CN100477087C - 放置台结构以及具有该放置台结构的热处理装置 - Google Patents
放置台结构以及具有该放置台结构的热处理装置 Download PDFInfo
- Publication number
- CN100477087C CN100477087C CNB2004800092949A CN200480009294A CN100477087C CN 100477087 C CN100477087 C CN 100477087C CN B2004800092949 A CNB2004800092949 A CN B2004800092949A CN 200480009294 A CN200480009294 A CN 200480009294A CN 100477087 C CN100477087 C CN 100477087C
- Authority
- CN
- China
- Prior art keywords
- mounting table
- cover
- pillar
- mentioned
- table structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Furnace Charging Or Discharging (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003103458A JP4222086B2 (ja) | 2003-04-07 | 2003-04-07 | 熱処理装置 |
JP103458/2003 | 2003-04-07 | ||
JP129249/2003 | 2003-05-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1833312A CN1833312A (zh) | 2006-09-13 |
CN100477087C true CN100477087C (zh) | 2009-04-08 |
Family
ID=33466553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800092949A Expired - Fee Related CN100477087C (zh) | 2003-04-07 | 2004-04-07 | 放置台结构以及具有该放置台结构的热处理装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4222086B2 (ja) |
CN (1) | CN100477087C (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010511304A (ja) * | 2006-11-27 | 2010-04-08 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | 石英で密閉されたヒータアセンブリ |
JP4450106B1 (ja) * | 2008-03-11 | 2010-04-14 | 東京エレクトロン株式会社 | 載置台構造及び処理装置 |
JP5029435B2 (ja) * | 2008-03-11 | 2012-09-19 | 東京エレクトロン株式会社 | 載置台構造及び熱処理装置 |
JP2009242835A (ja) * | 2008-03-28 | 2009-10-22 | Tokyo Electron Ltd | 成膜方法及び成膜装置 |
JP5439771B2 (ja) | 2008-09-05 | 2014-03-12 | 東京エレクトロン株式会社 | 成膜装置 |
KR101122719B1 (ko) | 2009-05-27 | 2012-03-23 | (주)티티에스 | 기판 가열 장치 및 이의 제조 방법 그리고, 이를 포함하는 기판 처리 장치 |
JP2011054838A (ja) * | 2009-09-03 | 2011-03-17 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
JP2011061040A (ja) * | 2009-09-10 | 2011-03-24 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
JP2012028428A (ja) * | 2010-07-21 | 2012-02-09 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
US9719169B2 (en) * | 2010-12-20 | 2017-08-01 | Novellus Systems, Inc. | System and apparatus for flowable deposition in semiconductor fabrication |
JP5942380B2 (ja) * | 2011-10-20 | 2016-06-29 | 住友電気工業株式会社 | 半導体製造装置用ウエハ保持体 |
CN104600000A (zh) * | 2013-10-30 | 2015-05-06 | 沈阳芯源微电子设备有限公司 | 一种基板周边吸附烘烤结构 |
JP6396818B2 (ja) * | 2015-01-29 | 2018-09-26 | 京セラ株式会社 | 試料保持具 |
CN104911544B (zh) * | 2015-06-25 | 2017-08-11 | 沈阳拓荆科技有限公司 | 控温盘 |
US10388546B2 (en) | 2015-11-16 | 2019-08-20 | Lam Research Corporation | Apparatus for UV flowable dielectric |
US11127605B2 (en) | 2016-11-29 | 2021-09-21 | Sumitomo Electric Industries, Ltd. | Wafer holder |
US20230130756A1 (en) * | 2021-10-22 | 2023-04-27 | Applied Materials, Inc. | Bottom cover plate to reduce wafer planar nonuniformity |
-
2003
- 2003-04-07 JP JP2003103458A patent/JP4222086B2/ja not_active Expired - Fee Related
-
2004
- 2004-04-07 CN CNB2004800092949A patent/CN100477087C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1833312A (zh) | 2006-09-13 |
JP4222086B2 (ja) | 2009-02-12 |
JP2004307939A (ja) | 2004-11-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100477087C (zh) | 放置台结构以及具有该放置台结构的热处理装置 | |
KR100744860B1 (ko) | 탑재대 구조체 및 이 탑재대 구조체를 갖는 열처리 장치 | |
KR100649461B1 (ko) | 표면 처리 방법 및 장치 | |
JP4306403B2 (ja) | シャワーヘッド構造及びこれを用いた成膜装置 | |
KR101354571B1 (ko) | 플라즈마 강화 화학적 기상 증착 및 경사형 에지 에칭을 위한 시스템 | |
JP4732469B2 (ja) | 表面処理方法及びその装置 | |
US20100163183A1 (en) | Mounting table structure and heat treatment apparatus | |
CN101038863A (zh) | 被处理件的处理方法及处理装置 | |
KR20100127200A (ko) | 배치대 구조 및 처리 장치 | |
KR100939588B1 (ko) | 표면 텍스쳐링을 구비한 플라즈마 반응기 기판 | |
JP2004356624A (ja) | 載置台構造及び熱処理装置 | |
TWI777243B (zh) | 薄膜沉積腔、多功能遮蔽盤以及多功能遮蔽盤的使用方法 | |
JP2007141895A (ja) | 載置台構造及び成膜装置 | |
KR20220080777A (ko) | 지지 유닛 및 이를 포함하는 기판 처리 장치 | |
KR102270549B1 (ko) | 적재 유닛 및 처리 장치 | |
JP3131860B2 (ja) | 成膜処理装置 | |
US6598312B2 (en) | Wafer drying apparatus | |
JP2003059998A (ja) | トレイ式マルチチャンバー基板処理装置及びトレイ式基板処理装置 | |
JP4124800B2 (ja) | 表面処理方法及びその装置 | |
JP2009260022A (ja) | 基板処理ユニットおよび基板処理装置 | |
JP2001257167A (ja) | 半導体製造装置 | |
US20230386823A1 (en) | Situ clean for bevel and edge ring | |
KR20080072257A (ko) | 기판 이송 장치 및 이를 이용한 기판 이송 방법 | |
KR20230101995A (ko) | 기판 처리 장치 | |
KR20070080766A (ko) | 기판 처리 장치 및 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CI02 | Correction of invention patent application |
Correction item: Priority Correct: 2003.05.07 JP 129249/2003 False: Lack of priority second Number: 37 Page: The title page Volume: 22 |
|
COR | Change of bibliographic data |
Free format text: CORRECT: PRIORITY; FROM: MISSING THE SECOND ARTICLE OF PRIORITY TO: 2003.5.7 JP 129249/2003 |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090408 Termination date: 20160407 |
|
CF01 | Termination of patent right due to non-payment of annual fee |