CN100574595C - 散热装置 - Google Patents
散热装置 Download PDFInfo
- Publication number
- CN100574595C CN100574595C CNB2006100602957A CN200610060295A CN100574595C CN 100574595 C CN100574595 C CN 100574595C CN B2006100602957 A CNB2006100602957 A CN B2006100602957A CN 200610060295 A CN200610060295 A CN 200610060295A CN 100574595 C CN100574595 C CN 100574595C
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- heat
- branching portion
- fin
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100602957A CN100574595C (zh) | 2006-04-14 | 2006-04-14 | 散热装置 |
US11/564,269 US7532472B2 (en) | 2006-04-14 | 2006-11-28 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100602957A CN100574595C (zh) | 2006-04-14 | 2006-04-14 | 散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101056523A CN101056523A (zh) | 2007-10-17 |
CN100574595C true CN100574595C (zh) | 2009-12-23 |
Family
ID=38604636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100602957A Expired - Fee Related CN100574595C (zh) | 2006-04-14 | 2006-04-14 | 散热装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7532472B2 (zh) |
CN (1) | CN100574595C (zh) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7423877B2 (en) * | 2006-09-01 | 2008-09-09 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080121369A1 (en) * | 2006-11-28 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation assembly having fan duct |
JP2008166465A (ja) * | 2006-12-28 | 2008-07-17 | Nippon Densan Corp | ヒートシンクファン |
CN101452328A (zh) * | 2007-12-03 | 2009-06-10 | 鸿富锦精密工业(深圳)有限公司 | 电脑散热装置 |
US8528627B2 (en) * | 2007-12-12 | 2013-09-10 | Golden Sun News Techniques Co., Ltd. | Heat-dissipating device having air-guiding cover |
TWM339033U (en) * | 2008-04-16 | 2008-08-21 | Asia Vital Components Co Ltd | Heat sink |
US8381799B2 (en) * | 2008-05-21 | 2013-02-26 | Asia Vital Components Co., Ltd. | Heat radiating unit |
US7684191B1 (en) * | 2008-08-28 | 2010-03-23 | Sun Microsystems, Inc. | Self-retaining vibration isolating fan mount assembly |
CN101742890B (zh) * | 2008-11-14 | 2013-06-05 | 富准精密工业(深圳)有限公司 | 散热装置 |
TWM358217U (en) * | 2009-02-03 | 2009-06-01 | Asia Vital Components Co Ltd | Fastening rack for fan |
US8191613B2 (en) * | 2009-02-16 | 2012-06-05 | Asia Vital Components Co., Ltd. | Thermal module with quick assembling structure |
CN201438459U (zh) * | 2009-03-13 | 2010-04-14 | 鸿富锦精密工业(深圳)有限公司 | 散热装置组合 |
CN101839247A (zh) * | 2009-03-18 | 2010-09-22 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101868134A (zh) * | 2009-04-14 | 2010-10-20 | 鸿富锦精密工业(深圳)有限公司 | 散热器及其制造方法 |
US8144470B2 (en) * | 2009-05-21 | 2012-03-27 | Pem Management, Inc. | Two-piece heat sink stud |
TWM371391U (en) * | 2009-06-04 | 2009-12-21 | Asia Vital Components Co Ltd | Pivot-connection unit and support frame structure thereof |
CN201563340U (zh) * | 2009-09-30 | 2010-08-25 | 鸿富锦精密工业(深圳)有限公司 | 散热器保护套及具有该保护套的散热装置 |
CN102056453A (zh) * | 2009-10-27 | 2011-05-11 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102056463A (zh) * | 2009-11-09 | 2011-05-11 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102098899A (zh) * | 2009-12-09 | 2011-06-15 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102098901A (zh) * | 2009-12-15 | 2011-06-15 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102105034A (zh) * | 2009-12-18 | 2011-06-22 | 富准精密工业(深圳)有限公司 | 固定架以及使用该固定架的散热装置 |
