CN100519184C - Screen painting method and apparatus used therein - Google Patents
Screen painting method and apparatus used therein Download PDFInfo
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- CN100519184C CN100519184C CNB200610058888XA CN200610058888A CN100519184C CN 100519184 C CN100519184 C CN 100519184C CN B200610058888X A CNB200610058888X A CN B200610058888XA CN 200610058888 A CN200610058888 A CN 200610058888A CN 100519184 C CN100519184 C CN 100519184C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/12—Machines with auxiliary equipment, e.g. for drying printed articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
- B41F15/405—Spraying apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F33/00—Indicating, counting, warning, control or safety devices
- B41F33/04—Tripping devices or stop-motions
- B41F33/14—Automatic control of tripping devices by feelers, photoelectric devices, pneumatic devices, or other detectors
Abstract
The silk screen printing process and silk screen printing unit is used in printing soldering alloy slurry onto workpiece with several same chip connecting patters arranged. Each of the silk screen masks has the size of covering one chip connecting pattern. After the silk screen masks for the chip connecting patterns are located on the workpiece, soldering alloy slurry is printed onto the located chip connecting patterns.
Description
Technical field
The present invention relates at the method for printing screen of having arranged serigraphy scolding tin slurry on the workpiece that a plurality of identical chips connection figures form and the silk-screen printing device of use thereof.
Background technology
With the technology that wiring plates such as printed circuit board are connected with semiconductor chip, generally adopt so-called flip-chip (FC) mode, use scolding tin salient point (bump: the mode that engages small scolding tin protrusion).This mode connects by the chip in board side arranges the scolding tin salient point on the figure, can once connect a tie point from thousands of to tens thousand of.Along with the progress of ITization, the tie point of the semiconductor chip of multifunction develops to miniaturization, high density and the high direction of counting rapidly.
On the chip connection figure of foregoing circuit plate side, arrange that the method for scolding tin salient point has method for printing screen, be about to the scolding tin slurry and be screen-printed on the chip connection figure.The silk-screen printing device of this method for printing screen and use thereof for example is disclosed in (Japan) spy and opens in the flat 6-155706 communique.
Fig. 7 A～7C is the method for printing screen in explanation past and the figure of silk-screen printing device.Fig. 7 A is the front view and the side view of the pattern of silk-screen printing device 90 in the past, is the part sectioned view of expression major part.And Fig. 7 B is the vertical view and the profile of the pattern of workpiece 10, and Fig. 7 C is the vertical view and the profile of the pattern of the screen mask (Screen Mask is hereinafter referred to as " silk screen ") 20 of use in the silk-screen printing device 90.
Adopting serigraphy in the past to form the scolding tin salient point, generally is to utilize silk-screen printing device 90 following the carrying out shown in Fig. 7 A.
That is to say, after being put into workpiece 10 on the workbench 40, the chip on workpiece 10 surfaces that form the scolding tin salient point is connected figure 1a and printed pattern (reach through hole) 2a that forms carries out position alignment on silk screen 20, silk screen 20 is overlapped onto on the workpiece 10.Then, printed pattern (reach through hole) 2a that utilizes squeegee to pass through silk screen 20 applies the scolding tin slurry 3 that supplies on the silk screen 20.Like this, the chip on workpiece 10 surfaces connects print solder slurry 3 on the figure 1a.At last, if draw back silk screen 20 upward from workpiece 10 surfaces, so, the chip on workpiece 10 surfaces connects formation scolding tin salient point on the figure 1a.
In the manufacturing of the wiring plate that semiconductor chip is installed, usually, in order to reduce manufacturing cost, be shown in as Fig. 7 B and arrange on the workpiece 10 and to make a plurality of identical chips and connect figure 1a, with its cut-out, make single wiring plate at last.So, in the above-mentioned silkscreen process that formation scolding tin salient point is used, also be as shown in Figure 7, utilize silk screen 20 while print solder slurry 3 on the whole surface of workpiece 10, formed printed pattern (reach through hole) 2a on this silk screen 20, the number of its layout is identical with the chip connection figure 1a of workpiece 10.
The printing precision of the scolding tin slurry 3 in the serigraphy depends on that basically the chip of workpiece 10 connects the registration accuracy of printed pattern (reach through hole) 2a of figure 1a and silk screen 20.Especially the serigraphy of making a plurality of chips connection figure 1a from the workpiece shown in Fig. 7 A～Fig. 7 C 10, each chip that its preceding topic condition is a workpiece 10 connects the desired location that figure 1a is arranged in regulation.
On the other hand, the vertical view of in Fig. 8 A, representing the pattern of other workpiece 11.Workpiece 11 is different with the workpiece 10 of Fig. 7 B, and the layout that its each chip connects figure 1a departs from the desired location of regulation.Therefore, the silk screen 20 of Fig. 7 C is overlapped on the workpiece 11 of Fig. 8 A exactly, if utilize silk screen 20 to carry out the serigraphy of scolding tin slurry 3, then scolding tin slurry 3 exceeds chip and connects figure 1a, causes printing defective.
And, when Fig. 8 B represents to utilize other workpiece 12, near the mode sectional drawing the silk screen of seeing from the front 20.Workpiece 12 produces deflection, produces between workpiece 12 and silk screen 20 and floats space F.If produce this space F that floats, then when serigraphy, scolding tin slurry 3 penetrates into and floats in the empty gap F, causes printing defective.In order to prevent to produce this space F that floats, the plus-pressure that the print head 31 of squeegee 30 is equipped with in common utilization is pushed silk screen 20 is adjacent on workpiece 12 it.Yet, in order to reduce manufacturing cost, the area of workpiece 12 is increased, and the area of workpiece 12 is big more, the silk screen pressurization of print head 31 is difficult more to the control of floating space F.
