CN100477087C - 放置台结构以及具有该放置台结构的热处理装置 - Google Patents

放置台结构以及具有该放置台结构的热处理装置 Download PDF

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Publication number
CN100477087C
CN100477087C CNB2004800092949A CN200480009294A CN100477087C CN 100477087 C CN100477087 C CN 100477087C CN B2004800092949 A CNB2004800092949 A CN B2004800092949A CN 200480009294 A CN200480009294 A CN 200480009294A CN 100477087 C CN100477087 C CN 100477087C
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China
Prior art keywords
mounting table
cover
pillar
mentioned
table structure
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Expired - Fee Related
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CNB2004800092949A
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English (en)
Chinese (zh)
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CN1833312A (zh
Inventor
川崎裕雄
岩田辉夫
纲仓学
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Furnace Charging Or Discharging (AREA)
CNB2004800092949A 2003-04-07 2004-04-07 放置台结构以及具有该放置台结构的热处理装置 Expired - Fee Related CN100477087C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003103458A JP4222086B2 (ja) 2003-04-07 2003-04-07 熱処理装置
JP103458/2003 2003-04-07
JP129249/2003 2003-05-07

Publications (2)

Publication Number Publication Date
CN1833312A CN1833312A (zh) 2006-09-13
CN100477087C true CN100477087C (zh) 2009-04-08

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CNB2004800092949A Expired - Fee Related CN100477087C (zh) 2003-04-07 2004-04-07 放置台结构以及具有该放置台结构的热处理装置

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JP (1) JP4222086B2 (ja)
CN (1) CN100477087C (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010511304A (ja) * 2006-11-27 2010-04-08 モメンティブ パフォーマンス マテリアルズ インコーポレイテッド 石英で密閉されたヒータアセンブリ
JP4450106B1 (ja) * 2008-03-11 2010-04-14 東京エレクトロン株式会社 載置台構造及び処理装置
JP5029435B2 (ja) * 2008-03-11 2012-09-19 東京エレクトロン株式会社 載置台構造及び熱処理装置
JP2009242835A (ja) * 2008-03-28 2009-10-22 Tokyo Electron Ltd 成膜方法及び成膜装置
JP5439771B2 (ja) 2008-09-05 2014-03-12 東京エレクトロン株式会社 成膜装置
KR101122719B1 (ko) 2009-05-27 2012-03-23 (주)티티에스 기판 가열 장치 및 이의 제조 방법 그리고, 이를 포함하는 기판 처리 장치
JP2011054838A (ja) * 2009-09-03 2011-03-17 Tokyo Electron Ltd 載置台構造及び処理装置
JP2011061040A (ja) * 2009-09-10 2011-03-24 Tokyo Electron Ltd 載置台構造及び処理装置
JP2012028428A (ja) * 2010-07-21 2012-02-09 Tokyo Electron Ltd 載置台構造及び処理装置
US9719169B2 (en) * 2010-12-20 2017-08-01 Novellus Systems, Inc. System and apparatus for flowable deposition in semiconductor fabrication
JP5942380B2 (ja) * 2011-10-20 2016-06-29 住友電気工業株式会社 半導体製造装置用ウエハ保持体
CN104600000A (zh) * 2013-10-30 2015-05-06 沈阳芯源微电子设备有限公司 一种基板周边吸附烘烤结构
JP6396818B2 (ja) * 2015-01-29 2018-09-26 京セラ株式会社 試料保持具
CN104911544B (zh) * 2015-06-25 2017-08-11 沈阳拓荆科技有限公司 控温盘
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
US11127605B2 (en) 2016-11-29 2021-09-21 Sumitomo Electric Industries, Ltd. Wafer holder
US20230130756A1 (en) * 2021-10-22 2023-04-27 Applied Materials, Inc. Bottom cover plate to reduce wafer planar nonuniformity

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Publication number Publication date
CN1833312A (zh) 2006-09-13
JP4222086B2 (ja) 2009-02-12
JP2004307939A (ja) 2004-11-04

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CI02 Correction of invention patent application

Correction item: Priority

Correct: 2003.05.07 JP 129249/2003

False: Lack of priority second

Number: 37

Page: The title page

Volume: 22

COR Change of bibliographic data

Free format text: CORRECT: PRIORITY; FROM: MISSING THE SECOND ARTICLE OF PRIORITY TO: 2003.5.7 JP 129249/2003

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090408

Termination date: 20160407

CF01 Termination of patent right due to non-payment of annual fee