CN101048055A - Advanced heat sinks and thermal spreaders - Google Patents
Advanced heat sinks and thermal spreaders Download PDFInfo
- Publication number
- CN101048055A CN101048055A CNA2006101729620A CN200610172962A CN101048055A CN 101048055 A CN101048055 A CN 101048055A CN A2006101729620 A CNA2006101729620 A CN A2006101729620A CN 200610172962 A CN200610172962 A CN 200610172962A CN 101048055 A CN101048055 A CN 101048055A
- Authority
- CN
- China
- Prior art keywords
- graphite linings
- fin
- thermoreceptor
- graphite
- supporting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat sink assembly for an electronic device or a heat generating device(s) is constructed from an ultra-thin graphite layer. The ultra-thin graphite layer exhibits thermal conductivity which is anisotropic in nature and is greater than 500 W/m DEG C. in at least one plane and comprises at least a graphene layer. The ultra-thin graphite layer is structurally supported by a layer comprising at least one of a metal, a polymeric resin, a ceramic, and a mixture thereof, which is disposed on at least one surface of the graphite layer.
Description
The cross reference of related application
The application requires the priority of the U.S. Patent application No.60/743998 of submission on March 30th, 2006, and the full content of this application is hereby incorporated by reference.The application still is the part continuation application (CIP) of the U.S. Patent application sequence No.10/761567 that submitted on January 21st, 2004.
Technical field
The present invention relates to thermal management assemblies, include but not limited to radiator, it can be used for heat is conducted to for example thermoreceptor (heat sink) from thermal source; Assembly has the radiator that contacts with thermal source, for example between thermal source and thermoreceptor; Thermoreceptor is used for heat dissipation.The invention still further relates to the manufacture method of thermal management assemblies.
Background technology
The progress of microelectric technique causes electronic equipment with unprecedented high-speed processing signals and data.Electronics and/or integrated circuit (" IC ") for example install that microprocessor, memory device etc. become littler, simultaneously the heat dissipation increase in demand.Can compare present Pentium series and the power of Power PC chip loss with the heat of top combustion burner above 100 watts at the heat that electronic installation for example produces in the PC.In brief, people can be at the top of these chips fried egg.
These heats must effectively be removed, in case locking system becomes unstable or destroyed.Radiator and/or thermoreceptor are through being usually used in that the heat on electronic unit surface is dissipated to colder environment, normally in the surrounding air.Directly the pyroconductivity of air is relatively poor usually towards periphery by the thermal source surface.
Thermoreceptor is a heat dissipation device, and it is by forming with the lot of materials of conducting heat energy from thermal source with the thermal source hot link.Thermoreceptor is usually designed to gives surrounding air with the heat delivered from the radiator on the IC.Thermoreceptor can be fin or integrated heat spreader form.Thermoreceptor will be from the thermal energy conduction of high-temperature area (being processor) to low-temperature region (being thermoreceptor).Then, heat energy is dissipated in the air that surrounds this thermoreceptor by convection current and the radiation surface by thermoreceptor.Thermoreceptor is usually designed to mainly increases heat conduction efficiency by increasing the surface area that directly contacts with air.Allow more heat to dissipate like this and reduce the working temperature of device thus.
The thermoreceptor that is used for cooling electronic components generally includes thermal-conductivity substrate plate and the one group of plate that is extended by substrate plate or the pin fins of the device of direct contact need cooling.Fin has increased the surface area that directly contacts with air, and increases the heat conduction efficiency between thermal source and the surrounding air thus.
In traditional thermoreceptor in the prior art, use various traditional technique for fixing fin to be integrated in the substrate of thermoreceptor or be assembled in the substrate.In the thermoreceptor that substrate and fins group are fitted together, substrate is copper or aluminium normally, and fin is copper or aluminium.Copper is compared with aluminium has higher thermal conductivity (390vs.101W/m.K), but copper is more expensive.And the density of copper is big, has increased the weight of thermoreceptor and has made thermoreceptor and electronic installation is easier is clashed into and/or flutter failure.Therefore, cupric is heated and thinks highly of and the cost height, and aluminium fin can not provide enough hot propertys.U.S. Patent No. 6862183 discloses the thermoreceptor with compound fin, and promptly each fin comprises the first that is made of copper, this first's hot link in substrate so that thermal energy conduction is gone out substrate, and second portion made of aluminum.
In order to overcome the weight issue of the traditional thermoreceptor that uses copper and/or aluminium, proposed to use the thermoreceptor of graphite.U.S. Patent No. 6538892 discloses a kind of radiation fin shape thermoreceptor assembly, has the plane fin with the graphite linings of fin planar alignment, make be parallel on the direction on plane thermal conductivity ratio in vertical direction thermal conductivity want high.Each fin comprises and being compressed or the graphite " sheet " of compacting, changes the thickness and the density of each graphite flake by the control degree of compression, and thickness is approximately 0.075mm to 3.75mm.U.S. Patent No. 6749010 discloses a kind of thermoreceptor system that has metallic substrates and be attached to a plurality of fins of this substrate, these fins are made of " sheet " resin impregnation stacked (laminate) of the compressed particles of flaky graphite, and each graphite flake has the thickness of about 0.075mm to 3.75mm.
Using graphite is a kind of method that overcomes the weight issue of aluminium in the prior art/copper thermoreceptor.Yet heat radiator represents to comprise the graphite linings of a plurality of μ m orders of magnitude or the graphite " sheet " of splitting in the prior art.Existence is for having the needs of ultra-thin thermoreceptor with the advanced thermal control system of maximization thermal conductivity and weight ratio.
Summary of the invention
The invention provides thermal management assemblies, be used for falling remove the electronic installation of heat or the thermal dissipation of similar system from needs.This assembly comprises the substrate that is used for the hot link electronic installation; And hot link is at least one thermoreceptor of substrate.This thermoreceptor comprises at least one graphite linings, the thermal conductivity that this graphite linings shows be in essence anisotropic and at least one plane greater than 500W/m ℃, this graphite linings has first surface, second surface and comprises the thickness of at least one graphene layer.Graphite linings is by at least a support (later) support structure that comprises metal, polymer resin, pottery and composition thereof at least one surface that is arranged on this graphite linings.
The invention still further relates to the method that is used to make the fin that is used for thermoreceptor, by by show thermal conductivity be in essence anisotropy and at least in one plane greater than splitting thickness on 500W/m ℃ the graphite flake less than at least one graphite linings of 0.1, thereby obtain to comprise the graphite linings of at least one graphene layer.
Description of drawings
Fig. 1 is the perspective view that comprises the graphite splitting of a plurality of graphene layers with atomic thickness.
Fig. 2 A, 2B and 2C are the cross-sectional views of striding fin thickness of the various execution modes of expression thermoreceptor of the present invention.
Fig. 3 A and 3B are the partial cross sectional view of an embodiment of the invention in the process of making thermoreceptor.
Fig. 4 is the partial cross sectional view of an execution mode of thermoreceptor with retaining part of the part of crooked fin structure, parallel substrate plate guiding and vertically-guided.
Fig. 5 is the perspective view of an execution mode of thermoreceptor with a plurality of rectangle fins of the substrate of being attached to.
Fig. 6 is the perspective view that uses an execution mode of ultra-thin graphite thermoreceptor of the present invention with the form of radiation fin.
Fig. 7 is the perspective view that uses an execution mode of ultra-thin graphite thermoreceptor of the present invention with the form of folding fin.
Fig. 8 is to use the perspective view of second execution mode of the of the present invention ultra-thin graphite thermoreceptor that folds fin.
Fig. 9 is to use the perspective view of the another execution mode of folding fin.
Figure 10 is the perspective view of another execution mode of partial radiation fin shape thermoreceptor.
Figure 11 is to use the perspective view of another execution mode of the execution mode of pin fins thermoreceptor.