Problem shown in above-mentioned Fig. 8 A, the 8B is especially serious in the workpiece that multi-layer sheet constituted that the multi-layer thermoplastic resin film that has formed conductor fig is bonded.This multi-layer sheet for example can be bonded together 20 layers of above-mentioned thermoplastic resin membrane, so can make the wiring plate of small inexpensive.Yet form the workpiece 10 shown in Fig. 7 A if 20 layers thermoplastic resin membrane is bonded together, each chip that is easy to generate in the workpiece 11 shown in Fig. 8 A connects the desired location deviation of figure 1a and the deflection in the workpiece 12 shown in Fig. 8 B.In above-mentioned multi-layer sheet, in recent years along with the further increase of thermoplastic resin membrane's bonding sheet number, chip connects figure 1a also to be developed to miniaturization, densification direction gradually.Therefore, in the serigraphy that formation scolding tin salient point is used, printed pattern (reach through hole) 2a that the chip of workpiece 10～12 connects figure 1a and silk screen 20 is difficult to aim at coincidence.
And, the thermoplastic resin membrane is carried out bonding multi-layer sheet, can recycling, but then, the problem of existence is: compare with general glass epoxy board, the wellability of scolding tin is good.Therefore, connect on the figure 1a if scolding tin slurry 3 can not be transferred to chip exactly, (in non-oxidizing atmosphere, make 3 fusings of scolding tin slurry, utilize surface tension to make its formations spherical) mobile when then refluxing (reflow), be connected with contiguous scolding tin slurry 3, cause scolding tin salient point bridge joint defective.
Moreover, in the serigraphy shown in Fig. 7 A～7C, on a chip connection figure 1a, produce under the underproof situation of scolding tin slurry 3 printings, comprise that also the chip of normal printing connects figure 1a, all the scolding tin slurry 3 of chip connection figure 1a must wash, and republishes.Like this, must republish repeatedly, till whole chips connect the normal printing of figure 1a quilt, and also very difficult miniaturization, high density, the counting of height that adapts to the semiconductor chip of multifunction from now on.
Summary of the invention
The present invention is for the method for printing screen that solves the above-mentioned past and silk-screen printing device problem and the scheme that proposes, its objective is the silk-screen printing device that method for printing screen and use thereof are provided, can corresponding comprise that the multi-layer thermoplastic resin film carries out multiple-plate workpiece bonding and that chip connection layout form height density ground is arranged.
The method for printing screen of a kind of mode of the present invention, arranging on the workpiece that a plurality of identical chips connection figures form, serigraphy scolding tin slurry, it is characterized in that: the screen mask that above-mentioned serigraphy is used forms and covers the size that 1 said chip connects figure, each is formed on chip on the above-mentioned workpiece connects figure and carry out location, connect the above-mentioned scolding tin slurry of serigraphy on figure at this chip that is positioned with respect to above-mentioned screen mask.
If adopt the present invention, then each is formed on chip on the workpiece and connects figure and position, carry out serigraphy, so the layout that also can corresponding each chip connects figure departs from the workpiece of the desired location of regulation.And the silk screen of above-mentioned silk-screen printing device forms and can cover the size that a chip connects figure, compares with the silk screen of the silk-screen printing device in the past that covers whole of workpiece, and the silk screen area is little.Even so produce the workpiece of deflection, also can enough less screen mask plus-pressures be controlled at the chip that forms on the workpiece connect produced between figure and the screen mask float space (space).
Moreover, even on a chip connection figure, produce under the underproof situation of printing of scolding tin slurry, also can only clean and produce the scolding tin slurry that the underproof chip of printing connects figure, only on this chip connection figure, republish the scolding tin slurry.So be connected the method for printing screen in past of figure till by printing normally up to whole chips and compare with must republishing repeatedly, the present invention can shorten printing underproof repair time greatly.
Preferably each being formed on chip on the above-mentioned workpiece connects figure and carries out method with respect to the location of screen mask, on above-mentioned screen mask, be formed for the figure of print register mark, at first carry out above-mentioned serigraphy with pseudo-workpiece, the above-mentioned position to standard mark of serigraphy on above-mentioned pseudo-workpiece stored, utilize the position of the alignment mark of this storage to come the chip connection figure that is formed on later on the workpiece is positioned.
If adopt the present invention, then owing to utilizing the alignment mark of actual serigraphy on pseudo-workpiece to carry out later location, so the influence of the machine error in the printing process etc. can be ignored, and can position exactly.
As mentioned above, method for printing screen of the present invention can be applicable to that also each chip connects the inclined to one side easily system of layout of figure from the workpiece of desired location and the workpiece that is easy to generate deflection.So, above-mentionedly be easy to generate the workpiece that chip connects graphical layout deviation and deflection, promptly the workpiece that multi-layer sheet constituted that is bonded of the described multi-layer thermoplastic resin film that has formed conductor fig of claim 3 can be suitable for above-mentioned method for printing screen.
Another way of the present invention relates to the employed silk-screen printing device of above-mentioned method for printing screen.
