers or more than three layers of single flexible circuitry board, and each of which is adhibited with half solid piece, the first outer layer possesses golden finger area for setting golden finger, the inner layer separately includes entity and die-cutting piece which can be tore with each other; the second layer includes entity and die-cutting piece which can be tore with each other, the die-cutting piece of inner layer and the second layer aligns at the golden finger area of the first outer layer. During the pressure of the multiple layer flexible circuitry board, the inner layer and the second layer which aligns at the golden finger area of the first outer layer are always kept, that is the die-cutting piece, so the altitude difference between the golden finger area and other area can be decreased, so dry film is pressed on outer layer, the perfect fill will be realized, and without air bubble, later perfect line etching is guaranteed, the problem of ill plough of line can be avoided.
Description
Technical field
The present invention relates to a kind of multi-layer flexible circuit board and manufacture method thereof.
Background technology
Miniaturization and light-weighted development along with various electronic equipments require size little, and the thermal endurance height has the flexible circuit board of superior bending performance and multifunction simultaneously, and multi-layer flexible circuit board arises at the historic moment.
Multi-layer flexible circuit board is some individual layer flexible circuit board, adds adhesive by interlayer, and hot pressing makes adhesive solidify realize the strong bond stack between each layer and form, and the adhesive after the curing is exactly a prepreg.Multi-layer flexible circuit board also has dynamic area, and promptly interlayer does not have the zone of adhesive, and dynamic area can crooked, bending, has excellent bending performance.
The golden finger zone of multi-layer flexible circuit board is a dynamic area, generally in design and manufacture process, the interior layer segment of the regional correspondence of golden finger washed out and dodge, with the thickness requirement that satisfies the golden finger zone and the requirement of bending performance, but wash out after the internal layer, because the step of outer golden finger edges of regions can be very high, in outer dry film lamination, can occur pressing dry mould unreal, have bubble, circuit etching to open circuit, have a strong impact on yield of products.
Summary of the invention
The purpose of this invention is to provide a kind of multi-layer flexible circuit board, the lamina rara externa face of this wiring board is smooth, and circuit etching is good, the yields height.
Another object of the present invention provides a kind of manufacture method of multi-layer flexible circuit board, makes the filling that the outer dry film of multi-layer flexible circuit board can be good, thereby improves yield of products.
For achieving the above object, the present invention proposes a kind of multi-layer flexible circuit board, comprise the individual layer flexible circuit board more than three layers or three layers, bonding between each layer with prepreg, first skin is provided with the golden finger zone, be used for the installation of golden finger, internal layer comprises body and die-cut respectively, peelable connection between body and die-cut; Second skin comprises body and die-cut, peelable connection between body and die-cut, and internal layer and second outer field die-cut are aligned with the first outer field golden finger zone.
There is opening the described internal layer and the second outer field body and die-cut junction, and described opening is convenient to tear off die-cut from body.
The described internal layer and the second outer field opening are joint-cutting.
With the first outer internal layer adjacent, its body is provided with the reinforcing chip that is used for the golden finger zone is carried out reinforcement, die-cut peelable connection of described reinforcing chip and this internal layer, reinforcing chip and first outer bonding by prepreg, described reinforcing chip is made up of the base material and the epiphragma that link to each other in turn.
A kind of manufacture method of multi-layer flexible circuit board comprises the steps: A) making internal layer flexible circuit board; B) predefined body 2 and die-cut 3 junction opening on the internal layer flexible circuit board; C) on the internal layer flexible circuit board behind the opening, make outer flexible circuit board, die-cut of internal layer is aligned with the first outer field golden finger zone, predefined body and die-cut junction opening on second skin, and second outer field die-cut also be aligned with the first outer field golden finger zone; D) according to the profile of predefined each layer of profile punching press flexible circuit board, form multi-layer flexible circuit board.
Opening among opening among the described step B on the internal layer and the step C on second skin is respectively the joint-cutting of die-cut formation.
When making first skin among the described step C, with the first outer internal layer adjacent on, its body is provided with the reinforcing chip that is used for the golden finger zone is carried out reinforcement, die-cut peelable connection of described reinforcing chip and this internal layer, the reinforcing chip and first skin is bonding by prepreg, described reinforcing chip is made up of the base material and the epiphragma that link to each other in turn, and the Copper Foil on it etches away in the manufacturing process of its place internal layer circuit.