Figure 12 is the perspective view with ultra-thin/ultralight thermoreceptor of honeycomb, alveolate texture.
Figure 13 is the perspective view of restrainting or tiltedly opening up the ultra-thin thermoreceptor of pattern (splayed pattern) form to expand.
Figure 14 is the end view with ultra-thin thermoreceptor of a plurality of otch of determining air communication not at the same level hole.
Figure 15 is as the curve chart of the heat conduction of thermal conductivity function resistance in comprising the thermoreceptor assembly of various sizes fin.
Figure 16 is as another curve chart of the heat conduction of thermal conductivity function resistance in comprising the thermoreceptor assembly of different materials fin.
Embodiment
As used herein, approximate language can be used to revise any quantificational expression that can change, and can not cause the variation of associated basic function.Therefore, the value of revising by term (for example " approximately " and " basically ") in some cases is not limited to specific exact value.
Term " thermoreceptor " can use " heat dissipation device (heat dissipator) " to replace, and this term can be odd number or plural form, expression can be one or more article, and this term is meant not only collects heat, but also carries out the element of dissipation function.
As used herein, term " substrate plate ", " substrate plate " or " fixed support " can be replaced use, are meant directly with radiator device to be cooled or treat therefrom to remove conductive structure or the parts that the device surface of heat contacts.As used herein, the device that term " radiator " ordinary representation has the sleeve pipe form, it contacts with thermoreceptor with thermal source.Radiator sometimes also as isolator work with at collision and the frangible IC parts of when vibration protection.
As used herein, term " thermal decomposition graphite " (" TPG ") can use " high orientation pyrolytic graphite " (" HOPG ") or compression annealing pyrolytic graphite (" CAPG ") to replace, be meant the graphite material of forming by the crystallite of suitable size, this crystallite has high alignment and guidance quality each other and has the high degree of preferred crystallite orientation of the carbon-coating or the height of good order, has (a-b direction) thermal conductivity in the plane greater than 1000W/m-K.In one embodiment, TPG has greater than thermal conductivity in the plane of 1500W/m-K.
As used herein, the carbon plate or the layer (as shown in Figure 1) of term " Graphene (graphene) " or " graphene film " expression atomic thickness, these sheets or layer have piled up to form " can divide " layer (perhaps mica shape splitting) in graphite.
The present invention relates to be used to maximize the advanced thermal control system of thermal conductivity and the ratio of weight, promptly ultra-thin thermoreceptor comprises at least one individual layer or single splitting of graphite.
Therefore graphite has anisotropic structure and shows or have many character for example thermal conductivity and the conductance and the diffuse fluid of the directivity of height.Graphite is made up of the layered planes of hexagonal array or networks of carbon atoms.As shown in Figure 1, these layered planes 10 of the carbon atom of hexagonal arrangement are smooth basically and feasible parallel to each other basically and equidistant through orientation or arrangement.Basically smooth, parallel equally spaced carbon atom sheet or layer 10 are commonly referred to graphene layer or basal plane, and they are crosslinked or bond together and its group is arranged in crystallite.The superposed layer of carbon atom or lamination combine by weak Van der Waals force in graphite.Consider graphite-structure, diaxon or direction ordinary representation that is to say " c " axle or direction and " a " axle or direction." c " axle or direction can be thought the direction perpendicular to carbon-coating." a " axle or direction can think to be parallel to the direction of carbon-coating or perpendicular to the direction of " c " direction.
When graphite is made up of multilayer or plane because its layer structure, graphite almost as mica along the base plane splitting.Use is simplified technology and is for example got a slice band and it is pressed on the smooth graphite surface taking-up then, the thin splitting 1 that this band band has plenty of graphite.As shown in Figure 1, each splitting 1 comprises a plurality of graphene layers 10 of carbon atomic layer (unit cell layer).Reported the thick graphite block for a slice 2mm, people can obtain the splitting of 20-40 25-50 μ m.The graphite quality is high more, and the splitting that the millimeter graphite flake people of unit can obtain is many more and the graphite splitting is thin more.The thermoreceptor design is complicated task, needs a large amount of mathematics-finite element analyses, fluid dynamics etc.When the design thermoreceptor, consider various factors, comprise thermal resistance, the area of thermoreceptor, the shape of thermoreceptor, i.e. the height of fin or pin design and fin or pin, whether use fan with and the maximum temperature that allows of air velocity, thermoreceptor material and punch die.
Thermal resistance is the important parameter in the thermoreceptor design.Thermal resistance is directly proportional with the thickness of material and is inversely proportional to the thermal conductivity of material and the surface area of hot-fluid.The present invention relates to have the advanced thermal control system of optimization thermal resistance, promptly comprise for example ultra-thin thermoreceptor of graphite of Heat Conduction Material, have, and that the monoatomic layer of thickness and carbon is of uniform thickness is thin up to 1000W/m-K or higher thermal conductivity.
Be used to make ultrathin advanced radiator technology in one embodiment, pyrolytic graphite (" PG ") sheet is as the raw material source of the ultra-thin splitting of graphite, the ultra-thin splitting of this graphite is used for advanced radiator of the present invention.The axle surface that thermal decomposition and graphite vapour deposition are exposing by the low pressure carbonaceous gas is formed by keeping substrate at high temperature, wherein takes place in PG usually.The thermal decomposition graphite flake separates from substrate plate, and carries out thermal anneal process.In annealing steps, according to thickness that is annealed product and volume, PG is heated to more than 2900 degrees centigrade and keeps the long enough time, forms thermal decomposition graphite (" TPG ").In one embodiment, this long enough time is one minute or still less.In second execution mode, it is 45 seconds.In the 3rd execution mode, it is 30 seconds.In the 4th execution mode, it is 10 seconds.In annealing process, crystallization takes place change the improvement that causes on the layer plane direction, perpendicular to the thickness minimizing (reducing in the c direction) of layer plane, length and width increase (increasing) on a direction.Along with crystal size increases improved directivity causes having at least 1000 watts/m-K on certain orientation in final material excellent heat conducting rate.In one embodiment, the PG layer by hot pressing, is used to form the parallel of the TPG sheet of excellent heat conducting rate and graphite linings or splitting when standing to anneal.Hot pressing can use technology well known in the art and apparatus for example to use punch die, roller etc. to finish.
As used herein, term " graphite linings " expression comprises the single splitting of PG of the graphene layer of at least one nano thickness.As used herein, term " splitting " or " splitting " expression are peeled off, are removed or take out or separate a slice graphite to obtain the technology of at least one ultra-thin graphite layer, comprise at least one single graphene layer of nano thickness.Graphite " sheet " comprises at least two splittings or graphite linings, each so that comprise a plurality of graphene layers.
Although general terms " graphite " can use at this, use the pyrolytic graphite (PG) of (a-b direction) thermal conductivity in the Typical Planar that has less than 500W/m-K, the thermal decomposition graphite (TPG) that perhaps has (a-b direction) thermal conductivity in the plane greater than 600W/m-K according to application ultra-thin thermoreceptor of the present invention.In one embodiment, initial feed is that the thickness that can buy from the source that comprises companies such as Panasonic, General Electric Company is the graphite flake of 0.1 ± 0.05mm.
Preparation comprises the ultra-thin graphite layer of graphene layer: in one embodiment, at first use insertion agent well known in the art to handle graphite flake with the peeling off or separate of promoting layer, thereby obtain the splitting of graphitization pyrolytic graphite on the c axle.After inserting, promptly use and insert after the agent processing, clean or purge treated pyrolytic graphite to remove unnecessary insertion agent.The example that inserts agent comprises organic and for example nitric acid, sulfuric acid, perhalogeno (perhalo) acid and composition thereof, 7 of inorganic acid, 7,8-8-four cyano quinone methane (7,7,8-8-tetracyanoquinomethane) (TCNQ), TCNE (tegracyanoethylene) (TCNE), 1,2,4,5-four cyano benzene (tetracyanobenzene) (TCBN) etc.; Bromine and iron chloride; The chlorate of nitric acid and potash.