This mode of the present invention is at the silk-screen printing device of having arranged serigraphy scolding tin slurry on the workpiece that a plurality of identical chips connection figures form, it is characterized in that: the screen mask that above-mentioned serigraphy is used forms and can cover the size that 1 said chip connects figure, and this silk-screen printing device has: the chip that carries out above-mentioned serigraphy is connected the workpiece alignment mechanism that usefulness was changed and located to figure; Carry out the serigraphy mechanism that above-mentioned serigraphy is used; And between the desired location of the desired location of above-mentioned workpiece alignment mechanism and above-mentioned serigraphy mechanism, the workbench that keeps above-mentioned workpiece alignment mechanism and above-mentioned workpiece is carried out the movable workbench mechanism of mobile usefulness, utilize above-mentioned workpiece alignment mechanism that the chip that each is formed on the above-mentioned workpiece is connected figure, carry out location with respect to above-mentioned screen mask, utilize above-mentioned movable workbench mechanism that said chip is connected the desired location that the oriented workpiece of figure moves to above-mentioned serigraphy mechanism, utilize above-mentioned serigraphy mechanism to connect the above-mentioned scolding tin slurry of serigraphy on the figure, utilize above-mentioned movable workbench mechanism to make workpiece after the above-mentioned serigraphy turn back to the desired location of above-mentioned workpiece alignment mechanism at above-mentioned oriented chip.
Utilize above-mentioned workpiece alignment mechanism, serigraphy mechanism and movable workbench mechanism, come that each is formed on chip on the workpiece and connect figure and carry out location, can be implemented in the method for printing screen that oriented chip connects serigraphy scolding tin slurry on the figure with respect to screen mask.And, utilizing the above-mentioned method for printing screen of above-mentioned silk-screen printing device, its effect front illustrates that at this, its explanation is omitted.
In the present invention, above-mentioned workpiece alignment mechanism can adopt such structure, promptly has: workpiece travel mechanism is used to change the chip that carries out above-mentioned serigraphy and connects figure; The workpiece micromotion mechanism is used to make above-mentioned workpiece fine motion, makes the chip that carries out above-mentioned serigraphy connect figure and positions with respect to above-mentioned screen mask; And still image processing camera, be used to measure the position that said chip connects figure.
In the case, preferred above-mentioned workpiece micromotion mechanism structurally has: parallel micromotion mechanism, make above-mentioned workpiece with face that above-mentioned screen mask parallels in carry out parallel moving; And the rotation micromotion mechanism, make above-mentioned workpiece with face that above-mentioned screen mask parallels in be rotated mobile.
Utilize above-mentioned workpiece micromotion mechanism to make to be formed on each chip on the workpiece to connect figure, even with face that screen mask parallels in depart from the afore mentioned rules position and produce deviation at an arbitrary position with on any direction, also can position with respect to screen mask exactly.
And in the present invention, above-mentioned silk-screen printing device can adopt such structure, promptly has: above-mentioned screen mask; The silk screen elevating mechanism is used to make above-mentioned screen mask to carry out lifting with respect to above-mentioned workpiece; Print head, it remains on inside with above-mentioned scolding tin slurry, and the inner scolding tin slurry that keeps is sprayed from the slit nozzle that is formed on front end; Elevating mechanism is used to make above-mentioned print head to carry out lifting with respect to above-mentioned screen mask, and the front end with above-mentioned print head is pressed on the screen mask simultaneously; And head moving mechanism, be used to make the front end of above-mentioned print head to parallel by certain speed and move with above-mentioned screen mask face.
In the case, preferably utilize above-mentioned head moving mechanism to control the pressing force of the front end of above-mentioned print head to screen mask.
Like this, can prevent that the scolding tin slurry from spilling from the front end of print head, prevent that screen mask from floating from workpiece.Like this, can make printing not produce the infiltration of scolding tin slurry.And, fragile screen mask is closely fitted on the workpiece, do not produce the gap, along with the screen mask that miniaturization also can enough films is printed.
And, in the present invention, preferably utilize pressing mechanism to control the ejection pressure of scolding tin slurry from the slit nozzle of the inside that is maintained at above-mentioned print head.Like this, can its precision that sprays from the slit nozzle be improved, can print out fine highdensity scolding tin salient point scolding tin slurry plus-pressure.
In above-mentioned silk-screen printing device, the following structure of preferred employing, promptly in order to carry out above-mentioned location, on above-mentioned screen mask, be formed for the figure of print register mark, at first, utilize above-mentioned serigraphy mechanism on pseudo-workpiece, to carry out serigraphy, utilize above-mentioned movable workbench mechanism make serigraphy the pseudo-workpiece of above-mentioned alignment mark turn back to the desired location of above-mentioned workpiece alignment mechanism, utilize the said fixing image to handle camera, measure the position of above-mentioned alignment mark, carry out the image storage, utilize the position of this stored alignment mark, the chip that forms on above-mentioned workpiece after carrying out connects the location of figure.
Like this, can realize the method for printing screen and the effect thereof of front.
And as explained above, above-mentioned silk-screen printing device can be applicable to that also the layout that makes chip connect figure easily produces deviation and deflection and multilayer has been formed the workpiece that multi-layer sheet constituted that the thermoplastic resin membrane of conductor fig is bonded.
As above, above-mentioned method for printing screen and silk-screen printing device can solve the method for printing screen in screen mask past of while print solder slurry on whole of workpiece of utilizing whole of covering workpiece and the problem of silk-screen printing device.Especially, above-mentioned method for printing screen and silk-screen printing device are also can corresponding a lot of layers thermoplastic resin membrane to be bonded together, and the high-density arrangement chip connects the method for printing screen and the silk-screen printing device of the workpiece that multi-layer sheet constituted of figure.