Owing to adopted above scheme, in the entire making process of multi-layer flexible circuit board, remaining and the corresponding interior layer segment and the second outer layer segment in the first outer golden finger zone, be die-cut, can reduce the difference in height between golden finger zone and other parts of skin like this, thereby when pressing dry film layer by layer outside, realize the good filling of dry film, bubble can not occur, guarantee follow-up good circuit etching, when making the golden finger circuit, avoid the bad problem of circuit open circuit.
With the first outer internal layer adjacent on reinforcing chip is set, can carry out reinforcement to the golden finger zone, improve the reliability of multi-layer flexible circuit board; In addition, simple to operate because the part that directly adopts the internal layer flexible circuit board when as stiffening plate, having avoided in the prior art that the golden finger zone carried out reinforcement, is difficult to the problem of accurately locating, the efficient height, reinforcing effect is good.
Description of drawings
Also the present invention is described in further detail in conjunction with the accompanying drawings below by specific embodiment.
Fig. 1 is the structural representation of internal layer flexible circuit board.
Fig. 2 is the structural representation that is provided with the internal layer flexible circuit board of stiffening plate.
Fig. 3 is a schematic flow sheet of the present invention.
Fig. 4 is the structural representation of the embodiment of the invention.
Fig. 5 is the structural representation of comparative example of the present invention.
Embodiment
Referring to Fig. 1,2, a kind of multi-layer flexible circuit board, comprise the individual layer flexible circuit board more than three layers or three layers, bonding between each layer with prepreg, first skin is provided with the golden finger zone, be used for the installation of golden finger, internal layer comprises body and die-cut respectively, peelable connection between body and die-cut; Second skin comprises body and die-cut, peelable connection between body and die-cut; Internal layer and second outer field die-cut are aligned with the first outer field golden finger zone.With four layers flexible circuit board is example, is ground floor, the second layer, the 3rd layer and the 4th layer from bottom to up in turn, and then ground floor is second skin, and the 4th layer is first skin, and the second layer and the 3rd layer are internal layer.
Wherein the individual layer flexible circuit board can be that the flexible circuit board of single face also can be two-sided flexible circuit board, the flexible circuit board of single face is meant that it is Copper Foil that copper-clad plate has only a surface, has epiphragma at copper foil surface, two-sided flexible circuit board is meant that two surfaces up and down of copper-clad plate all are Copper Foils, is respectively with epiphragma at copper foil surface.
There is opening body and die-cut junction, and described opening is convenient to tear off die-cut from body.Its split shed can be joint-cutting, and this joint-cutting can be used the die-cut formation of die cutting die; Opening also can when this hole is through hole, be more convenient for tearing off body with die-cut for along body and die-cut row's aperture that the junction is provided with.
When the golden finger field strength is not enough, need carry out reinforcement to it, then with the first outer internal layer adjacent, be provided for the golden finger zone is carried out the reinforcing chip of reinforcement on its body, die-cut peelable connection of reinforcing chip and this internal layer, the reinforcing chip and first skin are bonding by prepreg, and reinforcing chip is made up of the base material and the epiphragma that link to each other in turn, and the Copper Foil on it etches away in the internal layer circuit manufacturing process at its place.
Referring to Fig. 3, the manufacture method of multi-layer flexible circuit board comprises the steps:
A, making internal layer flexible circuit board
B, on the internal layer flexible circuit board predefined body and die-cut junction opening;
C, on the internal layer flexible circuit board behind the opening, make outer flexible circuit board, die-cut of internal layer is aligned with the first outer field golden finger zone, predefined body and die-cut junction opening on second skin, and second outer field die-cut also be aligned with the first outer field golden finger zone;
D, according to the profile of predefined each layer of profile punching press flexible circuit board, form multi-layer flexible circuit board.