In another embodiment, chemical source for example particle, fluid, gas or liquid at first is imported into to increase stress in the zone between graphene layer, and the interaction of the interlayer that is used to weaken causes graphene layer to be peeled off from graphite surface.In one embodiment, thus importing the splitting layer from the particle of chemical source with the dosage of selecting controllably promotes splitting.In one embodiment, for example acetone, benzene, naphthalene are used for making graphene layer peel off from graphite surface by their the interlayer interaction force of weakening reagent.
In one embodiment, use ultrasonic wave to obtain to separate graphene layer, wherein use the ultrasonic wave performance of selecting be used between graphene layer in connect and concentrate energy on the interface.When for example the interface layer between Graphene such as acetone, benzene died down by the use chemical source, ultrasonic energy was partially absorbed and separates graphene layer, effectively and fast separates graphene layer thus.The ultrasonic wave condition is frequency, power, time etc. along with the interactional chemical source of interlayer of the employed Graphene that is used to weaken changes.
In another execution mode, use people such as Zhang on May 6th, 2005 at APPLIEDPHYSICS LETTERS 86, the micromechanics method of operating splitting graphene layer of describing in 073,104 2005 articles of delivering is to obtain the graphite microcrystal of thickness d in 10 to 100nm scopes.The content of this piece article is hereby incorporated by reference.In this method, graphite flake or piece are transferred into the micromachined silicon cantilever and use the binding agent gummed.Thin microcosmic splitting can obtain/control by the normal force of adjusting between cantilever and the substrate.
In one embodiment, the splitting of separation that comprises at least one graphene layer is by obtaining with respect to the photoresist layer extruding PG sheet that is coated on the glass baseplate, is used to realize comprising the top splitting of the PG of at least one graphene layer that is attached to photoresist layer.Photoresist layer can be dissolved in the solvent for example acetone, stays the single splitting layer of the PG of at least one graphene layer with nano thickness.
In another execution mode, the copper, aluminium or the zinc-plated Copper Foil band that are supported by the high conductivity pressure sensitive adhesives be with respect to the extruding of pyrolytic graphite base material, and be stripped from, and is used to realize comprise the splitting of the pyrolytic graphite of at least one graphene film or layer.In one embodiment, metal forming has the thickness of 5.0-25 μ m, support by carbon or Parylene (parylene), then, floor height conduction pressure sensitive adhesives.Metal forming can be bought from the source that comprises Chomerics and Lebow company.
Little fine finishining/etching step: etching, little fine finishining or patterned surface show with the caking property of stacked/coat to be increased, and this provides the support structure that ultra-thin graphite layer needs/integrated needed.In one embodiment, use technology composition known in the art, little fine finishining or etched surfaces, these technology comprise that vacuumize/plasma auxiliary process comprises particle etching, plasma etching, reactive ion etching or chemical etching, crack on the Graphene surface, breach or hole.
In one embodiment, use physical technology for example ion(ic) etching carry out etching.In second execution mode, for example etching is carried out in plasma etching or oxidation to use chemical reaction.In the 3rd execution mode, the combined process that uses physics and chemical effect for example reactive ion etching with little fine finishining Graphene surface.In one embodiment, using gases sample oxygen, argon gas and fluoro-gas (for example fluorine Lyons (Freon), SF for example
6And CF
4) carry out dry ecthing.In one embodiment, use the oxygen base to carry out oxide etch, make carbon oxidized (burning) and change into carbon dioxide on graphene film, to produce pattern.In an execution mode of oxide etch, the oxygen base that oxygen molecule is used when being created in etching graphene layer surperficial by ultraviolet irradiation.In another execution mode, graphene layer 500 to 800 degrees centigrade down by oxide etch, notice that wherein diameter in the density in the lip-deep hole of Graphene and hole raises along with oxidizing temperature and increases.
Provide structuring integrated graphene layer: because thermoreceptor of the present invention is to be that the graphene layer of nano-scale is made by atomic layers thick, that this ultra-thin graphite layer provides the structure of coating form is integrated/support (in the one deck or the both sides of graphite linings), perhaps with supporting layer stacked (if desired can in one or both sides).In an execution mode shown in Fig. 2 A, ultra-thin graphite layer is coated on both sides or the surface.In second execution mode shown in Fig. 2 C, graphite linings is only partly applied at the top or the tip of fin.In the 3rd execution mode (not shown), only the bottom of graphite linings is coated to be used for the support structure of thermoreceptor fin.In the 4th execution mode shown in Fig. 2 B, graphite linings uses the coating identical with mounting bracket to apply.
In one embodiment and before coating, diameter 0.1 to 5mm and spacing use method well known in the art to drill ultra-thin graphite layer at 2 to 25mm hole or through hole, these methods comprise that edm (EDM), discharge grind (EDG), laser and plasma.In another embodiment, before handling, in ultra-thin graphite bar, make the slit.
In one embodiment, the ultra-thin graphite bar with at least one graphene layer uses resin, metal, pottery or its mixture to apply or processing.Example comprises Parylene; Silicon nitride; Silica; The nano particle of metal (for example aluminium or tungsten), cerium oxide, indium oxide, tin oxide, zinc oxide, antimony oxide, titanium oxide, zirconia, silica and aluminium oxide; Cyanoacrylate (cynoacrylate); Carbon film; The self-assembled monolayer material; PFPE; Hexamethyldisiloxane (hexamethyldisilazane); Perfluoro decanoate; Silicon dioxide; Silex glass; Acrylic acid; Epoxy resin; Siloxanes; Urethanes; The phenol resin system; Perhaps their composition.Coating provides moisture-proof, structural integrity and working strength, promptly for the stiffness (stiffness) of graphite linings and " fixing " of graphite linings geometry.
Coated weight that uses and coating layer thickness should be enough to make final ultra-thin graphite layer to have sufficient structural integrity to be used as thermoreceptor, and the anisotropy thermal conductivity of graphite is not by adverse effect simultaneously.In one embodiment, the thickness of coating is 50nm to 1000nm.In second execution mode, the thickness of coating is less than 500nm.In the 3rd execution mode, apply sufficient quantity coating, making that superficial layer is abundant freely splits, and means that light microscope or the SEM by having the 10k magnification ratio do not observe the crack.The crack also comprises hole, perforation, pore or line.
Coating can use technology well known in the art to apply, and the type of the coating material of use determines applying method sometimes.The example of painting method includes but not limited to expanding thermal plasma (ETP), ion plating, plasma enhanced chemical vapor deposition (PECVD), metal organic chemical vapor deposition (MOCVD) (being also referred to as Metalorganic chemical vapor deposition (OMCVD)), metal organic vapor growth (MOVPE), for example sputter of physical gas-phase deposition, reactive electron beam (e bundle) deposition, plasma spraying, manual brushing, dipping, spraying and flow coating.
Use for little/few volume thermoreceptor, can be used as the brushing that this method uses is excellent for small size, but its inhomogeneous and coating material that causes coating layer thickness " air drying " solvent base or moisture cured normally.Can also use spraying, spray by hand-held paint spray gun in spray or automatic application system, coating layer thickness consistency and surface coverage may change.In another embodiment, flow coating is used for a side and applies, and wherein graphite linings is crossed " ripple " of coating material with special angle, the viscosity by material and cross this wave propagation velocity control coating layer thickness.
In one embodiment, Parylene C is as the coating material of ultra-thin thermoreceptor, that be used to approach, inertia and coating highly conformal (conformal) film.Parylene C can for example brush, flood by the physics painting method or spray on the side or both sides that is applied to graphite linings.In second execution mode, the both sides of ultra-thin thermoreceptor use chemical vapor deposition method to apply Parylene C.