Below with reference to the accompanying drawings with the narration of preferred forms of the present invention, can further fully manage the present invention.
Description of drawings
Figure 1A～1C is the figure of explanation method for printing screen of the present invention and silk-screen printing device, and Figure 1A is the pattern side view of silk-screen printing device 100, is to utilize part section to represent the figure of major part.Figure 1B is the vertical view and the profile of the pattern of workpiece 10, and Fig. 1 C is the vertical view and the profile of the pattern of the screen mask 21 of use in the silk-screen printing device 100.
Fig. 2 A, 2B are illustrated in the preparation work operation that the storage standards position is used in the silk-screen printing device 100, the figure of the silkscreen process of the pseudo-workpiece of the employing of carrying out at first (dummy work) 13.Fig. 2 A is the vertical view and the profile of pattern of the pseudo-workpiece 13 before the printing, and Fig. 2 B is the figure of desired location situation during serigraphy on pseudo-workpiece 13 of being illustrated in serigraphy mechanism 60.
Fig. 3 A, 3B are illustrated in the preparation work operation that the storage standards position is used in the silk-screen printing device 100 figure of the operation of storage standards position in silk-screen printing device 100.Fig. 3 A is the vertical view and the profile of pattern that is printed with the pseudo-workpiece 13 of scolding tin slurry 3, and Fig. 3 B is illustrated on the desired location of workpiece alignment mechanism 50, the figure of the situation in silk-screen printing device 100 during the storage standards position.
Fig. 4 A, 4B are explanation figure of the operation of serigraphy on the workpiece 10 of reality, and to be expression connect figure 1a with the chip of the printing object of workpiece 10 moves to the figure that still image is handled the operation on the field positions of camera 53.Fig. 4 A is illustrated on the desired location of workpiece alignment mechanism 50, the situation when making the chip of printing object connect figure 1a to move, and to be the expression of pattern ground connect the figure that figure 1a moves to the situation in the visual field with the chip of printing object to Fig. 4 B.
Fig. 5 A, 5B are explanation figure of the operation of serigraphy on the workpiece 10 of reality, the figure of the operation when to be expression with the chip of the printing object of workpiece 10 connect figure 1a and position on normal place.Fig. 5 A is illustrated on the desired location of workpiece alignment mechanism 50, the situation when making the chip of printing object connect figure 1a location, the figure of the situation of Fig. 5 B when to be the expression of pattern ground with the chip of printing object connect figure 1a and position on normal place.
Fig. 6 A, 6B are the figure of explanation operation of serigraphy on the workpiece 10 of reality, are the operation of serigraphy is carried out in expression to the chip connection figure 1a of the printing object of workpiece 10 figure.Fig. 6 A is illustrated on the desired location of silk screen mechanism 60, the situation when the chip of printing object connects serigraphy on the figure 1a, and Fig. 6 B is the figure of chip that pattern ground the is illustrated in printing object situation when connecting serigraphy scolding tin slurry 3 on the figure 1a.
Fig. 7 A～7C is the method for printing screen in explanation past and the figure of silk-screen printing device.Fig. 7 A is the pattern front view and the side view of silk-screen printing device 90 in the past, is the figure that represents major part with local section.
Fig. 7 B is the vertical view and the profile of the pattern of workpiece 10,
Fig. 7 C is the vertical view and the profile of the pattern of employed screen mask 20 in the silk-screen printing device 90.
Fig. 8 A, 8B are the figure that the problem points of method for printing screen in the past and silk-screen printing device is described.Fig. 8 A is the vertical view of the pattern of another workpiece 11, and Fig. 8 B is the profile that is illustrated near the pattern the silk screen seen from the front when utilizing another workpiece 12 20.
The specific embodiment
Below with reference to the accompanying drawings, describe the best mode that enforcement the present invention uses in detail.
Figure 1A～1C is the figure of explanation method for printing screen of the present invention and silk-screen printing device, and Figure 1A is the pattern side view of silk-screen printing device 100, is to utilize part section to represent the figure of major part.And Figure 1B is identical with Fig. 7 B, is the vertical view and the profile of the pattern of workpiece 10, and Fig. 1 C is the vertical view and the profile of the pattern of the screen mask (hereinafter referred to as " silk screen ") 21 of use in the silk-screen printing device 100.
Silk-screen printing device 100 shown in Figure 1A is on the workpiece 10 that is furnished with a plurality of identical chip connection figure 1a shown in Figure 1B repeatedly, the device of serigraphy scolding tin slurry 3.These silk-screen printing device 100 employed silk screens 21 have with a chip of workpiece 10 and are connected the corresponding printed pattern of figure 1a (reach through hole) 2a shown in Fig. 1 C, and formation can cover the size that a chip connects figure 1a.The size of a chip connection figure for example is about 40mm * 40mm.And, in printed pattern (reach through hole) 2a of silk screen 21,, comprise the test pattern A1, the A2 that represent with thick line that are used for the print register mark in order to locate.
The silk-screen printing device 100 of Figure 1A has: workpiece alignment mechanism 50 is used for that the chip that carries out serigraphy is connected figure 1a and changes and locate; Serigraphy mechanism 60 is used to carry out serigraphy; And movable workbench mechanism 70, be used to make workpiece alignment mechanism 50 and keep the workbench 40 of workpiece 10, between the desired location (right side) of the desired location (left side) of workpiece alignment mechanism 50 and serigraphy mechanism 60, move.