Opening among opening among the described step B on the internal layer and the step C on second skin is respectively the joint-cutting with die cutting die die-cut formation, also can one arrange aperture for what go out along body and die-cut junction with perforating device.When making first skin among the described step C, with the first outer internal layer adjacent on, its body is provided with the reinforcing chip that is used for the golden finger zone is carried out reinforcement, and die-cut peelable connection of described reinforcing chip and this internal layer is with reinforcing chip and first outer bonding by prepreg.Wherein reinforcing chip is made up of base material and the epiphragma placed in turn, and Copper Foil etches away in the manufacturing process of the internal layer circuit at its place on it.This base material is flexible circuitry plate substrate commonly used, such as the base material of being made up of polyimides (PI) or PETG (PET) film, adhesive and Copper Foil three parts, such base material also is the said three layer flexible cover copper plate materials of those skilled in the art; Also can adopt by PI or PET film and Copper Foil base material dimerous such base material said two sheets of flexible copper-clad plate of those skilled in the art just material.Epiphragma is this area epiphragma commonly used, such as the epiphragma of being made up of PI or PET film and adhesive.
Embodiment, referring to Fig. 4, with four layers of flexible circuit board is example, it is ground floor, the second layer, the 3rd layer, the 4th layer flexible circuit board 11,12,13,14 from top to bottom in turn, wherein the second layer, the 3rd layer are the internal layer flexible circuit board, ground floor is the second outer flexible circuit board, and the 4th layer is the first outer flexible circuit board.
Have at single face on the Copper Foil of glue material copper-clad plate, its model is made the circuit of flexible circuit board for damp LVASF0518RDT10 is arranged; After circuit forms, epiphragma in copper foil surface hot pressing, the model of epiphragma forms second layer flexible circuit board for damp CSK0515KA is arranged.
Continuation has at single face on the Copper Foil of glue material copper-clad plate, and its model is for there being damp LVASF0518RDT10, on make the circuit of flexible circuit board; After circuit forms, epiphragma in copper foil surface hot pressing, the model of epiphragma forms the 3rd layer of flexible circuit board for damp CSK0515KA is arranged.
Use prepreg 15 again, its model is the FR1500 of Du Pont, bonds together by the non-copper face that covers of fast pressure with the above-mentioned second layer and the 3rd layer of flexible circuit board.
The moulds of industrial equipment of using hemisection then predefined body 2 and die-cut 3 on the second layer and the 3rd layer the die-cut formation joint-cutting in junction.If desired reinforcement is carried out in the 4th layer golden finger zone, die-cut of the 3rd layer the die-cut length that is shorter in length than other each layers then, the 3rd layer body exceeds the part of other each layer bodies as stiffening plate 7, bonds on the 4th layer by prepreg.In addition, for the ease of the pressing stiffening plate 7 and first skin, can be at the also die-cut formation joint-cutting in junction of other parts of the body of stiffening plate and this layer.
Die-cut 3 prepreg of two sheets of flexible wiring board washes out, and makes die-cut 3 to be dynamic area.
After the die-cut intact prepreg, applying prepreg 16 on the epiphragma of the second layer, its model is the FR1500 of Du Pont, by ground floor single face in the hot pressing pressing the non-copper face that covers of glue material copper-clad plate is arranged, the moulds of industrial equipment of using hemisection again predefined body 5 and die-cut 6 on ground floor the die-cut formation joint-cutting in junction.
Applying prepreg 17 on the 3rd layer epiphragma, its model are the FR1500 of Du Pont, and the non-copper face that covers of glue material copper-clad plate is arranged by the 4th layer of single face in the hot pressing pressing.2 boring on the Copper Foil of glue material copper-clad plate is arranged at ground floor and the 4th layer of single face, plasma etching, black hole, press dry film, exposure is developed, after etching circuit, epiphragma in the hot pressing is used the profile of profile mould according to predefined each layer of profile punching press flexible circuit board more respectively, forms four layers of flexible circuit board.
Die-cut can tear off the body of its place layer along opening with hand after product shaping.
In the present embodiment, employing thickness is that the rolled copper foil of 4～45 μ m has glue material Copper Foil as single face, adopting thickness is that polyimides (PI), PETG (PET) film of 5～30 μ m formed epiphragma, and adopting thickness is that the adhesive of 10～25 μ m is as prepreg.
Comparative example 1, referring to Fig. 5, with four layers of flexible circuit board is example, it is ground floor, the second layer, the 3rd layer, the 4th layer flexible circuit board 11 ', 12 ', 13 ', 14 ' from top to bottom in turn, wherein the second layer, the 3rd layer are the internal layer flexible circuit board, and ground floor and the 4th layer are outer flexible circuit board.