In another execution mode, because the nanostructure and the ultra-thin character of graphite linings, flame-spraying or plasma deposition technology are used for the coating layer thickness of thickness less than 500nm.In one embodiment, coating comprises metal, and wherein ultra-thin graphite layer is exposed to the metal of evaporation in plasma coated technology.In another execution mode, one deck aluminium oxide making coatings, wherein aluminum metal is evaporated in induction coupling oxygen plasma, thus cambium layer on the Graphene surface that exposes.
In one embodiment, the resin that is used to handle or apply graphite linings can be used as binding agent so that further for example metal forming or another ultra-thin graphite layer are stacked with the graphite linings of this resin treatment and another layer.In one embodiment, the used for epoxy resin making coatings, this layer is bonded to this graphite linings another layer metal forming for example that is used for support structure after curing.In another execution mode, the material of metalloid pottery (ceramic/metal) precursor uses in flame-spraying (plasma spray coating) to form coating/supporting layer on side of ultra-thin graphite layer or both sides, form ultra-thin reinforcement graphite bar, it can also be processed to form ultra-thin fin or ultra-thin thermoreceptor.
Ultra-thin in one embodiment fin/coating graphite linings can use them itself can not get wet, and the welding material of graphite linings welds other material successively or parts are mounting bracket, water-cooling system etc.
Cut-out/formation has the fin of required form: in one embodiment, ultra-thin reinforcement graphite tape is cut into required size by in EDM well known in the art, EDG, laser, plasma or other method any one.In one embodiment, after cutting, this can be used according to last thermal control and form or bend to required form.In one embodiment, this is rolled into tubular, forms " pin fins ".
In one embodiment, graphite linings by layer by layer or coating cut/form step after strengthening.In second execution mode, before stacked/coating processes, cut/form step.
In another execution mode, by any one in graphite linings, form or punch louvre, slit or the through hole in EDM well known in the art, EDG, laser, plasma or other method.In one embodiment, in graphite linings, form through hole, make diffusion bonding to form via a plurality of through holes that resin is arranged in the graphite linings coating on both sides.These through-hole diameters can be provided with optimum heat-transmission and mechanical performance for 1-5mm and each interval 3-25mm.
In another embodiment, the special design of graphite linings has a lot of holes or through hole to form weak mechanical structure, fills or applies through hole and be used for supporting construction, minimizes the stress of propagating by thermoreceptor or radiator simultaneously.By adjusting the quantity and the position of through hole, thermal conductivity by TPG and the mechanical integrity of TPG can be to specific application optimizationization, when coating material (for example Parylene, metal etc.) flows into and passes through the hole scattering, produce the mechanical through hole that opposite face is crosslinked together like this, thereby improve section modulus.In another embodiment, the engineering size of through hole and interval help to alleviate the low z direction conductivity of TPG, and the perforation thickness conductivity of enhancing is provided in final products.
In another execution mode, the surface-texturing of high thermal conductivity graphite linings or roughening make this layer that effective adhesive can be arranged and/or adhere to welding material, sealing or stacking material.
Assemble ultra-thin thermoreceptor: the ultra-thin graphite layer of fin 14 forms is assembled into the intimate contact mounting bracket or substrate plate effectively transmits heats to pass through fin 14 in a-b direction (height of fin or length depend on configuration).In one embodiment, mounting bracket (perhaps substrate plate) comprises plastic material to eliminate all machinings and punching.In second execution mode, plastics are molded by the metal filled material that is used for EMI shielding, and perhaps high thermal resistance material is molded, make thermoreceptor can be soldered on the substrate plate in the assembly.In another embodiment, mounting bracket is molded and is formed by metal, and it will not only eliminate machining and punching, but also helps heat radiation.
Ultra-thin thermoreceptor can use known method to be fixed in mounting bracket, and these methods include but not limited to use binding agent, soft soldering, curl, forging, staking, brazing, bonding, welding and spot welding.In an execution mode shown in Fig. 3 A and 3B, connect via curling technology.In second execution mode, before curling, in groove, add binding agent with further joint fin 14.
Because part is out of shape TPG also with the thermal conductivity heat conduction of excellence, in execution mode as shown in Figure 4,14 bendings of coating/reinforcement graphite fins make the part fin be parallel to substrate plate 12 orientations and remainder is orientated perpendicular to basal substrate 12.In the stepped construction of an embodiment of the invention and given ultra-thin graphite layer, bending is progressive to prevent that layer and failure of layer bonding and layer from breaking fully.In order to prevent that in BENDING PROCESS layer from breaking, can remove some graphene layers to be limited in graphene layer clustering and the compress-layering subsequently on the crooked concave side and to break in one embodiment from bending area (on the concave surface with respect to horizontal ends and vertical end bending).In another execution mode, bending area can comprise a row hole to prevent the graphene layer clustering.These holes allow layer to slide and fill materials of loss, prevent the compress-layering of bar thus and break.
In one embodiment, binding agent is used for ultra-thin graphite thermoreceptor is fixed in mounting bracket.Binding agent is represented any organic and inorganic/organic composite system as used herein, and they can be used to the thermoreceptor that bonds.In one embodiment, binding agent be fill system for example the carried metal polymer comprise the binding agent of load silver, compound, the Al of boron nitride (" BN ")
2O
3, silica or they for example fill mixture in the epoxy resin etc. of BN at polymeric matrix, it keeps the structural integrity of height and has sufficient thermal conductivity under serviceability temperature.In another execution mode, the hot sticky ligament of bilateral is used to guarantee that each fin of thermoreceptor adheres to mounting bracket.
In one embodiment, get wet the brazing (braze) of ultra-thin graphite layer is used for ultra-thin graphite thermoreceptor is fixed in mounting bracket.Effectively the example of brazing comprise " Ti-Cu-Sil " (titanium, copper, silver), based on the brazing of titanium and the titantium hydride in the composition of silicon and indium; With the low temperature brazing material.In one embodiment, brazing is used for high vacuum environment for example approximately 10E-6Torr and lower environment, the permission brazing graphene layer of getting wet in the process that fin is bonded to mounting bracket.
The execution mode of ultra-thin thermoreceptor: ultra-thin graphite thermoreceptor of the present invention can be crooked, be folded into the fin that the various different thermal controls of identical, that be shaped, sealing or stacked conduct are used in using, and includes but not limited to cooling system, thermoreceptor, radiator and conducting-heat elements.The quantity of fin, their size and interval change according to the cooling needs of using.
Because its ultra-thin and lightweight character, thermoreceptor can provide optimization, therefore than the thick thermal control means of the prior art heat of spontaneous heating device or installing device removal in the future better.Wait until that from for example fuel cell, nuclear reactor, automobile, laptop computer, laser diode, evaporator with spacecraft use relevant with national defence comprises aircraft, jet fighter etc. from the exemplary application scope that commerce is used, can include but not limited to execution mode described here with Any shape and form.
As shown in figure 15, according to computer thermal models, in the scope of expecting usually in thermal decomposition graphite, the heat conduction resistance is very little as the function of thermal conductivity, and this thermal decomposition graphite is the material that uses in thermoreceptor of the present invention.As shown in figure 16, for the computer thermal models of the thermoreceptor assembly that uses different materials, using material of the prior art for the ratio of pyrolytic graphite heat conduction resistance expection is aluminium, eGRAF HS-400
TMLow many of the heat conduction of the thermoreceptor assembly of material or polyphenylene sulfide (PPS) resistance.Thermoreceptor of the present invention with ultra-thin fin provides optimized heat conduction resistance, has the combination of maximum thermal conductivity and minimum thickness.It provides the optimization thermal control heat maximum that can remove according to the weight or the available total surface area of heat abstraction/cooling of thermoreceptor (being fin).