And serigraphy mechanism 60 has: silk screen 21; Silk screen elevating mechanism 61 is used to make silk screen 21 to carry out lifting with respect to workpiece 10; Print head 62, its inner scolding tin slurry 3 that keeps can eject the scolding tin slurry 3 that inside keeps simultaneously from the slit nozzle 62n that is formed on front end; Elevating mechanism 63 is used to make print head 62 to carry out lifting with respect to silk screen 21, and the front end with print head 62 is pressed on the silk screen 21 simultaneously; And head moving mechanism 64, be used to make the front end of print head 62 to move by the face of certain speed with silk screen 21 with paralleling.And the front view of silk-screen printing device 100 is omitted.The Y direction width of the slit nozzle 62n of print head 62 is a bit larger tham the width (for example 40mm) that chip connects figure 1a, and for example Y direction width is about 50mm, and the directions X width is about 2mm.
And in silk-screen printing device 100, the front end of print head 62 is controlled by an elevating mechanism 63 pressing force of silk screen 21.And in silk-screen printing device 100, the print head 62 inner ejection pressure of scolding tin slurry 3 from slit nozzle 62n that keep are controlled by the pressing mechanism with piston 65 (diagram is omitted).
Below explanation utilizes the method for printing screen of the present invention of the silk-screen printing device 100 shown in Figure 1A～Fig. 1 C.
Fig. 2 A～3B is explanation preparation work operation before the serigraphy on the workpiece of reality, i.e. the figure of the operation that the storage normal place is used in the silk-screen printing device 100 of Figure 1A.
Fig. 2 A, 2B are the figure that represents the silkscreen process of the pseudo-workpiece 13 of the utilization carried out at first.Fig. 2 A is the vertical view and the profile of the pattern of the pseudo-workpiece 13 before the printing.Fig. 2 B is the desired location that is illustrated in serigraphy mechanism 60, the figure of the situation of serigraphy on pseudo-workpiece 13.
Shown in Fig. 2 A, pseudo-workpiece 13 for example adopts the chip that does not form Figure 1B to connect the plate that insulation board is only arranged of figure 1a.
At first, the desired location (left side) in the workpiece alignment mechanism 50 shown in Figure 1A makes pseudo-workpiece 13 remain on workbench 40.Then, utilize movable workbench mechanism 70, shown in Fig. 2 B, move desired location position, on pseudo-workpiece 13, carry out the serigraphy of scolding tin slurry 3 up to serigraphy mechanism 60.
Fig. 3 A, 3B are the figure that is illustrated in the operation of storage standards position in the silk-screen printing device 100.Fig. 3 A is the vertical view and the profile of pattern that is printed with the pseudo-workpiece 13 of scolding tin slurry 3, and Fig. 3 B is the desired location that is illustrated in workpiece alignment mechanism 50, the figure of the situation in silk-screen printing device 100 during the storage standards position.
As shown in Figure 3A, in Fig. 2 A, on the pseudo-workpiece 13 that has been screen printed, utilize the scolding tin slurry 3 of the printed pattern 2a of silk screen 21 to form transfer graphic, wherein, also comprise alignment mark A1, the A2 of the location usefulness of representing with thick line.
Shown in Fig. 3 B, utilize movable workbench mechanism 70 make serigraphy the pseudo-workpiece 13 of alignment mark A1, A2 turn back to the desired location of workpiece alignment mechanism 50; Utilize still image to handle the position that camera 53 is measured alignment mark A1, A2, image is stored.Utilize the alignment mark A1 of this storage, the position of A2, formed chip on the later practical work piece 10 is connected figure 1a position.
If this method of employing, then owing to utilize that actual scolding tin slurry 3 formed alignment mark A1, the A2 that has been screen printed carries out later location on pseudo-workpiece 13, so, can ignore to the influence of machine error in the printing process etc., can locate exactly.And the required preparation work operation in storage standards position in the silk-screen printing device shown in Fig. 2 A～3B 100 is only carried out once when changing silk screen 21, does not need to carry out later on till changing silk screen 21 again.
Fig. 4 A～5B is the figure of explanation operation of serigraphy on the workpiece 10 of reality.
To be expression connect figure 1a with the chip of the printing object of workpiece 10 moves to the figure that still image is handled the operation on the field positions of camera 53 for Fig. 4 A, 4B.Fig. 4 A is illustrated on the desired location of workpiece alignment mechanism 50, the figure of the situation when making the chip of printing object connect figure 1a to move.Fig. 4 B is the situation of the chip of pattern ground expression printing object when connecting figure 1a and moving on the field positions.
At first, on the desired location (left side) of the workpiece alignment mechanism 50 shown in Fig. 4 A, workpiece 10 is remained on the workbench 40.
Shown in Fig. 4 A, the chip of printing object connects figure 1a and handles moving on camera 53 field positions to still image, is to move by the workbench 40 that utilizes workpiece travel mechanism 51 to make to have installed workpiece 10 to carry out.
Like this, shown in Fig. 4 B, the field positions that the still image that the chip of the printing object of workpiece 10 connection figure 1a represents with thick line in figure is handled camera 53 moves.