Have at single face on the Copper Foil of glue material copper-clad plate, its model is for there being damp LVASF0518RDT10,, make the circuit of flexible circuit board; After circuit forms, epiphragma in copper foil surface hot pressing, the model of epiphragma forms second layer flexible circuit board for damp CSK0515KA is arranged, and with on it predefined die-cut wash out.
Continuation has at single face on the Copper Foil of glue material copper-clad plate, and its model is for there being damp LVASF0518RDT10,, make the circuit of flexible circuit board; After circuit forms, epiphragma in copper foil surface hot pressing, the model of epiphragma forms the 3rd layer of flexible circuit board for damp CSK0515KA is arranged.
With prepreg 15 ', its model is the FR1500 of a Du Pont glue again, is attached to non-the covering on the copper face on the second layer flexible circuit board, and predefined die-cut and prepreg corresponded on it are washed out together.
Bond together by the non-copper face that covers of fast pressure the above-mentioned second layer and the 3rd layer of flexible circuit board.
The prepreg 16 ', 17 ' of fitting respectively on the epiphragma of the second layer and the 3rd layer of flexible circuit board, ground floor and the 4th layer of single face have the non-copper face that covers of glue material copper-clad plate in the hot pressing respectively.
2 boring on the Copper Foil of glue material copper-clad plate is arranged at ground floor and the 4th layer of single face, plasma etching, black hole, press dry film, exposure is developed, after etching circuit, epiphragma in the hot pressing is used the profile of profile mould according to predefined each layer of profile punching press flexible circuit board more respectively, forms four layers of flexible circuit board.
In this comparative example, employing thickness is that the rolled copper foil of 4～45 μ m has glue material Copper Foil as single face, adopting thickness is that polyimides (PI), PETG (PET) film of 5～30 μ m formed epiphragma, and adopting thickness is that the adhesive of 10～25 μ m is as prepreg.
Four layers of flexible circuit board that embodiment and comparative example are obtained detect, open short circuit phenomenon and product yields with 40 times of lens examination products, referring to table one, the test for short-circuit of opening of four layers of flexible circuit board of embodiment is 250pcs, and its product yields is 85%; And the test for short-circuit of opening of comparative example is 250pcs, and its product yields is 60%, this shows, adopts technical scheme of the present invention, has greatly improved the yields of multi-layer flexible circuit board.
Table one
Claims (7)
1, a kind of multi-layer flexible circuit board, comprise the individual layer flexible circuit board more than three layers or three layers, bonding between each layer with prepreg, first skin is provided with the golden finger zone, be used for the installation of golden finger, it is characterized in that: internal layer comprises body and die-cut respectively, peelable connection between body and die-cut; Second skin comprises body and die-cut, peelable connection between body and die-cut, and internal layer and second outer field die-cut are aligned with the first outer field golden finger zone.
2, multi-layer flexible circuit board according to claim 1 is characterized in that: there is opening the described internal layer and the second outer field body and die-cut junction, and described opening is convenient to tear off die-cut from body.
3, multi-layer flexible circuit board according to claim 2 is characterized in that: the described internal layer and the second outer field opening are joint-cutting.
4, multi-layer flexible circuit board according to claim 2, it is characterized in that: with the first outer internal layer adjacent, its body is provided with the reinforcing chip that is used for the golden finger zone is carried out reinforcement, die-cut peelable connection of described reinforcing chip and this internal layer, the reinforcing chip and first skin are bonding by prepreg, and described reinforcing chip is made up of base material and the epiphragma placed in turn.
5, a kind of manufacture method of multi-layer flexible circuit board is characterized in that, comprises the steps:
A) make the internal layer flexible circuit board;
B) predefined body and die-cut junction opening on the internal layer flexible circuit board;
C) on the internal layer flexible circuit board behind the opening, make outer flexible circuit board, die-cut of internal layer is aligned with the first outer field golden finger zone, predefined body and die-cut junction opening on second skin, and second outer field die-cut also be aligned with the first outer field golden finger zone;
D) according to the profile of predefined each layer of profile punching press flexible circuit board, form multi-layer flexible circuit board.
6, the manufacture method of multi-layer flexible circuit board according to claim 5 is characterized in that: the opening among opening among the described step B on the internal layer and the step C on second skin is respectively the joint-cutting of die-cut formation.