Compare with the thermoreceptor of prior art, ultra-thin thermoreceptor is a ultralight, and promptly TPG has 2.18 to 2.24g/cm
3Density.The 8.9-g/cm of this and copper
3Density and the 2.702-g/cm of aluminium
3Density compare.Also allow fin ultra-thin as fin in thermoreceptor of the present invention from the graphite linings of graphite flake or the use of splitting, the fin thickness range is from nanometer level 5nm or bigger to less than 50mil (.0254mm) for example, by comparison, the prior art fin has the thickness of 0.25mm to 0.75mm usually.In one embodiment, the thickness range of fin is between 10nm to 30mil.In second execution mode, scope is between 50nm to 20mil.The thickness of the fin of being made by ultra-thin graphite layer does not have the upper limit, yet, the light as far as possible thermoreceptor (and therefore fin is as thin as possible to several nanometers) of expectation and maximization heat abstraction capacity usually.
Since ultra-thin and ultralight character, the heat removal amount of thermoreceptor optimization thermoreceptor per surface area of the present invention or weight (thermal conductivity of TPG is the 400W/mK of 1000W/mK with respect to copper at least, is 200W/mK for aluminium).In one embodiment, thermoreceptor comprises that height is lighter than a plurality of low section thermoreceptor of 1gm less than 10mm and total weight, is used for most of radio communication capsul inside of the restricted quarter.In one embodiment, thermoreceptor comprise each highly for 10mm and width at least at least 10mm (gross area is at least 100mm
2) and weight less than 20 to 100 fins of 5gm.
In one embodiment, ultra-thin thermoreceptor comprises a plurality of fins with rectangular shape shown in Figure 5, and the aspect ratio of fin (height ratio thickness) was greater than 100: 1.The a-b axle of fin 14 along and basad plate 12 is inner extends.Electronic installation for example microprocessor 20 uses thermal interfacial material and substrate plate 12 hot links.In another execution mode (not shown), integrated heat spreader can be used between electronic installation 20 and the basal substrate 12.
In another execution mode as shown in Figure 6, thermoreceptor comprises a plurality of radially-arranged intervals fin 14, and it is right to have a fin that is fixed in vertical mounting bracket 12.In an execution mode (not shown), the thermoreceptor assembly comprises that also guiding is used to cool off the fan of the air stream of thermoreceptor.
In an execution mode as shown in Figure 7, after graphite substrate was cut into required size, substrate was folded into the fold form, made to have the peaceful face portion of fold part alternately.Folding fin 14 is arranged on the top of substrate plate 12, makes the top surface of the fold part adjacent substrate plate 12 on fin 14 1 sides to use brazing, soft soldering or binding agent to be fixed in substrate plate 12.
In second execution mode of as shown in Figure 8 thermal control system, folding fin 14 is formed by the bar of the ultra-thin graphite layer of the Graphene that comprises carbon atom thickness.Folding fin 14 has a plurality of alternate planes parts and sweep, the fin of the folded form of fold basically that formation has a sweep of fin is substantially perpendicular to and extends from the top surface of substrate plate, and the straight flange 14b of folded membrane 14 is fixed in substrate plate 12.In one embodiment, grid body (lourer) 30 is formed on each sweep of fin 14 to promote circulation of air and heat convection current.In another execution mode as shown in the figure, in fin 14, comprise a plurality of cracks 31.Although not shown in Figure 8, will have the heat conduction compound (promptly in being connected in the electronic unit operating temperature process of thermoreceptor, fusing) that to select phase change character and be provided on the substrate plate 12 to help to minimize air gap.In one embodiment, this layer comprises the material with excellent heat conducting character and dielectric strength.
Fig. 9 illustrates another execution mode of folding fin 14 assemblies, and this assembly is formed with common serpentine structure, and be provided with in substrate plate 12 cooperate a plurality of downwards towards bending.
In another execution mode as shown in figure 10, ultra-thin hot fin is a radiation fin thermoreceptor form, be used to cool off thermal source for example electronic unit (as chip assembly) for example those are attached to the parts of printed circuit board (PCB) by ball grid array, wherein use a plurality of parallel radiation fins 14 that support by substrate plate 12.Substrate plate or mounting bracket 12 can comprise graphite, metal or high temperature thermoplastic.Each plurality of fin members 14 has the graphene layer that mainly combines with the plane of fin 14, makes each fin 14 have the maximum thermal conductivity of the expection ab direction of graphite.
In an execution mode as shown in figure 11, ultra-thin is cut and forms a plurality of " needle-like " fin 14.In one embodiment, these pins also be perforated or provide a plurality of through holes or hole with the low z-that helps to alleviate TPG to conduction, thereby the conduction that strengthens impenetrating thickness is provided in final products.Size of pin fins (height of pin and diameter) and the hole of playing cutter can optimized design become air-flow and the heat abstraction rate of passing through these pins with optimization.
In the execution mode as shown in figure 12, the fin 14 that ultra-thin thermoreceptor can moulding has integrated cellular shape porous geometry with formation, each fin has hexagonal or other opening loose structure.Honeycomb provides and has been used for convection current or other and dissipates by the maximum surface of the heat of base part transmission.This structure also allows net list to reveal grade flexible or " elasticity ", and it allows at the bottom of honeycomb bending or the alternate manner aglucon with crooked or other deviation in the surface that is contained in electronic shell that substrate plate 12 is attached to or other surface.With fold bar bonding or other mode in conjunction with for example using binding agent or scolder or, along the longitudinal length of the corresponding groove in adjacent band mutually in heap and substrate plate 12 by laser or spot welding.
In another execution mode as shown in figure 13, ultra-thin thermoreceptor is the form that expands and restraint, fin 14 is tied an end and is attached to each other by tack line or binding material 11, and the other end of fin 14 and adjacent fin are spaced apart, form oblique exhibition pattern (splayed pattern).In another execution mode (not shown), the ultra-thin thermoreceptor of any basic geometric form such as single concentric circles or a plurality of concentric circles, square, different size, shape, interval be designed to optimize transmissions from the heat of electronic installation to surrounding air.
Be further noted that in all execution modes fin 14 can preferably be equipped with a plurality of through holes, slit or crack, with further promotion thermal convection and air flows.Through hole and/or crack, their size at interval can change according to last application.In an execution mode as shown in figure 14, the fin 14 of thermoreceptor provides different a lot of cracks and has increases a lot of cracks of level continuously.In having fin not at the same level 14, airslide can be according to dispelling the heat from electronic module to keep the needed thermal conductivity customization of balance with the convection heat that transmits from the air-flow cell wall.
And for all execution modes, pressure clip or support (not shown) can be preferably used for the compression stress that provides downward, further will fold fin 14 and firmly remain on its appropriate location/be fixed in substrate plate 12.In the execution mode radiation fin or the honeycomb shape thermoreceptor, the top that the net of woven wire or perforated sheet form is arranged on fin or honeycomb is used for thermoreceptor is firmly remained on its appropriate location.
Embodiment: provide embodiment to explain the present invention but be not in order to limit the scope of the invention at this.
Embodiment 1: fix with respect to flat surfaces from thermal decomposition graphite (TPG) sheet that General Electric Company buys.The use back side is coated with the metal forming with high conduction adhesive tape, is die-cut into overlapping a little this TPG sheet, with respect to this TPG sheet extruding.Metallic foil can from comprise that Choerics source buys as CHO-FOIL or CHO-FOIL EMI mask tape.The stripping metal paillon foil cause from splitting top, pyrolytic graphite surface graphene layer, and splitting is pasted on the bonding backing of metallic foil.After the top splitting is rived, repeat this technology to obtain next graphite splitting.