The figure of Fig. 5 A, the 5B operation when to be expression with the chip of the printing object of workpiece 10 connect figure 1a and be positioned in normal place.Fig. 5 A is illustrated on the desired location of workpiece alignment mechanism 50, the situation when making the chip of printing object connect figure 1a location, the figure of the situation of Fig. 5 B when to be the expression of pattern ground with the chip of printing object connect figure 1a and be positioned at normal place.
Shown in Fig. 5 A, the chip connection figure 1a of printing object moves to normal place and positions, be by on the desired location of workpiece alignment mechanism 50, utilize parallel micromotion mechanism 52x, 52y and the rotation micromotion mechanism 52r of workpiece micromotion mechanism 52, the workbench 40 that workpiece 10 has been installed is moved carry out.
Like this, shown in Fig. 5 B, the chip of the printing object of workpiece 10 connects figure 1a, the still image of representing with thick dotted line is handled in the visual field of camera 53 in the drawings, in the X-Y face parallel with silk screen 21, make workpiece 10 carry out parallel move and rotation is moved, position.And, connecting in the location of figure 1a at the chip of above-mentioned printing object, the convex region (land) that the chip that has printed the scolding tin slurry 3 of alignment mark A1, A2 is connected figure 1a is registered on the normal place of the alignment mark A1, the A2 that store among Fig. 3 B.
Fig. 6 A, 6B are that expression connects the figure that figure 1a carries out the operation of serigraphy to the chip with the printing object of workpiece 10.Fig. 6 A is the desired location that is illustrated in serigraphy mechanism 60, the figure of the situation when the chip of printing object connects serigraphy on the figure 1a, Fig. 6 B are the figure of chip that pattern ground the is illustrated in printing object situation when connecting serigraphy scolding tin slurry 3 on the figure 1a.
As shown in Figure 6A, after finish the location, utilize movable workbench mechanism 70 that workpiece alignment mechanism 50 is moved on the desired location of serigraphy mechanism 60 with the desired location of the workbench 40 that keeps workpiece 10 from workpiece alignment mechanism 50.Then, utilize silk screen elevating mechanism 61 that silk screen 21 is descended, the chip that silk screen 21 is overlapped as workpiece 10 printing object connects on the figure 1a.Because the chip of printing object connects figure 1a with respect to silk screen 21 location, so printed pattern (reach through hole) 2a that chip connects figure 1a and silk screen 21 just in time overlaps exactly.Then, utilize an elevating mechanism 63 that print head 62 is descended, the front end of print head 62 is pressed on the silk screen 21.Utilize pressing mechanism (diagram is omitted) then with piston 65, the scolding tin slurry 3 that is maintained at print head 62 inside is sprayed from slit nozzle 62n, simultaneously, utilize head moving mechanism 64 that print head 62 is moved abreast by certain speed and silk screen 21 faces.The translational speed of the print head 62 that head moving mechanism 64 causes for example reaches about 20mm/ second.
And when printing, the front end of print head 62 is controlled by an elevating mechanism 63 pressing force of silk screen 21.The front end of print head 62 for example is about 150kPa to the pressing force of silk screen 21.Like this, can prevent that scolding tin slurry 3 from spilling from the front end of print head 62, can prevent that silk screen 21 from floating from workpiece 10.Therefore, can make printing not produce the infiltration of scolding tin slurry 3.And, fragile silk screen 21 is close on the workpiece 10, can not produce the gap, along with the development of miniaturization also can be carried out serigraphy by enough films.
And the print head 62 inner ejection pressure of scolding tin slurry 3 from slit nozzle 62n that keep are controlled by the pressing mechanism with piston 65 (diagram is omitted).Scolding tin slurry 3 ejection accurately from slit nozzle 62n can be made like this, fine highdensity scolding tin salient point can be printed.The ejection pressure of scolding tin slurry 3 from slit nozzle 62n for example is about 50kPa.
Shown in Fig. 6 B, on the chip connection figure 1a of the printing object of printing the workpiece 10 that finishes, the scolding tin slurry 3 of printing can not go beyond the scope.
Printing shown in Fig. 6 B turns back on the desired location of workpiece alignment mechanism 50 workpiece 10 after finishing, and utilizes the operation shown in Fig. 4 A, the 4B to make the chip connection figure 1a of printing next time move to still image and handles on the field positions of camera 53.After, carry out the operation of Fig. 4 A～Fig. 6 B repeatedly, scolding tin slurry 3 is screen-printed to a plurality of identical chips that are arranged on the workpiece 10 connects on figure 1a whole.
As shown above, utilizing the above-mentioned method for printing screen of the silk-screen printing device 100 shown in Figure 1A～1C, is that each chip of utilizing workpiece alignment mechanism 50 to make to be formed on the workpiece 10 connects figure 1a and positions with respect to silk screen 21 respectively.Then, utilizing movable workbench mechanism 70 that chip is connected the oriented workpiece 10 of figure 1a moves on the desired location of serigraphy mechanism 60.Then, utilizing serigraphy mechanism 60 that scolding tin slurry 3 is screen-printed to oriented chip connects on the figure 1a.Then, utilize movable workbench mechanism 70 that the workpiece 10 after the serigraphy is turned back on the desired location of workpiece alignment mechanism 50.Like this, each chip connection figure 1a that is formed on the workpiece 10 is positioned with respect to silk screen 21, scolding tin slurry 3 is screen-printed to oriented chip connects on the figure 1a.