US10103089B2 (en) * | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
USD671257S1 (en) | 2010-04-10 | 2012-11-20 | Lg Innotek Co., Ltd. | LED lamp |
CN102238845B (zh) * | 2010-04-23 | 2014-12-10 | 昊翔电能运动科技(昆山)有限公司 | 散热装置及含其的调速器 |
US8593814B2 (en) * | 2011-01-26 | 2013-11-26 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat sink assembly |
CN102527758B (zh) * | 2012-01-20 | 2014-12-03 | 东莞汉旭五金塑胶科技有限公司 | 散热器铝底座的挤压成型模具及其制法 |
US8780562B2 (en) * | 2012-07-20 | 2014-07-15 | Tai-Her Yang | Heat dissipater having heat conductive rib with interval forming as flow guide hole and applied in electric luminous body |
JP2014103184A (ja) * | 2012-11-19 | 2014-06-05 | Nippon Densan Corp | ヒートシンクおよびヒートシンクファン |
WO2015157523A1 (en) * | 2014-04-10 | 2015-10-15 | Advanced Thermal Solutions, Inc. | Multiple flow entrance heat sink |
US20160338227A1 (en) * | 2015-05-11 | 2016-11-17 | Adtran, Inc. | Low profile heat sink |
CN106455460A (zh) * | 2016-12-26 | 2017-02-22 | 昊翔电能运动科技(昆山)有限公司 | 一种驱动器以及调速器 |
US11665858B2 (en) | 2018-04-03 | 2023-05-30 | Raytheon Company | High-performance thermal interfaces for cylindrical or other curved heat sources or heat sinks |
TWM609965U (zh) * | 2020-12-02 | 2021-04-01 | 訊凱國際股份有限公司 | 散熱鰭片與散熱器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6662412B2 (en) * | 2001-08-03 | 2003-12-16 | Tsan-Wen Chuang | Buckle of IC heat dissipating device |
CN2615862Y (zh) * | 2003-02-19 | 2004-05-12 | 诺亚公司 | 中心几何形变散热器 |
CN2649826Y (zh) * | 2003-08-23 | 2004-10-20 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN2664182Y (zh) * | 2003-10-27 | 2004-12-15 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
JP2005158812A (ja) * | 2003-11-20 | 2005-06-16 | Fujikura Ltd | ファン付きヒートシンク |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6557626B1 (en) * | 2000-01-11 | 2003-05-06 | Molex Incorporated | Heat sink retainer and Heat sink assembly using same |
US6343014B1 (en) * | 2000-08-11 | 2002-01-29 | Ming-Chuan Yu | CPU cooling arrangement |
US6407919B1 (en) * | 2000-12-18 | 2002-06-18 | Fargo Chou | Structure of computer CPU heat dissipation module |
EP1290928B1 (en) * | 2001-03-03 | 2005-04-27 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
US6336499B1 (en) * | 2001-05-31 | 2002-01-08 | Hong Tsai Liu | CPU heat sink mounting structure |
US6671172B2 (en) * | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
US6657862B2 (en) * | 2001-09-10 | 2003-12-02 | Intel Corporation | Radial folded fin heat sinks and methods of making and using same |
DE20115410U1 (de) * | 2001-09-19 | 2001-12-06 | Sunonwealth Electr Mach Ind Co | Kompressorstruktur für einen Ventilator |
USD478875S1 (en) * | 2001-11-05 | 2003-08-26 | Zalman Tech Co., Ltd. | Duct and housing unit for a heat sink for electronic equipment |
TW584260U (en) * | 2002-06-28 | 2004-04-11 | Hon Hai Prec Ind Co Ltd | Heat sink device |
TW564971U (en) * | 2003-01-10 | 2003-12-01 | Hon Hai Prec Ind Co Ltd | A heat dissipating assembly |
TW588828U (en) * | 2003-01-15 | 2004-05-21 | Hon Hai Prec Ind Co Ltd | Fan cover |
USD491260S1 (en) * | 2003-01-16 | 2004-06-08 | Chin-Kuang Luo | Heat dissipator |
US6714415B1 (en) * | 2003-03-13 | 2004-03-30 | Intel Corporation | Split fin heat sink |
USD511326S1 (en) * | 2003-06-25 | 2005-11-08 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD537418S1 (en) * | 2003-06-25 | 2007-02-27 | Sanyo Denki Co., Ltd. | Heat sink |