Embodiment 2: using small-sized painting brush to brush thickness by exposed (not stacked) graphite linings surface of the graphite bar of metal forming backing (backed) in example 1 is 0.10,0.25,0.50,0.75 and the Parylene C of 1.00mil (mil).The result shows that along with the increase of Parylene thickness, the mechanical strength of ultra-thin thermoreceptor of the present invention increases, and goes down at about 0.50mil intensity gain.
Embodiment 3: the exposed graphite linings surface that the load of two parts silver, B-level bonding system is applied to obtain in an embodiment the metal forming backing strip.The thermal conductivity of the thermoreceptor that obtains is at least 75% of a uncoated TPG product.
Although describe the present invention with reference to preferred implementation, those skilled in the art should understand that when not departing from the scope of the invention, can carry out various variations and its element of replacing of equal value.The present invention is not subjected to the restriction of disclosed specific implementations as implementing best mode of the present invention, and the present invention will comprise all execution modes that fall in the appended claim scope of the present invention.All cited literature 2s in this reference specially are incorporated herein by reference.
Claims (13)
1. thermal management assemblies, the heat of being used to dissipate from electro-heat equipment, this assembly comprises:
Be used for the substrate of hot link in electro-heat equipment; And
Hot link is at least one thermoreceptor of this substrate, this thermoreceptor comprises at least one graphite linings, the thickness that this graphite linings has first surface, second surface and comprises at least one graphene layer, wherein, this graphite linings obtain by at least one graphene layer of splitting from graphite flake and wherein this graphite linings show anisotropy in itself and at least one plane greater than 500W/m ℃ thermal conductivity, and
This thermoreceptor also comprises supporting layer, this supporting layer comprises at least a in metal, polymer resin, pottery and composition thereof, and this supporting layer is arranged at least one surface of graphite linings by at least a technology that is selected from coating, brushing, spraying, distribution, dipping, the stacked and powder coated.
2. the thermal management assemblies of claim 1, wherein before being arranged on this supporting layer on the graphite linings, by plasma etching, ion etching, chemical etching and in conjunction with at least a PROCESS FOR TREATMENT graphite linings.
3. any one thermal management assemblies among the claim 1-2, wherein this supporting layer is gone up by at least one surface that Parylene is applied to graphite linings and is formed, wherein, by one of brushing, dipping, spraying and chemical vapor deposition method Parylene is applied on the graphite linings surface.
4. any one thermal management assemblies among the claim 1-2, wherein this supporting layer comprises the metal forming by heat conduction tack coat backing, and wherein by push metal forming with respect at least one surface of graphite linings by heat conduction binding agent backing, peel off this metal foil layer to rive this graphite flake and being fixed on the heat conduction tack coat of backing metal foil layer from least one graphite linings, this supporting layer is set at least one surface of graphite linings.
5. radiating fin, be used for thermal management assemblies, this fin comprises at least one graphite linings, the thickness that this graphite linings has first surface, second surface and comprises at least one graphene layer, wherein, this graphite linings obtains by at least one graphene layer of splitting from graphite flake, and wherein this graphite linings show anisotropy in essence and at least one plane greater than 500W/m ℃ thermal conductivity
This graphite linings is strengthened by supporting layer disposed thereon, and this supporting layer is arranged at least one surface of graphite linings by at least a technology that is selected from coating, brushing, spraying, distribution, dipping, the stacked and powder coated.
6. the radiating fin of claim 5, wherein this fin has the thickness of 5nm to 50mil.
7. any one radiating fin among the claim 5-6, wherein this supporting layer comprises Parylene; Silicon nitride; Silica; The nano particle of cyanoacrylate, metal dust, cerium oxide, indium oxide, tin oxide, zinc oxide, antimony oxide, titanium oxide, zirconia, silica, aluminium oxide; Carbon film; PFPE; Hexamethyldisiloxane; Perfluoro decanoate; Silicon dioxide; Silex glass; Acrylic acid; Epoxy resin; Siloxanes; At least a in urethanes and the phenol resin.
8. any one radiating fin among the claim 5-6, wherein this graphite linings is strengthened by supporting layer disposed thereon, and this supporting layer is by forming with respect at least one surface extruding of graphite linings metal foil layer by heat conduction binding agent backing.
9. any one radiating fin among the claim 5-7, wherein this graphite linings is strengthened by supporting layer disposed thereon, this supporting layer is to use plasma deposition technology to form by at least one surface of applying graphite linings, has supporting layer less than the thickness of 500nm with formation.
10. any one radiating fin among the claim 5-9, wherein this graphite linings is strengthened by supporting layer disposed thereon, and it creates one of following form:
Radiation or partial radiation shape fin;
Folding fin with alternation and sweep;
Wavy fin with a plurality of alveolate textures;
Oblique a plurality of fins of exhibition pattern have terminal and expansion end of a tube bank and fin and separate each other at expansion end and adjacent fin;
The solid rectangular fin;
Rectangle fin with a plurality of slits of at least one air hole that is used for definite this thermoreceptor of perforation;
Folding fin with alternation and sweep, and wherein each sweep has a plurality of vertical clearance gap of at least one air hole that is used for determine connecting this thermoreceptor;
A plurality of pin fins; And their combining form.
11. a thermal management assemblies, comprise among a plurality of claim 5-10 appoint can one radiating fin.
12. a cooling system comprises:
Surface-mounted integrated circuit;
The processor that is connected with this surface-mounted integrated circuit;
Hot link is in the thermoreceptor of this processor, this thermoreceptor comprise that substrate conducts away with the heat with processor and hot link in the fin of substrate, this fin comprises at least one graphite linings, the thickness that this graphite linings has first surface, second surface and comprises at least one graphene layer, this graphite linings is by one deck acquisition at least of splitting from graphite flake, this graphite linings show anisotropy in essence and at least one plane greater than 500W/m ℃ thermal conductivity
This thermoreceptor also comprises supporting layer, this supporting layer comprises at least a of metal, polymer resin, pottery and composition thereof, and this supporting layer is arranged at least one surface of graphite linings by at least a technology that is selected from coating, brushing, spraying, distribution, dipping, the stacked and powder coated.