If adopt above-mentioned method for printing screen, then owing to connect figure 1a and position and serigraphy to being formed on each chip on the workpiece 10, so, the workpiece 10 that the layout that also can corresponding each chip connects figure 1a departs from from the desired location of regulation.And the silk screen 21 of the silk-screen printing device 100 shown in Figure 1A, the 1C form to cover the size that 1 chip connects figure 1a, compares with the silk screen 20 of the silk-screen printing device 90 in past of whole of the covering workpiece 10 shown in Fig. 7 A, the 7B, and the silk screen area is less.So, even workpiece 12 has produced the deflection shown in Fig. 8 B, the little silk screen plus-pressure that also can utilize a silk screen elevating mechanism 61 and an elevating mechanism 63 to be produced is restrained the chip that is formed on the workpiece 12 and is connected the space of floating that is produced between figure 1a and the silk screen 21.
Moreover, even connect under the underproof situation of printing that produces scolding tin slurry 3 on the figure 1a at a chip, also can only wash the scolding tin slurry 3 that the underproof chip of printing connects figure 1a takes place, only on this chip connection figure 1a, republish scolding tin slurry 3.So, and must be connected figure 1a to whole chips and republish repeatedly up to being compared by the method for printing screen in past till the printing normally, can shorten greatly printing underproof repair time.
According to above method, above-mentioned method for printing screen and silk-screen printing device can solve the method for printing screen in whole silk screen past of while print solder slurry on whole of workpiece of utilizing the covering workpiece and the problem points of silk-screen printing device.
Above-mentioned method for printing screen and silk-screen printing device also can be suitable for the workpiece that layout that each chip is connected figure departs from the workpiece of desired location easily and is easy to generate deflection.So, can be applicable to the workpiece that is easy to generate these problems, for example formed the workpiece that multi-layer sheet constituted that the thermoplastic resin membrane of conductor fig is bonded by multilayer.Especially, this method for printing screen and silk-screen printing device can be applicable to by the multi-layer thermoplastic resin film also and be bonded that chip connects the high workpiece that multi-layer sheet constituted of layout density of figure.
And, more than according to specific embodiment, describe the present invention in detail, still, those skilled in the art can carry out various changes and correction etc. under the situation that does not break away from claim scope of the present invention and thought.
Claims (5)
1, a kind of method for printing screen, arranging that serigraphy scolding tin slurry is characterized in that on the workpiece that a plurality of identical chips connection figures form:
Said chip connects figure ranks shape on workpiece arranges,
Above-mentioned workpiece comprises multilayer formed the multi-layer sheet that the thermoplastic resin membrane of conductor fig is bonded,
The screen mask that above-mentioned serigraphy is used forms and covers the size that 1 said chip connects figure,
Each is formed on chip on the above-mentioned workpiece connects figure and carry out location, connect the above-mentioned scolding tin slurry of serigraphy on figure at this chip that is positioned with respect to above-mentioned screen mask,
For above-mentioned location, on above-mentioned screen mask, be formed for the figure of print register mark,
At first carry out above-mentioned serigraphy with pseudo-workpiece,
Store position to the above-mentioned alignment mark of serigraphy on above-mentioned pseudo-workpiece,
Utilize the position of the alignment mark of this storage to come the chip connection figure that is formed on later on the workpiece is positioned.
2, a kind of silk-screen printing device, arranging that serigraphy scolding tin slurry is characterized in that on the workpiece that a plurality of identical chips connection figures form:
Said chip connects figure ranks shape on workpiece arranges,
The multi-layer sheet that above-mentioned workpiece is bonded by the multi-layer thermoplastic resin film that has formed conductor fig and constituting,
The screen mask that above-mentioned serigraphy is used forms and can cover the size that 1 said chip connects figure,
This silk-screen printing device has: the chip that carries out above-mentioned serigraphy is connected the workpiece alignment mechanism that usefulness was changed and located to figure; Carry out the serigraphy mechanism that above-mentioned serigraphy is used; And between the desired location of the desired location of above-mentioned workpiece alignment mechanism and above-mentioned serigraphy mechanism, the movable workbench mechanism that the movable workbench that keeps above-mentioned workpiece alignment mechanism and above-mentioned workpiece is used,
Above-mentioned workpiece alignment mechanism has and is used to measure the still image that said chip connects the position of figure and handles camera,
Utilize above-mentioned workpiece alignment mechanism that the chip that each is formed on the above-mentioned workpiece is connected figure, carry out location with respect to above-mentioned screen mask,
Utilize above-mentioned movable workbench mechanism that said chip is connected the desired location that the oriented workpiece of figure moves to above-mentioned serigraphy mechanism,
Utilize above-mentioned serigraphy mechanism above-mentioned scolding tin slurry of serigraphy on above-mentioned oriented chip connection figure,
Utilize above-mentioned movable workbench mechanism to make workpiece after the above-mentioned serigraphy turn back to the desired location of above-mentioned workpiece alignment mechanism,
In order to carry out above-mentioned location, on above-mentioned screen mask, be formed for the figure of print register mark,
At first, utilize above-mentioned serigraphy mechanism on pseudo-workpiece, to carry out serigraphy,
Utilize above-mentioned movable workbench mechanism, make serigraphy the pseudo-workpiece of above-mentioned alignment mark turn back to the desired location of above-mentioned workpiece alignment mechanism,
Utilize the said fixing image to handle camera, measure the position of above-mentioned alignment mark, carry out the image storage,
Utilize the position of this stored alignment mark, the chip that forms on above-mentioned workpiece after carrying out connects the location of figure.