USD516526S1 (en) * | 2003-06-25 | 2006-03-07 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD509483S1 (en) * | 2003-06-25 | 2005-09-13 | Sanyo Denki Co., Ltd. | Heat sink |
US6886627B2 (en) * | 2003-06-27 | 2005-05-03 | Intel Corporation | Radial heat sink with helical shaped fins |
CN1578614B (zh) * | 2003-06-30 | 2010-04-21 | 山洋电气株式会社 | 轴流风扇装置和发热体冷却装置 |
US7160080B2 (en) * | 2003-12-25 | 2007-01-09 | Asia Vital Component Co., Ltd. | Fan assembly |
JP2005197303A (ja) * | 2003-12-26 | 2005-07-21 | Nippon Densan Corp | ヒートシンクファン |
CN2694486Y (zh) * | 2004-03-06 | 2005-04-20 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
US7113403B2 (en) * | 2004-04-07 | 2006-09-26 | Asia Vital Component Co., Ltd. | Centrifugal fan type cooling module |
JP4498007B2 (ja) * | 2004-05-13 | 2010-07-07 | 山洋電気株式会社 | ファン装置及び発熱体冷却装置 |
USD500745S1 (en) * | 2004-05-25 | 2005-01-11 | Cooler Master Co., Ltd. | Heat-dissipation fins |
TW200421074A (en) * | 2004-06-03 | 2004-10-16 | Asia Vital Components Co Ltd | A stand structure having positioning function |
US7150311B2 (en) * | 2004-12-02 | 2006-12-19 | Asia Vital Component Co., Ltd. | Radiation module capable of resisting reverse flow of hot fluid |
US7178587B2 (en) * | 2004-12-20 | 2007-02-20 | Asia Vital Component Co., Ltd. | Heat-dissipating module |
US7289330B2 (en) * | 2005-11-10 | 2007-10-30 | Fu Shun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a fan mounting device |
US20070146995A1 (en) * | 2005-12-27 | 2007-06-28 | Liang-Hui Zhao | Heat dissipation device |
US20070181288A1 (en) * | 2006-02-08 | 2007-08-09 | Bing Chen | Combination of a heat sink and a fan |
USD561120S1 (en) * | 2006-09-28 | 2008-02-05 | Delta Electronics, Inc. | Heat dissipating module |
USD564460S1 (en) * | 2007-01-25 | 2008-03-18 | Nidec Corporation | Heat sink fan |
USD561122S1 (en) * | 2007-01-30 | 2008-02-05 | Fujikura Ltd. | Heat sink |
USD561124S1 (en) * | 2007-01-30 | 2008-02-05 | Fujikura Ltd. | Heat sink |
USD561123S1 (en) * | 2007-01-30 | 2008-02-05 | Fujikura Ltd. | Heat sink |
-
2006
- 2006-04-14 CN CNB2006100602957A patent/CN100574595C/zh not_active Expired - Fee Related
- 2006-11-28 US US11/564,269 patent/US7532472B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6662412B2 (en) * | 2001-08-03 | 2003-12-16 | Tsan-Wen Chuang | Buckle of IC heat dissipating device |
CN2615862Y (zh) * | 2003-02-19 | 2004-05-12 | 诺亚公司 | 中心几何形变散热器 |
CN2649826Y (zh) * | 2003-08-23 | 2004-10-20 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN2664182Y (zh) * | 2003-10-27 | 2004-12-15 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
JP2005158812A (ja) * | 2003-11-20 | 2005-06-16 | Fujikura Ltd | ファン付きヒートシンク |
Also Published As
Publication number | Publication date |
---|---|
US20070242433A1 (en) | 2007-10-18 |
CN101056523A (zh) | 2007-10-17 |
US7532472B2 (en) | 2009-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hongfutai precision electronics (Yantai) Co., Ltd. Assignor: Hung Fujin Precision Industry (Shenzhen) Co., Ltd.|Hon Hai Precision Industry Co Contract record no.: 2010990000395 Denomination of invention: Heat sink combination Granted publication date: 20091223 License type: Exclusive License Open date: 20071017 Record date: 20100629 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091223 Termination date: 20150414 |
|
EXPY | Termination of patent right or utility model |