13. a method that is used to make thermal control system, this method comprises:
Make fin by splitting thickness from graphite flake less than at least one graphite linings of 1mil, this graphite linings comprises at least one graphene layer, and this graphite linings shows anisotropy in essence and at least one plane greater than 500W/m ℃ thermal conductivity;
Fin is connected in substrate to form thermoreceptor; And
In integrated circuit, make thermoreceptor that the heat from integrated circuit in the integrated circuit course of work is conducted away the thermoreceptor hot link.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74399806P | 2006-03-30 | 2006-03-30 | |
| US60/743998 | 2006-03-30 | ||
| US11/555681 | 2006-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101048055A true CN101048055A (en) | 2007-10-03 |
Family
ID=38772146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101729620A Pending CN101048055A (en) | 2006-03-30 | 2006-11-30 | Advanced heat sinks and thermal spreaders |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101048055A (en) |
Cited By (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098886A (en) * | 2009-12-14 | 2011-06-15 | 和硕联合科技股份有限公司 | Cabinet and manufacturing method thereof |
| CN102149632A (en) * | 2008-09-09 | 2011-08-10 | ***纪念研究院 | Mesoporous metal oxide graphene nanocomposite materials |
| CN102569220A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | Folding high-heat-radiation body |
| WO2012109979A1 (en) * | 2011-02-14 | 2012-08-23 | Huawei Technologies Co., Ltd. | Devices having anisotropic conductivity heatsinks, and methods of making thereof |
| CN102768998A (en) * | 2011-05-05 | 2012-11-07 | 优杰精密机械(苏州)有限公司 | Substrate for high-power electronic device module |
| CN102869941A (en) * | 2010-05-04 | 2013-01-09 | Bsh博世和西门子家用电器有限公司 | Refrigerator and evaporator for same |
| CN103107147A (en) * | 2012-04-06 | 2013-05-15 | 北京中石伟业科技股份有限公司 | Radiator with surface covered with graphene film |
| US8450014B2 (en) | 2008-07-28 | 2013-05-28 | Battelle Memorial Institute | Lithium ion batteries with titania/graphene anodes |
| CN103162268A (en) * | 2011-12-14 | 2013-06-19 | 欧司朗股份有限公司 | Heat dissipation device and illumination device provided with the same |
| US8530566B2 (en) | 2011-03-09 | 2013-09-10 | Industrial Technology Research Institute | Electrically insulating and thermally conductive composition and electronic device |
| US8557441B2 (en) | 2010-10-09 | 2013-10-15 | Battelle Memorial Institute | Titania-graphene anode electrode paper |
| US8557442B2 (en) | 2008-07-28 | 2013-10-15 | Battelle Memorial Institute | Nanocomposite of graphene and metal oxide materials |
| US8563169B2 (en) | 2009-08-10 | 2013-10-22 | Battelle Memorial Institute | Self assembled multi-layer nanocomposite of graphene and metal oxide materials |
| CN103489836A (en) * | 2013-09-26 | 2014-01-01 | 天津安品有机硅材料有限公司 | Radiator based on high-density graphene and manufacturing method thereof |
| CN103517621A (en) * | 2013-09-09 | 2014-01-15 | 天津天星电子有限公司 | Hole cellular board radiator manufacturing method |
| CN103533809A (en) * | 2013-09-26 | 2014-01-22 | 天津安品有机硅材料有限公司 | Radiation material and radiator manufactured from same |
| CN103547441A (en) * | 2011-03-16 | 2014-01-29 | 莫门蒂夫性能材料股份有限公司 | High thermal conductivity/low coefficient of thermal expansion composites |
| US8835046B2 (en) | 2009-08-10 | 2014-09-16 | Battelle Memorial Institute | Self assembled multi-layer nanocomposite of graphene and metal oxide materials |
| CN104717876A (en) * | 2013-12-11 | 2015-06-17 | 中扬动力股份有限公司 | Heat transfer catalytic heat dissipation method |
| CN104720847A (en) * | 2013-12-20 | 2015-06-24 | 三星麦迪森株式会社 | Ultrasonic Probe And Method Of Manufacturing The Same |
| CN107624074A (en) * | 2015-03-09 | 2018-01-23 | 国家科学研究中心 | Method for forming the medical treatment device comprising graphene |
| CN107667071A (en) * | 2015-03-09 | 2018-02-06 | 国家科学研究中心 | The method for forming graphene device |
| CN107708342A (en) * | 2016-08-05 | 2018-02-16 | 罗伯特·博世有限公司 | Housing and manufacture method for electronic control unit |
| CN107810662A (en) * | 2015-06-26 | 2018-03-16 | 微软技术许可有限责任公司 | Cooled down via the subsea vessel of integrated heat exchanger |
| CN107835916A (en) * | 2015-05-15 | 2018-03-23 | 莫门蒂夫性能材料股份有限公司 | The light-emitting diode component of heat management is carried out using pyrolytic graphite |
| CN108352371A (en) * | 2015-11-20 | 2018-07-31 | 捷恩智株式会社 | The manufacturing method of radiator, e-machine, lighting machine and radiator |
| CN108513570A (en) * | 2015-12-03 | 2018-09-07 | 纳米技术仪器公司 | Graphene film and production method highly conductive and be orientated |
| CN109822982A (en) * | 2019-02-14 | 2019-05-31 | 广东思泉新材料股份有限公司 | A kind of Multi-layer graphite temperature-uniforming plate and preparation method thereof |
| CN111836488A (en) * | 2019-04-18 | 2020-10-27 | 苹果公司 | Thin coating of support plate |
| CN112040743A (en) * | 2020-09-09 | 2020-12-04 | 广东思泉新材料股份有限公司 | Heat conducting fin with coating layer structure |
| CN112218823A (en) * | 2018-06-07 | 2021-01-12 | 斯马特高科技有限公司 | Laminated graphene-based thermally conductive film and method for manufacturing the same |
| CN113523554A (en) * | 2021-07-06 | 2021-10-22 | 武汉光谷机电科技有限公司 | Welding method for welding heat pipe radiator fins based on scanning galvanometer laser |
| CN114647287A (en) * | 2020-12-18 | 2022-06-21 | 慧与发展有限责任合伙企业 | Method and apparatus for extended serial temperature control in a computing device |
-
2006
- 2006-11-30 CN CNA2006101729620A patent/CN101048055A/en active Pending
Non-Patent Citations (2)
| Title |
|---|
| A.K.GEIM: "Electric Field Effect in Atomically Thin Carbon Films", 《SCIENCE》 * |
| MOHAMED A OSMAN ET AL: "Temperature dependence of the thermal conductivity of single-wall carbon nanotubes", 《IOPSCIENCE》 * |
Cited By (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8450014B2 (en) | 2008-07-28 | 2013-05-28 | Battelle Memorial Institute | Lithium ion batteries with titania/graphene anodes |
| US8557442B2 (en) | 2008-07-28 | 2013-10-15 | Battelle Memorial Institute | Nanocomposite of graphene and metal oxide materials |
| US9070942B2 (en) | 2008-07-28 | 2015-06-30 | Battelle Memorial Institute | Nanocomposite of graphene and metal oxide materials |
| CN102149632A (en) * | 2008-09-09 | 2011-08-10 | ***纪念研究院 | Mesoporous metal oxide graphene nanocomposite materials |
| US9346680B2 (en) | 2008-09-09 | 2016-05-24 | Battelle Memorial Institute | Mesoporous metal oxide graphene nanocomposite materials |
| CN102149632B (en) * | 2008-09-09 | 2014-08-13 | ***纪念研究院 | Mesoporous metal oxide graphene nanocomposite materials |
| US9017867B2 (en) | 2009-08-10 | 2015-04-28 | Battelle Memorial Institute | Self assembled multi-layer nanocomposite of graphene and metal oxide materials |
| US8835046B2 (en) | 2009-08-10 | 2014-09-16 | Battelle Memorial Institute | Self assembled multi-layer nanocomposite of graphene and metal oxide materials |
| US8563169B2 (en) | 2009-08-10 | 2013-10-22 | Battelle Memorial Institute | Self assembled multi-layer nanocomposite of graphene and metal oxide materials |
| CN102098886A (en) * | 2009-12-14 | 2011-06-15 | 和硕联合科技股份有限公司 | Cabinet and manufacturing method thereof |
| CN102098886B (en) * | 2009-12-14 | 2013-09-25 | 和硕联合科技股份有限公司 | Cabinet and manufacturing method thereof |
| CN102869941A (en) * | 2010-05-04 | 2013-01-09 | Bsh博世和西门子家用电器有限公司 | Refrigerator and evaporator for same |
| CN102869941B (en) * | 2010-05-04 | 2015-09-30 | Bsh家用电器有限公司 | Refrigeration plant and the evaporimeter for this refrigeration plant |