7, the manufacture method of multi-layer flexible circuit board according to claim 9, it is characterized in that, when making first skin among the described step C, with the first outer internal layer adjacent on, its body is provided with the reinforcing chip that is used for the golden finger zone is carried out reinforcement, die-cut peelable connection of described reinforcing chip and this internal layer, the reinforcing chip and first skin is bonding by prepreg, described reinforcing chip is made up of base material and the epiphragma placed in turn, and the Copper Foil on it etches away in the manufacturing process of its place internal layer circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101535023A CN100527916C (en) | 2006-04-30 | 2006-09-08 | Multi-layer flexible circuit board and its producing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610020961.4 | 2006-04-30 | ||
| CN200610020961 | 2006-04-30 | ||
| CNB2006101535023A CN100527916C (en) | 2006-04-30 | 2006-09-08 | Multi-layer flexible circuit board and its producing method |
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| Publication Number | Publication Date |
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| CN101064989A true CN101064989A (en) | 2007-10-31 |
| CN100527916C CN100527916C (en) | 2009-08-12 |
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| CNB2006101535023A Active CN100527916C (en) | 2006-04-30 | 2006-09-08 | Multi-layer flexible circuit board and its producing method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159041A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Method for once pressure-forming of inner and outer layers of multi-layer flexible circuit board |
| CN104159394A (en) * | 2014-07-24 | 2014-11-19 | 深圳崇达多层线路板有限公司 | PCB slice and preparation method thereof |
| CN104717829A (en) * | 2015-02-02 | 2015-06-17 | 昆山意力电路世界有限公司 | High-density bubble-free golden finger pressing structural slab and processing method thereof |
| CN104768323A (en) * | 2015-03-24 | 2015-07-08 | 深圳华麟电路技术有限公司 | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board |
| CN107493663A (en) * | 2017-08-30 | 2017-12-19 | 景旺电子科技(龙川)有限公司 | A kind of four layers of FPC of unsymmetric structure preparation method |
| WO2021017477A1 (en) * | 2019-07-30 | 2021-02-04 | 昆山国显光电有限公司 | Display panel and display device |
| CN113507791A (en) * | 2021-06-02 | 2021-10-15 | 深圳市强达电路股份有限公司 | Manufacturing method of gold finger with stepped structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19617055C1 (en) * | 1996-04-29 | 1997-06-26 | Semikron Elektronik Gmbh | High-density multilayer prepreg semiconductor power module |
-
2006
- 2006-09-08 CN CNB2006101535023A patent/CN100527916C/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159041A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Method for once pressure-forming of inner and outer layers of multi-layer flexible circuit board |
| CN104159394A (en) * | 2014-07-24 | 2014-11-19 | 深圳崇达多层线路板有限公司 | PCB slice and preparation method thereof |
| CN104717829A (en) * | 2015-02-02 | 2015-06-17 | 昆山意力电路世界有限公司 | High-density bubble-free golden finger pressing structural slab and processing method thereof |
| CN104768323A (en) * | 2015-03-24 | 2015-07-08 | 深圳华麟电路技术有限公司 | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board |
| CN107493663A (en) * | 2017-08-30 | 2017-12-19 | 景旺电子科技(龙川)有限公司 | A kind of four layers of FPC of unsymmetric structure preparation method |
| WO2021017477A1 (en) * | 2019-07-30 | 2021-02-04 | 昆山国显光电有限公司 | Display panel and display device |
| US11747927B2 (en) | 2019-07-30 | 2023-09-05 | Kunshan Go-Visionox Opto-Electronics Co., Ltd | Display panel and display device |
| CN113507791A (en) * | 2021-06-02 | 2021-10-15 | 深圳市强达电路股份有限公司 | Manufacturing method of gold finger with stepped structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100527916C (en) | 2009-08-12 |
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Assignee: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. Assignor: BYD Co.,Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Multi-layer flexible circuit board and its producing method License type: Exclusive license Record date: 20080504 |
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Effective date of registration: 20201209 Address after: 214500 East head of Lianhua Village South Coal Mine, Gushan Town, Jingjiang City, Taizhou City, Jiangsu Province Patentee after: Jingjiang Hongyang Marine Equipment Manufacturing Co.,Ltd. Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
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