3, the described silk-screen printing device of claim 2 is characterized in that, above-mentioned serigraphy mechanism has:
Above-mentioned screen mask;
The silk screen elevating mechanism is used to make above-mentioned screen mask to carry out lifting with respect to above-mentioned workpiece;
Print head, it remains on inside with above-mentioned scolding tin slurry, and the inner scolding tin slurry that keeps is sprayed from the slit nozzle that is formed on front end;
Elevating mechanism is used to make above-mentioned print head to carry out lifting with respect to above-mentioned screen mask, and the front end of above-mentioned print head is pressed on the screen mask; And
Head moving mechanism is used to make the front end of above-mentioned print head to move by certain speed with above-mentioned screen mask face with paralleling.
4, silk-screen printing device as claimed in claim 3 is characterized in that: utilize above-mentioned elevating mechanism to control the pressing force of the front end of above-mentioned print head to screen mask.
5, silk-screen printing device as claimed in claim 3 is characterized in that: the ejection pressure of scolding tin slurry from the slit nozzle that utilizes pressing mechanism to control to be maintained at the inside of above-mentioned print head.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP064406/2005 | 2005-03-08 | ||
| JP2005064406A JP4506515B2 (en) | 2005-03-08 | 2005-03-08 | Screen printing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1830667A CN1830667A (en) | 2006-09-13 |
| CN100519184C true CN100519184C (en) | 2009-07-29 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610058888XA Expired - Fee Related CN100519184C (en) | 2005-03-08 | 2006-03-08 | Screen painting method and apparatus used therein |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4506515B2 (en) |
| KR (1) | KR100659371B1 (en) |
| CN (1) | CN100519184C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102355996A (en) * | 2009-08-06 | 2012-02-15 | 松下电器产业株式会社 | Screen printing device and screen printing method |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5206053B2 (en) * | 2008-03-21 | 2013-06-12 | 凸版印刷株式会社 | Step-type printing apparatus and step-type printing method |
| TWI365693B (en) * | 2008-10-09 | 2012-06-01 | Nan Ya Printed Circuit Board | Solder bump printing method for single print circuit board |
| CN102179996B (en) * | 2011-01-14 | 2012-06-27 | 浙江大学 | Substrate positioning method suitable for screen printing technology |
| CN104797021A (en) * | 2015-03-15 | 2015-07-22 | 新乡市杰达精密电子器件有限公司 | Multi-heating-surface thick film heating body and printing device and technology thereof |
| CN105922725A (en) * | 2016-06-13 | 2016-09-07 | 深圳市兴华炜科技有限公司 | Solder paste supplementing mechanism and supplementing method thereof |
| DE102016220678A1 (en) * | 2016-10-21 | 2018-04-26 | Robert Bosch Gmbh | Printing device and printing method for applying a viscous or pasty material |
| CN110774783B (en) * | 2019-10-29 | 2021-07-20 | 广州柳川智能装备有限公司 | Interface printing method for special-shaped bottle |
| CN111845072A (en) * | 2020-07-29 | 2020-10-30 | 广州舞磊科技有限公司 | Stationery printing machine based on reciprocating motion is printing evenly |
| US20230060880A1 (en) * | 2021-08-24 | 2023-03-02 | Robert Bosch Gmbh | Flattening surface of pasted track in stencil printing process |
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| JPS59220991A (en) | 1983-05-31 | 1984-12-12 | 富士通株式会社 | Method of positioning front and back patterns of ic board |
| JPH0275777A (en) * | 1988-09-09 | 1990-03-15 | Sanyo Electric Co Ltd | Piston device assembly method for compressor |
| JPH0286190A (en) * | 1988-09-22 | 1990-03-27 | Fujitsu Ltd | Printing printed circuit board |
| JPH0734500B2 (en) * | 1988-11-02 | 1995-04-12 | 三洋電機株式会社 | Screen alignment method and apparatus for screen printing machine |
| JPH0834346B2 (en) * | 1989-01-17 | 1996-03-29 | 三洋電機株式会社 | Screen printing machine |
| JPH04122032U (en) * | 1991-04-18 | 1992-10-30 | 株式会社富士通ゼネラル | Ceramic substrate printing |
| JPH1142762A (en) * | 1997-07-29 | 1999-02-16 | Fujitsu Ltd | Squeegee device, solder paste printing method, and solder paste printing apparatus |
| JP2003260783A (en) * | 2002-03-08 | 2003-09-16 | Matsushita Electric Ind Co Ltd | Solder paste printing method and mask for solder paste printing |
| JP4003556B2 (en) * | 2002-06-27 | 2007-11-07 | 株式会社デンソー | Printed circuit board manufacturing method |
| JP2004306102A (en) * | 2003-04-08 | 2004-11-04 | Sony Corp | Solder feeder and solder printing machine |
-
2005
- 2005-03-08 JP JP2005064406A patent/JP4506515B2/en not_active Expired - Fee Related
-
2006
- 2006-02-03 KR KR1020060010578A patent/KR100659371B1/en active IP Right Grant
- 2006-03-08 CN CNB200610058888XA patent/CN100519184C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102355996A (en) * | 2009-08-06 | 2012-02-15 | 松下电器产业株式会社 | Screen printing device and screen printing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1830667A (en) | 2006-09-13 |
| JP4506515B2 (en) | 2010-07-21 |
| KR100659371B1 (en) | 2006-12-19 |
| JP2006253226A (en) | 2006-09-21 |
| KR20060099397A (en) | 2006-09-19 |
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