| US8557441B2 (en) | 2010-10-09 | 2013-10-15 | Battelle Memorial Institute | Titania-graphene anode electrode paper |
| US9040200B2 (en) | 2010-10-09 | 2015-05-26 | Battelle Memorial Institute | Titania-graphene anode electrode paper |
| CN102569220A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | Folding high-heat-radiation body |
| US8537553B2 (en) | 2011-02-14 | 2013-09-17 | Futurewei Technologies, Inc. | Devices having anisotropic conductivity heatsinks, and methods of making thereof |
| WO2012109979A1 (en) * | 2011-02-14 | 2012-08-23 | Huawei Technologies Co., Ltd. | Devices having anisotropic conductivity heatsinks, and methods of making thereof |
| US8530566B2 (en) | 2011-03-09 | 2013-09-10 | Industrial Technology Research Institute | Electrically insulating and thermally conductive composition and electronic device |
| US10347559B2 (en) | 2011-03-16 | 2019-07-09 | Momentive Performance Materials Inc. | High thermal conductivity/low coefficient of thermal expansion composites |
| CN103547441A (en) * | 2011-03-16 | 2014-01-29 | 莫门蒂夫性能材料股份有限公司 | High thermal conductivity/low coefficient of thermal expansion composites |
| CN102768998A (en) * | 2011-05-05 | 2012-11-07 | 优杰精密机械(苏州)有限公司 | Substrate for high-power electronic device module |
| CN103162268A (en) * | 2011-12-14 | 2013-06-19 | 欧司朗股份有限公司 | Heat dissipation device and illumination device provided with the same |
| CN103107147A (en) * | 2012-04-06 | 2013-05-15 | 北京中石伟业科技股份有限公司 | Radiator with surface covered with graphene film |
| WO2013149420A1 (en) * | 2012-04-06 | 2013-10-10 | 北京中石伟业科技股份有限公司 | Highly heat-conductive adhesive tape of metal foil |
| CN103517621A (en) * | 2013-09-09 | 2014-01-15 | 天津天星电子有限公司 | Hole cellular board radiator manufacturing method |
| CN103533809A (en) * | 2013-09-26 | 2014-01-22 | 天津安品有机硅材料有限公司 | Radiation material and radiator manufactured from same |
| CN103533809B (en) * | 2013-09-26 | 2016-03-30 | 天津沃尔提莫新材料技术有限公司 | The radiator of a kind of heat sink material and making thereof |
| CN103489836A (en) * | 2013-09-26 | 2014-01-01 | 天津安品有机硅材料有限公司 | Radiator based on high-density graphene and manufacturing method thereof |
| CN103489836B (en) * | 2013-09-26 | 2016-09-07 | 天津安品有机硅材料有限公司 | Radiator based on high-density graphite alkene and preparation method thereof |
| CN104717876A (en) * | 2013-12-11 | 2015-06-17 | 中扬动力股份有限公司 | Heat transfer catalytic heat dissipation method |
| CN104720847A (en) * | 2013-12-20 | 2015-06-24 | 三星麦迪森株式会社 | Ultrasonic Probe And Method Of Manufacturing The Same |
| CN104720847B (en) * | 2013-12-20 | 2020-04-24 | 三星麦迪森株式会社 | Ultrasonic probe and method of manufacturing the same |
| CN107624074A (en) * | 2015-03-09 | 2018-01-23 | 国家科学研究中心 | Method for forming the medical treatment device comprising graphene |
| CN107667071A (en) * | 2015-03-09 | 2018-02-06 | 国家科学研究中心 | The method for forming graphene device |
| US11577960B2 (en) | 2015-03-09 | 2023-02-14 | Centre National De La Recherche Scientifique | Method of forming a graphene device using polymer material as a support for a graphene film |
| US11040191B2 (en) | 2015-03-09 | 2021-06-22 | Centre National De La Recherche Scientifique | Method of forming a medical device comprising graphene |
| CN107835916A (en) * | 2015-05-15 | 2018-03-23 | 莫门蒂夫性能材料股份有限公司 | The light-emitting diode component of heat management is carried out using pyrolytic graphite |
| TWI700359B (en) * | 2015-05-15 | 2020-08-01 | 美商摩曼帝夫特性材料公司 | Light emitting diode assembly using thermal pyrolytic graphite for thermal management |
| CN107810662A (en) * | 2015-06-26 | 2018-03-16 | 微软技术许可有限责任公司 | Cooled down via the subsea vessel of integrated heat exchanger |
| US10524395B2 (en) | 2015-06-26 | 2019-12-31 | Microsoft Technology Licensing, Llc | Artificial reef datacenter |
| CN107810662B (en) * | 2015-06-26 | 2020-04-07 | 微软技术许可有限责任公司 | Subsea vessel cooling system via integrated heat exchanger |
| CN108352371A (en) * | 2015-11-20 | 2018-07-31 | 捷恩智株式会社 | The manufacturing method of radiator, e-machine, lighting machine and radiator |
| CN108513570A (en) * | 2015-12-03 | 2018-09-07 | 纳米技术仪器公司 | Graphene film and production method highly conductive and be orientated |
| CN107708342A (en) * | 2016-08-05 | 2018-02-16 | 罗伯特·博世有限公司 | Housing and manufacture method for electronic control unit |
| CN112218823A (en) * | 2018-06-07 | 2021-01-12 | 斯马特高科技有限公司 | Laminated graphene-based thermally conductive film and method for manufacturing the same |
| CN112218824A (en) * | 2018-06-07 | 2021-01-12 | 斯马特高科技有限公司 | Graphene-based heat removal device and method for manufacturing same |
| CN109822982A (en) * | 2019-02-14 | 2019-05-31 | 广东思泉新材料股份有限公司 | A kind of Multi-layer graphite temperature-uniforming plate and preparation method thereof |
| CN109822982B (en) * | 2019-02-14 | 2023-12-15 | 广东思泉新材料股份有限公司 | Multilayer graphite temperature-equalizing plate and preparation method thereof |
| CN111836488A (en) * | 2019-04-18 | 2020-10-27 | 苹果公司 | Thin coating of support plate |
| US11898808B2 (en) | 2019-04-18 | 2024-02-13 | Apple Inc. | Support plate thin cladding |
| CN112040743A (en) * | 2020-09-09 | 2020-12-04 | 广东思泉新材料股份有限公司 | Heat conducting fin with coating layer structure |
| CN114647287A (en) * | 2020-12-18 | 2022-06-21 | 慧与发展有限责任合伙企业 | Method and apparatus for extended serial temperature control in a computing device |
| CN113523554A (en) * | 2021-07-06 | 2021-10-22 | 武汉光谷机电科技有限公司 | Welding method for welding heat pipe radiator fins based on scanning galvanometer laser |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101048055A (en) | Advanced heat sinks and thermal spreaders | |
| KR20070098450A (en) | Advanced heat sinks and thermal spreaders | |
| US10347559B2 (en) | High thermal conductivity/low coefficient of thermal expansion composites | |
| JP5795021B2 (en) | Heat dissipation structure | |
| US8604623B2 (en) | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | |
| US20050116336A1 (en) | Nano-composite materials for thermal management applications | |
| EP2546871B1 (en) | Method for producing a heat dissipating structure | |
| US7797808B2 (en) | Thermal management system and associated method | |
| US20080019097A1 (en) | Thermal transport structure | |
| JP2003188323A (en) | Graphite sheet and its manufacturing method | |
| US20090269604A1 (en) | Composite thermal interface material system and method using nano-scale components | |
| US20060073332A1 (en) | Thermal interface material and method for manufacturing same | |
| US20110032678A1 (en) | Nano-tube thermal interface structure | |
| TW201204193A (en) | hBN insulator layers and associated methods | |
| WO2005028549A2 (en) | Nano-composite materials for thermal management applications | |
| JP2016184706A (en) | Cooling structure and cooling component | |
| CN1314071A (en) | Method for producing circuit-forming board, circuit-forming board, and carbon sheet | |
| JP2005210035A (en) | Graphite composite material | |
| KR101839920B1 (en) | Heat-dissipating Printed Circuit Board and Manufacturing Method Thereof | |
| WO2019112048A1 (en) | Laminate and electronic device | |
| US20200340757A1 (en) | Expanded graphite-enhanced vapor-based heat transfer device and production process | |
| KR101839917B1 (en) | Heat-dissipating type PCB and Manufacturing Method Thereof | |
| EP3624183A1 (en) | Insulating sheet and laminate | |
| Xu et al. | Ultra-high-performance heat spreader based on a graphite architecture with three-dimensional thermal routing | |
| WO2005083783A1 (en) | Heat dissipating sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20071003 |